GB2520228A - Apparatus and methods for wireless communication - Google Patents

Apparatus and methods for wireless communication Download PDF

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Publication number
GB2520228A
GB2520228A GB1311809.6A GB201311809A GB2520228A GB 2520228 A GB2520228 A GB 2520228A GB 201311809 A GB201311809 A GB 201311809A GB 2520228 A GB2520228 A GB 2520228A
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GB
United Kingdom
Prior art keywords
conductive member
micro aperture
inductor
conductive
coupled
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB1311809.6A
Other versions
GB201311809D0 (en
Inventor
Joonas Krogerus
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nokia Technologies Oy
Original Assignee
Nokia Technologies Oy
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nokia Technologies Oy filed Critical Nokia Technologies Oy
Priority to GB1311809.6A priority Critical patent/GB2520228A/en
Publication of GB201311809D0 publication Critical patent/GB201311809D0/en
Priority to PCT/FI2014/050524 priority patent/WO2015001181A1/en
Publication of GB2520228A publication Critical patent/GB2520228A/en
Withdrawn legal-status Critical Current

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Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q5/00Arrangements for simultaneous operation of antennas on two or more different wavebands, e.g. dual-band or multi-band arrangements
    • H01Q5/30Arrangements for providing operation on different wavebands
    • H01Q5/378Combination of fed elements with parasitic elements
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/351Working by laser beam, e.g. welding, cutting or boring for trimming or tuning of electrical components
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36Removing material
    • B23K26/38Removing material by boring or cutting
    • B23K26/382Removing material by boring or cutting by boring
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/12Supports; Mounting means
    • H01Q1/22Supports; Mounting means by structural association with other equipment or articles
    • H01Q1/24Supports; Mounting means by structural association with other equipment or articles with receiving set
    • H01Q1/241Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM
    • H01Q1/242Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use
    • H01Q1/243Supports; Mounting means by structural association with other equipment or articles with receiving set used in mobile communications, e.g. GSM specially adapted for hand-held use with built-in antennas
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/42Housings not intimately mechanically associated with radiating elements, e.g. radome
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q1/00Details of, or arrangements associated with, antennas
    • H01Q1/44Details of, or arrangements associated with, antennas using equipment having another main function to serve additionally as an antenna, e.g. means for giving an antenna an aesthetic aspect
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01QANTENNAS, i.e. RADIO AERIALS
    • H01Q9/00Electrically-short antennas having dimensions not more than twice the operating wavelength and consisting of conductive active radiating elements
    • H01Q9/04Resonant antennas
    • H01Q9/30Resonant antennas with feed to end of elongated active element, e.g. unipole
    • H01Q9/42Resonant antennas with feed to end of elongated active element, e.g. unipole with folded element, the folded parts being spaced apart a small fraction of the operating wavelength
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04MTELEPHONIC COMMUNICATION
    • H04M1/00Substation equipment, e.g. for use by subscribers
    • H04M1/02Constructional features of telephone sets
    • H04M1/0202Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00Articles made by soldering, welding or cutting
    • B23K2101/36Electric or electronic devices
    • B23K2101/38Conductors

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Computer Networks & Wireless Communication (AREA)
  • Signal Processing (AREA)
  • Support Of Aerials (AREA)

Abstract

An apparatus 102, or a method, for wireless communication, comprises: a conductive casing side walls 202 having at least one micro aperture 30 which is at least partially filled by a dielectric layer and where a first inductor 28 is coupled to the conductive member in parallel with the at least one micro aperture 30. The dielectric layer may be an anodized layer. The micro aperture 30 may be formed by laser perforation with dimensions which make it invisible to the human eye and is configured to enable the passage of radio waves 44. A second inductor may be coupled to the conductive member in parallel with the micro aperture 30. Various resonant conditions may be arranged where different conductive parts of the apparatus may be directly or parasitically driven to form a radiated electromagnetic signal beam.

Description

TITLE
Apparatus and methods for wireless communication
TECHNOLOGICAL FIELD
Embodiments of the present invention relate to apparatus and methods for wireless communication. In particular, they relate to apparatus in a portable electronic device.
BACKGROUND
Apparatus, such as portable electronic devices, usually include an antenna arrangement to enable the portable electronic device to wirelessly communicate with other devices. The antenna arrangement is provided within a cover of the portable electronic device to shield the antenna arrangement from damage caused by the environment and from contact with the user.
