CN104952816B - Electronic building brick for inverter - Google Patents
Electronic building brick for inverter Download PDFInfo
- Publication number
- CN104952816B CN104952816B CN201510140960.2A CN201510140960A CN104952816B CN 104952816 B CN104952816 B CN 104952816B CN 201510140960 A CN201510140960 A CN 201510140960A CN 104952816 B CN104952816 B CN 104952816B
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- China
- Prior art keywords
- housing portion
- metal island
- electronic building
- building brick
- semiconductor
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/20927—Liquid coolant without phase change
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
- H01L23/3736—Metallic materials
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Thermal Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
A kind of electronic building brick for inverter, including the substrate with dielectric layer and metallic circuit wiring.Multiple terminals are arranged attached to DC power supply.First semiconductor and the second semiconductor connect together between the terminal of DC power supply.First metal island (for example, band) is in the first area between the first semiconductor and the second semiconductor.First metal island has the height or thickness for being greater than metallic circuit wiring.First metal island provides the radiator for heat dissipation.
Description
Related application
This document (including attached drawing) is based on 35 U.S.C § 119 (e), it is desirable that based on the U.S. submitted on March 28th, 2014
The priority and right for the submission date that provisional application 61/971,590, wherein herein being combined the provisional application by quoting
Herein.
Technical field
This disclosure relates to a kind of electronic building bricks for inverter.
Background technique
Electronic building brick may have insufficient heat dissipation in the prior art certain, and this insufficient heat dissipation reduces
The service life of power semiconductor switch or maximum power output.Therefore, it is necessary to have the electronics group for improving heat dissipation for inverter
Part.
Summary of the invention
It in one embodiment, include the base with dielectric layer and metallic circuit wiring for the electronic building brick of inverter
Plate.Multiple terminals are arranged attached to DC power supply.First semiconductor and the second semiconductor connect between the terminal of DC power supply
It is connected to together.First metal island (for example, band) is in the first area between the first semiconductor and the second semiconductor.First
Metal island has the height or thickness for being greater than metallic circuit wiring.First metal island provides radiator to radiate.
Detailed description of the invention
Fig. 1 is the perspective view of one embodiment of the electronic building brick for inverter.
Fig. 2 is the perspective exploded view of the electronic building brick of Fig. 1, further illustrates upper housing component and lower case component.
Fig. 3 is the perspective view for the electronic building brick of Fig. 2 being assembled.
Fig. 4 is the first cross section of the reference line 4-4 along Fig. 3 of Fig. 3, and wherein reference line 4- is also shown in Fig. 1 and Fig. 2
4。
Fig. 5 is the second cross section of the reference line 5-5 along Fig. 3 of Fig. 3, and wherein reference line 5- is also shown in Fig. 1 and Fig. 2
5。
Fig. 6 is the third cross section of the reference line 6-6 along Fig. 3 of Fig. 3, and wherein reference line 6- is also shown in Fig. 1 and Fig. 2
6。
Fig. 7 is the cross section of one embodiment of electronic building brick, which illustrates the enlarging section of the rectangle region 7 of Fig. 4
Point.
Fig. 8 is the cross section of the small amplifier section of the rectangle region 7 similar to Fig. 4 of another embodiment, wherein presenting
Thermal interfacial material.
Fig. 9 is the cross section of the small amplifier section of the rectangle region 7 similar to Fig. 5 of another embodiment, wherein presenting
Conduction path and ground plane.
Figure 10 is the illustrated examples of the fluid cooling system of the electronic building brick comprising Fig. 1.
Like reference numerals in different attached drawings indicate similar element.
Specific embodiment
In one embodiment, Fig. 1 shows the circuit board assemblies 11 of the electronic building brick 200 for inverter.Electronics group
The circuit board assemblies 11 of part 200 include substrate 34, which has dielectric layer 54 and on the one or both sides of substrate 34
The wiring of one or more metallic circuit.DC terminal is arranged attached to DC power supply.First semiconductor 20 and the second semiconductor
22 connect together between the terminal of DC power supply.First metal island 24 (for example, band) is located at the first semiconductor 20 and
In first area (primary zone) between two semiconductors 22.First metal island 24 has the height for being greater than metallic circuit wiring
Degree or thickness.First metal island 24 provides the radiator for heat dissipation.
In one embodiment, DC terminal (42,44) includes surface-mounted connector, such as substantial cylindrical and wrap
Include the surface-mounted female connectors of metal material or alloy material.Each connector (36,38,40,42,44) can include
Surface-mounted connector.Each connector (36,38,40,42,44) can have for installation into substrate 34 at one end
The installation gasket 48 of upper corresponding conductive spacer 50, wherein the conductive spacer 50 and one or more conducting wiring (for example,
406) related or be electrically connected to one or more conducting wiring.
As shown, electronic building brick 200 shows three phases or three switch portions, wherein each phase, which has, is connected to
First semiconductor 20 of two semiconductors 22.In the input end of each switch portion, the first DC terminal 42 and the second DC terminal
44 provide DC current for each phase or switch portion.The output of each switch portion is limited by one group of AC connector.
For each phase, the first semiconductor 20 may include semiconductor switch (for example, low-pressure side semiconductor switch), should be partly
There is conductor switch at least one to be connected to the side of the dc bus or DC power supply powered to DC terminal (for example, low pressure
Side or negative terminal) switch terminal.For example, the switch terminal can refer to hair if the first semiconductor 20 includes transistor
Emitter-base bandgap grading and collector, or if the first semiconductor 20 includes field effect transistor, the switch terminal can be with finger source electrode and leakage
Pole.The control terminal (for example, base stage or grid) of first switch transistor is connected to unshowned control circuit or driver.
For each phase, the second semiconductor 22 may include semiconductor switch (for example, high-pressure side semiconductor switch), should be partly
There is conductor switch at least one to be connected to the side of the dc bus or DC power supply powered to DC terminal (for example, high pressure
Side or plus end) switch terminal.For example, the switch terminal can refer to transmitting if the first semiconductor 20 includes transistor
Pole and collector, or if the first semiconductor 20 includes field effect transistor, switch terminal can be with finger source electrode and drain electrode.First
The control terminal (for example, base stage or grid) of switching transistor is connected to unshowned control circuit or driver.
The output of each switch portion is limited by one group of exchange (AC) connector (36,38,40).As shown in Figure 1, exchange connection
Device includes the first AC connector 36, second for being respectively used to the first phase switch portion, the second phase switch portion and third phase switch portion
AC connector 38 and third AC connector 40.In one embodiment, AC connector (36,38,40) includes surface peace
Dress formula connector, such as substantial cylindrical and surface-mounted female connectors including metal material or alloy material.Each table
Panel mounting type connector (36,38,40) can have for installation into conductive spacer 50 corresponding on substrate 34 at one end
Installation gasket 48, wherein the conductive spacer 50 is related to one or more conducting wiring or is electrically connected to described one or more
Conducting wiring (for example, 406).
For each phase, the first metal island 24 (for example, band) is between the first semiconductor 20 and the second semiconductor 22
First area in.In a construction, each first metal island 24 usually have the height for being greater than metallic circuit wiring or
Thickness.For example, the first metal island 24 provides radiator, to dissipate to the inside of first housing portion 100 or first shell component 132
It is hot or thermally conductive.The heat distributed or the heat conducted can be transmitted to coolant circulation or transmission by first housing portion 100
Across the conduit or converter section of first housing portion 100.In one embodiment, the first metal island 24 includes covering copper (copper
pour)。
Between the surface-mounted connector that second metal island 26 (for example, band) is positioned adjacent to or any DC terminal
In second area between (42,44) and any neighbouring AC connector (36,38,40).For example, the second metal island 26 provides
Radiator, with to the internal heat dissipating of first housing portion 100 or first shell component 132/thermally conductive.First housing portion 100 can
With the heat distributed or the heat conducted are transmitted to coolant circulation or are conveyed through first housing portion 100 conduit or
Converter section (transition).In one embodiment, the second metal island 26 includes covering copper.
