GB2520345A - LED lighting apparatus - Google Patents
LED lighting apparatus Download PDFInfo
- Publication number
- GB2520345A GB2520345A GB1320390.6A GB201320390A GB2520345A GB 2520345 A GB2520345 A GB 2520345A GB 201320390 A GB201320390 A GB 201320390A GB 2520345 A GB2520345 A GB 2520345A
- Authority
- GB
- United Kingdom
- Prior art keywords
- led
- lighting apparatus
- led lighting
- cap
- pcbs
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
- F21V29/50—Cooling arrangements
- F21V29/70—Cooling arrangements characterised by passive heat-dissipating elements, e.g. heat-sinks
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/20—Light sources comprising attachment means
- F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
- F21K9/238—Arrangement or mounting of circuit elements integrated in the light source
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/60—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction
- F21K9/61—Optical arrangements integrated in the light source, e.g. for improving the colour rendering index or the light extraction using light guides
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
- F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
- F21K9/90—Methods of manufacture
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V23/00—Arrangement of electric circuit elements in or on lighting devices
- F21V23/003—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array
- F21V23/004—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board
- F21V23/005—Arrangement of electric circuit elements in or on lighting devices the elements being electronics drivers or controllers for operating the light source, e.g. for a LED array arranged on a substrate, e.g. a printed circuit board the substrate is supporting also the light source
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
- F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
- F21Y2107/90—Light sources with three-dimensionally disposed light-generating elements on two opposite sides of supports or substrates
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
- F21Y2115/00—Light-generating elements of semiconductor light sources
- F21Y2115/10—Light-emitting diodes [LED]
Abstract
An LED lamp comprises a heat conductive plate 3 interposed between two printed circuit boards 1, 2, each PCB including at least one LED chip 21. The LED chip on one PCB emits light in an opposing direction to the LED chip on the other PCB.
Description
LED Lighting Apparatus Technical Reid The present invention relates, generally, to an LED lighting apparatus, and more particularly to a compact LED lighting apparatus with omnidirectional light output. Ba
Halogen capsule lamps are popular light sources for use in decorative luminaires. Such lamps emit high intensity light in one direction. Such lamps typically have a short lifetime, which makes frequent changes necessary.
Different versions of led retro fit replacements are available. For example, single side low voltage (G4) LED capsule lamps consisting of one printed circuit board (PCB) that is usually circular and double sided can be used. LEDs are mounted on one side of the 1 5 PCB, and the required driver components are mounted to the back. Such lamp structures only emit light from one side of the lamp however, and the lamps are not typically suitable for use as mains capsule lamps since no electric insulation is provided.
Furthermore. the lack of any heat sink limits their usage to low wattage (such as <2W for example) implementations.
LED capsule lamps with multiple mains voltage LED boards mains are also available, and typically consist of multiple LED boards that are interlinked to form a column shape, thereby enabling the lamps to emit light at 360 degrees, or omnidirectionally. A driver for such a lamp is placed at the base of the lamp, and all electric components are enclosed in a plastic housing for the purposes of ensuring electrical insulation. Such lamp designs are however significantly larger than their mains halogen capsule lamp counterparts, and assembly is relatively difficult given the need, amongst other things, for the interlinking of the multiple LED boards.
AC LED Capsule lamps that may be driven directly by mains AC voltage can also be provided. For example, in order to implement a G9 LED capsule LED, such LEDs are placed onto a heat sink facing upwards and emit light away from the lamp base. The LED is typically covered by a diffusing cap. The heat sink must not be electrically conductive. Such lamps are generally not reliable and can be easily damaged by surges in current from a power supply.
