GB2542814A - Imaging device - Google Patents

Imaging device Download PDF

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Publication number
GB2542814A
GB2542814A GB1517277.8A GB201517277A GB2542814A GB 2542814 A GB2542814 A GB 2542814A GB 201517277 A GB201517277 A GB 201517277A GB 2542814 A GB2542814 A GB 2542814A
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GB
United Kingdom
Prior art keywords
image sensor
imaging device
electrical energy
thermal image
thermal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB1517277.8A
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GB201517277D0 (en
Inventor
James Holliday Antony
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CORDEX INSTR Ltd
Original Assignee
CORDEX INSTR Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CORDEX INSTR Ltd filed Critical CORDEX INSTR Ltd
Priority to GB1517277.8A priority Critical patent/GB2542814A/en
Publication of GB201517277D0 publication Critical patent/GB201517277D0/en
Publication of GB2542814A publication Critical patent/GB2542814A/en
Withdrawn legal-status Critical Current

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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J1/00—Photometry, e.g. photographic exposure meter
    • G01J1/42—Photometry, e.g. photographic exposure meter using electric radiation detectors
    • G01J1/44—Electric circuits
    • G01J1/46—Electric circuits using a capacitor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/0096—Radiation pyrometry, e.g. infrared or optical thermometry for measuring wires, electrical contacts or electronic systems
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/026—Control of working procedures of a pyrometer, other than calibration; Bandwidth calculation; Gain control
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/02—Constructional details
    • G01J5/08—Optical arrangements
    • G01J5/0859—Sighting arrangements, e.g. cameras
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
    • G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
    • G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
    • G01J5/20—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using resistors, thermistors or semiconductors sensitive to radiation, e.g. photoconductive devices
    • G01J5/22—Electrical features thereof
    • G01J5/24—Use of specially adapted circuits, e.g. bridge circuits
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/45—Cameras or camera modules comprising electronic image sensors; Control thereof for generating image signals from two or more image sensors being of different type or operating in different modes, e.g. with a CMOS sensor for moving images in combination with a charge-coupled device [CCD] for still images
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/60—Control of cameras or camera modules
    • H04N23/65—Control of camera operation in relation to power supply
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • H04N25/60—Noise processing, e.g. detecting, correcting, reducing or removing noise
    • H04N25/67—Noise processing, e.g. detecting, correcting, reducing or removing noise applied to fixed-pattern noise, e.g. non-uniformity of response
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N5/00—Details of television systems
    • H04N5/30—Transforming light or analogous information into electric information
    • H04N5/33—Transforming infrared radiation

Abstract

An imaging device 10 comprising a visible image sensor 12, a thermal image sensor 14, and a source of electrical energy 16 operably connected to one or both of the visible image sensor 12 and the thermal image sensor 14 by an electrical circuit 18. The electrical circuit 18 comprises one or more of a capacitor, a diode, and a resistor which reduce one or more of the capacitance, voltage, and inductance of the electrical energy in the electrical circuit. The visible image sensor 12 and the thermal image sensor 14 may be aligned in two dimensions. The electrical circuit 18 may comprise two or more electrical circuits. The visible image sensor 12 may be a CMOS sensor. The thermal image sensor 14 may be a bolometer. The imaging device is employed to obtain an image in a hazardous and/or explosive environment.