Third metal island 28 is between the second semiconductor switch 22 and corresponding AC connector, or more generally,
Between two semiconductor switch 22 and surface-mounted connector, it is located on substrate 34.In a construction, each third metal
Island 28 usually all has the height or thickness for being greater than metallic circuit wiring.For example, third metal island 28 provides radiator, with to the
The internal heat dissipating or thermally conductive of one casing part 100 or first shell component 132.First housing portion 100 can will be distributed
Heat or the heat conducted are transmitted to coolant circulation or are conveyed through the conduit or converter section of first housing portion 100.One
In a embodiment, third metal island 28 includes covering copper.
4th metal island 30 is located in substrate 34 close to 20 ground of (for example, for each phase) first semiconductor switch.
In a construction, each 4th metal island 30 usually has the height or thickness for being greater than metallic circuit wiring.For example, the 4th
Metal island 30 provides radiator, with to the internal heat dissipating of first housing portion 100 or first shell component 132 or thermally conductive.First
The heat distributed or the heat conducted can be transmitted to coolant circulation or be conveyed through the first shell by casing part 100
Divide 100 conduit or converter section.In one embodiment, the 4th metal island 30 includes covering copper.
In one embodiment, the first semiconductor switch 20 and the second semiconductor switch 22 include by silicon, silicon carbide, nitridation
Gallium or metal oxide semiconductor field-effect that other semiconductor materials are constituted, being encapsulated in the form of planar chip group are brilliant
Body pipe (MOSFET) or insulated gate bipolar transistor (IGBT).These chipsets may be implemented as flat shape, and be packaged
Attachment manufacturing process with preparation for being carried out on substrate.Thermal conditioning is by (having and being located at (in Fig. 4) first housing portion
Integral type coolant channel in 100) shell is enhanced, and second housing portion 102 provides increase general plane
The first semiconductor switch 20 and the second semiconductor switch 22 (for example, MOSFET/IGBT chipset) current density (A/cm2)
Chance.Therefore, it in the case where the defined rated current of electronic building brick 200, is opened according to used in inverter design
The type of device is closed, the die size ratio that can be used can otherwise be used for 20 second semiconductor of the first semiconductor switch
The die size of semiconductor material used in switch 22 is smaller.
Bilateral thermal conditioning by being connected to laterally draw the chipset of the general plane of hot-fluid by electrical interconnection is supported
The reduction of the package dimension of the die size of semiconductor or the first semiconductor switch 20 and the second semiconductor switch 22.Therefore,
Semiconductor switch 20 and the second semiconductor switch 22, which are placed on, allows each semiconductor dies in lower junction temperature
(Tj) in the thermal conditioning environment operated under.Herein, thermal conditioning environment is properly termed as more sides heat of Power switching devices (20,22)
It adjusts.Lower value of the Tj under defined power condition provides and subtracts in the case where no damage or reduction inverter ability
The chance of the die size and package dimension of small first semiconductor switch 20 and the second semiconductor switch 22.Reduce semiconductor switch
In (20,22) size of Si, SiC and the mold of GaN material can increase pari passu on each chipset conducting wiring area,
The area on island, radiator area or bus, so that hot-fluid (Fig. 4) and second housing portion 102 100 from mold to first housing portion
In coolant channel lateral flow it is more effective.
In a construction, a group capacitor 56 may be mounted at or on substrate 34.For example, as shown in Figure 1, the first array
Capacitor 56 be mounted on the first side of substrate 34, and the capacitor 56 of second array be mounted on substrate 34 with the first side phase
In anti-second side.Although showing four capacitors 56 of two column in every side of substrate 34, any appropriate number can be used
The capacitor 56 of amount.As shown, each capacitor 56 has first terminal 58 and Second terminal 60.In a construction,
Each capacitor 56 can include electrolytic capacitor 56.
In one embodiment, capacitor includes surface-mounted, low profile thin film capacitor.Pass through high surface area
Conductive terminal (58,60) and encapsulation of the thermal interfacial material for capacitor 56 around capacitor 56, convenient for for filtered
The lower temperature of every Ampere currents rises the higher ampere with per unit capacitor (for example, microfarad (uF)) that is required or using
Electric current carries out heat transfer management.Thermal interfacial material includes solidifying (for example, being substantially crosslinked) polymer, elastomer or plastics or solid
Body dielectric substance, which is positioned at, is inserted under uncured state, under liquid phase or under semisolid phase as resin,
It injects between the inside of the first shell and second housing and capacitor 56 to enhance heat dissipation.Capacitor 56 may be constructed such that for example
It can bear the component of unleaded formula melt back welding temperature distribution needed for surface-mounted production line.
As shown in Figure 1, assisting base plate 46 is mounted on the plane for being roughly parallel to substrate 34 or the planar offset from substrate 34
Different Plane in.Connector has dielectric portion and terminal, wherein the connector is mounted on assisting base plate 46 or installs
At in assisting base plate 46.Auxiliary circuit board can have one or more openings 52.For example, auxiliary circuit board can have
For each phase or the assist openings 52 of switch portion, allow second housing portion 102 or second shell component 134 contact or
Close to switch portion to conduct away heat from switch portion.
In alternative embodiments, as shown in figure 9, by be connected to one or more metal islands (for example, 24,28,
30) and one or more thermal conducting paths 900 between the heat dissipation island 901 or radiator of the opposite side of substrate 34 are (for example, thermally conductive
Open-work, thermally conductive blind hole or thermally conductive and conductive path or other structure), by heat from one or more metal islands (for example, 24,
28,30) it conducts away.In one embodiment, radiator or heat dissipation island 901 are isolated on the basis of phase one by one, so that each
Mutually heat dissipation island (island for example, the first phase radiates) is all with another phase output terminal of electronic building brick 200 (for example, in substrate 34
Downside or opposite side) corresponding other phases heat dissipations island (island for example, the second phase heat dissipation island and third phase radiate) is mechanically decoupled
With electric isolution (for example, the electromagnetic isolation in operational frequency range).Further, tire out with the heat transmitted by thermal conducting path 900
Long-pendingly or discretely, heat is sent to (for example, in first housing portion 100 or second housing portion) coolant channel
Interior fluid or coolant.
The circuit board assemblies 11 of electronic building brick 200 may include be electrically connected to terminal multiple being mounted on substrate 34
The second metal island in second area between one surface-mounted connector, and the surface-mounted connector that is positioned adjacent to
26。
Fig. 2 illustrates the housing unit of the circuit board assemblies 11 of encapsulating Fig. 1.In one embodiment, shell includes first
Housing unit 132 and second shell component 134, wherein first shell component 132 and second shell component 134 cooperate.First shell
Body component 132 includes first housing portion 100 and third casing part 104.Second shell component 134 includes second housing portion
102 and the 4th casing part 106.