Summaw According to an example, there is provided an LED lighting apparatus, comprising a heat conductive element interposed between two printed circuit boards (PCBs), each PCB including at least one LED chip to emit light for the apparatus, wherein an LED chip on one PCB emits light in an opposing direction to an LED chip on the other PCB. Optical means to reflect and refract light emitted from the LED chips on the PCBs can be provided. The optical means can be a part of a cap for the apparatus. The cap can be transparent or opaque. At least one PCB can include LED driver components for the or each LED chip. The driver components can be distributed across the PCBs. Connection pins for the apparatus can be mounted on at least one of the PCBs. The connection pins can be in the form of bipin or looped bipin connections for example. A housing to house the heat conductive element and PCBs can be provided. At least a portion of the heat conductive element can contact the housing when housed therein. The housing can 1 5 be formed from heat conductive material, such as heat conductive plastic, thereby to dissipate heat transferred to the housing from the heat conductive plate. The PCBs can be connected. For example, the PCBs or the components mounted thereon can be connected using at least one wire. The optical means can include a light splitter for and arranged over respective ones of the LED chips of the PCBs. Each LED chip or cluster of LED chips can have its own light splitter. At least one light splitter can be in the form of a v-shaped grove in a cap of the apparatus. Other shapes are possible, and the faces of the grooves can be curved, and/or coloured and so on. The optical means can be arranged to receive light emitted from an LED chip. A light splitter can include two reflective surfaces to reflect light emitted from an LED chip. At least one of the two reflective surfaces can be a partially reflective surface.
According to an example, there is provided a method for forming an LED lighting apparatus, comprising interposing a heat conductive element between two printed circuit boards (PCBs), each PCB including at least one LED chip to emit light for the apparatus, wherein an LED chip on one PCB emits light in an opposing direction to an LED chip on the other PCB. A cap with optical means for respective ones of the LED chips can be provided, and the said optical means can be arranged or otherwise disposed over respective ones of the LED chips thereby to receive light to be emitted from the LED chips. The optical means can be arranged to reflect and refract light emitted from the LED chips. Driving components for the LED chips can be mounted on at least one PCB.
Driving components can be distributed over both PCBs, and the PCBs and/or distributed driving components can be connected. The apparatus can be housed in a heat conductive housing. At least a portion of the heat conductive element can be arranged in contact with a portion of the housing.
According to an example, there is provided a cap for an LED lighting apparatus as provided above. The cap can be the transparent or opaque and can include at least one light splitter. The or each light splitter can include at least one partially reflective surface.
The or each light splitter can be in the form a v-shaped groove in the cap. The cap can be arranged in combination with the LED lighting apparatus provided above thereby to provide, in use, omnidirectional lighting.
According to an example, there is provided an LED retro-fit capsule lamp including an LED lighting apparatus as provided above.
According to an example, there is provided an LED retro-fit capsule lamp as including a cap as provided above.
Brief Description of the Drawings
Embodiments will now be described, by way of example only, with reference to the accompanying drawings, in which: Figure 1 is a schematic representation of an LED capsule lamp according to an example; and Figure 2 is a schematic representation of a cap according to an example.
Description
Example embodiments are described below in sufficient detail to enable those of ordinary skill in the art to embody and implement the systems and processes herein described. It is important to understand that embodiments can be provided in many alternate forms and should not be construed as limited to the examples set forth herein.
Accordingly, while embodiments can be modified in various ways and take on various alternative forms, specific embodiments thereof are shown in the drawings and described in detail below as examples. There is no intent to limit to the particular forms disclosed.
On the contrary, all modifications, equivalents, and alternatives falling within the scope of the appended claims should be included. Elements of the example embodiments are consistently denoted by the same reference numerals throughout the drawings and
detailed description where appropriate.
The terminology used herein to describe embodiments is not intended to limit the scope.
The articles a,' "an," and "the" are singular in that they have a single referent, however the use of the singular form in the present document should not preclude the presence of more than one referent. In other words, elements referred to in the singular can number one or more, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises," "comprising," "includes," and/or "including," when used herein, specify the presence of stated features, items, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, 1 5 items, steps, operations, elements, components, and/or groups thereof.
