KR101417765B1 - A deterioration diagnosing system for a distributing board using the IR image of 2 Dimensional thermopile array and the method thereof - Google Patents

Abstract

The present invention relates to a deterioration diagnosis system for each facility area of an incoming panel with a 2D thermophile array infrared thermal image and a method thereof. The deterioration diagnosis system comprises an array sensor unit which obtains a thermal image by sensing the temperature of an incoming panel, and a monitoring device which analyzes the thermal image and determines abnormality in the incoming panel by each facility area of the incoming panel. The monitoring device comprises a sensor receiving unit which receives the thermal image from the array sensor unit; a storing unit which stores a facility composition image which shows the facility area of the incoming panel; an image dividing unit which matches the facility composition image and the thermal image and divides the thermal image for each facility area according to the facility area of the facility composition image; and an abnormality determining unit which measures the temperature for each facility area from the thermal image and determines the abnormality of the incoming panel by using the temperature for each facility area. Accordingly, it is possible to determine abnormality according to the structure of an incoming panel by using a 2D thermophile array sensor, thereby monitoring the deterioration of an extra-high voltage incoming panel and a high voltage incoming panel by using a deterioration monitoring method.

Description

BACKGROUND OF THE INVENTION 1. Field of the Invention [0001] The present invention relates to a two-dimensional thermopile array infrared thermal imaging system and a method thereof,

A two-dimensional thermopile array sensor is used to detect the abnormality according to the structure of a switchboard. By this, it is possible to observe all the deterioration of special high voltage and high voltage switchgear, low voltage switchboard, distribution board, The present invention relates to a deterioration diagnosis system and a method thereof for a facility area of a switchboard using a two-dimensional thermopile array infrared image.

Generally, the switchgear is able to supply extraordinary high voltage power at a wide range of power consumers such as APT, building, school, factory, port, airport, sewage treatment plant, substation, heavy industrial plant, subway, chemical complex, And is installed in a water distribution system for supplying power to the facility, and is used for power monitoring, control and protection.

The switchgear is divided into a high voltage switchgear used for the 3.6 kV or 7.2 kV power distribution system and a special high voltage switchable for 22.9 kV, 24 kV, 25.8 kV, and a low voltage switchboard, Control panel. In addition, the switchgear can be used in gas insulated switchgear (C-GIS), metal clad switchgear (MCSG), and high voltage And a compartment switchgear (Medium Compartment Switchgear).

In order to improve the quality of safety and durability, these switchboards are designed with a focus on functionality and safety by accommodating a vacuum circuit breaker (VCB) with excellent blocking performance, or they are designed to be powerful and convenient in spite of its compact size. It is being developed to make the maintenance of the switchboard easier.

The interior of such a switchboard can be generally divided into a high-voltage side and a low-voltage side. In addition, when referring to the facility, the power supply company KEPCO, A transformer that changes the electricity to the voltage or capacity required by the factory or user, or a power distribution unit that has a circuit breaker that protects the entire equipment from an accident such as a short-circuit accident.

Conventionally, in order to measure the temperature and deterioration degree of the electric power facilities including the high-voltage and high-voltage switchgear, the low-voltage switchboard, the distribution board, and the motor control panel, it is necessary to use a temperature sensor or a thermal camera The temperature is measured and the deterioration state is checked by the projection, and only the periodical measurement is performed according to the prescribed inspection standard, and the state of the appearance is estimated by checking only the appearance state by the neck. Therefore, there is a problem in that it is not possible to prevent accidents caused by the soundness and deterioration of the water distribution equipment.

In order to solve such a problem, there have been proposed techniques for non-contact measurement of the heat temperature of a switchboard using a thermal imaging camera. As an example, a technique has been proposed in which a display device is installed on a panel door of a power distribution panel, a thermal imaging camera is installed inside a panel door, and the internal temperature measured by a thermal imaging camera is displayed on a panel door display device [ ]. A thermal imaging camera is mounted in a switchboard to monitor the constantly-installed switchboard. An average pixel difference between a thermal sensing portion and a neighboring portion of the thermal sensing portion of the image captured by the thermal imaging camera is obtained. A technology for detecting abnormal situations only is proposed [Patent Document 2].

However, since the thermal imaging camera captures the heat of the various components in the switchboard as a whole, it is necessary to distinguish the temperature of each component or determine the abnormality detection temperature differently. However, the prior art does not solve such a problem.

On the other hand, there is a technique of inserting a temperature tube at the bus-bar connection terminal of the switchboard and acquiring the change of color of the temperature tube by the heat of the terminal part through the camera to check the heat of the bus- However, [Patent Document 3] has a problem that a temperature tube must be separately installed.

[Patent Document 1] Korean Patent No. 10-0947785 (Announcement of Mar. 15, 2010) [Patent Document 2] Korean Patent No. 10-0984679 (issued on October 1, 2010) [Patent Document 3] Korean Patent No. 10-1190244 (issued October 12, 2012)

An object of the present invention is to solve the above-mentioned problems, and it is an object of the present invention to provide a two-dimensional thermopile array sensor capable of discriminating an abnormality according to a structure of an extra high voltage and high voltage switchgear, a low voltage switchgear, The present invention provides a deterioration diagnosis system and method for a facility area of a switchboard using a two-dimensional thermopile array infrared ray image that matches an image image to a structural image of a switchboard and determines whether or not an abnormality exists in each part of a switchboard.

In order to achieve the above object, the present invention relates to a two-dimensional thermopile array thermal image-based installation and dismantling system (including a special high-voltage and high-voltage switchgear, a low-voltage switchgear, a distribution board and a motor control panel) deterioration monitoring system, An array sensor unit for sensing a thermal image to acquire a thermal image; And a monitoring device for analyzing the thermal image to determine the presence or absence of an abnormality inside the power-distribution panel in accordance with a facility area of a switchboard, the monitoring device comprising: a sensor receiver for receiving the thermal image from the array sensor; A storage unit for storing a facility configuration image representing a facility area of the power distribution panel; An image classification unit for performing image matching with respect to the facility configuration image and the thermal image and dividing the thermal image into zones according to a facility area of the facility configuration image; And an abnormality determination unit for determining a temperature for each facility area from the thermal image and determining the abnormality of the power plant by using the temperature for each facility area.

According to another aspect of the present invention, there is provided a system for diagnosing deterioration in a facility area of a switchboard using a two-dimensional thermopile array infrared ray image, wherein the image classification unit finds minutiae corresponding to each other in the image of the facility image and the thermal image, The facility image is adjusted so that the size and the view of the image coincide with the image of the thermal image using the minutiae points and the image of the thermal image is divided into zones according to the facility area of the adjusted facility image .

According to another aspect of the present invention, there is provided a system for diagnosing deterioration in a facility area of a switchboard using a two-dimensional thermopile array infrared ray image, wherein the image segmenting unit obtains an edge from an image of the equipment configuration image and the thermal image, (Hereinafter referred to as a characteristic edge) that matches in the edge and finds a characteristic point within the characteristic edge.

According to another aspect of the present invention, there is provided a system for diagnosing deterioration of an installation area of a switchboard using a two-dimensional thermopile array infrared ray image, the system comprising: And comparing the region of the pixel portion that is higher than the temperature belonging to the upper portion among the images of the pixels.

According to another aspect of the present invention, there is provided a system for diagnosing deterioration of an installation area of a switchboard using a two-dimensional thermopile array infrared ray image, wherein the image division unit matches an equipment image with respect to one image in the thermal image, And the remaining image of the thermal image is continuously divided into the obtained facility area.

Further, the present invention provides a system for diagnosing a deterioration in a facility area of a switchboard using a two-dimensional thermopile array infrared ray image, wherein the abnormality determination unit sets a critical temperature for each facility of the switchboard, And comparing the measured temperature with the critical temperature of the facility disposed in the corresponding area to determine whether or not the facility is abnormal.

In addition, the present invention provides a system for diagnosing deterioration in a facility area of a transmission / reception panel using a two-dimensional thermopile array infrared ray image, wherein the abnormality determination unit calculates a slope of a temperature change for each region in the thermal image, And the slope is compared with a predetermined threshold slope to determine whether or not the facility is abnormal.

In addition, the present invention is characterized in that, in a deterioration diagnosis system for each installation area of a transmission and reception panel using a two-dimensional thermopile array infrared ray image, the critical slope is set differently for each area.

Further, the present invention is a system for diagnosing deterioration of a facility area of a switchboard using a two-dimensional thermopile array infrared ray image, wherein the abnormality determination unit measures the temperature of each region in the thermal image, The temperature difference between the equipments is calculated, and the temperature difference is compared with a predetermined threshold temperature difference to determine the abnormality of the equipments.

The present invention also relates to a two-dimensional thermopile array for receiving thermo-image data obtained by sensing the temperature inside a switchboard from a two-dimensional thermopile array sensor and judging the abnormality of the power- A method for diagnosing star deterioration, comprising the steps of: (a) receiving a thermal image from the array sensor; (b) finding feature points corresponding to each other in an image of the thermal imaging image and a previously stored facility configuration image; (c) adjusting the facility configuration image so that the size and the viewpoint of the image match the image of the thermal image using the feature points; (d) dividing the image of the thermal image into regions corresponding to the equipment area of the adjusted facility configuration image; (e) obtaining a temperature for each facility region from the thermal image; And (f) judging whether or not there is an abnormality in the power plant by using the temperature for each facility area.