Description

IMAGING DEVICE
The present invention relates to an imaging device and method of obtaining an image in a hazardous environment.
Some imaging devices including thermal and visible imagers are required to be used in hazardous and/or explosive atmospheres. Special consideration must be given to the arrangement of the component parts of such imaging devices to make them suitable for such use and/or intrinsically safe. A thermal imager detects infrared radiation emitted from an object or scene within its field of view. It converts the infrared radiation emitted into electrical signals that are displayed on a screen. Thermal imagers convert infrared radiation into visible light. Thermal imagers typically operate at wavelengths from 7,500 to 14,000nm or 7.5 to 14pm. Two objects or areas of a scene at the same temperature are displayed on a screen using the same colour.
Thermal imagers are commonly used to inspect electrical equipment. The thermal imager is used to measure infrared radiation or heat produced by the electrical equipment and converts the measurements into a visible image. Regular inspections of the electrical equipment allow an operator to compare successive readings and thereby detect when the thermal images produced vary over time. An increased thermal reading indicates the particular area of the electrical equipment is heating up and is therefore prone to failure. A thermal imager can therefore be used to provide an early warning system for component failure and help organise a service regime that concentrates on components that are failing and need replacement.
Whilst thermal imagers are useful for detecting infrared radiation, the human eye detects light in the visible spectrum and it is often therefore difficult to interpret a thermal image from a thermal imager without a corresponding visible image from a visible image detector. An operator often therefore uses a visible image of the same object or scene to interpret the thermal image.
According to a first aspect of the present invention there is provided an imaging device comprising: a visible image sensor; a thermal image sensor; and a source of electrical energy operably connected to one or both of the visible image sensor and the thermal image sensor by an electrical circuit; wherein the electrical circuit comprises one or more of a capacitor, a diode, and a resistor and the one or more of the capacitor, diode, and resistor reduce one or more of the capacitance, voltage, and inductance of the electrical energy in the electrical circuit.
The imaging device is typically intrinsically safe, that is the imaging device may be safe for operation in a hazardous and/or explosive atmosphere or area. Intrinsic safety may require the electrical energy supplied to the visible image sensor and/or thermal image sensor to be controlled and/or limited. The electrical energy supplied to the visible image sensor and/or thermal image sensor should not be a potential source of ignition.
The imaging device may comprise a visible detector comprising the visible image sensor and a lens. The imaging device may comprise a thermal detector comprising the thermal image sensor and a lens. The imaging device may therefore comprise two lens.
The visible image sensor and the thermal image sensor are typically aligned in at least one, typically two dimensions. Normally the visible detector and the thermal detector and so typically the lens of the visible detector and the lens of the thermal detector are aligned in at least one, typically two dimensions and/or side-by-side. The visible detector and the thermal detector are normally stacked on top of one another.
The image seen and/or produced by the visible detector is typically the same or at least substantially the same in at least one, typically two dimensions as the image seen and/or produced by the thermal detector. The two images may be referred to as a ‘picture in picture’ output.
The visible image sensor may be referred to as a visible light image sensor. The visible image sensor may be referred to as an optical detector. The thermal image sensor may be referred to as an infrared detector. The visible image sensor typically detects visible light and/or radiation. The thermal image sensor typically detects electromagnetic radiation in the Infrared (IR) spectral band. The visible radiation may be electromagnetic radiation having a wavelength of from 300 to 800nm, normally from 380 to 760nm. The infrared radiation may be electromagnetic radiation having a wavelength from 750nm to 1mm.
In use, the electrical energy is passable through one or more of the capacitor, diode, and resistor.
The electrical circuit comprising one or more of the capacitor, diode, and resistor connecting the source of electrical energy and one or both of the visible image sensor and the thermal image sensor may comprise two or more electrical circuits. The two or more electrical circuits may be referred to as power domains. The electrical circuit may comprise five separate electrical circuits, that is may be five power domains. A first power domain may comprise the visible image sensor. A second power domain may comprise the thermal image sensor. The electrical circuit or two or more electrical circuits may provide the resistive spark and/or thermal ignition requirements of the imaging device.
The maximum power available to the visible image sensor and/or the thermal image sensor is typically 1.3watts (W). This maximum power is normally the power after safety critical components, typically including a fuse and a resistor.