The cover of the portable electronic device defines the exterior surface of the portable electronic device and may at least partly comprise a metal or any other conductive material. Such a cover is relatively strong and may have an attractive aesthetic appearance. However, the relatively high electrical conductivity of the cover may cause the cover to function as a Faraday cage for the antenna arrangement and prevent the portable electronic device from wirelessly communicating with other devices via the antenna arrangement.
It would therefore be desirable to provide an alternative apparatus.
BRIEF SUMMARY
According to various, but not necessarily all, embodiments of the invention there is provided an apparatus comprising: a conductive member having at least one micro aperture defined therein; a dielectric layer that at least partially fills the at least one micro aperture; and a first inductor coupled to the conductive member in parallel with the at least one micro aperture.
The dielectric layer may be an anodization layer.
The at least one micro aperture may be dimensioned to not be visible to a human eye.
The at least one micro aperture may be configured to enable the passage of radio waves there through.
The at least one micro aperture may be formed in the conductive member by laser perforation.
The apparatus may further comprise a second inductor coupled to the conductive member in parallel with the at least one micro aperture. The second inductor may have the same or a different inductance to the first inductor.
At least a first part of the conductive member may have an electrical length configured to resonate in a first operational frequency band.
The first part of the conductive member may be coupled to radio frequency circuitry.
The first part of the conductive member may be galvanically connected to a feed point. The feed point may be coupled to the radio frequency circuitry.
The apparatus may further comprise an antenna coupled to the radio frequency circuitry via a feed point. The first part of the conductive member may be configured to parasitically couple to the antenna.
The conductive member may be a conductive cover portion.
The conductive cover portion may be a bezel of a portable electronic device.
According to various, but not necessarily all, embodiments of the invention there is provided a portable electronic device comprising an apparatus as described in any of the preceding paragraphs.
According to various, but not necessarily all, embodiments of the invention there is provided a method comprising: providing a conductive member having at least one micro aperture defined therein; at least partially filling the at least one micro aperture with a dielectric layer; and coupling a first inductor to the conductive member in parallel with the at least one micro aperture.
The dielectric layer may be an anodization layer.
The at least one micro aperture may be dimensioned to not be visible to a human eye.
The at least one micro aperture may be configured to enable the passage of radio waves there through.
The method may further comprise forming the at least one micro aperture in the conductive member by laser perforation.
The method may further comprise coupling a second inductor to the conductive member in parallel with the at least one micro aperture. The second inductor may have the same or a different inductance to the first inductor.
At least a first part of the conductive member may have an electrical length configured to resonate in a first operational frequency band.
The first part of the conductive member may be coupled to radio circuitry.
The first part of the conductive member may be galvanically connected to a feed point. The feed point may be coupled to the radio circuitry.
The method may further comprise coupling an antenna to the radio circuitry via a teed point. The first pad of the conductive member being configured to parasitically couple to the antenna.
The conductive member may be a conductive cover portion.
The conductive cover portion may be a bezel of a portable electronic device.
BRIEF DESCRIPTION
For a better understanding of various examples that are useful for understanding the brief description, reference will now be made by way ot example only to the accompanying drawings in which: Fig. 1 illustrates a schematic diagram of a portable electronic device according to
various examples;
Fig. 2A illustrates a schematic diagram of an apparatus according to various
examples;
Fig. 2B illustrates a schematic diagram ot another apparatus according to various
examples;
Fig. 3 illustrates a perspective view diagram ot an exterior of a portable electronic device according to various examples; Fig. 4A illustrates a perspective view diagram of another apparatus according to
various examples;
Fig. 4B illustrates a plan view diagram otthe apparatus illustrated in Fig. 4A; Fig. 5 illustrates a schematic plan view diagram ot a first portable electronic device according to various examples; Fig. 6 illustrates a schematic plan view diagram ot a second portable electronic device according to various examples; Fig. 7 illustrates a schematic plan view diagram of a third portable electronic device according to various examples; and Fig. 8 illustrates a flow diagram of a method ot manufacturing an apparatus according to various examples.
DETAILED DESCRIPTION
In the following description, the wording connect' and couple' and their derivatives mean operationally connected or coupled. It should be appreciated that any number or combination of intervening components can exist (including no intervening components). Additionally, it should be appreciated that the connection or coupling may be a physical galvanic connection and/or an electromagnetic connection.