As described above, according to the system and method for deterioration diagnosis of the installation area of a transmission and reception panel using infrared thermography of a two-dimensional thermopile array according to the present invention, a two-dimensional thermopile array sensor can be used to detect the abnormality It is possible to observe all of the deterioration of the special high-voltage switchboard and the high-voltage switchboard by one deterioration monitoring method.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a block diagram of a configuration of a deterioration diagnosis system according to an embodiment of the present invention; FIG.
2 is a block diagram of a configuration of a thermopile array sensor unit according to the present invention;
3 is a block diagram of a two-dimensional thermopile array sensor according to an embodiment of the present invention.
4 is a configuration circuit diagram of an array sensor unit according to an embodiment of the present invention;
5 illustrates a method of reading a signal from a sensor array according to the present invention.
6 is a configuration diagram of a power supply bias supply circuit of the image processing unit according to the present invention;
7 is a flowchart for explaining a method of improving the quality of deterioration image by the image processing unit according to the present invention.
FIG. 8 is a graph illustrating a principle of histogram conversion and improvement in contrast ratio according to a thermal image processing method according to the present invention.
9 is a configuration diagram for transmitting data in the thermal image sensor module according to the present invention.
10 is a configuration diagram of a serial peripheral interface (SPI) serial interface between a sensor module (SENSOR) and an external controller (μC) according to the present invention.
11 is a flowchart illustrating a method of transmitting sensor value data from an external controller (μC) to a sensor module according to the present invention.
13 is a table showing commands in the sensor module according to the present invention;
FIG. 14 is a flowchart for explaining a control method in a power / room deterioration monitoring system according to an embodiment of the present invention; FIG.
15 is a table showing header and transmission format of correction data of sensed temperature according to an embodiment of the present invention;
16 is a graph for explaining current temperature calculation using a temperature offset according to the present invention.
17 is a front view of the enclosure of the thermal image monitoring system according to the present invention.
18 is an alarm screen of the user interface according to the present invention;
FIG. 19 is a block diagram of a configuration of a monitoring device of a deterioration diagnosis system according to a second embodiment of the present invention, using a two-dimensional thermopile array infrared ray image. FIG.
FIG. 20 is an example of an image of a facility configuration according to the present invention. FIG.
FIG. 21 is a flowchart for explaining a method of diagnosing deterioration of an installation area of a power plant using infrared thermography of a two-dimensional thermopile array according to a third embodiment of the present invention. FIG.
22 is a table showing critical temperatures for each facility according to the third embodiment of the present invention.
FIG. 23 is a flowchart for explaining a method of diagnosing deterioration of an installation area of a switchboard using a two-dimensional thermopile array infrared image according to a fourth embodiment of the present invention. FIG.
FIG. 24 is a flowchart for explaining a method for diagnosing deterioration of an installation area of a switchboard using a two-dimensional thermopile array infrared image according to a fifth embodiment of the present invention; FIG.
25 is a table showing a threshold temperature difference according to the fifth embodiment of the present invention.
26 is a view showing an example of a point temperature sensing method by an infrared sensor according to the related art;
FIG. 27 is a flowchart for explaining a method for diagnosing deterioration of an installation area of a power plant using infrared thermography of a two-dimensional thermopile array according to a sixth embodiment of the present invention; FIG.
28 is an initial temperature distribution of a setting region according to the sixth embodiment of the present invention;
29 is a temperature distribution after a predetermined time of the setting region according to the sixth embodiment of the present invention.
30 is a flowchart for explaining a method for diagnosing deterioration of an installation area of a power plant using infrared thermography of a two-dimensional thermopile array according to a seventh embodiment of the present invention.
31 is a temperature distribution after a predetermined time in a setting region according to the seventh embodiment of the present invention;
32 is a diagram showing an initial area of a setting area and an extended area after a predetermined time according to a seventh embodiment of the present invention;
33 is a flowchart for explaining a deterioration diagnosis method for each installation area of a switchboard using a two-dimensional thermopile array infrared image according to an eighth embodiment of the present invention;
34 is a flowchart for explaining a deterioration diagnosis method for each installation area of a switchboard using a two-dimensional thermopile array infrared image according to a ninth embodiment of the present invention;
35 is a temperature distribution diagram of the setting region after a predetermined time according to the ninth embodiment of the present invention;
36 is a flowchart for explaining a method for diagnosing deterioration of an installation area of a power plant using infrared thermography of a two-dimensional thermopile array according to a tenth embodiment of the present invention;
37 is a graph showing a temperature histogram of a thermal image according to a tenth embodiment of the present invention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described in detail with reference to the drawings.

In the description of the present invention, the same parts are denoted by the same reference numerals, and repetitive description thereof will be omitted.

First, a configuration of a deterioration diagnosis system for each installation area of a switchboard using a two-dimensional thermopile array infrared ray image according to an embodiment of the present invention will be described with reference to FIG.

As shown in FIG. 1, the deterioration diagnosis system according to the embodiment of the present invention includes an array sensor unit 20, a monitoring device (not shown) installed in the switchboard 10, 30, and a remote server 40. In addition, it may further comprise a load factor monitoring device 50 for monitoring the load factor of the monitoring device 30. [ The load factor is obtained as a percentage of the current load power versus the capacity of the transformer.

The array sensor unit 20 is composed of a plurality of array sensors or thermal imagers 21. The array sensor or the thermal imaging camera 21 is installed inside the switchboard 10 to measure the heat of the equipment 11 provided inside the switchboard 10 by an image. Specifically, at least one thermal imaging camera 21 is installed on one side of the interior of the switchboard 10. Preferably, the thermal imaging camera 21 is installed on an inner side surface of the switchgear 10 provided with a door.

The equipment or the equipment 11 provided inside the switchboard 10 can be used for various applications such as a bus bar, a vacuum breaker VCB, a power transformer PT for a meter, a MOF, a load break switch (LBS) , Various mold-type insulation devices, device connection parts, and components requiring insulation deterioration prediction. For example, it is a matter of course that the present invention can be applied to a monitoring device for a facility such as a molded case circuit breaker (MCCB) and various distribution lines, which are low-voltage side constituent devices inside a switchgear.

Meanwhile, the array sensor unit 20 and the monitoring device 30, the monitoring device 30, and the remote server 40 are connected by a network to perform data communication. Preferably, the array sensor unit 20 and the monitoring device 30 are connected to the Internet by the UDP protocol, and the monitoring device 30 and the remote server 40 are connected to the Internet by the TCP protocol.

The array sensor unit 20 is constituted by a sensor for sensing the temperature of the component 11 in the switchboard including the high voltage devices such as the busbar, the breaker, the MOF, the CT, the PT and the transformer as described above. Preferably, the array sensor unit 20 is a thermal imaging camera 21 by a two-dimensional thermopile array sensor. An image photographed by the array sensor unit 20 is a two-dimensional thermal image, which is an internal area image of the photographed switchboard, and each cell value is a numerical value indicating the temperature of the corresponding part. Further, the thermal image displays a color according to the value of each cell or the temperature of each part.

On the other hand, the installation method of the thermal imaging camera 21 can be classified into a fixed type, a rotary type, a mobile type, and the like. In the fixed type, a plurality of cameras are installed in various places in the power switchboard 10 to capture a thermal image of the entire interior.

In the rotary type camera, a camera is installed in one place, and the camera can be rotated up and down and left and right, so that the entire interior of the switchboard 10 can be picked up with a wide viewing angle. In other words, the rotary type enables to measure the temperature of the main apparatus and the relatively high-temperature devices constituting the switchboard at a fixed position. At this time, the fan tilt function is performed at a fixed position to detect heat and image more efficiently . The rotary type can also be used by installing a number of cameras. In the case of a rotary type, the pan tilt range of the thermal imaging camera 200 is in the range of 70 degrees, and the thermal imaging camera has a deterioration detection range angle of 45 degrees upward and downward, respectively. Therefore, since the deterioration detection range of the thermal imaging camera can detect the deterioration of the main switchboard in a range of about 160 degrees as a whole, assuming that the main switchboard structure is installed at the top after the switchboard, it has a detection range exceeding the range of the switchboard.

Also, in case of mobile installation, unlike the case where a plurality of thermal imaging cameras are fixedly installed, the temperature is measured by remotely moving the components between the relay and control panels.

Next, the monitoring apparatus 30 receives the thermal image from the array sensor unit 20, and analyzes the received thermal image to determine whether or not an abnormality exists. The monitoring device 30 stores an image of a layout configuration or a layout configuration for the area inside the switchboard 10 and separates the thermal image according to the configuration of the switchboard using the stored layout configuration diagram. Then, the monitoring device 30 calculates the average temperature of the corresponding region for each of the separated images, compares the average temperature with the reference temperature, or obtains the temperature increase value to determine whether or not there is an abnormality. In addition, the monitoring device 30 displays the thermal image on the display or notifies the manager of the detection of the abnormality when the abnormality is detected.