All components of the or each electrical circuit having a surface area of equal to or less than 20mm2 are typically encapsulated with a local non-flowing potting compound. The compound may be Dow Corning® 744 RTV Sealant. The compound typically increases the surface area of the components to greater than 20mm2. The compound typically complies with clause 6.6 of standard IEC 60079-11. All components are therefore normally considered to have a surface area of more than 20mm2 in accordance with Table 3a of standard IEC 60079-0. The maximum permitted power for temperature class T4 components is 1.3watts at an ambient temperature range of from -20°C to +40°C.
The electrical energy in the or each electrical circuit typically comprises an electric current. To be intrinsically safe the imaging device typically has power limitations such that the electric current is less than or equal to 0.4amperes and/or the voltage is less than or equal to 8.5volts (V) DC. The electric current may be less than or equal to 0.37amperes (A). The voltage is typically less than or equal to 5volts DC.
An electric current of less than or equal to 0.37amperes and/or a voltage of less than or equal to 5volts DC typically renders the current or voltage respectively nonincendiary, that is not incendiary and therefore not capable of causing a fire.
The power of the electrical energy in the or each electrical circuit is typically equal to or less than 1,8watts. The power of the electrical energy may be equal to or greater than 0.5watts. The power of the electrical energy is typically 1.3watts. This typically means the electrical energy, and therefore the imaging device, is intrinsically safe. The visible image sensor and/or the thermal image sensor are normally operable with a maximum power of 1,3watts and/or a minimum power of 0.5watts. The whole of the visible image sensor and/or the thermal image sensor may have these maximum, minimum and/or typical wattages or these values may apply to separate blocks and/or parts of the visible image sensor and/or the thermal image sensor.
The imaging device may include a processor for processing data collected by the visible image sensor and/or thermal image sensor. The processor may process the data so that it is suitable for displaying on an electronic visual display or screen.
The visible image sensor may be referred to as an active-pixel sensor (APS). The visible image sensor typically comprises an array of pixel sensors, each pixel sensor comprising a photodetector and an amplifier. The visible image sensor is typically a Complementary Metal-Oxide Semiconductor (CMOS) sensor.
The visible image sensor is typically certified as intrinsically safe as defined in IEC 60079-0 and/or IEC 60079-11 standards.
The surface of the thermal image sensor may include a series of heat sensors comprising vanadium oxide or amorphous silicon. The thermal image sensor may include a layer of silicon. The thermal image sensor may be a bolometer, typically a microbolometer. The microbolometer may be an infrared Focal Plane Array (FPA) detector. The FPA may comprise a plurality of light sensing pixels at a focal plane of the lens of the thermal detector. The thermal image sensor may comprise an array of individual pixels. There may be 320 x 240 pixels.
The thermal image sensor is typically adapted to measure the temperature of an object in front of it and/or the lens of the thermal detector. This may be in addition to detecting infrared radiation emitted by an object. The thermal image sensor may take into account the objects emissivity, ambient humidity, reflected temperature and the distance between the object and the thermal image sensor. FPA detectors often degrade over time caused by ‘drift’ in the array. When this degradation occurs, an accurate recording of the thermal image of an object may not be possible. A Non-uniformity Correction (NUC) may be used to recalibrate the array. The NUC may correct the Fixed Pattern Noise (FPN) of the array or data collected by the thermal imager. FPN is a characteristic of thermal imagers and causes image degradation.
It may be an advantage of the present invention that the image seen and/or produced by the visible image sensor is the same or at least substantially the same as the image seen and/or produced by the thermal image sensor because these images can be used to reduce Fixed Pattern Noise (FPN). Known Fixed Pattern Noise patterns of the thermal image may be used with the digital image to perform a Non-Uniformity Correction (NUC) of the thermal image.
Parameters of the Non-Uniformity Correction (NUC) may be defined and/or controlled by a controller board. The controller board may measure and/or control one or more of the voltage, inductance and capacitance of electrical energy in the electrical circuit. A third power domain may comprise the controller board.
It may be an advantage of the present invention that one or more of the voltage, capacitance and inductance of electrical energy in the electrical circuit is useable to provide a power budget to power the visible image sensor and/or the thermal image sensor.
The imaging device may be housed in a casing. The casing may be spark-proof, that is the casing comprises a material that is not damaged by sparks. The casing may be shockproof, that is the casing can withstand the impact of being dropped from a height up to 2meters onto a hard surface.
The resistor may be a current limiting resistor and may be used to limit the electrical energy and/or power in the electrical circuit. The resistor may have one or more of a resistance of less than or equal to 12.7ohms, a resistance of 12.7ohms, a power rating of less than or equal to 0.75W, a power rating of 0.75W and a size of 2010. The resistor may dissipate the electrical energy as heat.