Figs. 2A, 2B, 4, 5, 6 and 7 illustrate an apparatus 22, 221, 222, 223, 224, 225, 226 comprising: a conductive member 24 having at least one micro aperture 30 defined therein; a dielectric layer 26 that at least partially fills the at least one micro aperture 30; and a first inductor 28 coupled to the conductive member 24 in parallel with the at least one micro aperture 30.
In more detail, fig. 1 illustrates an electronic device 10 which may be any apparatus such as a hand portable electronic device (for example, a mobile cellular telephone, a tablet computer, a laptop computer, a personal digital assistant or a hand held computer), a non-portable electronic device (for example, a personal computer or a base station for a cellular network), a portable multimedia device (for example, a music player, a video player, a game console and so on) or a module for such devices. As used here, the term module' refers to a unit or apparatus that excludes certain parts or components that would be added by an end manufacturer or a user.
The electronic device 10 comprises an antenna arrangement 12, radio frequency circuitry 14, circuitry 16, a ground member 18, a cover 20 and an apparatus 22.
The antenna arrangement 12 includes one or more antennas that are configured to transmit and receive, transmit only or receive only electromagnetic signals. The radio frequency circuitry 14 is connected between the antenna arrangement 12 and the circuitry 16 and may include a receiver and/or a transmitter and/or a transceiver.
The circuitry 16 is operable to provide signals to, and/or receive signals from the radio frequency circuitry 14. The electronic device 10 may optionally include one or more matching circuits, filters, switches, or other radio frequency circuit elements, and combinations thereof, between the antenna arrangement 12 and the radio frequency circuitry 14.
The radio frequency circuitry 14 and the antenna arrangement 12 may be configured to operate in a plurality of operational frequency bands. For example, the operational frequency bands may include (but are not limited to) Long Term Evolution (LIE) (US) (734 to 746 MHz and 869 to 894 MHz), Long Term Evolution (LIE) (rest of the world) (791 to 821 MHz and 925 to 960 MHz), amplitude modulation (AM) radio (0.535-1.705 MHz); frequency modulation (FM) radio (76-108 MHz); Bluetooth (2400-2483.5 MHz); wireless local area network (WLAN) (2400- 2483.5 MHz); hiper local area network (HiperLAN) (5150-5850 MHz); global positioning system (GPS) (1570.42-1580.42 MHz); US -Global system for mobile communications (US-GSM) 850 (824-894 MHz) and 1900 (1850 -1990 MHz); European global system for mobile communications (EGSM) 900 (880-960 MHz) and 1800 (1710 -1880 MHz); European wideband code division multiple access (EU-WCDMA) 900 (880-960 MHz); personal communications network (PCN/DCS) 1800 (1710-1 880 MHz); US wideband code division multiple access (US-WCDMA) 1700 (transmit: 1710 to 1755 MHz, receive: 2110 to 2155 MHz) and 1900 (1850- 1990 MHz); wideband code division multiple access (WCDMA) 2100 (transmit: 1920-1980 MHz, receive: 2110-2180 MHz); personal communications service (PCS) 1900 (1850-1990 MHz); time division synchronous code division multiple access (TD-SCDMA) (1900 MHz to 1920 MHz, 2010 MHz to 2025 MHz), ultra wideband (UWB) Lower (3100-4900 MHz); UWB Upper (6000-10600 MHz); digital video broadcasting -handheld (DVB-H) (470-702 MHz); DVB-H US (1670-1675 MHz); digital radio mondiale (DRM) (0.15-30 MHz); worldwide interoperability for microwave access (WiMax) (2300-2400 MHz, 2305-2360 MHz, 2496-2690 MHz, 3300-3400 MHz, 3400-3800 MHz, 5250-5875 MHz); digital audio broadcasting (DAB) (174.928-239.2 MHz, 1452.96-1490.62 MHz); radio frequency identification low frequency (RFID LF) (0.125-0.134 MHz); radio frequency identification high frequency (RFID HF) (13.56-13.56 MHz); radio frequency identification ultra high frequency (RFID UHF) (433 MHz, 865-956 MHz, 2450 MHz).
A frequency band over which an antenna can efficiently operate using a protocol is a frequency range where the antenna's return loss is less than an operational threshold. For example, efficient operation may occur when the antenna's return loss is better than (that is, less than) -4dB or -6dB.