Preferably, the monitoring device 30 may be attached to the switchboard 10. For example, the array sensor unit 20 can be installed inside the switchboard 10, and the monitor device 30 can be installed outside the switchboard 10. At this time, a thermal image is acquired from the internal thermal camera 21, and the monitor 30 analyzes the image to determine whether or not there is an abnormality in the server 10.

The remote server 40 is a device having a computing processing function such as a personal computer (PC) or a server device. The remote server 40 is connected to the monitoring device 30 via a network, and receives thermal image data or judged data from the monitoring device 30 .

The remote server 40 can share the role with the monitoring device 30 and can process it. For example, the monitoring device 30 may obtain a thermal image in real time and perform only a simple comparison to monitor the abnormality. The remote server 40 obtains the area of the component equipment in the thermal image, And performs functions such as setting or managing the functions of the display device. In particular, the remote server 40 has excellent performance such as data storage capacity and computing ability, and the monitoring apparatus 30 may be inferior in performance to the remote server 40 as equipment installed in the field. In consideration of such a difference in performance, the functions between the remote server 40 and the monitoring apparatus 30 can be shared. Hereinafter, it will be described that the monitoring device 30 performs all the above functions.

Further, the monitoring device 30 is connected to the load factor monitoring device 50 to monitor the load factor.

Next, the configuration of the two-dimensional thermopile array sensor 21 according to one embodiment of the present invention will be described in more detail with reference to FIG. 2 to FIG.

2 is a block diagram of an entire configuration of the two-dimensional thermopile array sensor 21. As shown in FIG.

2, the two-dimensional thermopile array sensor 21 used as a thermal imaging camera includes a lens unit 210, a pixel array unit 220, a signal processing unit 230, and an image processing unit 240 . In addition, it may further comprise a display unit 250 for outputting a thermal image.

FIG. 3 shows the configuration of a lens unit and a pixel array around a lens. FIG. 4 shows a configuration of the pixel array unit 220, the signal processing unit 230, An image processing unit 240, and the like.

The two-dimensional thermopile array sensor 21 focuses the optical information of the object on the infrared detector in order through the infrared optical system, the infrared detector changes the optical information into the electrical signal difference, The image is reproduced.

As shown in FIG. 3, the lens unit 210 is composed of a lens that collects infrared rays. Particularly, the lens unit 210 is composed of a high-performance germanium double lens or a silicon single lens. Preferably, it has a viewing angle of 90 degrees. The FOV is calculated by the following equation according to the optical rule.

[Equation 1]

f = focal length of the lens

P = pitch of pixel portion

N _{Col / Row} = number of pixels in the pixel portion, which depends on whether the FOV is vertical or horizontal.

Similarly, given a FOV, the focal length is calculated as follows.

&Quot; (2) "

In addition, the pixel array unit 220 includes a thermopile pixel array 221 composed of a plurality of thermopile pixels and a PCB substrate 222 for generating measured values in each cell as a thermal temperature array. The pixel array 221 is a cell that senses heat through an infrared ray or the like and is designed as a lens configuration of the lens unit 210. [ That is, the field of view (FOV) of the lens and the size of the pixel array are determined. The PCB substrate 222 is composed of a bias correction circuit for each cell, a control / timing circuit, and a multiplexer of an array matrix.

As shown in FIG. 4, the pixel array unit 220 is a photodiode unit that detects analog infrared (IR) signals and converts them into electrical signals. The signal processing unit 230 converts the generated electrical signals into image signals It is a readout circuit that reads out sequentially.

The readout circuit of the signal processing unit 230 is provided with a highly integrated silicon substrate, and the integration of the time delay integration and the detection signal is processed by a capacitor switching method using CMOS

The two-dimensional sensor array signal detection in the signal processing unit 230 can be largely divided into three types, namely, a pixel-by-pixel method, a serial method and a column-wise method. In accordance with the electrical characteristics of the infrared sensor, And the chip interview and the power consumption, the system is selected in an appropriate manner.

In the pixel-wise processing method, each pixel is composed of the detection element D, the amplifier A, and the integrator I, and the voltage signal due to the resistance change of the detection element is amplified and integrated through the amplifier and the integrator. The advantage of the pixel-wise method is that the detection bandwidth can be reduced and the configuration of the control circuit for signal detection is simple. However, since the detection element, the amplifier and the integrator are required for each cell, the power consumption is very high and the chip area There is a disadvantage that it occupies a lot.

The serial method is a method of controlling the reading order of the detection circuit by placing only a switch in each cell. Since the above method uses only one amplifier and an integrator, the detection circuit can be simplified and miniaturized, and power consumption is also remarkably reduced. However, since the number of cells to be burdened by one detection circuit is large, the detection bandwidth is very high and the total noise voltage is also increased.

A column-wise processing method combining the above two methods is implemented.

As shown in FIG. 5, the column-wise manner of the signal processing unit 230 according to the present invention reads a line from the detecting element D one row at a time. Thus, the signal processing unit 230 amplifies the signal by the amplifier I in units of one row, and integrates the signal by the integrator I.

The column-wise detection method as described above has a power consumption lower than that of the pixel-wise method, takes up a small chip area, has a detection bandwidth lower than that of the serial method, and has an advantage of high resolution.

Next, the configuration of the power supply bias supply circuit of the image processing unit 240 will be described with reference to FIG.

As shown in FIG. 6A, in a signal processing unit and an image processing unit (image signal processor) circuit interfaced to an MCU (machine control unit), when the external DC bias reference power source and the in-phase signal power source are changed, The temperature data value changes and acts as an error cause.

As shown in FIG. 6A, an input signal of a common mode voltage VCMC and a reference power supply V _REF are implemented using a capacitor 470nF.

6B, a voltage reference IC is implemented by using the LM4041. In this case, the reference power source V _REF is designed so as not to exceed 1.225V Respectively. Here, the in-phase signal voltage is designed to be adjustable using the variable resistor R4 so as to generate a low impedance voltage.

The valid data VS sampled from the circuit is connected to trigger the interrupt service routine of the MCU and generates a clock frequency of 1 MHz by means of a timer function.

In FIG. 6B, terminals CONT, SCLK_ASIC and DATA_ASIC of the image signal processor are connected to the digital input / output terminals of the MCU, and OUT_A1 and OUT_A2 are connected to the AD converter.

Internal reference voltage is applied when SBY = LOW when terminal SBY is in the standby state, and external reference voltage is applied when SBY = HIGH.

Next, a description will be given of a method of improving the image quality of the deterioration image by the image processing unit 240 of the array sensor 21 with reference to FIG.

A thermal image is an image having a low contrast ratio because the concentration distribution is concentrated on a partial area. If the contrast ratio is low, the image is not sharp and the object becomes difficult to identify. Therefore, the image quality should be improved by adjusting the contrast ratio component to the maximum. In order to improve the image quality, a method for enhancing the image quality using the histogram and the density distribution of the image is implemented in the image processor.

A histogram smoothing method is a density conversion method that is often used in general image processing. This method improves the contrast ratio by making the concentration distribution flat. It is a method in which the relative density distribution magnitudes on the histogram are compared and spread evenly over the entire area. This method is simple and has excellent contrast ratio effect, so it is widely used for general visible light image processing. However, a region having a small concentration distribution spreads less than a relatively large region, and in some cases, it can be reduced rather than a region of a circle concentration distribution. If there is an important object or target in a region with a small concentration distribution, identification becomes difficult, and if histogram smoothing is applied to a thermal image as it is, image quality may deteriorate.

In the present invention, an adaptive density distribution conversion method of the histogram variable method is designed as a method of improving the contrast ratio suitable for the density distribution of the thermal image.

This method does not compare all the histogram sizes when comparing density distribution, but limits the size level appropriately according to the image. That is, it limits the size of the histogram and prevents the large area from expanding excessively.

FIG. 8 shows the principle of the histogram conversion and the contrast ratio improvement according to the thermal image processing method according to the present invention.

First, the basic histogram function is obtained from the input image, and the histogram size is limited to the specific value P over the entire area. In other words, we obtain a new histogram function of the black part whose histogram size is limited based on the P value. Then, by using the histogram smoothing method using the new variable histogram, the density distribution area of the image is transformed to improve the contrast ratio. As shown in FIG. 8, the regions A and B having different concentration distribution sizes are uniformly spread evenly, and the contrast ratio is effectively improved. Here, the Heise program magnitude adjustment value P may vary depending on the region in which the target is located, from the viewpoint of target identification.

Next, a configuration for transmitting data in the thermal image sensor module of the array sensor unit 200 according to the embodiment of the present invention will be described with reference to Figs. 9 to 13. Fig. The infrared light is detected by the pixel array unit 220, and the converted electric signal is transmitted to the signal processing unit 230. FIG.

As shown in FIG. 9, data transmission / reception between the controller of the sensor module and the MMI device is performed via Ethernet UDP, and the communication interface method is performed using the SPI communication interface.

The communication interface specification is as follows.

Data format: 8 data bits

Frame Sync: None

Module Selection: SS-Pin

Clock Edge Select: The serial output data changes when transitioning from an idle clock to an active clock.