As shown, first housing portion 100 and second housing portion 102 have mounting hole (108,110), the mounting hole
For receiving one or more fasteners 117 so that first housing portion 100 is fastened or connected to second housing portion 102,
The circuit board assemblies 11 of middle Fig. 1 be sandwiched between first housing portion and second housing portion 102 or by first housing portion and
Second housing portion 102 is closed.Third casing part 104 is fixed to or is connected to first housing portion 100.For example, third
Casing part 104 may include the upper cover of radiator or housing unit.Similarly, the 4th casing part 106 may include heat dissipation
The lower cover of device or housing unit.4th casing part 106 is fixed to or is connected to second housing portion 102.Implement at one
In example, first housing portion 100 and second housing portion 102 by polymer, plastics, there is such as reinforcing fiber or carbon fibre
Filler polymeric matrix constitute.For example, first housing portion 100 and second housing portion 102 can be by 3 D-printings
Machine production, the three-dimensional printer can print have for conduct fluid with cooling circuit board component 11 or its be thermally generated component
Various openings 52, conduit or the three-dimensional structure in channel.In illustrative configuration, third casing part 104 and the 4th shell
Divide 106 can be configured to by such as metal material of aluminium, cast aluminium, metallic alloy, alloy material or heat sink material.It can pass through
It can promote the resin or any appropriate thermally conductive of heat dissipation from polymer, plastics or conductive particle including such as metallic particles
Polymer material constructs third casing part 104 and the 4th casing part 106 to print the three-dimensional printer of three-dimensional structure.
First inner surface of first housing portion 100 can be suitble to and the side of circuit board assemblies 11 on size and shape
Cooperation or interlocking, however the second inner surface of second housing portion 102 can be suitble on size and shape and circuit board assemblies
11 opposite side cooperation or interlocking.For example, first housing portion 100 has and the corresponding AC connector on substrate 34
With the general cylindrical shape groove of DC terminal engagement.In addition, first housing portion 100 includes 75 groove of first switch portion, this
One switch portion groove be it is substantially rectangular, polyhedral, or shape and ruler with the first switch portion 75 of the top of substrate 34
Very little consistent other shapes；77 groove 126 of second switch portion, the second switch portion groove be it is substantially rectangular, polyhedral,
Or the consistent other shapes of shape and size with the second switch portion 77 of 34 top of substrate；79 groove of third switch portion, this
Three switch portion grooves are substantially rectangular, similar polyhedron, or the shape and size with the third switch portion 79 of 34 top of substrate
Consistent other shapes.About 56 array of capacitor, the first shell has and capacitor 56 corresponding on circuit board assemblies 11
The consistent focus type capacitor groove of size and shape or individual capacitor groove.
Second housing portion 102 has the protruding portion 124 of the protrusion for each switch portion, wherein the protrusion of the protrusion
Portion 124 can contact the downside of each switch portion.In alternative embodiments, second housing portion 102 has for each
The protruding portion of the protrusion of switch portion, wherein the protruding portion of the protrusion can contact each switch portion by heat-conducting interface material
Downside, as shown in Figure 8.Heat-conducting interface material includes that the thermally conductive binder of plug-in type, plug-in type thermal grease conduction or plug-in type are thermally conductive poly-
Close object.As shown, second housing portion 102 has and the size and shape one of capacitor 56 corresponding on circuit board assemblies 11
56 groove of focus type capacitor of cause.
It is respectively used to receive coolant and the first entrance of coolant is discharged as shown, first housing portion 100 has
116 and first outlet 118.Similarly, second housing portion 102, which has, is respectively used to receive coolant and is discharged the of coolant
Two entrances 120 and second outlet 122.Figure 10 provides how coolant recycles or be conveyed through electronic building brick 200 in electronics
The illustrated examples of the cooling one embodiment of the enhancing to switch portion, capacitor 56 or other components are provided in component 200.
Fig. 3 show Fig. 2 in its electronic building brick 200 under being assembled state.Each AC connector (36,38,40)
It can be via connector corresponding with electronic building brick 200 (for example, surface-mounted connection with DC connector (42,44)
Device or female connectors) cooperation mating connector 128 (for example, male plug) be connected to conductor 130 or cable.For example, direct current connects
Connecing device (42,44) can connect or be coupled to the source direct current (DC), such as battery, generator, fuel cell power output end or rectification
Formula alternating current generator.Meanwhile AC connector can be coupled or connected to the correspondence phase that will be controlled electric motor (for example,
Any conventional, unconventional or Mutual Inductance Coupling switch-type magnetic resistance motor or permanent magnet alternating current motor) or alternating current generator or
Other motors.
Fig. 4 illustrates the cross section along reference line 4-4 of electronic building brick 200.The similar attached drawing for including in Fig. 1 to Fig. 4
Label indicates similar elements or features.The cross section of Fig. 4 is shown in first shell component 132 or first housing portion 100
First entrance 116 and first outlet 118 between the coolant channel (420,422,424,421,428) that extends.Fig. 4's is transversal
Face also shows the second entrance 120 in second shell component 134 or second housing portion 102 and prolongs between second outlet 122
The coolant channel (411,412,414,416,418) stretched.In one embodiment, in first entrance 116 and first outlet 118
Between, the first coolant channel (420,422,424,421,428) is entirely in first housing portion, this is eliminated
For in the cooperation in electronic building brick 200 to shift coolant between first housing portion 100 and second housing portion 102
The demand of port.Similarly, between second entrance 120 and second outlet 122, the second coolant channel is entirely
In second housing portion 102, this eliminate in electronic building brick 200 in first housing portion 100 and second housing
The demand of any cooperation port of coolant is shifted between part 102.Therefore, in first housing portion 100 and second housing portion
Divide any washer, sealing element or the binder removed between those cooperation ports in 102, and will not leak.
For illustrative purpose, the visible part for being depicted so that the first coolant channel is designated as first by Fig. 4
The output par, c (420,422,424,421,428) of coolant channel, although the first coolant channel, which has, is similar to output section
The importation divided.The output par, c of first coolant channel and importation are substantially interchangeable, because of their only phases
For the direction of fluid or coolant flow, and relative to pump discharge end or pump input terminal relative to first entrance and first outlet
Orientation be defined.For example, when first entrance and the first output end are inverted to the connection between pump, importation and defeated
It is partially re-defined out.
In one embodiment, the output par, c (420,422,424,421,428) of the first coolant channel includes first
It is exported outside 420, one group first of entrance transverse chambers, 422, one group first of inside output duct, 424, one group first of converter section of output
428, one group of first external input conduit of conduit 421 and the first outside transverse chambers, one group of first input converter section, in one group first
Portion's input pipe.The output par, c (420,422,424,421,428) of first coolant channel is connected to first entrance 116 and
Between one outlet 118, and can along detour diameter or sinuous path first entrance 116 and first outlet 118 it
Between pass through first housing portion 100.Can be described from first entrance 116 to the direction of first outlet 118 in conjunction with fluid stream
The output par, c (420,422,424,421,428) of one coolant channel, wherein outgoing route is advanced since first entrance 116
And wherein input path is advanced towards first outlet 118.
In the first coolant channel, first entrance 116 is connected to first entrance transverse chambers 420.One group of first inside is defeated
Conduit 422 includes one or more extended from first entrance transverse chambers 420 (for example, in paper in Fig. 4 longitudinally) out
A first inside output duct.Corresponding one group of inside output duct 422 is connected to corresponding one group of first output converter section
424.In one embodiment, the region of each first output converter section 424 can include substantially spiral, generally oblong
The channel of the generally circular or other arc of shape, the channel engage a corresponding first inside output duct 422
Or it is connected to corresponding one first outside and exports converter section 424.In a construction, the first outside of group output duct 421
One end be connected to corresponding one group of first output converter section 424, and the opposite end of the first outside of group output duct 421 connects
To the first outside transverse chambers 428.
