GB2522569A

GB2522569A - Door lock Actuator, Component mounting structure, and component mounting method

Info

Publication number: GB2522569A
Application number: GB1506689.7A
Authority: GB
Inventors: Mikio Yamagata; Nobuya Akagi
Original assignee: U Shin Ltd
Current assignee: U Shin Ltd
Priority date: 2012-10-22
Filing date: 2013-10-22
Publication date: 2015-07-29
Anticipated expiration: 2033-10-22
Also published as: GB2522569B; DE112013005084T5; WO2014065288A1; JP6215836B2; GB201506689D0; JPWO2014065288A1

Abstract

This door lock actuator (1) is equipped with a resin case (2). Terminals (11A, 11B, 11C) are provided on the front surface (2b) side of the bottom wall (2a) of the case (2). Fixed contacts (13a, 13b, 13c) are provided on first surfaces (11a) of the terminals (11A through 11C). A diode (14A) as a surface-mount component is placed inside a through-hole (15) that is formed in the bottom wall (2a). Terminals (11A, 11B) protrude (protrusions (16a, 16b)) into the through-hole (15) from the hole wall (15a) of the through-hole (15). Connection parts (21) for electrically connecting second surfaces (11b), which are formed on the opposite side to the first surfaces (11a) (fixed contacts (13a through 13c)), of the protrusions (16a, 16b) to electrodes (14b) of the diode (14A) are provided.

Description

DESCRIPTION

DOOR LOCK ACTUATOR, COMPONENT MOUNTING STRUCTURE, AND

COMPONENT MOUNTING METHOD

TECHNICAL FIELD

[0001] The present invention relates to a door lock actuator, a component mounting structure, and a component mounting method.

BACKGROUND ART

[0002] Patent Document 1 discloses a door lock device provided with an actuator which moves a door lock lever of a vehicle to an unlocked position, a locked position and a super locked position. Patent Document 1 also discloses an actuator which adopts a method where a state of a door latch is switched between a locked state and a super locked state by controlling electricity supplied to a motor which is a power source. In such an actuator, a part from which electricity is supplied to the motor and a contact switching portion are provided on one resin case (substrate), and a diode is used as a circuit constitutional component for an electricity supply control. The diode is limited to a diode of an axial type in the currently used resin case (substrate) structure.

[0003] The mounting structure of a diode of an axiaj type is described hereinafter with reference to Fig. 22 to Fig. 24.

[0004] Fig. 22 to Fig. 24 show the mounting structure of the diode of an axial type. Fig. 22 is a cross-sectional view, Fig. 23 is a plan view, and Fig. 24 is a side view. Metal terminals 102, 104 which constitute conductors are mounted on a resin case 101. A component holding portion 10 1A having an approximately rectangular frame shape is formed on the resin case 101. Lead support portions 102A, 104A which are raised vertically are formed on respective end portions of the metal terminals 102, 104 arranged on both sides of the component holding portion lOlA of the resin case 101, respectively. Grooves 102a, 104a extending in the longitudinal direction are formed on the lead support portions 102A, 104A, respectively.

[0005] A diode of an axial type 105 is housed in the inside of the component holding portion lOlA of the resin case 101. Leads 108 extending horizontally from both sides of the diode 105 are fitted into from above and supported by grooves 102a, lO4a formed on the lead support portions lO2A, 104A, respectively. By soldering portions of both leads 108 (portions indicated by a symbol "a" in Fig. 22 to Fig. 24) supported by the lead support portions 102A, 104A, the diode 105 is electrically connected to the metal terminals 102, 104 through the leads 108, and thus mounting the diode 105 on the resin case 101.

PRIOR ART DOCUMENT

PATENT DOCUMENT

[0006] Patent Document 1: JP 2010-28 1076 A

SUMMARY OF THE INVENTION

PROBLEMS TO BE SOLVED BY THE INVENTION

[0007] It is expected that the number of manufacturers who manufacture diodes of an axial type will be decreased in the future and hence, there is a possibility that it becomes difficult for users to use this type of diodes in the future. Accordingly, it is necessary to exchange currently used electronic components of an axial type with surface mount components used in printed circuit boards.

[0008] In a currently used resin case (substrate), the resin case is manufactured by molding a metal terminal therein by insert-molding.

In manufacturing the metal terminal, at the time of setting the metal terminal in a mold, it is necessary to insert flanges for soldering (lead support portions lO2A, 104A described above) into a core mold.

Accordingly, a contact switching surface and a soldering surface become coplanar and hence, contact corrosion occurs due to solder flux thus giving rise to a possibility of lowering quality of a door lock actuator.

[0009] Further, in mounting a surface mount component on the substrate, the surface mount component has an electrode on a bottom surface thereof and hence, when the surface mount component is directly mounted on the metal terminal, there exists a possibility that a solder defect occurs.