SPI Data Input Acquisition: When the SCK clock (Clock) is in the active phase (SCK clock active state is high level, inactive state is low level)

SCK frequency: 10MHz

As shown in FIG. 10, the sensor module transmits data sensed by an SPI (Serial Peripheral Interface) serial interface method to the external controller (μC). At this time, one sensor module may be connected as shown in FIG. 10 (a), or two or more sensor modules may be connected as shown in FIG. 10 (b).

The SCK signal is bi-directional. This is because the sensor module operates as a master during data transmission. To stop the data transfer, you can either send the 'x' command or turn the SS line off and on. When connecting multiple sensor modules, only one should be selected as a slave. Selecting multiple slaves will result in a collision on the SPI bus and damage to the sensor module.

A method of transmitting sensor value data from the sensor module to the external controller (μC) is as shown in FIG. 11A. At this time, the communication timings of the signals such as SS (Slave Select), SCK (Serial Clock), SDI (Serial Data Input) and SDO (Serial Data Output) of the Serial Peripheral Interface (SPI) serial interface scheme are as shown in FIG. . Fig. 12 (a) shows the communication timing of command reception, and Fig. 12 (b) shows the communication timing of response transmission.

The command is sent as an ASCII value, and each command distinguishes it by appending CL (0x0D), LF (0x0A) to the end. As an example, it is possible to use the commands used for transmission and reception using the ASCII value as shown in FIG.

The method of continuously receiving sensor values is as shown in FIG. 11B. As shown in FIG. 11B, in order to receive the sensor value one time or continuously, the module is switched to the SPI master and the slave as necessary. The external controller is labeled μC and the sensor module is set to master.

One data is transmitted as a 16-bit value. A packet may contain multiple data frames. The UART and SPI devices send the LSB first when sending a 16-bit angle. All data except the packet index is a 16-bit value.

The communication protocol between the controller of the sensor module and the MMI device is summarized in FIG. 11C.

Next, a control method in the power / room deterioration monitoring system according to the embodiment of the present invention will be described in more detail with reference to FIG.

As shown in FIG. 14A, the main process of the control method in the power plant deterioration monitoring system according to the embodiment of the present invention is largely divided into three processes.

The first main process, the second UDP process, and the third UI process.

In the first main process, the timer interrupt service process has a function of transferring a key value read through a key scan process performed at regular intervals to a UDP process or a UI process.

The second UDP process has data transmission / reception between the main controller and the 2D array image sensor module (2D Array Image Sensor Module).

The socket process sends and receives data according to the 2D array image sensor module and the UDP communication protocol through the Ethernet UDP through the control by the SPI interface.

In the third UI process, the LCD display is made up of a draw function for expressing a thermal image, a menu and a data graph, and the like.

Draw function is divided into 5 functions. Among them, Draw Temp Graph function constitutes a function to show the distribution of real time changing temperature in the form of thermal video, always on the screen.

The remaining four functions include the Draw detail main window, the Draw Menu window, the Draw Alarm setting window, the Draw Alarm list window, .

The Draw detail main window function implements functions to configure the temperature histogram or trend screen. In the Draw Menu window function, there is a function to set up a configuration window for controller configuration and alarm setting, to input any arbitrary value, a button to list up the alarm status, and a display window And the like. The "Draw Alarm Setting Window" function implements the function of displaying the setting window and the input window for inputting the alarm setting. The draw alarm list window function records the event when an alarm occurs and implements the function to read and display the recorded contents.

As shown in FIG. 14B, a timer process provides a time value of delay processes necessary for operating the main process. Here, we have 10mSec, 200mSec, and 500mSec timers. Also, in the timer process, the key scan process is processed at intervals of 10 mSec in the timer interrupt service process in order to detect a change in the key values at a constant cycle.

As shown in FIG. 14C, the process for receiving temperature data from the sensor module and processing the image data as image data is as follows.

The temperature data received through the communication layer is converted from a Kelvin temperature value to a Celsius temperature value through a data process and passed to a frame draw process. This Celsius temperature value includes the values classified into three kinds of maximum / minimum / average value.

In the frame draw process, first, the image is transformed into a pixel color corresponding to a temperature value corresponding to each pixel. The histogram data according to the temperature distribution can be displayed in 12 bar graphs from the minimum temperature to the maximum temperature.

Image Rotation In the 90CCW function (Image Rotate 90CCW Function), the original image is sometimes tilted 90 degrees to the right, which implements the function to rotate the image 90 degrees to the left again. The Up Scale Image Function implements the ability to scale an image with a resolution of 32x31 to 226x218 to fit the resolution of a 4.3-inch LCD display.

The Draw Histogram Function implements the ability to draw a histogram graph using the histogram data created so that the previous process can draw 12 bar graphs.

In the Draw trend graph function, three areas are set in advance and the maximum temperature value of each area is calculated. The trend of the maximum temperature is calculated in units of one minute, and the trend graph is displayed for each of the three regions.

Next, a method of correcting sensed temperature data according to an embodiment of the present invention will be described in more detail with reference to FIGS. 15 to 16. FIG.

To obtain the calibration settings of the sensor module, request a single temperature data frame with the 'k' command. At this time, the sensor module automatically reads the setting value used for calibration. After receiving the temperature data frame, request the actual setting value of the device by 'M' command. The response includes the following information.

"PIXCvsTA X, BFL3 X, F814 X, THVsTA X IGNORE_ELOFF X ELOFF32 X SBY Y FC X EXP Z"

Above, X, Y, Z, etc. are constants related to the device. X = "true" or "false", Y = "1" or "0", and Z is a decimal number with two decimal places. Example: "3.47". This constant is stored and then added to the formula.

Next, the correction constant value is requested with the 'w' command. The sensor module will respond to the calibration information shown in Figure 15A. Stores the painted constant value. All stored constant values are named with reference to "constant name". If there are no painted parts in the example sentence and there is no "constant name", you do not need to save it.

Next, a constant or correction data associated with the pixel is transmitted immediately after the header as shown in Fig. 15B. The number of packets (UDP) and the number of lines (UART) are the same as the number of pixels according to the type of device. Each packet / line is as follows.

The pixel number, the temperature 1 (X), the pixel constant 1 (X), the temperature 2 (X), the pixel constant X, the temperature 3 (X), the pixel constant 3 (X) (X)

X means the pixel number in the above line. Store all pixel association constants.

Next, we calibrate at each of the four ambient temperature correction points for temperature and pixel constants. The offset between the integral and the two correction points (each temperature offset and the acceptance on the pixel), linear interpolation between the two correction points is useful for the calculation. This makes it very close to the actual ambient temperature.

The following example is based on FIGS. 15A and 15B after collecting data at pixel zero. Linear interpolation is seen in the example of temperature offset. The actual ambient temperature is estimated at 300K.

An example of calculation using the actual temperature offset of pixel 0 at 300K is shown in FIG.

As shown in FIG. 16, linear interpolation is sufficient to calculate the actual temperature offset V _Th (C, R). (C, R) refers to rows and columns and is associated with a value. It is desirable to process the pixel constants in the same way for the calculation.

Next, a method for obtaining the ambient temperature will be described.

The ambient temperature is calculated by the following equation (3).

&Quot; (3) "

Where T _Amb is the actual ambient temperature (absolute temperature of one decimal place)

PTAT _i is the Nth PTAT value. N depends on the device.

Next, a method of obtaining the temperature of the measurement object (object) will be described.

The column is (C), the column associated with the pixel, and the row (C, R) indicates the variable name.

The received pixel absolute voltage consists of the amplifier's electronic offset V _elOff (C), the pixel temperature offset V _Th (C, R), and the amplified pixel voltage V _Pix (C, R).

_{V Abs (C, R) =} V Pix (C, R) + V Th (C, R) + V elOff (C)

The electronic offset uses a modulo-n-check scheme to correspond to the pixel voltage. The number of amplifiers is divided by the pixel number, and the remainder coincides with the electronic offset.

If the device has a calibration setting of " IGNORE_ELOFF false ", the electronic offset of the amplifier V _elOff (C) is subtracted from the absolute voltage of the received pixel. If left alone, the electronic offset can be set to zero.

_{IGNORE_ELOFF false → V Abs (C,} R) - V elOff (C) = V Pix (C, R) + V Th (C, R)

_{IGNORE_ELOFF ture → V Abs (C,} R) = V Pix (C, R) + V Th (C, R)

The next step is to obtain the pixel amplification voltage for the subtraction process to match the temperature offset.

_{IGNORE_ELOFF false → V Pix (C,} R) = V Abs (C, R) - V elOff (C) - V Th (C, R)

_{IGNORE_ELOFF ture → V Pix (C,} R) = V Abs (C, R) - V Th (C, R)

As mentioned earlier, V _Th (C, R) are _{T h1 (C, R),} T h2 (C, R), T h3 (C, R), T h4 (C, R) between each of the two temperature offset value Must be processed by linear interpolation to approach the actual ambient temperature T _Amb .

The next step is linear interpolation to obtain the actual pixel constants P _ix C (C, R). This is related to the current T _Amb .

The object temperature T _O is the absolute temperature of the lower one decimal place and is calculated by the following equation (4).