The circuitry 16 may include processing circuitry, memory circuitry and input/output devices such as an audio input device (a microphone for example), an audio output device (a loudspeaker for example), a display and a user input device (such as a touch screen display and/or one or more buttons or keys).
The antenna arrangement 12 and the electronic components that provide the radio frequency circuitry 14 and the circuitry 16 may be interconnected via the ground member 18 (for example, a printed wiring board). The ground member 18 may be used as a ground plane for the antenna arrangement 12 by using one or more layers of the printed wiring board. In other embodiments, some other conductive part of the electronic device 10 (a battery cover or a chassis within the interior of the cover 20 for example) may be used as the ground member 18 for the antenna arrangement 12. In some examples, the ground member 18 may be formed from several conductive parts of the electronic device 10, one part which may include the printed wiring board. The ground member 18 may be planar or non-planar.
The cover 20 has an exterior surface that defines one or more exterior visible surfaces of the electronic device 10 and also has an interior surface that defines a cavity configured to house the electronic components of the electronic device 10 such as the antenna arrangement 12, the radio frequency circuitry 14, the circuitry 16 and the ground member 18.
The apparatus 22 is described in the following paragraphs with reference to several
examples.
Fig. 2A illustrates a schematic diagram of an apparatus 221 according to various examples. The apparatus 221 includes a conductive member 24, a dielectric layer 26 and an inductor 28.
The conductive member 24 may comprise any suitable material having a relatively high electrical conductivity. For example, the conductive member 24 may comprise a metal such as aluminum, or other conductive material such as graphite, carbon, conductive polymer, and conductive composite materials and so on. Additionally or alternatively, the conductive member 24 may include a conductive layer (a metal layer for example) which is coated with plastic or may include a plastic layer that is coated or that otherwise carries a conductive layer (a metal layer for example).
The conductive member 24 may form at least a part of the cover 20 of the electronic device 10 (and may consequently be referred to as a conductive cover portion). For example, the conductive member 24 may form a bezel that extends around the perimeter of the electronic device 10 (that is, the conductive member 24 provides at least a part of the side surface of the electronic device 10). Alternatively, the conductive member 24 may form an upper or lower surface of the electronic device 10. In some examples, the conductive member 24 may not form a part of the cover and may instead be housed within the cover 20.
The conductive member 24 has at least one micro aperture 30 defined therein. The at least one micro aperture 30 has at least one dimension that is of the order of microns. In particular, the micro aperture 30 may have at least one dimension that is of the order of single digit microns, tens of microns, or hundreds of microns. As illustrated in Fig. 2A, the aperture 30 has a width W, a height H and a depth (not illustrated in the Fig.). The width W is of the order of microns, and the height is of the order of millimeters or centimeters. The depth may be of the order or microns, millimeters or centimeters, but not limited to these depths.
The at least one micro aperture 30 is configured to enable the passage of radio waves there through. For example, where the conductive member 24 is a conductive cover portion, the aperture 30 is sized and positioned to enable the antenna arrangement 12 to transmit radio frequency waves out of the electronic device 10 and to receive radio frequency waves that were emitted outside of the electronic device 10.
The at least one micro aperture 30 may be dimensioned to not be visible to a human eye. For example, where the width W of the micro aperture 30 is of single digit microns or low tens of microns (for example, 1 to 30 microns), the micro aperture 30 may be invisible to the naked eye or may be barely visible to the naked eye.
The at least one micro aperture 30 may be formed through any suitable process.
For example, the micro aperture 30 may be formed through: laser perforation; patterning a conductive layer on a substrate; wet or dry chemical etching; plasma arc cutting; or micromachining (using grinding tools for example). Where the micro aperture 30 is formed through laser perforation, the micro aperture 30 may be referred to as a laser perforation aperture.
The dielectric layer 26 at least partially fills the at least one micro aperture 30. In other words, the dielectric layer 26 may extend through a part of the height H of the micro aperture 30, or may extend through the whole of the height H of the micro aperture 30. The dielectric layer 26 may comprise any suitable dielectric material and may be an anodization layer (comprising a metal oxide such as alumina, A1203, for example). The anodization layer 26 may extend over other surfaces of the conductive member 24 so that the anodization layer 26 appears to continuously cover the conductive member 24.