[0010] The present invention has been made in view of the above-mentioned drawbacks, and it is an object of the present invention to provide a door lock actuator having the mounting structure of a surface mount component with which corrosion of a fixed contact of a conductor can be prevented.

MEANS FOR SOLVING THE PROBLEMS

[0011] A first aspect of the present invention provides a door lock actuator comprising, a substrate having a front surface and a back surface, a conductor disposed on the front surface of the substrate, the conductor having a first surface which is a surface on a front surface side of the substrate and on which a fixed contact for switching an energization path to a power source by contacting with a movable contact is provided, a through hole formed in the substrate so as to penetrate the substrate from the front surface to the back surface, a projecting portion constituting a portion of the conductor which projects from a hole wall of the through hole, a surface mount component including a component body and an electrode mounted on an outer surface of the component body, the surface mount component disposed in an inside of the through hole, and a bonding portion where a second surface of the projecting portion on a side opposite to the first surface and the electrode of the surface mount component are electrically bonded to each other.

[0012] For example, the bonding portion is formed by soldering.

[0013] The bonding portion between the electrode of the surface mount component disposed in the inside of the through hole formed in the substrate and the projecting portion (a portion of the conductor) projecting from the hole wall of the through hole is provided on the surface (second surface) of the conductor on a side opposite to the surface (first surface) on a fixed contact side. Accordingly, it is possible to prevent corrosion of the fixed contact of the conductor caused due to solder flux for soldering at the bonding portion.

[0014] It is preferable that the door lock actuator includes a support portion for supporting the surface mount component disposed in the inside of the through hole. The support portion is provided on a front surface side of the substrate so as to traverse the through hole.

[0015] The surface mount component disposed in the inside of the through hole is supported by the support portion. The surface mount component is positioned at the predetermined position in the inside of the through hole by the support portion and hence, the operability for bonding (soldering, for example) the electrode of the surface mount component and the projecting portion of the conductor is improved whereby the surface mount component can be accurately mounted at the predetermined position.

[0016] A portion of the conductor may be disposed so as to traverse the through hole along the support portion.

[0017] The first surface of the conductor may be substantially coplanar with the front surface of the substrate.

[0018] The door lock actuator may include a holding portion for holding the conductor in the vicinity of the projecting portion on the front surface of the substrate. The holding portion is disposed at a position on the front surface side of the substrate adjacent to the through hole.

[0019] By providing the holding portion, the position of the projecting portion in the inside of the through hole can be surely held. As a result, the operability for bonding (soldering, for example) the electrode of the surface mount component and the projecting portion of the conductor is further improved.

[0020] A second aspect of the present invention provides a component mounting structure comprising a substrate having a front surface and a back surface, a conductor disposed on the front surface of the substrate, the conductor having a first surface which is a surface on a front surface side of the substrate and on which a contact is provided, a through hole formed in the substrate so as to penetrate the substrate from the front surface to the back surface, a projecting portion constituting a portion of the conductor which projects from a hole wall of the through hole, a surface mount component including a component body and an electrode mounted on an outer surface of the component body, the surface mount component disposed in the inside of the through hole, and a bonding portion where a second surface of the projecting portion on a side opposite to the first surface and the electrode of the surface mount component are electrically bonded to each other.

[0021] A third aspect of the present invention provides a component mounting method for mounting a surface mount component including a component body and an electrode mounted on an outer surface of the component body on a substrate, comprising, providing a conductor disposed on the front surface side of the substrate, a contact being provided on a first surface of the conductor which is a surface on the front surface side of the substrate, disposing the surface mount component in an inside of a through hole formed in the substrate so as to penetrate the substrate from the front surface to a back surface on a side opposite to the front surface, and electrically bonding a projecting portion which constitutes a portion of the conductor projecting from a hole wall of the through hole and the electrode of the surface mount component to each other on a second surface of the conductor on a side opposite to the first surface on which the contact is provided.

EFFECT OF THE INVENTION

[0022] According to the present invention, the electrode of the surface mount component disposed in the inside of the through hole formed in the substrate and the surface (second surface) of the projecting portion of the conductor (the portion of the conductor) which projects from the hole wall of the through hole on a side opposite to the surface (first surface) on a fixed contact side are electrically bonded to each other.

Due to such electric bonding, corrosion of the fixed contact of the conductor caused due to solder flux or the like can be prevented and hence, high quality of a door lock actuator can be ensured.

BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Fig. 1 is a plan view of a door lock actuator according to a first embodiment of the present invention; Fig. 2 is a plan view of a resin case of the door lock actuator shown in Fig. 1; Fig. 3 is a schematic plan view of the resin case of the door lock actuator shown in Fig. 1; Fig 4 is a schematic bottom surface view of the resin case of the door lock actuator shown in Fig. 1; Fig. 5 is a schematic circuit diagram of the door lock actuator shown in Fig. 1; Fig. 6 is a partially enlarged plan view of a portion A in Fig. 1; Fig. 7 is a partially enlarged bottom surface view of the portion A in Fig. 1; Fig. 8 is a cross-sectional view taken along a line VIlI-VIlI in Fig. 6; Fig. 9 is a cross-sectional view of a modification of a first embodiment; Fig. 1OA is a cross-sectional view for describing a component mounting method; Fig. lOB is a cross-sectional view for describing the component mounting method; Fig. 11 is a partially enlarged plan view of a portion B in Fig. 1; Fig. 12 is a partially enlarged bottom surface view of the portion B in Fig. 1; Fig. 13 is a cross-sectional view taken along a line XIII-XIII in Fig. 11; Fig. 14 is a schematic partial perspective view of the portion B in Fig. 1; Fig. 15 is a partially enlarged cross-sectional view of a door lock actuator according to a second embodiment of the present invention; Fig. 16 is a partially enlarged cross-sectional view of a door lock actuator according to a third embodiment of the present invention; Fig. 17 is a partially enlarged pian view of a door lock actuator according to a fourth embodiment of the present invention; Fig. 18 is a partially enlarged bottom surface view of the door lock actuator according to the fourth embodiment of the present invention; Fig. 19 is a cross-sectional view taken along a line XIX-XIX in Fig. 17; Fig. 20 is a partially enlarged cross-sectional view of a door lock actuator according to a fifth embodiment of the present invention; Fig. 21 is a partially enlarged cross-sectional view of a door lock actuator according to a sixth embodiment of the present invention; Fig. 22 is a cross-sectional view showing the mounting structure of a diode of an axial type; Fig. 23 is a plan view showing the mounting structure of the diode of an axial type; Fig. 24 is a side view showing the mounting structure of the diode of an axial type.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0024] Hereinafter, embodiments of the present invention are described with reference to attached drawings.

[0025] (First embodiment) Fig. 1 shows a door lock actuator 1 according to a first embodiment of the present invention. The door lock actuator 1 can switch a door lock device mounted on a door of a vehicle between a locked state, an unlocked state and a super locked state (a state where the door lock device does not shift to the unlocked state even when an inner lock knob is operated).

[0026] The door lock actuator 1 includes a resin case 2 which is closed by a cover not shown in the drawing. A motor 3 which is a power source, a worm wheel 4, a rotor 5, a lock knob lever 6, a slider 7, and a switch shaft 8 (having a movable contact 9) are housed in the resin case 2. The rotor 5 is connected to a lock lever not shown in the drawing which the door lock device includes (the lock lever being operated by a manipulation using a key from the outside of the vehicle). The lock knob lever 6 is connected to the inner lock knob (not shown in the drawing) provided for a locking operation and an unlocking manipulation inside the vehicle.

[0027] The rotation of the motor 3 is transmitted to the worm wheel 4 through a worm gear 10, and a posture of the rotor 5 is changed in an interlocking manner with the rotation of the worm wheel 4. In an interlocking manner with the rotation of the worm wheel 4, a state where the lock knob lever 6 and the rotor 5 are connected with each other by way of the slider 7 and a state where the connection between the lock knob lever 6 and the rotor 5 is released are switched. By performing these operations, the door lock device can be switched between the above-mentioned locked state, unlocked state and super locked state.

[0028] Referring to Fig. 2 to Fig. 4, three metal-made terminals (conductors) 1 1A, 1 1B, 1 1C are integrally provided on a bottom wall 2a of the resin case 2. In this embodiment, these terminals 1 1A to 1 1C have a bus bar shape where a thickness and a width are substantially set to fixed values. In this embodiment, the terminals 1 1A and 1 lB are integrally mounted on the bottom wall 2a of the resin case 2 by insert-molding. As shown most clearly in Fig. 8, first surfaces 1 la of these terminals 1 1A and 1 lB (surfaces on which fixed contacts 13a, 13b, 13c described later are provided) are coplanar with a flat inner surface 2b of the bottom wall 2a (a surface disposed on an inner side when the resin case 2 is closed by the cover) except for positions where diodes 14A, 14B described later are mounted. To be more specific, although second surfaces 1 lb (surfaces on a side opposite to the first surfaces 1 la) of the terminals 1 1A to 1 1C are embedded into the bottom wall 2a, the first surfaces 1 la are disposed on the substantially same plane as the inner surface 2b of the bottom wall 2a.