&Quot; (4) "

ε is the emission factor of the surface of the pixel that receives the radiant heat. VDM is a multiplier that makes it equal to the VDM constant. X is an exponent to make it equal to the EXP constant. VDM and EXP can be verified by sending an 'M' command.

Next, a user interface configuration of the thermal image monitoring system according to an embodiment of the present invention will be described with reference to FIGS. 17 to 18. FIG.

As shown in FIG. 17, the user interface of the thermal image monitoring system according to an exemplary embodiment of the present invention includes various switches that accept commands from a user or an administrator, and LED indicators that indicate various states. Figure 17 shows the interface at the front of the enclosure of the system unit.

The following switches are configured at the lower end of the housing front face of Fig.

The monitoring switch is for calling up the temperature real time display window, and the event switch is for calling up the alarm status window to read the alarm history. Also, the cancel switch is used to cancel the action (ACTION) to be set and move to the previous window. The confirmation switch is used to confirm and save the setting contents. In addition, the cursor key switches consist of UP / DOWN / LEFT / RIGHT switches. When you want to move between the fields corresponding to the items in the menu window, Is used.

The icons that can be moved by using this cursor key on the main screen are (a) automatic or manual display range, (b) histogram or trend, (c) configuration, alarm status, alarm setting.

On the other hand, LED indicators are formed on the right and left sides of the front surface of the housing of Fig.

The steady state LED indicates an ON alarm when the temperature below the set alarm value is input, and OFF in the alarm state. The alarm status LED is displayed as ON or BLINKING when the temperature value above the alarm setting is sensed. The PC Link LED is an indicator that indicates whether communication is being performed smoothly by connecting to the PC server, which is the upper model of this controller, and it is displayed as BLINKING when it is normal. Also, the TX indicator is blinking when there is transmit data, and the RX indicator is blinking when there is received data.

The 2D array indicator is an indicator that indicates that communication with the two-dimensional array deterioration temperature sensor is smooth and is indicated by blinking when it is normal. Also, the TX indicator of the 2D array is blinked when there is transmit data, and the RX indicator is blinked when there is received data.

In the center of the front surface of the housing of Fig. 17, there are displayed a thermal image (or thermal image) and characteristic values or statistics for the thermal image. By default, the display range setting is set to automatic, and the manual setting is selected when you know the characteristics of the monitored object.

In the case of the automatic setting, the temperature value transmitted from the 2D array sensor is arithmetically analyzed to automatically display the color distribution display range which is easy to recognize as the shape every time.

In the case of manual setting, when the display is changed automatically every time, the color range of maximum, minimum and average is changed automatically, so that it is difficult to recognize a specific value by color. To set the temperature display range.

When the manual radio button is selected in the display range window, set ΔT (difference between maximum and minimum values) and Tc (temperature display range center value) in the display range manual setting window. At this time, the minimum temperature value is calculated and displayed at the left end of the X axis of the histogram window, and the maximum temperature value is displayed at the right end. For example, when the Tc value is 25.0 degrees, when the value of DELTA T is 10.0, the maximum temperature value is 30.0 degrees and the minimum temperature value is 20.0 degrees. The color of values outside this range is replaced with the maximum or minimum value set manually.

On the other hand, menus for setting various environments of the system are displayed through a user interface of the thermal image monitoring system, and device system IP address setting, sensor module IP address setting, date setting, specific area monitoring setting, And the pan / tilt setting of the thermal imaging camera can be performed.

In particular, the area to be monitored can be set through the specific area monitoring setting function. For example, it is necessary to select three specific areas on the image screen to monitor the phenomenon that the temperature is deteriorating. At this time, the specific region may be selected as the regions that are higher than a predetermined set level temperature reference. The maximum / minimum / average temperature of the area is displayed. In addition, a specific area can be arbitrarily set by the administrator and the corresponding area can be set. When a plurality of areas are set, the area numbers are divided into L1, L2, and L3 in order to set the respective areas. When the areas of L1, L2, and L3 are determined, The maximum / minimum / average temperature of the area is indicated by a rectangle.

The ambient average temperature indicates the total average temperature value of the entire screen. At this time, the maximum / minimum / average temperature and the ambient temperature are displayed by rotating the temperatures of L1, L2, and L3 in a predetermined time interval (about 5 seconds apart) (BOLD) processing is performed and displayed. Also, utilizing the maximum temperature values of L1, L2, and L3, the trend screen shown on the main screen is formed.

Further, it is an environment setting function for capturing a desired specific area as a thermal image by adjusting the angle (angle) of the sensor module (thermal imager) to the left or right or up and down through the user interface. The PAN / TILT motor rotates according to the value input in the setting window to move the front direction of the camera. If you want to stop while moving, press the cancel switch. The preferred pan / tilt setting range is as follows. The setting range of PAN (X axis position) is -47 ° ~ + 31 °, and the setting range of Tilt (Y axis position) is -159 ° ~ + 159 ° and setting of pan / tilt adjustment speed The range is 1 ° / sec to 5 ° / sec.

In addition, a reference for setting an alarm or an alarm through the user interface can be performed by the alarm setting function. The alarm setting function has a setting function for setting a specific area alarm, setting an alarm for an ambient temperature rise, setting a deterioration index, and the like. The deterioration index is calculated using the average temperature and the ambient average temperature value of the specific region. The specific method of calculating the deterioration index will be described in detail below.

Meanwhile, as shown in FIG. 18, an alarm message is displayed on a part of the screen, and is classified into a warning alarm, a boundary alarm message, and an emergency alert message.

The warning message display method is such that xx is indicated by the number of the specific setting area in the above message, and the yellow band is blinked at intervals of 1 second. Also, in the method of displaying a border alarm message, xx is indicated by the number of the specific setting area in the message, and the orange band is blinked at intervals of 1 second. In the emergency alert message display method, xx is indicated by the number of the specific setting area in the message, and the red band is blinked at intervals of 1 second. Alternatively, the alarm of the warning can be informed by the red LED lighting, the boundary alarm by the red LED flashing every 1.5 seconds, and the emergency alarm by the red LED flashing every 0.3 second.

If several messages are received at the same time, the first message is displayed for 10 seconds and then the next message is displayed. Only up to six of these messages can be stored in the message store, and more are discarded. The alarm message can be closed by pressing the cancel switch and also automatically disappear after a predetermined period of time (about 10 seconds) even if the alarm message is released.

Further, an area for generating an alarm is displayed on the image screen. A square box of the image screen in Fig. 18 indicates a setting area. The set value and the detected maximum temperature value are displayed in it. For example, in "50/65" shown in FIG. 18, 50 is the alarm setting reference temperature, and 60 is the detection maximum temperature.

Next, a method of calculating the deterioration index (soundness index) according to the embodiment of the present invention will be described in more detail.

The membership parameter for the junction temperature is set as follows.

- 100 points if less than 50 degrees

- 5 points if more than 80 degrees

An example of calculating the junction temperature index will be described.

Assume that the membership parameter for the junction temperature (x is the junction temperature, v is the score) is:

&Quot; (5) "

xl: 80, vl: 5 ===> constant

xh: 50, vh: 100 ===> constant

Therefore, if x is less than or equal to xh, v = vh, and if x is greater than or equal to xl, then v = vl.

If neither of the above cases is true, the following formula is used.

&Quot; (6) "

Membership Value v = ((vh - vl) / (xh - xl)) (x - xl) + vl

For example, if x = 55,

v = ((100-5) / (50-80)) (55-80) + 5

  = (95 / -30) (-25) + 5 = -3.1 x -25 + 5 = 82.5

For example, if x = 60.

v = ((100-5) / (50-80)) (60-80) + 5

= (95 / -30) (-20) + 5 = -3.1 x -20 + 5 = 67

An example of calculating the temperature difference index will be described.

The membership parameter for temperature difference (x is the junction temperature - ambient temperature difference, v is the score) is as follows.

&Quot; (7) "

xl: 30, vl: 5 ===> constant

xh: 5, vh: 100 ===> constant

Therefore, if x is less than or equal to xh, v = vh, if x is greater than or equal to xl, v = vl

If neither of the above cases is true, the following formula is used.

&Quot; (8) "

Membership Value v = ((vh - vl) / (xh - xl)) (x - xl) + vl

For example, if x = 20,

v = ((100-5) / (5-30)) (20-30) + 5

  = (95 / -25) (-10) + 5 = -3.8 x -10 + 5 = 43

For example, if x = 10

v = ((100-5) / (5-30)) (10-30) + 5

= (95 / -25) (-20) + 5 = -3.8 x -20 + 5 = 81

The temperature deterioration index is obtained by the following equation (9).

&Quot; (9) "

Temperature Degradation Index (Integrity Index) = Connection Temperature Index * 0.7 + Temperature Difference Index * 0.3

For example, if the connection temperature is 55 degrees and the temperature difference is 20,

Temperature deterioration index = 82.5 * 0.7 + 43 * 0.3 = 57.75 + 12.9 = 70.65

Next, the configuration of the monitoring apparatus 30 according to the second embodiment of the present invention will be described more specifically with reference to FIG.

