GB2570621A - Led - Google Patents

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Publication number
GB2570621A
GB2570621A GB1714109.4A GB201714109A GB2570621A GB 2570621 A GB2570621 A GB 2570621A GB 201714109 A GB201714109 A GB 201714109A GB 2570621 A GB2570621 A GB 2570621A
Authority
GB
United Kingdom
Prior art keywords
led
heat sink
search
water cooling
document
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB1714109.4A
Other versions
GB2570621B (en
GB201714109D0 (en
Inventor
Michael Smith Gary
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to GB1714109.4A priority Critical patent/GB2570621B/en
Publication of GB201714109D0 publication Critical patent/GB201714109D0/en
Publication of GB2570621A publication Critical patent/GB2570621A/en
Application granted granted Critical
Publication of GB2570621B publication Critical patent/GB2570621B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/56Cooling arrangements using liquid coolants
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/50Cooling arrangements
    • F21V29/51Cooling arrangements using condensation or evaporation of a fluid, e.g. heat pipes
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21VFUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V31/00Gas-tight or water-tight arrangements
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/64Heat extraction or cooling elements
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20954Modifications to facilitate cooling, ventilating, or heating for display panels
    • H05K7/20981Liquid coolant without phase change
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21LIGHTING
    • F21YINDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00Light-generating elements of semiconductor light sources
    • F21Y2115/10Light-emitting diodes [LED]

Abstract

A water cooled LED light 9 comprising a heat sink 1, 3, 4 (see Figure 1). A seal 2 is included and a fixing means are provided which ensure a watertight connection between the LED and the heat sink.

Description

Introduction & Background:
The current lighting systems use either large glass bulbs/lamps, also reflectors/ heat shields & large fans or big heat sinks to cool led,s & the environment they are in. This is effective in many areas for its purpose but still creating a lot of heat. This may lead to more energy being used & running costs or other problems & reliant on a lot of power.
To overcome this problem, the present invention has a way of removing the heat silent & quickly, keeping the led,s cooler & helping obtain a more stable environment they are in. This could prolonging the life of the led,s due to the impact heat has on the electrical components. This also has adjustable power options for versatility.
Statement of Invention:
The cooling of the led,s embedded or adapted to the heat sink is by means of reducing the amount of heat. This is by means of cooling is preferably by method such as direct surface contact. With maximum heat removal creating cooler electric, means electrons have less resistance. Using less power.
The led light heat sink is a module or a multi-linkable module, also small enough and light in weight, to allow easy connection or disconnection to its environment quick and safely. The design of the invention makes it easy enough to be fixed or suspended with very little effort and axis.
Optional Features:
The invention may have the option to have embedded led,s directly into it, or adapted to other led lights with less efficient cooling by the holes underneath the base plate. It also has the ability to be multi linked in a liquid cooled system or modular. The led light/heat sink also can have the option to have a reflector or lens fitted to the base by means of predrilled holes for future use.
The invention will now be described with reference to the associated drawings & pictures:
Figurel:
This is a complete & assembled heat sink with all parts.
Page 2/6
Figure 2:
This shows the top plate with necessary holes.
Figure 3:
This shows the base plate with holes. And with embedded leds
Figure 4:
This shows an alternative fitting of a light & additional reflector/shade & the direction of the drawing to indicate construction.
List of figures:
Figure 1. This shows the heat sink with all parts, 1,2,3,4, the seal part 2, which sits inbetween, the plates.
Figure 2. The top plate & 2 holes for fittings, and bolts part/4. Figure 3, part 1 the base plate, showing the underside showing slot “7” a power cable slot, example part 9 led,s. & process “8” fixture holes & part 4 bolt holes.
Which is all fitted together comprising of a seal in-between to seal the two surfaces together. Two holes shown in figure 2, which are situated in the top plate, these are for pipefittings to the unit, Ref to picture 6. In Figure 4 shows a shade/reflector part 5, & an adapted plate for example part 6. This also shows a machined area in the base plate part 3, cut out “10”.
Detailed Description of my invention:
A thermal reducing temperature heat sink that is water cooled, which consists of four parts to assemble,& a fabrication process. It can operate in any axis once connected to the modular system or multi-linked system. The invention has the option to be stand alone or in a multilink system. Can be adapted easily for a variety of uses & places & environments.
Page 3/6
Picture/ illustration ref:
Picture 1:
This shows a fully built invention with all the parts as a unit apart from the bolts and the seal in place. With holes on top for fittings part shown in picture 6.
Picture 2:
This shows a side view and the top part 1 is in acrylic for bench testing and shows the bolts and any issues at time of testing,’’there were none” at present. Also note the cut out for wires slot 7.
Picture 3:
This shows the Base plate contact surface with some drilled holes for additional adaptations or under side reflector or any kind. Prior fabrication.
Picture 4:
This shows an example of led placement after fabrication directly on the surface.
Picture 5:
This shows a example of what a optional lens would be like for illustration only at present.
Picture 6:
This shows a working and tested invention with an adapted & modified part for point of extreme thermal stress testing the invention under great load. The red recyclable liquid was for illustration, which was needed for the leak test, to check the invention functioned correctly, heat conductivity & flow. This worked well as picture shows and I recorded the temps via picture and video footage.
Page 4/6
Patent Claims:

Claims (4)

1. A led light water cooling heat sink for led lights or light.
2. A led light water cooling heat sink according to claim 1,Where a led or led’s, are embedded in the heat sink or adapted to it, Also comprising of two main parts, Top & a Bottom.
3. A led light water cooling heat sink fixture according to claim 1 & 2 in which a top can be is attached to the fixture & a seal so it can be fixed together for cooling the led or led,s, which removes heat generated from the led,s by water cooling the led,s either mounted to it or embedded into it.
4. A led light water cooling heat sink fixture as according to all previous claims above with holes in the top plate of the base plate & threads in the base plate for fixtures to be added to & make water tight the invention.
Intellectual Property Office
Application No: GB1714109.4 Examiner: Mr Jorge Quintero
Claims searched: 1-4 Date of search: 20 October 2017
Patents Act 1977: Search Report under Section 17
Documents considered to be relevant:
Category Relevant to claims Identity of document and passage or figure of particular relevance X 1-4 CN 203218247 U SHEN YIMIN - see abstracts and Figure 1 and related description. X 1-4 CN 101463956 A SHENGRONG HUANG et al - see abstracts and Figure 4 and related description. X 1-4 US 2009/0001372 Al ARIK et al - see Figure 5 and related description.
Categories:
X Document indicating lack of novelty or inventive step A Document indicating technological background and/or state of the art. Y Document indicating lack of inventive step if P Document published on or after the declared priority date but combined with one or more other documents of before the filing date of this invention. same category. & Member of the same patent family E Patent document published on or after, but with priority date earlier than, the filing date of this application.
Field of Search:
Search of GB, EP, WO & US patent documents classified in the following areas of the UKCX :
Worldw ide search of patent documents classified in the following areas of the IPC____________
F21K; F21V; H01L; H05K________________________________________
The follow ing online and other databases have been used in the preparation of this search report WPI, EPODOC
GB1714109.4A 2017-09-04 2017-09-04 LED Heat Sink Active GB2570621B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB1714109.4A GB2570621B (en) 2017-09-04 2017-09-04 LED Heat Sink

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB1714109.4A GB2570621B (en) 2017-09-04 2017-09-04 LED Heat Sink

Publications (3)

Publication Number Publication Date
GB201714109D0 GB201714109D0 (en) 2017-10-18
GB2570621A true GB2570621A (en) 2019-08-07
GB2570621B GB2570621B (en) 2020-07-15

Family

ID=60050581

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1714109.4A Active GB2570621B (en) 2017-09-04 2017-09-04 LED Heat Sink

Country Status (1)

Country Link
GB (1) GB2570621B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021141505A1 (en) * 2020-01-07 2021-07-15 Stasiak Michal A cob led lighting lamp cooled by a liquid agent, in particular water

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090001372A1 (en) * 2007-06-29 2009-01-01 Lumination Llc Efficient cooling of lasers, LEDs and photonics devices
CN101463956A (en) * 2008-06-16 2009-06-24 厦门市三安光电科技有限公司 Wind power combined water-refrigeration LED road lamp
CN203218247U (en) * 2013-03-16 2013-09-25 青岛天信变频电机有限公司 Heat radiation device for disk-shaped diode

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103234184B (en) * 2012-09-05 2015-07-29 重庆三弓科技发展有限公司 A kind of LED integration module liquid heat radiating device
CN103822197A (en) * 2014-03-20 2014-05-28 重庆三弓科技发展有限公司 LED heat dissipation device
CN204853397U (en) * 2015-07-28 2015-12-09 青岛莱伊迪光电科技有限公司 LED lamp granule base plate cooling device
KR101962375B1 (en) * 2015-11-03 2019-03-27 재단법인 철원플라즈마 산업기술연구원 Flood lamp

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090001372A1 (en) * 2007-06-29 2009-01-01 Lumination Llc Efficient cooling of lasers, LEDs and photonics devices
CN101463956A (en) * 2008-06-16 2009-06-24 厦门市三安光电科技有限公司 Wind power combined water-refrigeration LED road lamp
CN203218247U (en) * 2013-03-16 2013-09-25 青岛天信变频电机有限公司 Heat radiation device for disk-shaped diode

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2021141505A1 (en) * 2020-01-07 2021-07-15 Stasiak Michal A cob led lighting lamp cooled by a liquid agent, in particular water
US11867385B2 (en) 2020-01-07 2024-01-09 Michal STASIAK COB LED lighting lamp cooled by a liquid agent, in particular water

Also Published As

Publication number Publication date
GB2570621B (en) 2020-07-15
GB201714109D0 (en) 2017-10-18

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