Unless otherwise defined, all terms (including technical and scientific terms) used herein are to be interpreted as is customary in the art. It will be further understood that terms in common usage should also be interpreted as is customary in the relevant art and not in an idealized or overly formad sense unless expressly so defined herein.
This invention relates a led capsule lamp that comprises two PCBs with LEDs mounted, placed back to back on a heat conductive plate that conducts heat to a lamp housing which also acts as heat sink. Electronic components for the led driver and the pins for the led capsule lamp are placed on at least one of the two PCBs. An optical device known as the light splitter with optical means placed above the LEDs facing opposite directions. The said optical means direct partial of the LED light projecting forward to the side of the LEDs creating evenly distributed 360 degree lights.
According to an example, a lighting apparatus comprises an LED capsule lamp which comprises two PCBs each with LEDs mounted thereon, either directly or indirectly (such as via a support mounted on a PCB for example). Each PCB is mounted on a heat conductive plate or element that conducts heat to a lamp housing which can also act as heat sink. A heat conductive mountinq element may sit between one or both PCBs and the heat conductive plate. That is, a PCB can be mounted directly or indirectly to the heat conductive plate.
Electronic components for an LED driver and pins/connections for the LED capsule lamp are placed on at least one of the two PCBs. In an example, an optical device in the form of a light splitter with optical means placed above the LEDs is provided. The optical means can direct some of the light projecting from an LED to the side of the lamp in order to create evenly distributed lighting.
According to an example, PCBs for the lamp can be arranged axially with respect to a lamp housing, with the LEDs facing away from the centre axis of the lamp. PCBs are placed back to back onto a heat conductive plate. That is, a heat conductive plate can be sandwiched between the PCBs with the LEDs of respective PCBs facing outwards. In an example, at least a portion of the heat conductive plate contacts a portion of the 1 5 housing, which can also acts as a heat sink. Connection pins of the lamp are mounted to one of the PCBs.
To achieve 360 degree, omnidirectional, light emission from the bulb, a transparent cap with optical lenses that lie in position substantially above the LEDS acting as a light splitter" for the lighting apparatus. The light splitter as illustrated in figure 2 has a v-shaped groove above the LED chips. The surfaces have an angle against the PCB and LEDs. When light travels through the lens, part of the light passes through the lens (refraction) and part of light reflects at the surface to side of the lamp.
In an alternatively example, the LED capsule lamp may comprises only one PCB with LEDs, driver and pins all being mounted thereon. The transparent cap with optical lens can therefore direct part of the emitted light to the side of the LED thereby enlarging the light distribution angle.
Figure 1 is a schematic representation of an LED capsule lamp according to an example.
Two PCBs (1, 2) are provided with LEDs (21) mounted on both PCBs and arranged to face away from the centre axis of the lamp. Some of the driver components for the lamp are mounted on PCB (1) and the rest of the components can be mounted on PCB (2). That is, components can be distributed over the PCBs. Alternatively, all such components can be mounted on one of the PCBs (1, 2).
The circuits on either PCB can be linked with wires (23). Two pins (4) forming the lamp cap are mounted to the PCB (2). A heat conductive plate (3), such as a copper plate for example, sits between the two PCBs. The plate 3 with the mounted PCBs can be inserted into the lamp housing (5), which can be made from heat conductive plastic. In an example, the plate (3) is in physical contact to the side of the lamp housing 5 allowing heat being transferred to the lamp housing (5).
The housing can thus accommodate the PCBs and electronic components of the lamp.
Two small openings are located at the bottom of the housing allowing the pins (4) of the lamp to pass through, forming the electric contacts for the base.
A transparent cap (6) is placed on the top of the LED capsule lamp thereby covering the part of PCBs with the LEDs mounted thereon. Figure 2 is a schematic representation of 1 5 a cap according to an example, for us use with the lamp as shown in and described with reference to figure 1. The cap can be transparent or opaque.