19, the monitoring apparatus 30 includes a sensor receiving unit 31, a display unit 32, an image classification unit 33, an abnormality determination unit 34, and a storage unit 36. Preferably, an alarm unit 35 may be added.

The sensor receiving section 31 receives thermal image data from the thermal imaging camera or the two-dimensional thermopile array sensor 30. [

In addition, the image classification unit 33 performs image matching on the stored facility image and the thermal image, and when the images are matched, the thermal image is separated into each facility image according to the corresponding region of the facility image do.

The equipment configuration image is an image of the inside of the switchboard, which represents the area of each facility. The facility configuration image is prepared in advance and stored in the storage unit 36. Or an ordinary camera (color camera, RGB camera, image camera, or the like) is installed in the switchboard 100, and the image of the interior of the switchboard is acquired and the area of each facility is determined. have.

At this time, the facility configuration image is an image in which the general camera is photographed at the same position as the thermal imaging camera or at a position close to the thermal imaging camera. Alternatively, when a three-dimensional image is generated from a schematic of a switchboard, a two-dimensional image viewed from the viewpoint may be generated.

As shown in FIG. 20, the facility configuration image is an image photographed inside the switchboard, and the facility area of each configuration facility can be distinguished from the facility configuration image. 20 (a) is an image of a distribution panel system, and Fig. 20 (b) is an equipment configuration image showing a facility area. In Fig. 20 (b), the dotted box represents the equipment area. Fig. 20 (c) is an equipment configuration image showing only the equipment area. Boxes in the image of Fig. 20 (c) each represent a facility area.

As shown in FIG. 20 (a), the main breaker 81, the branch breaker 82, the bus bar support 83, the bus bar bar 84, the charger bus bar 84, The area on the image occupied by the area 85 is the area of the facility. Or a switchgear is constituted by a bus bar, a vacuum breaker (VCB), a meter transformer (PT), a power meter (MOF), a load break switch (LBS), a bushing element, Can be distinguished.

20 (a) will be described in more detail as follows. The distribution panel system includes a main circuit breaker 81 and a bus bar support 83 having one side fixed to the bus bar support 83 and the other side connected to the main circuit breaker 81 And a plurality of branch breakers (85) connected to the plurality of charger bus bars (85) and connected to the plurality of charger bus bars (84) 82).

At this time, the bus bar bar or the cable connecting part can be a source of heat by the experiment, and heat of the distribution board or the low voltage switchboard can be generated in addition to the bus bar or cable connection part. That is, the various components and components constituting the switchboard 100 perform different functions and also accept or distribute currents of different voltages. Thus, the heat generated by each component or each component may be different.

On the other hand, preferably, a facility area is displayed in the facility configuration image or may have area data of the facility area. Alternatively, the equipment configuration image may be an image showing only the equipment area.

The image classification unit 33 obtains the edges of the facility construction image and the thermal image, and matches both images. In order for the thermal image and the equipment configuration image to match, both images must be adjusted so that the thermal image matches its size or viewpoint.

In the facility configuration image, a line or an edge indicating the corresponding area appears for each facility. An edge image representing an edge is an image generated by obtaining a pixel value difference (or an edge) between two neighboring pixels. Therefore, in the equipment configuration image, the edge of the equipment edge appears because the peripheral and pixel values are different. Also, in the image of a thermal image, if the temperature of a specific facility differs from the ambient temperature, the temperature change around the boundary line (boundary line of the equipment area) will be large. Therefore, a boundary line appears in the equipment area.

However, in the thermal image, there is a portion where a line or an edge indicating the corresponding region appears in each facility, and there is a portion not shown. That is, an edge appears if the facility is at a different temperature from the ambient temperature, otherwise the edge of the plant area does not appear if it is similar to the ambient temperature.

Thus, we find feature points or feature edges that match each other in contrast to the edges in the thermal image and the edges of the feature image. Both images are adjusted to match the size or the viewpoint of both images using matching feature points or feature edges. Preferably, the facility configuration image is adjusted to match the size and the viewpoint of the thermal image. As soon as a characteristic edge is found, the points of the characteristic edge become characteristic points. Techniques for finding feature points in two images and matching two images use known techniques used in the field of computer vision.

If both images are matched, thermal images can be separated for each facility area in the thermal image. At this time, the separated thermal image is referred to as a thermal image per facility area.

Meanwhile, as another embodiment, the image classification unit 33 may store the temperature (or the normal temperature) generated in each facility in advance and store the temperature, compares the set temperature of each facility with the temperature in the thermal image, You can find feature points.

In particular, feature points can be found by using the highest temperature among the set temperatures of each facility, or the temperature of the facility which has the highest temperature difference with the surrounding facilities. The image classification unit 33 obtains a thermal distribution in the image of the thermal image, and obtains an upper temperature (for example, a temperature corresponding to the upper 10%) in the thermal distribution. The characteristic point can be found by comparing the portion of the image of the thermal image that is higher in temperature than the upper temperature and the region of the facility with the highest set temperature in the facility construction image.

On the other hand, the image classifying unit 33 finds the minutiae of both images once and adjusts the image of the facility image once, and continues to use the adjusted image of the facility image.

Next, the abnormality determination unit 34 determines whether there is an abnormality by using the temperature and temperature of the thermal image, the temperature of the facility area and the change thereof, or the temperature of the facility area and the ambient temperature. A concrete determination method will be described below.

The display unit 32 displays the data of the thermal image on the two-dimensional display. At this time, if the thermal image is divided into the facility areas, the facility areas are displayed together on the thermal image.

Further, the display unit 32 displays a portion (or an area) determined to be abnormal in the thermal image. Particularly, it is possible to display the abnormality in each facility area on the thermal image.

The storage unit 36 stores a color image or an image (facility configuration image) of the switchboard, and stores data about the facility area in the facility configuration image.

When the determination unit 34 determines that there is an error, the alarm unit 35 notifies the abnormal state. Particularly, information on the abnormal state and the facilities in the corresponding facility area or abnormal state are informed together.

Next, with reference to FIG. 21, a method of diagnosing deterioration of each installation area of a switchboard using a two-dimensional thermopile array infrared ray image according to a third embodiment of the present invention will be described in more detail.

As shown in FIG. 21, according to a third embodiment of the present invention, a method for diagnosing deterioration of a plant area using a two-dimensional thermopile array infrared thermography is as follows. It is a way of judging.

It is difficult to judge the abnormality by setting the maximum temperature for each electric power equipment in the monitoring of the complex electric power equipment. It is also problematic to compare the temperature of each facility with the maximum permissible temperature for each facility. Therefore, a method for monitoring various facilities at the same time is needed. In the present invention, a sensor module is installed, an area for each facility to be monitored is set in advance while viewing an image, a maximum allowable temperature of the facility for the set area is set, do.

First, the facility area is distinguished from the thermal image (S11). Obtains the thermal image, and matches the obtained thermal image with the stored power storage facility area image to set each facility area in the thermal image.

Then, a critical temperature for each region is set (S12). And determines a critical temperature of the corresponding region by applying a critical temperature for the corresponding facility. The temperature for judging the abnormality according to each facility is as shown in Fig.

Then, the thermal image is received from the two-dimensional thermopile array sensor at predetermined time intervals, and the current temperature for each facility area is calculated (S14). Preferably, a value obtained by averaging the temperature of each cell in the facility region is calculated as the temperature or current temperature of the facility region.

It is determined whether the current temperature for each region is higher than the critical temperature of the corresponding region (S15). If the current temperature is not higher than the critical temperature, the process returns to the previous step (S14). If the current temperature is higher than the threshold temperature, it is determined that the current state is abnormal (S16). If it is judged to be abnormal, it performs the measures to be taken in the abnormal state. For example, an alarm signal in an abnormal state is sent to the manager or an alarm device provided in the monitoring apparatus is sounded.

The electric power facilities inside the switchgear are divided into high voltage equipment and low voltage equipment. 22 shows an allowable temperature for each facility accommodated in the high-voltage switchboard. That is, a critical temperature is set for a specific facility using a 2D thermopile array sensor, and an abnormality is determined when the temperature rises above a temperature reference of each facility. For example, if the surface temperature of the transformer exceeds 80 ° C, the transformer will indicate the abnormality. If the cable is a high-voltage cable, the CV cable will indicate the abnormality if it exceeds 90 ° C.

Next, with reference to FIG. 23, a description will be given of a method for diagnosing a deterioration in a facility area of a switchboard using a two-dimensional thermopile array infrared ray image according to a fourth embodiment of the present invention.

As shown in FIG. 23, according to the fourth embodiment of the present invention, the deterioration diagnosis method for the installation area of the switchboard using the infrared thermography of the two-dimensional thermopile array is compared with the slope of the thermoimage image, It is a method of judging whether or not there is an abnormality. If the temperature of each facility changes suddenly over time, an alarm message is notified so that an abnormal symptom of the facility can be captured in advance.

That is, it is judged that a problem occurs when the temperature of each region measured by the sensor is periodically monitored and the temperature gradient with respect to the time of the point becomes more than a predetermined value. This method plays a very important role in electric power facilities as a way to detect abnormal signs before problems occur in electric power facilities. By detecting anomalous signs, it is possible to operate the power facilities more safely by preventing accidents in advance. For example, when the temperature of the cable connection part exceeds 50 ° C, the slope of the temperature over time increases suddenly and it is judged that the fault is caused and the manager takes measures to prevent the accident.