In the second coolant channel (411,412,414,416,418), second entrance 120 is connected to second entrance transverse chambers
411.One group of second inside output duct 412 includes from second entrance transverse chambers 411 (for example, longitudinal in paper in Fig. 4
Ground) the second inside of one or more output duct for extending.Corresponding one group of inside output duct 412 is connected to corresponding one
Group the second output converter section 414.In one embodiment, each second output converter section 414 can be including substantially spiral shape
, the channel of the generally circular or other arc of substantially elliptical, the channel will the output of corresponding one second inside
Conduit 412 is engaged or coupled to a corresponding second outside output duct 416.In a construction, outside this group second
One end of output duct 416 is connected to corresponding one group of second output converter section 414, and the second outside of group output duct 416
Opposite end be connected to the second outside transverse chambers 418 or a series of substantially parallel curved catheters or circuit.
In one embodiment, one or more converter sections (424,414) may include substantially spiral, generally oblong
The channel of shape, generally circular or other arcs, the channel is around or about connector relevant to substrate 34 (for example, table
Panel mounting type connector) outside.Therefore, each converter section (for example, 424) has inside diameter surface or general cylindrical shape
Surface 410, the surface are configured for the substantial cylindrical cooperation of outer surface 408, nested or interlocking with connector 40.Such as
Shown in Fig. 4, converter section 424 (for example, the first converter section or upper converter section) closely surrounds the outside of connector 40, is used for thermal energy
From the coolant in the 40 to the first coolant channel of connector heat transmitting, and converter section 414 (for example, the second converter section or under
Converter section) in the construction shown not surround connector (for example, 40).Converter section 414 can be by close to outside radiator or the 4th
The metal or metal structure of shell parts 106 form or with the metal or metal structure close to radiator or the 4th casing part 106
It is associated.
In an illustrative configuration, first housing portion 100 includes the inner surface with fit shapes and size, this is matched
Shape and size are closed to correspond to the profile of adjacent first surface installing type connector (36,38,40) or correspond to DC terminal
(42,44).First housing portion 100 has the channel of the spirality path of the outer diameter around first surface installing type connector
Transition zone (for example, 414), to provide for radiating from surface-mounted connector (36,38,40) or DC terminal (42,44)
Hot path.For example, inner surface be substantially cylindrical and engage corresponding first surface installing type connector (36,
38,40) or the corresponding outside cylindrical surface of DC terminal (42,44).
First shell component 132 includes the first housing portion 100 for being covered on 24 top of substrate 34 and the first metal island.Its
In, heat by being contacted with the first metal island 24, the first housing portion 100 close above the metal island or with the metal island
It is conducted away from the first metal island 24.For example, heat is transmitted to the first shell from the first metal island 24 by the casing part
Divide the surrounding air around 100.With the accumulation of heat of the surrounding air by being transmitted to around first housing portion 100 or divide
Liftoff, heat is sent to fluid or coolant in coolant channel.Heat or thermal energy by being contacted with third metal island 28,
The first housing portion 100 close above the metal island or with the metal island is conducted away from third metal island 28.Heat or
Thermal energy by being contacted with the 4th metal island 30, first housing portion 100 quilt close above the metal island or with the metal island
It is conducted away from the 4th metal island 30.As shown, one or more conducting wiring is located in the one side or the multi-lateral of substrate 34.Connection
Device 32 can be surface mounted to the conductive spacer on substrate side, and can be mounted across in first housing portion 100 (figure
In 2) connector opening 15.
In Fig. 4, third casing part 104 has one or more cooling fins 402 or heat dissipation member for distributing thermal energy
Part.In alternative embodiments, third casing part 104 may be constructed such that radiator and be forged, cast, pressing mold or
It is formed in other ways by metal, alloy or metal material.Similarly, the 4th casing part 106 has for distributing thermal energy
One or more cooling fins 404 or heat dissipation element.In alternative embodiments, the 4th casing part 106 may be constructed such that
It radiator and is forged, casts, pressing mold or being formed in other ways by metal, alloy or metal material.
Fig. 5 shows the cross section along reference line 5-5 of electronic building brick 200.Similar attached drawing mark in Figure 4 and 5 figure
Note indicates similar element.The cross section of Fig. 5 be not shown any converter section cross section or any AC connector (36,38,
Or the cross section of DC terminal (42,44) 40).Further, the cross section of Fig. 5 is located at first housing portion 100 and second
Between the first coolant channel and the second coolant channel in casing part 102.
Fig. 6 shows the cross section along reference line 6-6 of electronic building brick 200.Similar attached drawing mark in Fig. 4 and 6 figures
Note indicates similar appended drawing reference.The cross section of Fig. 4 can disclose pair of output converter section and the first conduit and the second conduit
The output par, c answered, and the cross section of Fig. 5 can show the corresponding defeated of input converter section and the first conduit and the second conduit
Enter part.
One group of first external input conduit 521 includes from the first outside transverse chambers 528 (for example, indulging in paper in Fig. 4
To ground) the substantially parallel curved catheter of the first external input of one or more conduit 521 or a series of that extends or circuit.
Corresponding one group of external input conduit 521 is connected to corresponding one group of first input converter section 524.In one embodiment, often
A first input converter section 524 can include substantially spiral, substantially elliptical generally circular or other arcs
Channel, a corresponding first external input conduit 521 is engaged or coupled to inside corresponding one first by the channel
Input pipe 522.In a construction, one end of one group of first inside input pipe 522 be connected to corresponding one group first it is defeated
Enter converter section 524, and the opposite end of the first inside of group input pipe 522 is connected to first entrance transverse chambers 520.First entrance
Transverse chambers may be coupled to first entrance 116 or first outlet 118.
One group of second external input conduit 516 includes from the second outside transverse chambers 518 (for example, indulging in paper in Fig. 4
To ground) the substantially parallel curved catheter of the second external input of one or more conduit 516 or a series of that extends or circuit.Phase
The one group of second external input conduit 516 answered is connected to corresponding one group of second input converter section 514.In one embodiment,
Each second input converter section 514 can include substantially spiral, substantially elliptical generally circular or other arcs
A corresponding second external input conduit 516 is engaged or coupled in corresponding one second by the channel of shape, the channel
Portion's input pipe 512.In a construction, one end of one group of second inside input pipe 512 is connected to corresponding one group second
Converter section 514 is inputted, and the opposite end of the second inside of group input pipe 512 is connected to second outlet transverse chambers 511.Second goes out
Mouth transverse chambers 511 may be coupled to second entrance 120 or second outlet 122.
In fig. 4 to fig. 6, first housing portion 100 includes being located in first housing portion 100 for transmitting fluid or cold
But the one group of channel or microchannel of agent, and the wherein inner surface of first housing portion 100 and one or more metal island (examples
Such as, the first metal island 24, the second metal island 26, third metal island 28 or the 4th metal island 30) contact, above the metal island or
Close, coolant or fluid for being transferred to heat from metal island in the channel or microchannel with the metal island.At one
In construction, each AC connector (36,38,40) includes the surface-mounted connector being mounted on substrate 34.Each friendship
It is corresponding mutually defeated that stream connector is all electronically connected to such as the first semiconductor 20 and each of the switch portion of the second semiconductor 22 etc
Terminal out.Between the connector (26,38,40,42,44) that third metal island 28 is positioned adjacent to or neighbouring surface-mounted company
It connects in the third region between device.