[0029] Also referring to Fig. 5, the terminals 1 lA to 1 1C include external connection contacts 12a, 12b, 12c on the first surfaces 1 la at one ends thereof, respectively, and the terminals 1 1A to 1 1C include fixed contacts 13a, 13b, 13c on the first surfaces 1 la at the other ends thereof, respectively. Out of a pair of terminals (not shown in the drawing) of the motor 3, one terminal is electrically connected to a fixed contact 13a side of the terminal 1 1A, and the other terminal is electrically connected to an external connection contact 12a side of the terminal 1 1A. In accordance with the switching of a supply state of electricity supplied through the external connection contacts 12a to 12c, the motor 3 is rotated in either the forward direction or the reverse direction. Due to the rotation of the switch shaft 8 rotated together with the worm wheel 4 driven by the motor 3, connecting pieces 9a, 9b, 9c of the movable contact 9 are moved in a state where connecting pieces 9a, 9b, 9c of the movable contact 9 are in contact with the fixed contacts 13a, 13b, 13c. Due to such movement, a short-circuit state between the terminals 1 1A to 1 1C is changed. To be more specific, the short-circuit state is switched between a state where the terminal 1 1A and the terminal 1 lB are short-circuited and a state where the terminal 1 1A and the terminal 1 1C are short-circuited.

[0030] Referring to Fig. 1 to Fig. 5, to enable the supply of electricity to the motor 3 even in the midst of switching the short-circuit state of the terminal 1 1A and the terminal 1 1B, the terminal 1 1A and the terminal 11 B are electrically connected to each other through the diode 14A, and the terminal 1 1A and the terminal 1 1C are electrically connected to each other through the diode 14B. Referring to Fig. 8 and Fig. 13, each of the diodes 14A, 14B in this embodiment is of a surface mounting type, and includes an approximately rectangular parallelepiped component body 14a, and a pair of pad type electrodes 14b, 14b mounted on an outer surface of the component body 14a. To be more specific, in this embodiment, each of the electrodes 14b, 14b is bent into an L shape as a whole, and includes a side surface portion 14c and a bottom surface portion 14d. The bottom surface portions 14d are assembled into a bottom surface of the component body 14a so that the bottom surface portions 14d are coplanar with the bottom surface of the component body 14a. Hereinafter, the mounting structure of the diodes 14A, 14B mounted on the bottom wall 2a of the resin case 2 which constitutes a substrate is described.

[0031] Firstly, the mounting structure of the diode 14A (indicated by a symbol "A" in Fig. 1 to Fig. 4) is described.

[0032] Referring to Fig. 2 and Fig. 3, portions of the terminals 1 1A, 1 lB are branched from the terminals 1 1A, 1 lB, and extend to a position where the diode 14A is mounted (symbol "A"). The terminal 1 1C extends over the position where the diode 14A is mounted (symbol "A") in a straddling manner.

[0033] Referring to Fig. 6 to Fig. 8, a through hole 15 is formed in the bottom wall 2a of the resin case 2 at the position where the diode 14A is mounted so as to penetrate the bottom wall from the inner surface (front surface) 2b to a flat outer surface (back surface) 2c. The diode 14A is disposed in the inside of the through hole 15. In this embodiment, the through hole 15 has an approximately rectangular shape as viewed in a plan view. A hole wall isa of the through hole 15 has a pair of long side walls 15b, 15b disposed opposite to each other and a pair of short side walls 15c, 15c disposed opposite to each other.

A size of the through hole 15 (a distance between the long side walls 15b, 15b and a distance between the short side walls 15c, 15c) is set so that the diode 14A can be disposed in the inside of the through hole 15 in a state where the diode 14A is not in contact with the hole wall iSa.

The diode 14A is disposed in the inside of the through hole 15 in a posture where a bottom surface of the diode 14A is directed toward an outer surface 2c side of the bottom wall 2a of the resin case 2, and a top surface of the diode 14A is directed toward an inner surface 2b side of the bottom wall 2a of the resin case 2. The electrodes 14b, 14b of the diode 14A housed in the through hole 15 face the short side walls 15c, l5c of the hole wall iSa in a spaced-apart manner, respectively with distances formed therebetween.

[0034] A portion (projecting portion 16a) of the terminal 1 1A projects into the through hole 15 from one short side wall 1 Sc of the hole wall l5a of the through hole 15, and a portion (projecting portion 16b) of the terminal 1 lB projects into the through hole 15 from the other short side wall 15c of the hole wall 15a of the through hole 15. As shown most clearly in Fig. 8, the projecting portions 16a, 16b in this embodiment are not formed into a straight shape but are formed into a bent shape.

To be more specific, each projecting portion 16a, 16b includes: a portion extending along the inner surface 2b of the bottom wall 2a in the same manner as other portions of the terminal 1 1A, 1 1B, a portion which extends obliquely toward the bottom wall 2a from the portion which extends along the inner surface 2b of the bottom wall 2a; and a portion which further extends parallel to the inner surface 2b of the bottom wall 2a from the portion which extends obliquely toward the bottom wall 2a.