The inductor 28 is coupled to the conductive member 24 in parallel with the at least one micro aperture 30. In other words, the inductor 28 is connected in parallel with the at least one capacitor formed from the conductive member 24, at least one micro aperture 30 and the dielectric layer 26. The inductor 28 may be any suitable component that provides an inductive reactance. For example, the inductor 28 may be formed from a strip of conductive material (distributed component) or may be a lumped component. The inductor 28 need not necessarily be formed from a coil or winding of conductive material in two or three dimensions, as illustrated in Fig. 2A, and instead be formed of a piece of conductive material of any shape, including but not limited to one or more straight, bent, and curved portions of conductive material dependent on the frequency of operation. For example, microstrip inductors are good examples of distributed components.
Fig. 2B illustrates a schematic diagram of another apparatus 222 according to various examples. The apparatus 222 is similar to the apparatus 221 illustrated in Fig. 2A and where the features are similar, the same reference numerals are used.
The apparatus 222 differs from the apparatus 221 in that the apparatus 222 includes a first inductor 28 coupled to the conductive member 24 in parallel with the at least one micro aperture 30, and a second inductor 32 coupled to the conductive member 24 in parallel with the at least one micro aperture 30. The second inductor 32 may have the same or a different inductance to the first inductor 28.
In some examples, the first inductor 28 may be coupled to the conductive member 24 via a first switch that is configured to connect and disconnect the first inductor 28 to the conductive member 24. Similarly, the second inductor 32 may be coupled to the conductive member 24 via a second switch that is configured to connect and disconnect the second inductor 32 to the conductive member 24. The circuitry 16 may be configured to control the operation of the first switch and the operation of the second switch.
In some examples, the first inductor 28 may be coupled to the conductive member 24 via a digitally tunable capacitor. In other words, the digitally tunable capacitor is connected in series with the first inductor 28 so that the first inductor 28 and the digitally tunable capacitor are in shunt with the at least one micro aperture 30. In these examples, the apparatus 222 may not include the second inductor 32, or may include a second inductor 32 that is similarly coupled to the conductive member 24 via a digitally tunable capacitor.
In some examples, the apparatus 222 may include any number of inductors coupled to the conductive member 24 in parallel with the at least one micro aperture 30 (for example, the apparatus 222 may include three or more inductors). The inductors may be connected in parallel with one another (as described in the preceding paragraphs), in series with one another, or any combination of parallel and series connections. Additionally, the apparatus 222 may include any number of switches for controlling which inductors are coupled to the conductive member 24 and/or may include any number of digitally tunable capacitors as described in the preceding paragraphs.
Fig. 3 illustrates a perspective view diagram of an exterior of a portable electronic device 101 according to various examples. The portable electronic device 101 is similar to the electronic device 10 and where the features are similar, the same reference numerals are used. The portable electronic device 101 may be (for example, but not limited to) a mobile cellular telephone or a tablet computer.
The portable electronic device 101 includes a cover 20, a first apparatus 223, a second apparatus 224 and a display 34. The cover 20 defines the exterior surface of the portable electronic device 101 and includes an upper surface 2Oi that surrounds the display 34, a side wall 202 (which may also be referred to as a bezel), and a bottom surface 203. The side wall 202 extends around, and couples, the perimeter of the upper and lower surfaces 20i, 203. The first apparatus 223 and the second apparatus 224 are located on opposing sides of the side wall 202 of the portable electronic device 101.
The side surface 202 provides the conductive member 24 illustrated in Figs. 2A and 2B and therefore comprises a conductive material such as a metal. The upper surface 2Oi and the lower surface 203 may comprise any suitable material and may comprise a plastic or a glass for example.
The structure of the first apparatus 223 is described in greater detail in the following paragraphs with reference to Fig. 4A and Fig. 4B. The second apparatus 224 may have the same (or similar) structure as the first apparatus 223 or may have a different structure. For example, the second apparatus 224 may have a structure the same as (or similar to) that illustrated in Fig. 2A or in Fig. 2B. The inductors of the first apparatus 223 and the second apparatus 224 may have the same inductance values or may have different inductance values.
Figs. 4A and 4B illustrate perspective and plan view diagrams of the first apparatus 223 that includes a conductive member 24 (that is, the side wall 202 illustrated in Fig. 3), a plurality of micro apertures 30, a plurality of conductive portions 31 and an inductor 28. The plurality of micro apertures 30 are defined between the plurality of conductive portions 31 and are at least partially filled with a dielectric layer as illustrated in Figs. 2A and 2B. The conductive portions of the plurality of conductive portions 31 may be of micro size or may be larger.