In one example, second housing portion 102 includes one group of channel or micro- logical in second housing portion 102
Road, and wherein the inner surface of second housing portion 102 is opposite with one or more metal islands substrate 34 mounted thereto
Side contacts, it is close in the opposite side or with the opposite side, for heat from the transmitting of one or more of metal islands.One
In a construction, the first semiconductor 20 and the second semiconductor 22 include surface-mounted transistor, which is mounted on substrate 34
Above and it is electrically connected to corresponding metallic circuit wiring (for example, 406 in Fig. 4), and wherein second housing portion 102
Including the inner surface with fit shapes and size, the fit shapes and size correspond in the opposite side and substrate 34 of substrate 34
Any associated components (for example, force device or electronic component) profile or adjoining surface.
Fig. 7 illustrates the amplification rectangle part of the cross section of the electronic building brick 200 shown in Fig. 4.Fig. 7, which is clearly show, to be turned
Portion is changed, converter section engagement is connected to the connector of corresponding connector part (for example, plug) and conductor (for example, surface is pacified
Dress formula connector).Herein, the corresponding connector part is illustrated as right-angle type connector, although any connection device (example
Such as, linear connector or common connector) it can fall within the scope of the present invention.
In Fig. 7, first housing portion 100 includes the first conduit.First conduit includes being located at first housing portion 100 again
In one group of substantially parallel and channel or the first microchannel for being longitudinally extended, the wherein adjacent part of first housing portion 100
Hot path is provided between one or more metal islands and the first conduit.As previously mentioned, under metal island includes one or more
State island: the first metal island 24, the second metal island 26, third metal island 28 and the 4th metal island.In one embodiment, channel with
It is previously described herein that output and input path synonymous.
As shown in fig. 7, second housing portion 102 includes the second conduit.Second conduit includes being located at second housing portion again
One group in 102 channel or the second microchannel substantially parallel and be longitudinally extended, the wherein adjacency section of second housing portion 102
Divide and provides hot path between one or more metal islands and the second conduit.As previously mentioned, under metal island includes one or more
State island: the first metal island 24, the second metal island 26, third metal island 28 and the 4th metal island 30.
Third casing part 104 is fixed to the first connector part.Third connector part includes lid or radiator (example
Such as, with the lid of external cold sink or substantially parallel ridge projections), to provide for from one of electronic building brick 200
Or the supplement path of multiple metal island heat transfers.4th casing part 106 is fixed to the second connector part.4th connection
Device part includes lid or radiator (for example, lid with external cold sink or substantially parallel ridge projections), to provide
Supplement path for one or more metal island heat transfers from electronic building brick 200.
The electronic building brick 200 of Fig. 8 is similar to the electronic building brick 200 of Fig. 7, except the electronic building brick 200 of Fig. 8 further comprises heat
Outside boundary material (801,802,803), thermally conductive binder or thermally conductive lubricant.For example, thermal interfacial material (801,802,803) is used
Between the first metal island 24 and first housing portion 100, between third metal island 28 and first housing portion 100, Yi Ji
Between four metal islands 30 and first housing portion 100.Similar appended drawing reference in Fig. 7 and 8 figures indicates similar element or spy
Sign.
In one embodiment, thermal interfacial material be can be used in electronic building brick 200 inside and circuit board assemblies 11 it
Between gap fillers.For example, thermal interfacial material can be injected, be pushed into or be put into circuit board assemblies 11 and the first shell
Divide in the first gap between 100 inner surface being substantially obedient to and between circuit board assemblies 11 and second housing portion 102
The second gap between.Thermal interfacial material can fill irregular recess, groove or gap in one layer.Thermal interfacial material is non-
Often it is suitable for not leaving tack line after thermal interfacial material solidification or leaves negligible tack line.Thermal interfacial material is used
In avoiding short circuit and metal from contacting with metal, wherein active metal terminal (or potential is different from the conductive structure on ground) can be connect
Synapsis is in the metal parts of earth potential.Thermal interfacial material is very suitable for transmitting heat far from active component, and arrival is formed in the
Coolant channel in one casing part 100, second housing portion 102 or shell.For example, thermal interfacial material can be directly connected to
Metal island (for example, 30,24,28) or heat sink strip band on to substrate.Further, thermal interfacial material can be placed on capacitor 56
Face, and the vacancy between capacitor 56 and first housing portion 100 and the inside of second housing portion 102 can be filled, with
Heat is conducted or is exported far from capacitor 56.
In a construction, apply (for example, injection) thermal-control material, and when thermal-control material solidification, become
Dielectric medium structure with relatively high thermal conductivity is such as about 240 watts/meters-Kelvin and in the side z in x-y direction
It is upwards about 5 watts/meters-Kelvin.Wherein, x-y plane is the plane on the surface of substrate 34, so that passing through in heat transfer theory
Anisotropic gradient in electronic building brick 200 and occur.
As shown in Figure 1, wherein flip-chip or inverted mold method are used for the first semiconductor switch 20 and the second semiconductor
Switch 22, the first thermal interface material layer can be placed on the side of (or being joined to) substrate 34, and the second thermal interface material layer
It can be placed in (or being joined to) first thermal interface material layer, plurality of hot boundary layer tends to provide damping property and reduces vibration
Dynamic stress.
In a construction, if Heat Conduction Material includes the resin for being cured as dielectric substance, Heat Conduction Material ratio is such as
The peripherad component of conductive grease and enclosure interior provide better wearability and bigger adhesiveness.
In alternative embodiments, the substrate 34 as unfilled (naked substrate) circuit board (for example, ceramic substrate)
With thermal expansion coefficient (CTE) boundary layer, so that the first CTE of metal island (for example, biggish cover copper pattern) and substrate 34
Second CTE match, for carrying out thermal conditioning.For example, CTE boundary layer includes being located at metal island (for example, 30,24 and 28) and substrate
The dielectric layer (for example, general plane layer) of polymer, plastics or fiber filled polymer between 34.In an illustrated examples
In, CTE boundary layer includes the polyimides or bismaleimide being joined on such as substrate 34 of ceramic substrate (for example, FR4)
Amine triazine (BT) material.Further, including the polyimides being joined on substrate 34 or Bismaleimide Triazine (BT) material
CTE boundary layer can be used for the gate driving between substrate 34 and assisting base plate 46 or below substrate 34 and connector 32
CTE consistency is provided between circuit board.
In one embodiment, the electronic building brick 200 of Fig. 9 is similar to the electronic building brick 200 of Fig. 7, except the electronic building brick of Fig. 9
200 further comprise heat radiating metal island 901 or ground connection on the opposite side with metal island (24,28,30) with substrate 34
Layer (ground plane) thermal communication thermal conducting path 900 (for example, plastics access, polymer access, dielectric thermal conducting path,
Thermoplasticity access or thermoplastic insert) outside.One or more thermal conducting paths 900 are (for example, thermoplasticity access or thermoplasticity insertion
Part) it can be made of thermally conductive but electrical isolation dielectric substance: (1) ensure that metal island (28,24,30) does not form electrical connection
Or be not easy to electrical connection (for example, electric short circuit, if metal island be configured to electric drift or in operation potential rather than earth potential
Under), or (2) be used to that the different phase output terminals of inverter or electronic building brick 200 to be isolated, in the inverter or electronic building brick,
Ground plane is shared to be used between one or more metal islands (24,28,30) and corresponding heat radiating metal island 901 or ground plane.