[0035] A holding portion 17 which projects from the bottom wall 2a is formed on the inner surface 2b of the bottom wall 2a of the resin case 2 so that the holding portion 17 surrounds the through hole 15. The terminals 1 1A, 1 lB penetrate the holding portion 17, and extend into the inside of the through hole 15. On the other hand, a protecting portion 18 which projects from the bottom wall 2a is formed on the outer surface 2c of the bottom wall 2a of the resin case 2 so that the protecting portion 18 surrounds the through hole 15.

[0036] A support portion 19 is formed so that the support portion 19 connects two portions of an inner surface of the holding portion 17 with each other. In this embodiment, the support portion 19 is formed into a beam shape having a rectangular cross section. The support portion 19 extends in the direction along which the long side walls 15b, 15b of the through hole 15 face each other thus traversing the through hole 15 as viewed in a plan view. As shown most clearly in Fig. 8, in this embodiment, a top surface 19a of the support portion 19 is coplanar with an upper end surface of the holding portion 17. On the other hand, the top surface of the diode 14A is in contact with the bottom surface 19b of the support portion 19. A portion of the terminal 1 1C is arranged on the bottom surface 19b of the support portion 19. As shown most clearly in Fig. 6 and Fig. 7, the portion of the terminal 1 1C extends over the through hole 15 in a straddling manner. The portion of the terminal 1 1C which straddles the through hole 15 extends along the bottom surface 19b of the support portion 19 without being bent.

[0037] The side surface portions 14c of the electrodes 14b, 14b of the diode 14A disposed in the inside of the through hole 15 face distal ends of the projecting portions 16a, 16b. In other words, a distance between the distal ends of the projecting portions 16a, 16b is set so that the diode 14A is fitted in a space formed between the distal ends of the projecting portions 16a, 16b.

[0038] As described above, the fixed contacts 13a, 13b are formed on the first surfaces 1 la (upper surfaces in Fig. 8, for example) of the terminals 1 1A, 1 lB. On the other hand, the electrodes 14b, l4b of the diode 14A are soldered to the second surfaces 1 lb (the second surfaces 1 lb being lower surfaces in Fig. 8, and also being surfaces on a side opposite to the first surfaces 1 la on which the fixed contacts 13a, 13b are provided) of the projecting portions 16a, 16b of the terminals 1 1A, 1 lB. Due to such soldering, the electrodes 14b, 14b of the diode 14A are mechanically connected to the projecting portions 16a, 16b of the terminals 1 1A, 1 1B, and the electrodes 14b, 14b are also electrically connected to the projecting portions 16a, 16b of the terminals 1 1A, 1 lB.

In the drawings, reference numeral 21 indicates bonding portions formed by soldering. As shown in Fig. 9, there may be a case where the diode l4A includes tab-shaped electrodes 14b', l4b' which project from a bottom surface side of a component body l4a in the lateral direction.

Also in this case, the electrodes 14b', 14b' are soldered to the second surfaces 1 lb of the projecting portions 16a, 16b of the terminals 1 lA, 1 lB. Bonding portions 21 are formed due to such soldering.

[0039] As shown most clearly in Fig. 8, in this embodiment, the entire diode 14A and the whole bonding portions 21 are disposed in the inside of the through hole 15, and neither the diode 14A nor the bonding portions 21 project from the outer surface 2c of the bottom wall 2a of the resin case 2.

[0040] The diode 14A is mounted on the bottom wall 2a (substrate) of the resin case 2 in accordance with the following steps.

[0041] Referring to Fig. bA, in mounting the diode 14A, the resin case 2 takes an upside down posture, that is, the posture where the inner surface 2b of the bottom wall 2a is disposed on a lower side, and the outer surface 2c is disposed on an upper side (the posture where the support portion 19 is positioned on a lower side). The diode 14A is inserted into the through hole 15 from an upper side of the bottom wall 2a, that is, from an outer surface 2c side of the bottom wall 2a in a posture where the top surface of the component body 14a is disposed on a lower side and the bottom surface portion 14d of the electrode 14b is disposed on an upper side. As shown in Fig. lOB, the top surface (lower surface in Fig. lOB) of the component body 14a of the diode 14A is placed on the bottom surface 19b of the support portion 19 so that the diode 14A is supported on the support portion 19. The side surface portions 14c, 14c of two electrodes 14b, l4b of the diode 14A supported on the support portion 19 are brought into contact with the distal ends of the projecting portions 16a, lOb of the terminals 1 1A, 1 lB thus giving rise to a state where two electrodes 14b, 14b of the diode 14A and the terminals 1 1A, 1 lB are conductive with each other.