The capacitor may store the electrical energy in the form of an electric field. Using the capacitor, the inductance of the electrical energy may be reduced to 3millihenrys (mH). The reduced inductance of the electrical energy may satisfy the requirements of BS EN 60079-11 10.1.5.2. The inductance of the electrical energy may be suitable for use in an explosive atmosphere. The inductance of the electrical energy may satisfy the requirements of BS EN 60079-10.
The electric current of the electrical energy in the or each electrical circuit may be less than 50% of the allowed capacitance defined in table A.2 1 of standard IEC 60079-11.
The or each electrical circuit may comprise an inductor.
When the voltage in the or each electrical circuit is less than 5volts, the capacitance is normally equal to or less than 100microfarad (pF), optionally equal to or less than 50microfarad, and the inductance is normally equal to or less than 50microhenries (pH). The tolerance of the inductor is typically equal to or greater than 1 %. The inductor is typically derated by a factor of equal to or greater than 0.5.
The diode may allow the flow of electrical energy in a first direction and/or may restrict the flow of electrical energy in a second direction. The second direction may be opposed to the first direction.
The voltage in the electrical circuit may be less than or equal to 4.5volts. The resistance in the electrical circuit may be less than or equal to 55ohms. Typically the electrical circuit has an external resistance of less than or equal to 24ohms. The external resistance may be the resistance of an electrical charge that a surrounding environment, that may be an explosive environment and/or surrounding electronic equipment, may be exposed to.
The imaging device and/or electrical circuit of the imaging device may comprise two or more protection systems. The two or more protection systems may be in parallel in the electrical circuit. The two or more protection systems may comprise the resistor of the electrical circuit.
The inductance and the electrical energy may be suitable for use in an explosive atmosphere. The inductance and the electrical energy may satisfy the requirements of BS EN 60079-10. Using the capacitor, the inductance may be reduced to 6millihenrys. The reduced inductance may satisfy the requirements of BS EN 60079-11 10.1.5.2.
The source of electrical energy may be referred to as a power supply. The source of electrical energy is typically a battery. There is typically only one source of electrical energy operably connected to one or both of the visible image sensor and the thermal image sensor and the electrical circuit. It may be an advantage of the present invention that the typically only one source of electrical energy accounts for less of the overall size of the imaging device and/or the imaging device is less complicated and therefore normally more robust.
Each of the power domains, optionally first and second power domains and typically five power domains, may each have their own power budget. Each power budget typically comprises one or more of a predetermined current, inductance, capacitance and voltage of the electrical energy in the electrical circuit.
Each of the power domains, optionally first and second power domains and typically five power domains, may be individually protected. They may be individually protected with infallible tracking.
Each of the power domains, optionally first and second power domains and typically five power domains, normally have at least one barrier therebetween. The at least barrier may optionally be between the visible image sensor and/or the thermal image sensor and the electrical circuit.
The at least one barrier typically comprises at least one diode. The at least one diode may be referred to as a shunt protection diode. The at least one diode typically complies with standard IEC 60079-11, and may be clause 8.6.1 and/or clause 9 of standard IEC 60079-11. The at least one diode may be a zener diode and typically a 4.7volt zener diode. The zener diode typically complies with standard I EC 60079-11, and may be clause 5.3 of standard IEC 60079-11.
The at least one barrier optionally comprises at least one inductor. The at least one inductor typically comprises a 4.7volt zener clamp.
The imaging device may further comprise a Radio-frequency identification (RFID) tag. The RFID tag is typically incorporated into the imaging device. It may be an advantage of the present invention that the visible image sensor, thermal image sensor and a RFID tag are powered by the one source of electrical energy. The resulting imaging device is typically therefore robust.
The RFID tag may be used to transmit and/or receive data. The data transmitted and/or received by the RFID tag may be used to correct the transmission irregularities of the thermal image produced by the thermal image sensor. The data transmitted and/or received by the RFID tag may be used to one or more of turn on a flash, change an exposure, change the brightness. The data transmitted and/or received by the RFID tag may be a number that relates to a data file that contains the required information.
According to a second aspect of the present invention there is provided a method of obtaining an image in a hazardous environment, the method including the steps of: providing a visible image sensor and a thermal image sensor; providing a source of electrical energy operably connected to one or both of the visible image sensor and the thermal image sensor by an electrical circuit; providing one or more of a capacitor, a diode, and a resistor in the electrical circuit; and passing the electrical energy through the one or more of the capacitor, diode, and resistor in the electrical circuit to reduce one or more of the capacitance, voltage, and inductance of the electrical energy in the electrical circuit.