In alternative embodiments, the electronic building brick 200 of Fig. 9 is similar to the electronic building brick 200 of Fig. 7, except the electronics of Fig. 9
Component 200 further comprises heat radiating metal island 901 on the side opposite with metal island (24,28,30) with substrate 34 or connects
The thermal conducting path 900 of stratum thermal communication is conducted outside blind hole or plating access, and wherein thermal conducting path 900 includes conductive and thermally conductive
Metal pathway.For example, in some embodiments of present disclosure, thermal conducting path 900 can will be on the first side of substrate 34
One or more metal islands (28,24,30) (for example, electrically and mechanically) be connected to one in second side of substrate 34 or
Multiple heat radiating metal islands 901 or one or more ground planes, wherein second side is opposite with the first side.Fig. 9 is illustrated in general, thermally conductive
Access 900 (for example, dielectric thermal conducting path, heat-conducting metal access or both) (for example, calorifics, mechanically or electrically,
Or by connection type above-mentioned it is any combination of in a manner of) be connected between the first metal island 24 and metal ground plane 901, connect
Between third metal island 28 and heat radiating metal island 901 (also referred to as metal ground plane or phase Special grounding layer), and it is connected to
Between 4th metal island 30 and metal ground plane 901.Similar appended drawing reference in Fig. 7 and 8 figures indicates similar element or spy
Sign.
Figure 10 is the perspective view of the illustrated examples of the fluid cooling system 900 of the electronic building brick 200 comprising Fig. 1.Fluid
Cooling system 900 includes the radiator 950 that pump 952 is connected to by pipeline 958.Pump 952 is further through pipeline (956,962,943)
It is connected to electronic building brick 200.Radiator 950 has connectivity port (948,951).At least one connectivity port (for example, 951) is logical
Piping 958 is connected to pump intake 954 or pump discharge 956, wherein the opposite connector 964 from pump 952 is connected by pipeline
It is connected to electronic building brick 200.For example, the first radiator connectivity port 951 is connected to pump intake 954, and the second radiator connecting pin
Mouthfuls 948 by pipeline (944,946), one or more connectors 947, the inner passage in electronic building brick 200 and pipeline (943,
962,956) it is connected to pump discharge 964.
Electronic building brick 200, which has, to be secured together to form the first housing portion 100 of shell and second housing portion
102.The feature of shell further includes third casing part 104 and the 4th casing part 106.First housing portion 100 has first
Entrance 116 and first outlet 118.Second housing portion 102 has second entrance 120 and second outlet 122.
As shown, pump discharge 964 passes through pipeline (956,962,943) and T word connector, connection wye or other appropriate
Connector 947 is connected to the first entrance 116 and second entrance 120 of electronic building brick 200.Similarly, the second radiator port is logical
Piping and T word connector, connection wye or other connectors appropriate 947 are connected to first outlet 118 and second outlet 122.
In operation or before the procedure, fluid or coolant are filled to radiator 950.Radiator 950 can mention
For the reservoir of coolant；Channel and associated chamber in electronic building brick 200 can provide the reservoir of coolant, or heat dissipation
Both device 950 and electronic building brick 200 can provide the reservoir of coolant.Fluid or coolant are conveyed into the by pump 952
One entrance 116 recycles in first housing portion 100 for fluid or coolant.Fluid or coolant are connected by pipeline
First housing portion 100 is left at the first outlet 118 of radiator 950.Similarly, pump 952 transmits fluid or coolant
Into second entrance 120, for fluid or coolant second housing portion 102 in recycle.Fluid or coolant are passing through
Pipeline is connected at the second outlet 122 of radiator 952 and leaves second housing portion 102.
Circuit board assemblies 11 can be produced according to various technologies, in the technology, some examples are referring to herein.By or
Substrate 34 and auxiliary is mounted on by by the Power switching devices of surface-mounted film capacitor element, connector plug jack and plane
It helps on the one or both sides of substrate 46, onboard populated circuit board component 11 (for example, power switch printed circuit board).For example,
Place machine can be used and carry out installing component.Electronic building brick is provided including the low voltage connector for battery and motor wire
Control and gate driving functional circuit.
Shell (100,102,104,106) may include be molded (for example, injection molding), by 3 D-printing construct
Or the cover or lid that are formed in other ways.For example, in one embodiment, it can be for first housing portion 100 and second
Casing part 102 manufactures electronic building brick 200 in highly automated process using 3 D-printing, to support to be formed in the housing
Integral type coolant channel.Shell includes first housing portion 100 and second housing portion 102.Each casing part (100,
102) the control grid of the lower section of component and interconnection piece and connector 32 and drive for all having and being placed on circuit board assemblies 11
The shape and the consistent inner surface configuration/profile of profile and feature of dynamic circuit board.Therefore, electronic building brick 200 is very suitable for height
Density is encapsulated and is used for capacity (for example, electric current or power) output end of electronic building brick 200 using less volume.At one
In construction, substrate 34 can encapsulate (BGA) interconnection by using ball array to be connected to (or the gate driving circuit of assisting base plate 46
Plate).For example, the assembly substrate 34 with component mounted thereto can be undergone back together with control and gate driving circuit plate
Fusion welding process.
Connector (36,38,40,42,44) includes surface-mounted connector, the surface-mounted connector sustained load
(for example, electric motor, generator or motor) and between the energy source (for example, DC energy source) of electronic building brick 200
The plug (pin) and type of jack of electrical connection.Connector is assembled into the first semiconductor switch 20 and the second semiconductor switch 22
Capacitor element and plane chipset between.Above arrangement of the connector (36,38,40,42,44) in electronic building brick 200
Support electrical design function (for example, minimize system inductance and avoid unnecessary current loop), thermal design function (example
Such as, the space for being used to separate the component operated under the larger temperature difference between chipset (20,22) and capacitor (56), Yi Jiyong
In improve heat dissipation increased jack whole surface area) and mechanical function (for example, minimize circuit board 11 need integral face
Product).
In one embodiment, the assisting base plate 46 or circuit board of 32 lower section of connector include gate driving circuit and control
Circuit board.Assisting base plate 46 can be with one or more phases for controlling the first semiconductor switch 20 and the second semiconductor switch
Gate driving circuit it is associated.The method that specific integrated circuit (ASIC) can be used minimizes gate driving circuit.With
Conductive layout is not only simplified by circuit isolation in the ASIC of miniaturization gate driving circuit, also adds resistance by electric current
With voltage with the ability of spurious effects and electromagnetic interference caused by the change of time.The feature of gate driving circuit includes electricity
Influenza slowdown monitoring circuit and for discrete circuit low-voltage control.In a construction, current sensing circuit is near or adjacent in changing
The alternating current output end or one or more metal islands for flowing device are placed, and wherein current sensing circuit is accompanied by any necessary protection
With flux/field concentrator.Low voltage control and discrete circuit can be embedded in field programmable gate array (FPGA) and the discrete ministry of electronics industry
In part and integrated circuit.Gate driving circuit and control circuit over-assemble have and be placed on by inverter driving electric motor/
The surface-mounted low voltage connector conducting wire that battery on generator is connected with sensor.
In one embodiment, shell can be formed by three-dimensional (3-D) printing technology or injection molding technique.Shell tool
Consistent surface shape/the profile of circuit board assemblies 11 and feature for having and being used in converter assembly.Shell convenient for enhancing for
Semiconductor switch (20,22), thin film capacitor 56 (for example, thin film capacitor), the connector (example interconnected on circuit board 11
Such as, 36,38,40,42,44) and all thermal conditionings for being thermally generated circuit for being placed on circuit board 11.