[0042] A support height (a position in the thickness direction of the bottom wall 2a of the resin case 2) of the diode 14A in supporting the diode 14A by the component support portion 19 is set so that the bottom surface portions l4d of the electrodes 14b of the diode 14A and the second surfaces 1 lb of the projecting portions 16a, 16b of the terminals 1 1A, 1 lB become coplanar with each other. Accordingly, in a state shown in Fig. lOB where the diode 14A is supported on the support portion 19 of the resin case 2, the bottom surface portions 14d of the electrodes 14b of the diode 14A and the second surfaces 1 lb of the projecting portions 16a, 16b of the terminals 1 1A, 1 lB are coplanar with each other. In such a state, the diode 14A is disposed between the distal ends of the projecting portions l6a, l6b of the terminals 1 lA, 1 lB so that the diode l4A can be accurately positioned at the soldering position.

[0043] In a state where the diode l4A is disposed in the inside of the through hole 15 so that the bottom surface portions l4d of the electrodes 14b and the second surfaces 1 lb of the projecting portions 16a, 16b of the terminals 1 1A, 1 lB become coplanar with each other, as shown in Fig. lOB, the bottom surface portions 14d of the electrodes 14b of the diode 14A and the second surfaces 1 lb (back surfaces) of the projecting portions 16a, 16b of the terminals 1 1A, 1 lB are soldered to each other using a wire solder 22 and a soldering iron 23 thus forming bonding portions 21, 21. The electrodes l4b, l4b of the diode l4A are mechanically and electrically connected to the terminals 1 1A, 1 lB by the bonding portions 21, 21 so that the mounting of the diode 14A to the bottom wall 2a of the resin case 2 is completed.

[0044] As described above, in the mounting structure of the diode l4A according to this embodiment, the bonding portions 21 are formed so that the electrodes 14b, 14b of the diode 14A are soldered to the second surfaces 1 lb (surfaces on a side opposite to the first surfaces 1 la (front surface) on which the fixed contacts 13a, 13b are formed) which constitute back surfaces of the terminals 1 1A, 1 lB. Accordingly, corrosion of the fixed contacts 13a to 13c caused by a soldering flux can be prevented, and the door lock actuator can ensure high quality.

[0045] The diode 14A is supported on the support portion 19 and, at the same time, is positioned at a predetermined position where the diode 14A is soldered by the projecting portions 16a, 16b of the terminals 1 1A, 1 lB. Accordingly, the diode 14A can be accurately mounted at a predetermined position by soldering the diode 14A to the terminals 1 1A, 1 lB with high operability.

[0046] Further, the support height of the diode 14A in supporting the diode 14A by the support portion 19 is set so that the bottom surface portions 14d of the electrodes l4b of the diode 14A and the second surfaces 1 lb (back surfaces) of the projecting portions 16a, 16b of the terminals 1 1A, 1 lB become coplanar with each other. Accordingly, by bringing the diode 14A into contact with the support portion 19, the bottom surface portions 14d of the electrodes 14b of the diode 14A and the second surfaces 1 lb (back surfaces) of the projecting portions 16a, l6c of the terminals 1 1A, 1 lB are made coplanar with each other and hence, even when the diode 14A is of a surface mounting type which has no leads, the bonding portions 21 can be formed by soldering the pad type electrodes 14b and the flat second surfaces 1 lb of the terminals 1 1A, 1 lB to each other. Accordingly, it is unnecessary to additionally prepare a jig or the like for soldering used for forming the bonding portions 21 and hence, the restriction imposed on soldering equipment can be alleviated.

[0047] Further, portions of the terminals 1 1A, 1 lB in the vicinity of the projecting portions 16a, 16b are held on the inner surface 2b of the bottom wall 2a of the resin case 2 by the holding portion 17.

Accordingly, positions of the projecting portions 16a, 16b in the through hole 15 can be held with certainty. As a result, it is possible to further improve the operability of soldering between the electrodes l4b of the diode 14A and the projecting portions 16a, 16b.

[0048] Fig. 11 to Fig. 14 show the mounting structure of the diode 14B (indicated by a symbol "B" in Fig. 1 to Fig. 4). The mounting structure of the diode 14B is substantially equal to the above-mentioned mounting structure of the diode 14A except for the points described hereinafter. Accordingly, elements of the mounting structure of the diode 14B identical with or similar to the corresponding elements of the mounting structure of the diode 14A are given the same reference numerals. Further, steps of mounting the diode 14B on the bottom wall 2a (substrate) of the resin case 2 are substantially equal to the steps of mounting the diode 14A which have been described with reference to Fig. 1OA and Fig. lOB.