The method typically further comprises the step of a Non-Uniformity Correction (NUC) of an image obtained from the thermal image sensor. The method normally further comprises the step of using a visible image obtained from the visible image sensor to perform a Non-Uniformity Correction (NUC) of an image obtained from the thermal image sensor.
The method may provide a way of safely correct the Fixed Pattern Noise (FPN) of the array or data collected by the thermal imager when the visible image sensor and thermal image sensor are in a hazardous environment. The method may be intrinsically safe. The hazardous environment may be an explosive environment.
Optional features of the first aspect of the present invention may be incorporated into the second aspect of the present invention and vice versa.
An embodiment of the present invention will now be described, by way of example only, with reference to accompanying Figure 1.
Figure 1 shows an imaging device 10. The imaging device 10 comprises a visible image sensor 12 and a thermal image sensor 14. A source of electrical energy 16 is operably connected to both the visible image sensor 12 and the thermal image sensor 14 by an electrical circuit 18. The source of energy 16 is a battery.
The electrical circuit 18 comprises a capacitor, a diode and a resistor (not shown). The capacitor, diode and resistor reduce the capacitance, voltage and inductance of the electrical energy in the electrical circuit 18.
The visible image sensor 12 is a Complementary Metal-Oxide Semiconductor (CMOS) sensor. The thermal image sensor 14 is an infrared Focal Plane Array (FPA) detector. The visible image sensor 12 and the thermal image sensor 14 are stacked on top of one another. The visible image sensor 12 and the thermal image sensor 14 are therefore aligned in two dimensions. The image produced by the visible image sensor 12 is therefore substantially the same as the image produced by the thermal image sensor 14. The combined output is a ‘picture in a picture’.
The imaging device is intrinsically safe, that is the imaging device is safe for operation in a hazardous and/or explosive atmosphere. The imaging device is intrinsically safe because the electrical energy supplied to the visible image sensor and thermal image sensor is not a potential source of ignition and in use, the electrical energy passes through the capacitor, diode, and resistor.
The electrical circuit 18 comprises five separate electrical circuits referred to as power domains (not shown). A first power domain comprises the visible image sensor 12. A second power domain comprises the thermal image sensor 14. The first and second power domains are separate.
Each power domain carries electrical energy with a voltage of less than or equal to 5volts DC, a current of less than or equal to 0.37amperes and a power of less than or equal to 1.8watts. The electrical energy is therefore nonincendiary, that is not incendiary and therefore not capable of causing a fire and is intrinsically safe.
When the voltage of the electrical energy in each power domain is equal or less than 5volts(V), the capacitance is equal to or less than 100microfarad(pF), the inductance is equal to or less than 50microhenries(pH) and the resistance is equal to or less than 55ohms(Q).
The imaging device 10 also has a controller board (not shown) in electrical communication with the electrical circuit 18. The controller board is used to define parameters of the Non-Uniformity Correction (NUC), and control the voltage, inductance and capacitance of electrical energy in the electrical circuit 18.
The resistor (not shown) is a current limiting resistor and is used to limit the electrical energy and power in the electrical circuit 18. The resistor has a resistance of 12.7ohms, a power rating of 0.75W and a size of 2010.
The capacitor (not shown) stores the electrical energy in the form of an electric field. Using the capacitor, the inductance of the electrical energy is 3millihenrys or less.
The diode (not shown) is a 4.7volt zener diode.
In use the imaging device 10 monitors the condition of electrical equipment. The thermal image sensor 14 is used to monitor for and measure infrared radiation and therefore heat produced by the electrical equipment. The imaging device 10 converts these measurements into a visible image. The visible image sensor 12 provides a visible digital image of the same electrical equipment. The imaging device 10 displays the image produced for the user and uses the image for Non-uniformity Correction (NUC) of Fixed Pattern Noise (FPN) of the data and therefore image produced by the thermal imager.
Non-uniformity Correction of a thermal image usually requires a shutter disposed between the thermal image sensor and a lens of the thermal detector. The shutter is typically used to recalibrate the sensor. The shutter may be referred to as a paddle. The shutter or paddle typically provides a flat reference image and typically has a surface with high emissivity, that is an emissivity close to 1. The surface may be one or more of black, be roughly textured, and have a matt-finish.
Importantly for this invention, movement of a shutter is typically mechanical and would require an electric motor. The electric motor would typically require a significant amount of power and/or capacitance and/or inductance. The motor and shutter or paddle would also require a significant amount of space.
It may be an advantage of the imaging device 10 of the present invention that the Non-Uniformity Correction of the thermal image does not require a shutter and therefore the voltage, capacitance and inductance of electrical energy in the electrical circuit can be reduced and/or the voltage capacitance and inductance of electrical energy in the electrical circuit is intrinsically safe.
Modifications and improvements can be incorporated herein without departing from the scope of the invention.