To form shell by 3-D printing technology, firstly, laser scanner is used for scanning circuit plate 11.Laser scanning
One or more 3-D images of the profile of instrument generation circuit plate.The isolated laser image of the every side of circuit board 11 is collected as defeated
Enter data.Second, pre-formed thermal interfacial material (TIM) net (screen) can be deposited on the circuit board 11 for being assembled with component.
TIM permission is thermally generated component or region, heat-conduction component or region or thermal component or region and shell in component 200
Inside between be in close contact.In interchangeable construct, with (for example, optimize for electrical isolation and heat transfer) optimization thickness
One layer of TIM of degree can be unfolded on the inner surface of first housing portion 100 and second housing portion 102.
Third, shell can purchase vehicle by polymer, plastics or metal material.In a construction, based on by laser scanning
The one or more scanned profiles or scanned image that instrument is collected, by such as aluminium or high-molecule metal compound etc
Light-weight metal 3-D is printed as shell.The shell of 3-D printing is consistent with the component of circuit board 11 and feature.For example, the 3- of inverter
The shell of D printing can contact or touch all components and part on circuit board 11.As shown in figs. 4 and 7,3-D is printed
Shell will have be used to generate coolant vortex coolant built-in coolant channel or microchannel.Coolant channel passes through
The thermal conditioning of interconnection piece makes the double-sided cooled of semiconductor switch (20,22), and to the lateral of the heat from power device
It extracts effective.This automatic 3-D printing technology for inverter shell will efficiently reduce unused in electronic building brick 200
Volume or free space, this supports the package dimension for reducing electronic building brick 200.3-D printing will allow to optimize inverter shell/outer
Therefore the thickness of shell if 3-D printing technology is suitably used, can reduce required material significantly, thus with
3-D printing technology it is mature, the cost savings of wholesale may be implemented.3-D printing shell convenient for improve semiconductor switch (20,
22) channel of heat-conducting fluid is arrived, which results in the higher rated power of inverter.
In alternative embodiments, injection molding can be used for being formed shell or casing part (100,102).Shell promotees
Into resistance to vibration and vibration strength, because of the circuit board 11 that casing part (100,102) has been densely filled with TIM and has been sealed by TIM.
Unused and exposure the area of circuit board 11 will have conducting ring groove pattern or metal island, effectively to increase by 11 He of circuit board
Whole contact area between preforming thermal interfacial material (TIM).TIM is in 11 component of circuit board assemblies and such as the first shell
Electrical isolation and heat transfer are provided between part 100 and the shell of second housing portion 102.
TIM layers one or more of can be placed, encapsulate, inject, spray or be deposited on converter assembly following portions
On part or component: shell (100,102), substrate 34, assisting base plate 46, printed circuit board 11, capacitor 56, metal island (30,
24,28) the island, surface of band, gasket, circuit board 11 on or the metallicity or pattern of fin shape, connector or electricity
Any circuit, needs of being thermally generated on source jack (36,38,40,42,44), control and gate driving circuit plate are for vulnerable to vibration
Any part of the protection shell of dynamic and shock damage weakness, and/or it can become in other ways vulnerable to temperature vibration or temperature
Change any part of damage.Thermal interfacial material (TIM) between converter circuit plate 11 and casing part (100,102) helps
It realizes high capacity (for example, electric current output), high packaging density is (for example, the electric current of the every spatial volume occupied by component 200 is defeated
Out).
TIM is such as used for the possible double-sided cooled of semiconductor switch (20,22) convenient for the heat dissipation of enhancing electronic building brick 200
Method.For example, TIM can make the power of semiconductor switch (20,22) and the numerical value of heat cycle be significantly increased.With for conventional
Power semiconductor arrangement in electronic building brick is compared, which has potentially resulted in the improvement of semiconductor device reliability.
The component and internal thermal interfacial material (TIM) for being joined to component 200 tend to minimize (the inverter from node to heat exchanger
Cold plate) in coolant channel thermal resistance.The highest junction temperature allowed for power device is (for example, Tj_max, such as from about
175 degrees Celsius and it is higher) and highest coolant temperature (for example, up to 105 degrees Celsius) between increased nargin or difference
Provide the chance for reducing the die size of semiconductor device.
Preferred embodiment has been described, it is clear that can be in sheet of no disengaging such as in subsidiary claim limits
It is carry out various modifications in the case where the protection scope of invention.
Claims (24)
1. a kind of electronic building brick for inverter, the electronic building brick include:
There is dielectric layer and metallic circuit to be routed for substrate, the substrate；
Multiple terminals, the multiple terminal is for being connected to DC power supply；
First semiconductor and the second semiconductor, first semiconductor and the second semiconductor connect between the terminal of DC power supply
To together；With
First metal island, first metal island are described in the first area between the first semiconductor and the second semiconductor
First metal island, which has, is greater than height or thickness that metallic circuit is routed and is greater than first semiconductor and the second semiconductor
To be contacted with the cooling-part being located above first metal island and therefore provide the radiator for being used for radiating upwards.
2. electronic building brick according to claim 1, wherein heat is by being connected to first metal island and being located at substrate
Opposite side on ground plane or radiator between thermally conductive dielectric access be conducted away from first metal island.
3. electronic building brick according to claim 1, wherein the cooling-part includes:
First housing portion, the first housing portion are covered on above substrate and the first metal island；Wherein, heat is by with
The contact of one metal island, the first housing portion close above first metal island or with first metal island are remote by conduction
From first metal island.
4. electronic building brick according to claim 3, wherein thermal interfacial material is used in first metal island and the first shell
Between part.
5. electronic building brick according to claim 3, wherein first semiconductor and the second semiconductor include surface installation
Formula transistor, the surface-mounted transistor are installed on substrate and are electrically connected to the corresponding metallic circuit wiring,
And wherein the first housing portion includes the inner surface with fit shapes and size, and the fit shapes and size are corresponding
In the surface of the profile or adjoining of first metal island and the surface-mounted transistor.
6. electronic building brick according to claim 3, wherein the first housing portion includes being located at and first metal
Island contact, adjoining above first metal island or close to first metal island lid or shell in one group of channel,
For from the first metal island heat transfer.
7. electronic building brick according to claim 1, further comprises:
Multiple first surface installing type connectors, the multiple first surface installing type connector are installed on substrate and are electrically connected
It is connected to the terminal；With
Second metal island, in the second area between surface-mounted connector that second metal island is positioned adjacent to.
8. electronic building brick according to claim 7, wherein electronic building brick further includes first housing portion, first shell
It is partially covered on above the substrate, the first metal island and the second metal island and including one in the first housing portion
Group channel, and wherein the inner surface of the first housing portion is contacted with second metal island, in second metal island
Top or close to second metal island, for from the second metal island heat transfer.
9. electronic building brick according to claim 1, further comprises:
Multiple second surface installing type connectors, the multiple second surface installing type connector are installed on substrate and are electrically connected
It is connected to the first phase output terminals of first semiconductor and the second semiconductor；With
Third metal island, in the third region between surface-mounted connector that the third metal island is positioned adjacent to.
10. electronic building brick according to claim 9, wherein electronic building brick further includes first housing portion, outside described first
Shell parts are covered on above the substrate, the first metal island and third metal island and including being located in the first housing portion
One group of microchannel, and wherein the inner surface of the first housing portion is contacted with the third metal island, in the third gold
Belong to above island or close to the third metal island, is used for from the third metal island heat transfer.