First, a facility area is distinguished for a thermal image (S21). Obtains the thermal image, and matches the obtained thermal image with the stored power storage facility area image to set each facility area in the thermal image. This is the same as the third embodiment.

An allowable threshold slope is set (S22). Preferably, the threshold slope may be set differently for each region. For example, there may be a facility in which a temperature change frequently occurs, and there may be a facility in which a constant temperature is always maintained without a temperature change. In this case, the critical slope of the electron can be set to be larger than the critical slope of the latter. In this case, it is determined which facility is disposed in the corresponding area according to the facility area, and a critical slope of the corresponding area is set by applying a critical slope to the facility.

Then, the thermal image is received from the two-dimensional thermopile array sensor at predetermined time intervals, and the current temperature for each facility area is calculated (S23). Preferably, as in the third embodiment, a value obtained by averaging the temperatures of the respective cells of the facility area is calculated as the temperature of the facility area or the current temperature.

Then, the temperature change, that is, the slope of the temperature change is obtained using the calculated current temperature and the past temperature (S24). Then, it is determined whether the temperature gradient of each region is higher than the threshold gradient (S25). If the obtained temperature gradient is not higher than the critical gradient, the process returns to the previous step (S23). If the temperature gradient is higher than the critical gradient, it is determined to be in an abnormal state (S26). If it is judged to be abnormal, it performs the measures to be taken in the abnormal state.

Next, with reference to FIG. 24, a description will be given of a method for diagnosing deterioration of a facility area of a switchboard using a two-dimensional thermopile array infrared ray image according to a fifth embodiment of the present invention.

As shown in FIG. 24, according to the fifth embodiment of the present invention, there is provided a method for diagnosing a deterioration of a facility area of a switchboard using infrared thermography of a two-dimensional thermopile array, If the difference exceeds a specific threshold temperature difference, it is judged to be in an abnormal state.

For example, when a transformer or equipment of one phase is heated in a place where three transformers or three-phase equipment is installed, it is judged that a problem occurs when a temperature difference of more than a certain level occurs compared with the transformer and equipment of the remaining phases.

First, the facility area is divided for the thermal image (S31). Obtains the thermal image, and matches the obtained thermal image with the stored power storage facility area image to set each facility area in the thermal image.

The allowable threshold temperature difference between the facilities is set (S32). For example, FIG. 25 is a table showing a criterion for judging whether or not an abnormality is caused by a temperature difference between three-phase equipment.

Then, the thermal image is received from the two-dimensional thermopile array sensor at predetermined time intervals, and the current temperature for each facility area is calculated (S33). Preferably, a value obtained by averaging the temperature of each cell in the facility area is calculated as the temperature of the facility area or the current temperature.

Then, the difference between the temperature of each region and the temperature of another region is obtained (S34). Since each area has a corresponding facility, the temperature difference between the areas is the temperature difference between the facilities of the corresponding area. Then, it is determined whether the temperature difference between the equipments is higher than the critical temperature difference (S35). If the obtained temperature difference is not higher than the threshold temperature difference, the process returns to the previous step (S33). If the temperature difference is higher than the threshold temperature difference, it is judged as abnormal (S36).

In the meantime, although the method of diagnosing the deterioration of the installation area of the transmission / reception panel using the two-dimensional thermopile array infrared ray image has been described in the third, fourth, and fifth embodiments, You can monitor.

Next, with reference to FIG. 26 to FIG. 28, a deterioration diagnosis method for each installation area of a switchboard using a two-dimensional thermopile array infrared ray image according to a sixth embodiment of the present invention will be described.

The infrared sensor that is applied in most switchboards is a point temperature sensing system, which is a sensor that detects the temperatures at the surrounding points in addition to the target point of the busbar and the terminal block, and averages the detected values and indicates the temperature at one point. For this reason, there are restrictions on the distance between the target point and the sensor and the focus is limited, so that it is sensitive to the installation direction and the angle of the infrared sensor when it is desired to obtain the accurate temperature.

As an example, in the image of Fig. 26, assuming that the temperatures of the respective regions with respect to the points 1-4 in the center are 40 ° C, 50 ° C, 60 ° C, and 70 ° C, The temperature can not be individually detected. Instead, the average of the temperatures of 1 to 4 points is expressed as 55 ° C, which is the temperature of one point.

As described above, in the point-type infrared sensor according to the related art, it is difficult to calculate the accurate temperature by averaging the temperatures at the surrounding points together.

On the other hand, since the 2D array infrared array camera can directly measure the temperature of each pixel of the interest area designated by the user, it is possible to simultaneously measure the temperature distribution for each pixel in the vicinity of the area of interest have. Therefore, it can be used as an indispensable tool for monitoring deterioration of the local overheating of the accurate target point of the switchboard and monitoring diagnosis.

When the unbalance rate is less than 5%, the 2D array sensor measures the temperature in synchronism with the current flowing on the R, S and T phases of the switchboard. Then, if the temperatures of the connecting portions are different from each other, it is recognized as a contact failure and it is determined that the booster bar is overheated.

As shown in FIG. 27, the method for diagnosing deterioration of each installation region of a switchboard using a two-dimensional thermopile array infrared thermal image according to a sixth embodiment of the present invention includes the steps of: (a) ; An average temperature calculation step S42; A temperature recalculation step S43 after a predetermined time; And an abnormal state determination step (S44).

First, the thermal image according to the set temperature level can be displayed on the screen. That is, only the region of the temperature higher than the set temperature level is displayed on the screen (S41).

Next, calculate the average temperature for each region of interest. In particular, an average temperature for a region having a temperature equal to or higher than the set temperature level (or set level) is calculated (S42).

In the case of FIG. 28 (a), the region where the set level is 48 ° C or higher is a 4 × 4 array region, and the average temperature of the region is 51.4 ° C. (51.375 ° C.). At this time, the number of pixels is 16. In the case of FIG. 28 (b), the region where the set level is equal to or higher than 52 占 폚 is the region of 20 pixels and the average temperature of the region is 54.2 占 폚.

Next, after a predetermined time has elapsed, an average temperature of the area is calculated (S43). If the recalculated average temperature for the setting area is equal to or higher than the predetermined threshold temperature, the abnormal state is detected (S44). On the other hand, the critical temperature can be set differently depending on the elapsed time period to be recalculated, and the elapsed period can be set to a plurality of times. For example, an elapsed time period can be set to one hour, one day, one week, and so on.

For example, if the average temperature of the area is 60 ° C or more after one hour, an alarm is output according to the set level. In the case of FIG. 29, the average temperature of the 4 × 4 array region is 60 ° C. Therefore, an alarm is output. Or after one week, if the average temperature of the corresponding region is 80 DEG C or higher, an alarm according to the set level may be output.

Next, with reference to FIG. 30 to FIG. 32, a description will be given of a method for diagnosing deterioration of a plant and installation area using a two-dimensional thermopile array infrared image according to a seventh embodiment of the present invention.

The method for diagnosing the deterioration of the installation area using the two-dimensional thermopile array infrared thermal image according to the seventh embodiment of the present invention is the same as the method of the sixth embodiment described above. However, when recalculating the average temperature, There is a difference in resetting according to the setting level.

As shown in FIG. 30, the method according to the seventh embodiment of the present invention comprises the steps of: (a) setting a region according to a setting level (S51); An average temperature calculation step S52; Resetting the area after a predetermined time (S53); A temperature recalculating step (S54); And an abnormal state determination step S55.

First, the thermal image according to the set temperature level can be displayed on the screen. That is, only the region of the temperature higher than the set temperature level is displayed on the screen (S51).

Next, calculate the average temperature for each region of interest. Specifically, an average temperature is calculated for a region having a temperature equal to or higher than a set temperature level (or a set level) (S52). The average temperature is calculated as shown in Fig. 28 of the sixth embodiment.

Next, after a predetermined period of time has elapsed, the region of the temperature equal to or higher than the set temperature level is reset using the measured thermal image data (S53). A region having a temperature higher than the set level is obtained again. Then, the average temperature of the reset area is recalculated (S54).

Next, whether the recalculated average temperature for the reset area is equal to or higher than a predetermined threshold temperature or whether the increase rate of the reset area is equal to or greater than a predetermined threshold area increase rate is detected (S55). That is, whether or not the alarm is determined according to the increase in the average temperature obtained at this time is higher than the predetermined reference temperature and the size of the area increases.

As in the example of Fig. 28 (a), the case where the set level is 48 ° C or higher will be described. As shown in Fig. 31, after a predetermined time, when the set level is 48 deg. C or higher, the area having the temperature equal to or higher than the set level is an area of 8x4 array and its size is doubled. That is, the pixel size is 32 pixels, twice as large as the initial 16 (= 4 × 4) pixels. Also, the average temperature of the region was 55 캜, which was higher than the initial average temperature of 35.4 캜. Therefore, the total calories are increased by 2 to 3 times, and a warning is generated at this time.