In one example, the width of a micro aperture of the plurality of micro apertures 30 is microns, the height H is 7.3 millimeters, and the depth D is 200 microns. The spacing of the conductive member 24 between each micro aperture of the plurality of micro apertures 30 (that is, the width of a conductive portion 31) is 200 microns and the total width of the plurality of micro apertures 30 and the spacings there between is 2 millimeters.
The side wall 202 has a height H of 7.3 millimeters and a depth of 1 millimeter. A cavity 36 is defined in the side wall 202 due to the depth of the plurality of micro apertures 30 being less than the depth of the side wall 202. The inductor 28 is coupled to the conductive member 24 in parallel with the plurality of micro apertures and is positioned within the cavity 36 of the side wall 202. As described with reference to Fig. 2B, in some examples, the apparatus 223 may comprise a plurality of inductors coupled to the conductive member 24 in parallel with the plurality of micro apertures 30.
Similar to Fig. 2B, the apparatus 223 may include a plurality of inductors connected in parallel with the plurality of micro apertures 30. The plurality of inductors may be connected in parallel with one another, may be connected in series with one another, or may be arranged to have a combination of series and parallel connections.
Where at least some of the inductors are connected in series with one another, the inductors may be connected at multiple different, or same, contact points within the micro aperture structure. For example, a first inductor may be connected to the conductive portion 3li and to the conductive portion 314, a second inductor may be connected to the conductive portion 31e and to the conductive portion 3lg.
Consequently, in this example there are effectively two [C circuits in series connected over the gap defined by the micro apertures 30, and a capacitor is created in the middle of the micro aperture structure between the conductive portion 314 and the conductive portion 31.
The conductive portions 31 created by the micro apertures 30 may be used as connection points where an electrical connection to one or more resistor, inductor, or capacitor (RLC) component or components may be made. The components may be arranged to form circuit topologies such as T, Pi, [ networks and combinations thereof, and so on.
Some conductive portions 31 created by the micro apertures 30 may be made larger than other adjacent conductive portions 31 (that is, the conductive portions 31 need not all be the same width/depth/height). This may advantageously lead to inductance and capacitance control within the overall gap formed by the micro apertures 30 and may provide physical dimensions that enable more components to be added to increase the size and complexity of the network. The gap formed by the micro apertures 30 may advantageously be formed to have dimensions that facilitate practical manufacturing requirements (for example, dimensions that enable soldering of a lumped component thereto).
The apparatus 22, 221, 222, 223 and 224 may provide an advantage in that since the at least one micro aperture 30 may be invisible to the naked eye or may be barely visible to the naked eye, the conductive member 24 may appear to be a continuous piece of material. Where the side wall 202 provides the conductive member 24, the portable electronic device 101 advantageously appears to the user to be a continuous ring of material having no gaps or interruptions. This may render the electronic device 10, 101 more aesthetically pleasing to a user of the electronic device 10, 101.
By way of example, reference is now made to Figs. 5 to 7 which illustrate various examples in which a part 38 of the sidewall 202 that has been separated from the remainder of the side wall 202 by the micro apertures 30 is utilized as part of the antenna arrangement 12. The portable electronic devices illustrated in Figs. 5 to 7 are similar to the electronic devices 10, 101 and where the features are similar, the same reference numerals are used.
Fig. 5 illustrates a schematic plan view diagram of a first portable electronic device 102 according to various examples. The first portable electronic device 102 includes a first apparatus 225 and a second apparatus 226 where the side wall 202 provides the conductive member 24. The first apparatus 225 and the second apparatus 226 may have any combination of the structures of the apparatus 22, 221, 222, 223, 224, or may have a different structure. In some examples, the first portable electronic device 102 may only include one of the first apparatus 225 or the second apparatus 226.
The first pad 38 of the conductive sidewall may be either electrically floating at one or more resonant frequencies in the radio frequency spectrum, or may optionally be grounded at one or more locations as shown in Fig. 5. The antenna arrangement 12 positioned within the cover 20 of the portable electronic device 102 may include an antenna 40 coupled to radio frequency circuitry 14 via a feed point 41, and optionally, a parasitic antenna 42 coupled to ground via a ground point 43, with the radiation 44 propagating to and/or from the antenna arrangement 12 passing through the at least one micro aperture 30. As shown, the second part 46 of the side wall 202 may optionally be coupled at one or more locations 47 to ground 18, either directly via galvanic coupling, or indirectly via capacitive or inductive coupling or, alternatively, remain electrically floating, in other words no appreciable electrical coupling of signals within the operational frequency bands of the one or more antennas.