[0049] As shown most clearly in Fig. 13, a support portion 19 is formed so that the support portion 19 connects two portions of an upper end surface of a holding portion 17 with each other. Terminals are not arranged on the support portion 19. An outer surface 2c side of the bottom wall 2a of the resin case 2 has no protecting portion 18 (see Fig. 8, for example), and a projecting portion is not formed on an outer surface 2c of the bottom wall 2a even around a through hole 15 so that the outer surface 2c is flat. Projecting portions 16a, 16c of the terminals 1 1A, 1 1C which project into through hole 15 from short side walls 15c, 15c of the hole wall 15a of the through hole 15 are not bent and extends substantially straight up to distal ends thereof [0050] Hereinafter, other embodiments of the present invention are described. Constitutions which are not referred to in the description made hereinafter are substantially equal to the corresponding constitutions of the first embodiment. For example, the overall structure (see Fig. 1) of a door lock actuator 1 according to each one of the embodiments described hereinafter is substantially equal to the corresponding structure of the door lock actuator 1 according to the first embodiment. Further, in the following embodiments, the description will be made by taking the mounting structure of a diode 14A (a case where a terminal is arranged over the mounting position in a straddling manner) as an example. However, a diode 143 (a case where the terminal is not arranged over a mounting position in a straddling manner) can adopt the substantially same mounting structure as the diode 14A.

[0051] (Second embodiment) Fig. 15 shows a door lock actuator 1 according to a second embodiment of the present invention. In this embodiment, a protecting portion (see reference numeral 18 in Fig. 8, for example) is not formed, and an outer surface 2c of a bottom wall 2a of the resin case 2 has no projecting portion even around a through hole 15 so that the outer surface 2c is flat.

[0052] (Third embodiment) Fig. 16 shows a door lock actuator 1 according to a third embodiment of the present invention. In this embodiment, a protecting portion (see reference numeral 18 in Fig. 8, for example) is not formed, and an outer surface 2c of a bottom wall 2a of the resin case 2 does not have a projecting portion even around a through hole 15 so that the outer surface 2c is flat. A bottom surface of a component body 14a of a diode 14A, bottom surface portions 14d of electrodes 14b, bonding portions 21, and second surfaces 1 lb of projecting portions 16a, 16b of terminals 1 1A, 1 lB are slightly exposed from the outer surface 2c of the bottom wall 2a of the resin case 2.

[0053] (Fourth embodiment) Fig. 17 to Fig. 19 show a door lock actuator 1 according to a fourth embodiment of the present invention. In this embodiment, a holding portion (see reference numeral 17 in Fig. 8, for example) is not formed on an inner surface 2b of a bottom wall 2a of the resin case 2, and the inner surface 2b of the bottom wall 2a has no projecting portion even around a through hole 15 so that the inner surface 2b is flat. A support portion 19 is formed so that the support portion 19 connects long side walls 15b, 15b of a hole wall 15a of a through hole 15 which are disposed on opposite sides to each other. A top surface 19a of the support portion 19 is coplanar with the inner surface 2b of the bottom wall 2a. A portion of a terminal 1 1C (a portion which straddles over the through hole 15) is arranged on a top surface l9a of the support portion 19.

[0054] The top surface 19a of the support portion 19 is made coplanar with the inner surface 2b of the bottom wall 2a by eliminating the holding portion 17 so that it is possible to prevent the interference between the support portion 19 and other components arranged on an inner surface 2b side of the bottom wall 2a of the resin case 2. As a result, layout of components in the resin case 2 is enhanced.

[0055] (Fifth embodiment) Fig. 20 shows a door lock actuator 1 according to a fifth embodiment of the present invention. In this embodiment, a protecting portion (see reference numeral 18 in Fig. 8, for example) is not formed on an outer surface 2c side of a bottom wall 2a of the resin case 2, and the outer surface 2c of the bottom wall 2a has no projecting portion even around a through hole 15 so that the outer surface 2c is flat.

Further, a holding portion (see reference numeral 17 in Fig. 8, for example) is not formed on an inner surface 2b of the bottom wall 2a, and an inner surface 2b of a bottom wall 2a has no projecting portion even around a through hole 15 so that the inner surface 2b is flat. A support portion 19 is formed so that the support portion 19 connects long side walls 15b, 15b of the hole wall 15a of the through hole 15 which are disposed on opposite sides to each other, and a portion of a terminal 1 1C (a portion which straddles over the through hole 15) is arranged on a top surface 19a of the support portion 19.

[0056] (Sixth embodiment) Fig. 21 shows a door lock actuator 1 according to a sixth embodiment of the present invention. In this embodiment, in the same manner as the fifth embodiment (Fig. 20), the door lock actuator 1 has neither a protecting portion nor a holding portion (see reference numerals 18, 17 in Fig. 8, for example), and neither an inner surface 2b nor an outer surface 2c of a bottom wall 2a has a projecting portion even around a through hole 15 so that the inner surface 2b and the outer surface 2c are flat. Further, a bottom surface of a component body 14a of a diode 14A, an electrode 14b, bonding portions 21, and projecting portions 16a, 16b of the terminals 1 1A, 1 lB slightly project from the outer surfaces 2c of the bottom wall 2a of the resin case 2.