Two v-shaped grooves (61) are located on either side of the cap (6). each groove has two reflective surfaces (62) that reflect part of the lights to the side of the LEDs. LEDs (21) are mounted to PCB (2) as described in connection with figure 1. A v-shaped groove (61) is arranged so that, when the cap is in place on the lamp, light from LEDs travels into the cap/light splitter and when it reaches the surface (62) of the groove (61), part of the light (201) exits the cap (6) with the light path being slightly changed due to refraction. The other part of the light (203) is reflected by surface (62) and exits the cap (6) from the side. A further refraction may occur to the light (203) as it exits the cap (6).
Thus 360 degree lighting is generated.
As can be seen from figure 2, a v-shaped groove is arranged to receive light emitted from an LED chip. A reflective surface (62) of the groove can be partially reflective such that light emitted from the LED chip (21) is partially reflected (203) with some light passing through the surface (62). The partial reflection can be a function of the angle of incidence of light emitted from the LED chip (21). That is, the reflective surface (62) is arranged at an angle with respect to the LED chip (and thus the PCB on which the LED chip is mounted).
As such, light emitted from LED chip (21) is reflected and refracted such it is distributed over at least 180 degrees. A corresponding LED chip and groove on the opposite side of the device also emits and distributes light in the same way, thereby enabling the device to provide emission over 360 degrees.
By virtue of refraction at a cap/air interface as reflected light (203) exits the cap, the angle of emission of such light can be further altered so that the distribution of light from an LED chip (21) extends over an angle greater than 180 degrees.
Claims (33)
1. An LED lighting apparatus, comprising: a heat conductive element interposed between two printed circuit boards (PCBs), each PCB including at least one LED chip to emit light for the apparatus, wherein an LED chip on one PCB emits light in an opposing direction to an LED chip on the other PCB.
2. An LED lighting apparatus as claimed in claim 1, further comprising: optical means to reflect and refract light emitted from the LED chips on the PCBs.
3. An LED lighting apparatus as claimed in claim 2, wherein the optical means is part of a cap for the apparatus.
4. An LED lighting apparatus as claimed in any preceding claim, at least one PCB further comprising: LED driver components for the or each LED chip.
5. An LED lighting apparatus as claimed in claim 4, wherein the driver components are distributed across the PCBs.
6. An LED lighting apparatus as claimed in any preceding claim, further comprising connection pins for the apparatus mounted on at least one of the PCBs.
7 An LED lighting apparatus as claimed in any preceding claim, further comprising a housing to house the heat conductive element and PCBs.
8. An LED lighting apparatus as claimed in claim 7, wherein at least a portion of the heat conductive element contacts the housing when housed therein.
9. An LED lighting apparatus as claimed in claim 7 or 8, wherein the housing is formed from heat conductive material, such as heat conductive plastic, thereby to dissipate heat transferred to the housing from the heat conductive plate.
10. An LED lighting apparatus as claimed in any preceding claim, wherein the PCBs are connected.
11. An LED lighting apparatus as claimed in claim 10, wherein the PCBs are connected using at least one wire.
12. An LED lighting apparatus as claimed in claim 2, wherein the optical means includes a light splitter for and arranged over respective ones of the LED chips of the PCBs.
13. An LED lighting apparatus as claimed in claim 12, wherein at least one light splitter is in the form of a v-shaped grove in a cap of the apparatus.
14. An LED lighting apparatus as claimed in claim 12 or 13, wherein the optical means is arranged to receive light emitted from an LED chip.
15. An LED lighting apparatus as claimed in any of claims 12 to 14, wherein a light splitter includes two reflective surfaces to reflect light emitted from an LED chip.
16. An LED lighting apparatus as claimed claim 15, wherein at least one of the two reflective surfaces is a partially reflective surface.
17. A method for forming an LED lighting apparatus, comprising: interposing a heat conductive element between two printed circuit boards (PCBs), each PCB including at least one LED chip to emit light for the apparatus, wherein an LED chip on one PCB emits light in an opposing direction to an LED chip on the other PCB.