11. a kind of electronic building brick for inverter, the electronic building brick include:
There is dielectric layer and metallic circuit to be routed for substrate, the substrate；
First housing portion, for being mounted on above the substrate, the first housing portion has the first housing portion
Multiple coolant channels in the first housing portion；
Second housing portion, the second housing portion is for being mounted below the substrate；
Multiple terminals, the multiple terminal is for being connected to DC power supply；
First semiconductor and the second semiconductor, first semiconductor and the second semiconductor connect between the terminal of DC power supply
To together；With
First metal island, first area of first metal island between first semiconductor and second semiconductor
In, first metal island has the height or thickness for being greater than metallic circuit wiring, and the first metal island offer is used for
First of adjoining by being contacted with first metal island, above first metal island or close to first metal island
Coolant channel in casing part shifts the radiator of heat dissipation.
12. electronic building brick according to claim 11, wherein the coolant channel of the first housing portion further wraps
It includes:
A series of entrance coolant channels, a series of entrance coolant channels are for coolant to be transmitted to outside described first
In shell parts/recycle coolant in the first housing portion, the entrance coolant channel is suitable for receiving from entrance cold
But agent.
13. electronic building brick according to claim 11, wherein the coolant channel of the first housing portion further wraps
It includes:
A series of outlet coolant channels, a series of outlet coolant channels are for transmitting in the first housing portion
Coolant/recycle coolant in the first housing portion, the outlet coolant channel are suitable for receiving cooling from outlet
Agent.
14. electronic building brick according to claim 11, wherein the coolant channel of the first housing portion includes:
Entrance, the entrance is located in the first housing portion, for receiving coolant；
A series of entrance coolant channels, a series of entrance coolant channels are for coolant to be transmitted to outside described first
In shell parts/recycle coolant in the first housing portion, the entrance coolant channel connection and the entrance phase
Associated dispenser portion；
A series of outlet coolant channels, a series of outlet coolant channels are for transmitting in the first housing portion
Coolant/recycle coolant in the first housing portion, the outlet coolant channel are connected to curved device and institute
State the converter section between outlet coolant channel；With
Outlet, the outlet is located in the first housing portion, for coolant to be discharged.
15. electronic building brick according to claim 14, further comprises:
Radiator, the radiator is for receiving discharged coolant；
Pump, the pump is associated with radiator, so that coolant recycles in the radiator and first housing portion.
16. electronic building brick according to claim 11, further comprises:
Multiple first surface installing type connectors, the multiple first surface installing type connector are installed on substrate and are electrically connected
One for being connected to the terminal or being connected in the metallic circuit wiring；With
Second metal island, in the second area between surface-mounted connector that second metal island is positioned adjacent to.
17. electronic building brick according to claim 16, further comprises:
A series of entrance coolant channels below second metal island or a series of are neutralized positioned at the first housing portion
Outlet coolant channel.
18. electronic building brick according to claim 11, further comprises:
Multiple second surface installing type connectors, the multiple second surface installing type connector are installed on substrate and are electrically connected
It is connected to the first phase output terminals of first semiconductor and the second semiconductor；With
Third metal island, in the third region between surface-mounted connector that the third metal island is positioned adjacent to.
19. electronic building brick according to claim 18, further comprises:
A series of entrance coolant channels below the third metal island or a series of are neutralized positioned at the first housing portion
Outlet coolant channel.
20. electronic building brick according to claim 11, wherein the inner surface of the first housing portion is in size and shape
Suitable for cooperating with the substrate for being assembled with one or more surface-mounted components.
21. electronic building brick according to claim 20, wherein the surface-mounted component includes one in components described below
Kind is a variety of: transistor, capacitor and connector.
22. electronic building brick according to claim 11, wherein first semiconductor and second semiconductor include peace
Fill on the substrate and be electrically connected to the surface-mounted transistor of the corresponding metallic circuit wiring.
23. electronic building brick according to claim 11, wherein the second housing portion have for one of heat dissipation or
Multiple cold sinks.
24. electronic building brick according to claim 11, wherein the first housing portion and the second housing portion are matched
It closes to form the shell for the substrate.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US201461971590P | 2014-03-28 | 2014-03-28 | |
| US61/971,590 | 2014-03-28 | ||
| US14/291,996 US9504191B2 (en) | 2014-03-28 | 2014-05-30 | Electronic assembly for an inverter |
| US14/291,996 | 2014-05-30 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104952816A CN104952816A (en) | 2015-09-30 |
| CN104952816B true CN104952816B (en) | 2019-10-15 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510140960.2A Active CN104952816B (en) | 2014-03-28 | 2015-03-27 | Electronic building brick for inverter |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN104952816B (en) |
| GB (1) | GB2526172B (en) |
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| ES2773479T3 (en) * | 2016-05-24 | 2020-07-13 | Mitsubishi Electric Corp | System comprising at least one power module comprising at least one power chip that is cooled with a liquid cooled busbar |
| US10492343B2 (en) * | 2016-08-23 | 2019-11-26 | Ford Global Technologies, Llc | Vehicle power module assembly with cooling |
| CN109510455A (en) * | 2019-01-04 | 2019-03-22 | 武汉海达数云技术有限公司 | Power supply change-over device |
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| US7547966B2 (en) * | 2006-10-18 | 2009-06-16 | Hitachi, Ltd. | Power semiconductor module |
| JP2011155207A (en) * | 2010-01-28 | 2011-08-11 | Aisin Aw Co Ltd | Method of manufacturing inverter module, and the inverter module |
| WO2012132709A1 (en) * | 2011-03-29 | 2012-10-04 | ローム株式会社 | Power module semiconductor device |
| JP5217884B2 (en) * | 2008-10-14 | 2013-06-19 | 株式会社デンソー | Semiconductor device |
| US9148946B1 (en) * | 2014-03-28 | 2015-09-29 | Deere & Company | Electronic assembly for an inverter |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP4797077B2 (en) * | 2009-02-18 | 2011-10-19 | 株式会社日立製作所 | Semiconductor power module, power converter, and method for manufacturing semiconductor power module |
| KR101273724B1 (en) * | 2010-08-18 | 2013-06-12 | 삼성전기주식회사 | Radiant heat substrate and method for manufacturing the radiant heat substrate, and luminous element package with the radiant heat substrate |
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- 2015-03-05 GB GB1503707.0A patent/GB2526172B/en active Active
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Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7547966B2 (en) * | 2006-10-18 | 2009-06-16 | Hitachi, Ltd. | Power semiconductor module |
| JP5217884B2 (en) * | 2008-10-14 | 2013-06-19 | 株式会社デンソー | Semiconductor device |
| JP2011155207A (en) * | 2010-01-28 | 2011-08-11 | Aisin Aw Co Ltd | Method of manufacturing inverter module, and the inverter module |
| WO2012132709A1 (en) * | 2011-03-29 | 2012-10-04 | ローム株式会社 | Power module semiconductor device |
| US9148946B1 (en) * | 2014-03-28 | 2015-09-29 | Deere & Company | Electronic assembly for an inverter |
Also Published As
| Publication number | Publication date |
|---|---|
| GB201503707D0 (en) | 2015-04-22 |
| CN104952816A (en) | 2015-09-30 |
| GB2526172A (en) | 2015-11-18 |
| GB2526172B (en) | 2018-12-19 |
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