GB2526172B - Electronic assembly for an inverter - Google Patents

Electronic assembly for an inverter

Info

Publication number
GB2526172B
GB2526172B GB1503707.0A GB201503707A GB2526172B GB 2526172 B GB2526172 B GB 2526172B GB 201503707 A GB201503707 A GB 201503707A GB 2526172 B GB2526172 B GB 2526172B
Authority
GB
United Kingdom
Prior art keywords
inverter
electronic assembly
electronic
assembly
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
GB1503707.0A
Other versions
GB201503707D0 (en
GB2526172A (en
Inventor
N Singh Brij
N Oenick John
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Deere and Co
Original Assignee
Deere and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US14/291,996 external-priority patent/US9504191B2/en
Application filed by Deere and Co filed Critical Deere and Co
Publication of GB201503707D0 publication Critical patent/GB201503707D0/en
Publication of GB2526172A publication Critical patent/GB2526172A/en
Application granted granted Critical
Publication of GB2526172B publication Critical patent/GB2526172B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
    • H05K7/20927—Liquid coolant without phase change
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3736—Metallic materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
GB1503707.0A 2014-03-28 2015-03-05 Electronic assembly for an inverter Active GB2526172B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201461971590P 2014-03-28 2014-03-28
US14/291,996 US9504191B2 (en) 2014-03-28 2014-05-30 Electronic assembly for an inverter

Publications (3)

Publication Number Publication Date
GB201503707D0 GB201503707D0 (en) 2015-04-22
GB2526172A GB2526172A (en) 2015-11-18
GB2526172B true GB2526172B (en) 2018-12-19

Family

ID=52998407

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1503707.0A Active GB2526172B (en) 2014-03-28 2015-03-05 Electronic assembly for an inverter

Country Status (2)

Country Link
CN (1) CN104952816B (en)
GB (1) GB2526172B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3249685B1 (en) * 2016-05-24 2019-11-27 Mitsubishi Electric R&D Centre Europe B.V. System comprising at least one power module comprising at least one power die that is cooled by a liquid cooled busbar
US10492343B2 (en) * 2016-08-23 2019-11-26 Ford Global Technologies, Llc Vehicle power module assembly with cooling
CN109510455A (en) * 2019-01-04 2019-03-22 武汉海达数云技术有限公司 Power supply change-over device

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080224303A1 (en) * 2006-10-18 2008-09-18 Sunao Funakoshi Power Semiconductor Module
JP2010097967A (en) * 2008-10-14 2010-04-30 Denso Corp Semiconductor device
US20100208427A1 (en) * 2009-02-18 2010-08-19 Hitachi, Ltd. Semiconductor power module, inverter, and method of manufacturing a power module
JP2011155207A (en) * 2010-01-28 2011-08-11 Aisin Aw Co Ltd Method of manufacturing inverter module, and the inverter module
WO2012132709A1 (en) * 2011-03-29 2012-10-04 ローム株式会社 Power module semiconductor device

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101273724B1 (en) * 2010-08-18 2013-06-12 삼성전기주식회사 Radiant heat substrate and method for manufacturing the radiant heat substrate, and luminous element package with the radiant heat substrate
US9148946B1 (en) * 2014-03-28 2015-09-29 Deere & Company Electronic assembly for an inverter

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080224303A1 (en) * 2006-10-18 2008-09-18 Sunao Funakoshi Power Semiconductor Module
JP2010097967A (en) * 2008-10-14 2010-04-30 Denso Corp Semiconductor device
US20100208427A1 (en) * 2009-02-18 2010-08-19 Hitachi, Ltd. Semiconductor power module, inverter, and method of manufacturing a power module
JP2011155207A (en) * 2010-01-28 2011-08-11 Aisin Aw Co Ltd Method of manufacturing inverter module, and the inverter module
WO2012132709A1 (en) * 2011-03-29 2012-10-04 ローム株式会社 Power module semiconductor device

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
2013 25th International Symposium on Power Semiconductor Devices & IC's (ISPSD), Quing Hua et al, "Full-Integrated power module for motor drive applications" pages 289-292 *
Applied Power Electronics Conference and Exposition, 2013 Twenty-eigth Annual IEEE, Ning Puqi et al, "Double-sided cooling design for novel planar module", pages 616-621 *

Also Published As

Publication number Publication date
GB201503707D0 (en) 2015-04-22
CN104952816B (en) 2019-10-15
CN104952816A (en) 2015-09-30
GB2526172A (en) 2015-11-18

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