18. A method as claimed in claim 17, further including: providing a cap with optical means for respective ones of the LED chips; ananging the said optical means over respective ones of the LED chips thereby to receive light to be emitted from the LED chips.19. A method as claimed in claim 18, wherein the optical means are arranged to reflect and refract light emitted from the LED chips.
19. A method as claimed in claim 17 or 18, further comprising mounting driving components for the LED chips on at least one PCB.
20. A method as claimed in claim 19, further comprising distributing driving components over both PCBs, and connecting the PCBs.
21. A method as claimed in any of claims 17 to 20, further including housing the apparatus in a heat conductive housing.
22. A method as claimed in claim 21, further comprising providing at least a portion of the heat conductive element in contact with a portion of the housing.
23. A cap for an LED lighting apparatus as claimed in any of claims 1 to 16.
24. A cap as claimed in claim 23, wherein the cap the transparent and includes at least one light splitter.
25. A cap as claimed in claim 24, wherein the or each light splitter includes at least one partially reflective surface.
26. A cap as claimed in claim 24 or 25, wherein the or each light splitter is in the form a v-shaped groove in the cap.
27. A cap as claimed in any of claims 23 to 26 arranged in combination with the LED lighting apparatus thereby to provide, in use, omnidirectional lighting.
28. An LED retro-f it capsule lamp including an LED lighting apparatus as claimed in anyof claims ito 16.
29. An LED retro-f it capsule lamp as claimed in claim 28 including a cap as claimed in any of claims 23 to 27.
30. An LED lighting apparatus substantially as hereinbefore described with reference to and as shown in the accompanying drawings.
31. A method for forming an LED lighting apparatus substantially as hereinbefore described with reference to the accompanying drawings.
32. A cap substantially as hereinbef ore described with reference to and as shown in the accompanying drawings.
33. An LED retro-fit capsule lamp substantially as hereinbefore described with reference to and as shown in the accompanying drawings.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB1320390.6A GB2520345A (en) | 2013-11-19 | 2013-11-19 | LED lighting apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB1320390.6A GB2520345A (en) | 2013-11-19 | 2013-11-19 | LED lighting apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| GB201320390D0 GB201320390D0 (en) | 2014-01-01 |
| GB2520345A true GB2520345A (en) | 2015-05-20 |
Family
ID=49883832
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB1320390.6A Withdrawn GB2520345A (en) | 2013-11-19 | 2013-11-19 | LED lighting apparatus |
Country Status (1)
| Country | Link |
|---|---|
| GB (1) | GB2520345A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108332067A (en) * | 2017-01-17 | 2018-07-27 | 晶元光电股份有限公司 | LED illumination lamp |
| WO2018141191A1 (en) * | 2017-02-04 | 2018-08-09 | 栾斌臣 | Led light bulb capable of replacing halogen lamp and manufacturing process for led light bulb |
| CN110828632A (en) * | 2019-10-22 | 2020-02-21 | 鹤山市任挥岭灯饰企业有限公司 | LED insertion bubble manufacturing method and LED insertion bubble thereof |
| WO2022036553A1 (en) * | 2020-08-18 | 2022-02-24 | 深圳市照阳智汇电子科技有限公司 | G9 ceramic base having improved assembly mode, and g9 lamp |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080151551A1 (en) * | 2006-12-20 | 2008-06-26 | Industrial Technology Research Institute | Lens cap and light emitting diode package structure using the same |
| EP2505914A2 (en) * | 2011-04-01 | 2012-10-03 | Yadent Co. Ltd. | Lighting apparatus |