Claims (23)

1. An imaging device comprising: a visible image sensor; a thermal image sensor; and a source of electrical energy operably connected to one or both of the visible image sensor and the thermal image sensor by an electrical circuit; wherein the electrical circuit comprises one or more of a capacitor, a diode, and a resistor and the one or more of the capacitor, diode, and resistor reduce one or more of the capacitance, voltage, and inductance of the electrical energy in the electrical circuit.
2. An imaging device according to claim 1, wherein the visible image sensor and a lens are component parts of a visible detector.
3. An imaging device according to claim 1 or claim 2, wherein the thermal image sensor and a lens are component parts of a thermal detector.
4. An imaging device according to any preceding claim, wherein the visible image sensor and the thermal image sensor are aligned in two dimensions.
5. An imaging device according to any preceding claim, wherein the visible image sensor detects radiation having a wavelength of from 380 to 760nm.
6. An imaging device according to any preceding claim, wherein the thermal image sensor detects radiation having a wavelength of from 750nm to 1mm.
7. An imaging device according to any preceding claim, wherein the electrical circuit comprises two or more electrical circuits.
8. An imaging device according to any preceding claim, wherein the electrical circuit comprises five separate electrical circuits.
9. An imaging device according to any preceding claim, wherein maximum power available to the visible image sensor or the thermal image sensor is 1.3watts.
10. An imaging device according to any preceding claim, wherein electric current of the electrical energy is less than or equal to 0.4amperes.
11. An imaging device according to any preceding claim, wherein the voltage of the electrical energy is less than or equal to 5volts DC.
12. An imaging device according to any preceding claim, wherein power of the electrical energy is equal to or less than 1.8watts.
13. An imaging device according to any preceding claim, wherein the visible image sensor is a Complementary Metal-Oxide Semiconductor (CMOS) sensor.
14. An imaging device according to any preceding claim, wherein the thermal image sensor is a bolometer.
15. An imaging device according to any preceding claim, wherein in use a Non-Uniformity Correction (NUC) is used to recalibrate the array.
16. An imaging device according to any preceding claim, wherein the resistor has one or more of a resistance of less than or equal to 12.7ohms, a power rating of less than or equal to 0.75W, and a size of 2010.
17. An imaging device according to any preceding claim, wherein the capacitance of the electrical energy is equal to or less than 100microfarad.
18. An imaging device according to any preceding claim, wherein the inductance of the electrical energy is less than or equal to 3millihenrys.
19. An imaging device according to any preceding claim, wherein the imaging device further comprises a Radio-frequency identification (RFID) tag.
20. An imaging device according to claim 19, wherein the RFID tag is usable to transmit or receive data, the data usable to correct transmission irregularities of the thermal image producible by the thermal image sensor.
21. A method of obtaining an image in a hazardous environment, the method including the steps of: providing a visible image sensor and a thermal image sensor; providing a source of electrical energy operably connected to one or both of the visible image sensor and the thermal image sensor by an electrical circuit; providing one or more of a capacitor, a diode, and a resistor in the electrical circuit; and passing the electrical energy through the one or more of the capacitor, diode, and resistor in the electrical circuit to reduce one or more of the capacitance, voltage, and inductance of the electrical energy in the electrical circuit.
22. A method of obtaining an image in a hazardous environment according to claim 21, wherein the method further comprises the step of a Non-Uniformity Correction (NUC) of an image produced by the thermal image sensor.
23. A method of obtaining an image in a hazardous environment according to claim 21, wherein the method further comprises the step of using a visible image produced by the visible image sensor to perform a Non-Uniformity Correction (NUC) of an image produced by the thermal image sensor.
GB1517277.8A 2015-09-30 2015-09-30 Imaging device Withdrawn GB2542814A (en)

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GB2542814A true GB2542814A (en) 2017-04-05

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