[0057] The present invention is not limited to the above-mentioned embodiments, and various modifications including the following modification are conceivable.

[0058] In the first to sixth embodiments, the terminal is integrally provided on the bottom wall of the resin case by insert-molding.

However, methods other than the insert-molding can be adopted. For example, a projection may be formed on the bottom wall of the resin case, and a through hole of a size which allows the projection to pass therethrough may be formed in the terminal. In this case, the terminal is arranged on the bottom wall so that the projection passes through the through hole and, thereafter, a diameter of a distal end of the projection is enlarged by melting the distal end of the projection so that the terminal can be fixed to the bottom wall by a sort of caulking structure.

[0059] The bonding portions for electric and mechanical connection may be formed by techniques other than soldering.

[0060] In the first to sixth embodiments, the present invention has been described by taking the diode provided to the door lock actuator as an example. However, the present invention is also applicable to other surface mount components besides the diode. The number of electrodes of the surface mount components is not limited to two, and may be more than or equal to three. The present invention is also applicable to the mounting of the surface mount component of a device other than the door lock actuator.

DESCRIPTION OF REFERENCE NUMERALS

[0061] l:door lock actuator, 2:resin case, 2a:bottom wall, 2b:inner surface, 2c:outer surface, 3:motor, 4:worm wheel, 5:rotor, 6:lock knob lever, 7:slider, 8:switch shaft, 9:movable contact, 9a, 9b, 9c:connecting piece 1O:worm gear, 1 1A, 1 1B, 1 1C:terminal, 1 la:irst surface, 1 lb:second surface, 12a, 12b, 12:external connection contact, 13a, 13b, 13c:fixed contact, 14A, 14B:diode, 14a:component body, 14b, 14b':electrode, 14c:side surface portion, 14d:bottom surface portion, l5:through hole, 15a:hole wall, 15b: long side wall, l5c:short side wall, l6a, 16b, 16c:projecting portion, 17:holding portion, 18:protecting portion, 19:support portion, 19a:top surface, 19b:bottom surface, 21: bonding portion, 22: wire solder, 23:soldering iron

Claims

CLAIMS1. A door lock actuator comprising: a substrate having a front surface and a back surface; a conductor disposed on the front surface of the substrate, the conductor having a first surface which is a surface on the front surface side of the substrate and on which a fixed contact for switching an energization path to a power source by contacting with a movable contact is provided; a through hole formed in the substrate so as to penetrate the substrate from the front surface to the back surface; a projecting portion constituting a portion of the conductor which projects from a hole wall of the through hole; a surface mount component including a component body and an electrode mounted on an outer surface of the component body, the surface mount component being disposed in an inside of the through hole; and a bonding portion where a second surface of the projecting portion on a side opposite to the first surface and the electrode of the surface mount component are electrically bonded to each other.
2. The door lock actuator according to claim 1, wherein the bonding portion is formed by soldering.
3. The door lock actuator according to claim 1 or 2, further comprising a support portion for supporting the surface mount component disposed in the inside of the through hole, the support portion being provided on the front surface side of the substrate as to traverse the through hole.
4. The door lock actuator according to claim 3, wherein a portion of the conductor is disposed so as to traverse the through hole along the support portion.
5. The door lock actuator according to any one of claims 1 to 4, wherein the first surface of the conductor is substantially coplanar with the front surface of the substrate.
6. The door lock actuator according to any one of claims 1 to 5, further comprising a holding portion for holding the conductor in the vicinity of the projecting portion on the front surface of the substrate, the holding portion being disposed at a position on the front surface side of the substrate adjacent to the through hole.
7. A component mounting structure comprising: a substrate having a front surface and a back surface; a conductor disposed on the front surface of the substrate, the conductor having a first surface which is a surface on a front surface side of the substrate and on which a contact is provided; a through hole formed in the substrate so as to penetrate the substrate from the front surface to the back surface; a projecting portion constituting a portion of the conductor which projects from a hole wall of the through hole; a surface mount component including a component body and an electrode mounted on an outer surface of the component body, the surface mount component disposed in the inside of the through hole; and a bonding portion where a second surface of the projecting portion on a side opposite to the first surface and the electrode of the surface mount component are electrically bonded to each other.
8. A component mounting method for mounting a surface mount component including a component body and an electrode mounted on an outer surface of the component body on a substrate, comprising: providing a conductor disposed on the front surface side of the substrate, a contact being provided on a first surface of the conductor which is a surface on the front surface side of the substrate, disposing the surface mount component in an inside of a through hole formed in the substrate so as to penetrate the substrate from the front surface to a back surface on a side opposite to the front surface, and electrically bonding a projecting portion which constitutes a portion of the conductor projecting from a hole wall of the through hole and the electrode of the surface mount component to each other on a second surface of the conductor on a side opposite to the first surface on which the contact is provided.