| WO2012145139A1 (en) * | 2011-04-19 | 2012-10-26 | Cree, Inc. | Heat sink structures, lighting elements and lamps incorporating same, and methods of making same |
| US20120313518A1 (en) * | 2011-06-13 | 2012-12-13 | Taiwan Semiconductor Manufacturing Company, Ltd. | Led lamp and method of making the same |
| WO2013131227A1 (en) * | 2012-03-05 | 2013-09-12 | 胡斌 | Led light guide lens |
| US20130258657A1 (en) * | 2012-03-30 | 2013-10-03 | Uniled Lighting Taiwan Inc. | Panorama lamp |
-
2013
- 2013-11-19 GB GB1320390.6A patent/GB2520345A/en not_active Withdrawn
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080151551A1 (en) * | 2006-12-20 | 2008-06-26 | Industrial Technology Research Institute | Lens cap and light emitting diode package structure using the same |
| EP2505914A2 (en) * | 2011-04-01 | 2012-10-03 | Yadent Co. Ltd. | Lighting apparatus |
| WO2012145139A1 (en) * | 2011-04-19 | 2012-10-26 | Cree, Inc. | Heat sink structures, lighting elements and lamps incorporating same, and methods of making same |
| US20120313518A1 (en) * | 2011-06-13 | 2012-12-13 | Taiwan Semiconductor Manufacturing Company, Ltd. | Led lamp and method of making the same |
| WO2013131227A1 (en) * | 2012-03-05 | 2013-09-12 | 胡斌 | Led light guide lens |
| US20130258657A1 (en) * | 2012-03-30 | 2013-10-03 | Uniled Lighting Taiwan Inc. | Panorama lamp |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108332067A (en) * | 2017-01-17 | 2018-07-27 | 晶元光电股份有限公司 | LED illumination lamp |
| WO2018141191A1 (en) * | 2017-02-04 | 2018-08-09 | 栾斌臣 | Led light bulb capable of replacing halogen lamp and manufacturing process for led light bulb |
| CN110828632A (en) * | 2019-10-22 | 2020-02-21 | 鹤山市任挥岭灯饰企业有限公司 | LED insertion bubble manufacturing method and LED insertion bubble thereof |
| WO2022036553A1 (en) * | 2020-08-18 | 2022-02-24 | 深圳市照阳智汇电子科技有限公司 | G9 ceramic base having improved assembly mode, and g9 lamp |
Also Published As
| Publication number | Publication date |
|---|---|
| GB201320390D0 (en) | 2014-01-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP2447599B1 (en) | Lighting apparatus | |
| US9004724B2 (en) | Reflector (optics) used in LED deco lamp | |
| KR101227527B1 (en) | Lighting apparatus | |
| US8390182B2 (en) | Light emitting diode bulb | |
| US20120032577A1 (en) | Led lighting device | |
| JP3141579U (en) | LED lighting fixtures | |
| JP2008108674A (en) | Led lighting fixture | |
| EP2392851A1 (en) | LED lighting device | |
| JP2009117328A (en) | Illumination device | |
| JP2010135747A (en) | Light-emitting module and lighting apparatus | |
| CN201688229U (en) | LED lighting lamp | |
| JP2011154910A (en) | Driving circuit for semiconductor type light source of vehicular lamp and vehicular lamp | |
| JP2011222182A (en) | Lighting device | |
| GB2520345A (en) | LED lighting apparatus | |
| CN102278612B (en) | Light emitting diode (LED) illumination lamp | |
| JP3163443U (en) | LED lighting device | |
| JP2014035826A (en) | Light source apparatus and lighting apparatus | |
| TWM457847U (en) | Lighting device having a widely light emitting angle | |
| KR101082587B1 (en) | Illuminator using led | |
| US20110006679A1 (en) | LED bulb with an enlarged irradiation range by arranging led elements in three-dimension | |
| KR20140116776A (en) | Lamp and lighting apparatus | |
| KR101443670B1 (en) | LED lighting device | |
| KR101511776B1 (en) | High Luminance LED deck flood lamp with prefabricated structure | |
| TW201430271A (en) | LED device | |
| JP2011096648A (en) | Illumination device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| WAP | Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1) |