Another example will be described with reference to FIG. On the initial screen, the number of pixels in a region that is equal to or higher than the set level (for example, 38 DEG C) is 58, and the average temperature at this time is measured to be 40 DEG C. [ In Fig. 32, the white pixels are displayed as areas having a set level or higher on the initial screen (thermal image screen). After one hour, an additional 36 regions exceeding the set level (38 DEG C) were added, and the total number of pixels became 94. And the total average temperature in that area was increased to 55 ° C. In Fig. 32, gray pixels represent additional extended pixels.

Next, with reference to FIG. 33, a description will be given of a deterioration diagnosis method for each installation area of a switchboard using a two-dimensional thermopile array infrared ray image according to an eighth embodiment of the present invention.

As shown in FIG. 33, first, the ambient temperature is calculated in the thermal image (S61). After the predetermined time has elapsed, the ambient temperature is recalculated (S62). If the recalculated ambient temperature becomes higher than the predetermined critical ambient temperature, the abnormal state is detected (S63).

For example, in an initial thermal image, the ambient temperature is calculated as 35 ° C. If the re-calculated ambient temperature reaches 40 ° C after one hour, an abnormal condition is detected and an alarm is signaled. Alternatively, if the ambient temperature reaches 41 ° C or more after one week, the alarm is notified.

Next, with reference to FIG. 34 to FIG. 35, a description will be given of a method for diagnosing deterioration of each installation area of a switchboard using a two-dimensional thermopile array infrared ray image according to a ninth embodiment of the present invention.

The ninth embodiment of the present invention is the same as the sixth embodiment described above except that the temperature is recalculated only for a specific internal area within the setting area when recalculating the average temperature.

As shown in FIG. 34, the thermal image according to the set temperature level can be displayed on the screen. That is, only the region of the temperature higher than the set temperature level is displayed on the screen (S71). Then, an average temperature is calculated for a region having a temperature equal to or higher than the set temperature level (or set level) (S72).

Next, as in the example of Fig. 35, after a predetermined time has elapsed, the average temperature of the specific internal area in the setting area is calculated using the measured thermal image data (S73). If the average temperature of the inner region is equal to or higher than the threshold temperature of the predetermined inner region, the abnormal state is sensed (S74).

That is, after one hour or one week, when the temperature suddenly increases from the set level temperature in the central area of FIG. 35, the alarm is notified.

Next, with reference to FIG. 36 and FIG. 37, a description will be given of a method for diagnosing deterioration of a plant and installation area using a two-dimensional thermopile array infrared image according to a tenth embodiment of the present invention.

A two-dimensional thermopile array according to a tenth embodiment of the present invention is a method for diagnosing a thermal degradation of a plant in a switchboard using an infrared thermography, comprising: displaying a temperature value (or a pixel value) of a thermal image in a histogram and calculating a distribution of a mean value and a histogram To determine whether there is an abnormality.

First, an initial distribution diagram of a histogram (hereinafter referred to as a first distribution diagram) for the temperature from the thermal image is generated (S81). 37, the x-axis is the temperature and the y-axis is the number of pixels (N) of the temperature. Also, the average value or the center of gravity is displayed in the distribution chart of the histogram.

Then, a thermal image is acquired after a predetermined time has elapsed, and a distribution map of the current histogram (hereinafter referred to as a second distribution map) is generated from the thermal image.

Then, the first and second distribution maps are compared to determine whether there is an abnormality (S83). The comparison of the first and second distribution diagrams is made by the center of gravity, the biases of the distribution, and the average temperature.

First, in the second distribution diagram, whether or not the center of gravity moves relative to the first distribution chart and how much the center of gravity has moved is determined. That is, when the center of gravity of the second distribution chart moves rightward relative to the center of gravity of the first distribution chart and the movement amount is large, the abnormal state is detected.

In addition, when the biased distribution of the distribution of the second distribution diagram is shifted to the right more than the first distribution diagram, the abnormal state is detected.

Also, when the average value of the second distribution diagram moves to the right much, it is detected as an abnormal state.

Next, a description will be given of a method for diagnosing deterioration in a facility area of a switchboard using a two-dimensional thermopile array infrared ray image according to an eleventh embodiment of the present invention.

The eleventh embodiment of the present invention relates to the above-described third to sixth embodiments, that is, a method for determining whether or not an abnormal image is divided into regions by region.

The temperature of the object such as the configuration equipment changes with the magnitude of the current, so the color or temperature value of the initial thermal image also changes. Further, the color or temperature value of the initial thermal image changes in accordance with the change of the ambient temperature of the object.

Therefore, it is necessary to newly learn the color or temperature value of the initial thermal image. At this time, the temperature value of the initial thermal image must be reset in consideration of the temperature rise limit of the insulator of the object.

It is also possible to set a predetermined value based on the load factor (0 to 100%) that the temperature of the object changes depending on the magnitude of the current or the like. That is, when the load factor is 0%, the reference threshold values are set to the initial state, and the reference threshold value is set to be proportionally higher as the load factor increases. After dividing the range of 0 ~ 100% which is the range of the load rate by intervals, the reference threshold value within the interval is set in advance. The reference threshold value is changed according to the load factor. In particular, the reference threshold values can be set using a thermal image that is previously measured in a normal case according to a load factor.

The invention made by the present inventors has been described concretely with reference to the embodiments. However, it is needless to say that the present invention is not limited to the embodiments, and that various changes can be made without departing from the gist of the present invention.

10: Switchboard 11: Configuration equipment
20: array sensor unit 21: thermal imaging camera
30: Monitoring device 31: Sensor receiving part
32: display section 33:
34: abnormality determination unit 35: alarm unit
36:
40: remote server
210: lens part 220: pixel array part
230: signal processing unit 240: image processing unit

Claims (8)

A two-dimensional thermopile array infrared thermal imaging diagnosis system,
An array sensor unit for sensing a temperature inside the switchgear and acquiring a thermal image; And
And a monitoring device for analyzing the thermal image to judge whether there is an abnormality inside the power /
The monitoring device includes:
A sensor receiving unit for receiving the thermal image from the array sensor unit;
A storage unit for storing a facility configuration image representing a facility area of the power distribution panel;
An image classification unit for performing image matching with respect to the facility configuration image and the thermal image and dividing the thermal image into zones according to a facility area of the facility configuration image; And
And an abnormality determination unit for determining a temperature for each facility region from the thermal image and determining an abnormality of the power plant by using the temperature for each facility region,
Wherein the image classification unit finds minutiae corresponding to each other in the image of the facility configuration image and the thermal image and adjusts the facility configuration image so that the size and the viewpoint of the image match the image of the thermal image using the minutiae point, And the image of the thermal image is divided into zones according to the facility area of the adjusted facility configuration image. The system for diagnosing the deterioration of the installation area of the power plant using the infrared thermography.
delete The method according to claim 1,
Wherein the image segmenting unit obtains an edge from an image of the facility construction image and the thermal image and finds an edge (hereinafter referred to as a characteristic edge) which is matched in the edge of the two images, and finds a characteristic point within the characteristic edge Two - Dimensional Thermo - file Array Infrared Thermal Imaging System for Deterioration Diagnosis of Switchboards.
The method according to claim 1,
Wherein the image classification unit compares the region corresponding to the facility with the highest temperature in the facility construction image and the region of the pixel portion that is higher than the upper temperature in the image of the thermal image to find the characteristic point. Deterioration Diagnosis System for Installation Area of Arrangement System Using Array Infrared Thermal Imaging.
The method according to claim 1,
The abnormality determination unit sets a critical temperature for each facility of the switchboard and compares the measured temperature calculated for each region in the thermal image with the critical temperature of the facility in the corresponding region to determine whether the facility is abnormal Two - dimensional thermopile array infrared thermal imaging system for the detection of deterioration in the installation area of a power plant.
The method according to claim 1,
Wherein the abnormality determination unit calculates a slope of a temperature change for each region in the thermal image and compares the slope of the temperature change with a predetermined threshold slope to determine whether the facility is abnormal or not. Deterioration Diagnosis System for Installation Area of Infrastructure using Infrared Thermal Imaging of File Array.
The method according to claim 1,
Wherein the abnormality determination unit determines the temperature of the facility in the region by measuring the temperature in each region in the thermal image, calculates the temperature difference between the facilities, compares the temperature difference with a predetermined threshold temperature difference, Wherein the infrared thermography is used to determine the presence or absence of the infrared thermography.
A two-dimensional thermopile array that detects the temperature inside the switchboard from the two-dimensional thermopile array sensor and receives the acquired thermo-image and judges the abnormality of the switchboard facility. As a result,
(a) receiving the thermal image from the array sensor;
(b) finding feature points corresponding to each other in an image of the thermal imaging image and a previously stored facility configuration image;
(c) adjusting the facility configuration image so that the size and the viewpoint of the image match the image of the thermal image using the feature points;
(d) dividing the image of the thermal image into regions corresponding to the equipment area of the adjusted facility configuration image;
(e) obtaining a temperature for each facility region from the thermal image; And
(f) judging whether or not an abnormality occurs in the power plant by using the temperature of each facility area. 2. A method for diagnosing a deterioration in a plant area of a power plant using infrared thermography of a two-dimensional thermopile array.

Images