The antenna 40 may include any suitable forms of antenna and may include, but not be limited to, monopoles, dipoles, loops, planar inverted F antennas (PIFA5), inverted F antennas (IFA5), inverted L antennas (ILAs), arrays, helices, slots, patches, meanders, and variations and combinations thereof. It should be appreciated that there may be any number of antenna elements and parasitic elements within the device or as part of the cover 20 of the device.
The antenna 40 has a first electrical length configured to resonate at least at a first operational frequency band, and the optional internal parasitic antenna 42 has a second electrical length configured to resonate at least at a second resonant frequency, the second resonant frequency being different than the first resonant frequency.
The first part 38 of the side wall 202 has a third electrical length configured to resonate at least at a third operational frequency band. The third operational frequency band may be different to the first and/or second operational frequency band or may be the same as first and/or second operational frequency band.
The inductor or inductors 28 have an inductance that is selected to enable the first part 38 to resonate in at least the third operational frequency band. Furthermore, the inductor or inductors 28 have an inductance that is selected to form a band stop filter with the capacitor provided by the at least one micro aperture 30 that has a maximum impedance at the third operational frequency band. The band stop filter formed by the inductor 28 and the micro aperture 30 provide increased isolation between the first part 38 and the second part 46.
The first part 38 of the side wall 202 may be considered to provide a further optional parasitic antenna configured to couple to the antenna 40 and/or the optional internal parasitic element 42. When the first part 38 of the side wall 202 is configured to have a third electrical length that falls within the frequency band(s) at which the antenna 40 and/or the optional internal parasitic antenna 42 operate, radio frequencies radiated by the antenna 40 and the optional internal parasitic antenna 42 will couple to/from the first part 38 of the side wall 202 for further radiation to/from the ether at the same time as radio frequencies passing through the at least one micro aperture 30. As such, the first part 38 of the side wall 202 may widen the bandwidth of the overall antenna arrangement 12, while appearing from outside of the portable electronic device 102 as a continuous conductive structure.
In an alternative example in which the first part 38 of the side wall 202 has an electrical length which is configured to resonate at a third resonant frequency which is substantially different to the first and/or second operational frequency bands, the first part 38 can be considered to be operating outside of the operational frequency band(s) in which the antenna 40 and/or the optional internal parasitic antenna 42 operate. In particular, the inductor or inductors 28 have an inductance that is selected to provide the first part 38 with an impedance at the first and/or second operational frequency bands that is relatively high and presents an open circuit. As such, the first part 38 of the side wall 202 of this example may appear almost transparent at the operational frequency band(s).
Fig. 6 illustrates a schematic plan view diagram of a second portable electronic device 103 according to various examples. The second portable electronic device 103 includes a first apparatus 225 and a second apparatus 226 where the side wall 202 provides the conductive member 24. The first apparatus 225 and the second apparatus 226 may have any combination of the structures of the apparatus 22, 221, 222, 223, 224, or may have a different structure. In some examples, the second portable electronic device 103 may only include one of the first apparatus 225 or the second apparatus 226.
The first part 38 of the side wall 202 is a portion of an antenna 40 (which is connected to the radio frequency circuitry 14 via a feed point 41) of the antenna arrangement 12. The first part 38 may be galvanically connected to the antenna 40 at a coupling point 45, or may be coupled to the antenna 40 at the coupling point 45 via one or more components (for example, via a capacitor and/or an inductor). The first part 38 of the side wall 202 may also be optionally grounded at ground point 49, such as at a position spaced apart from the position at which the first part 38 is coupled to the antenna 40. The first part 38 may be grounded to the ground member 18 at the same location as the parasitic antenna 42 or may be grounded to the ground member 18 at a different location to the parasitic antenna 42. The grounding connection between first part 38 and the ground member 18 may include one or more reactive components (an inductor and/or a capacitor for example). In some examples, the first part 38 may provide a multiple input multiple output (MIMO) antenna of the antenna arrangement 12.
The at least one micro aperture 30 and the inductor 28 serve to electrically separate or isolate the first part 38 of the side wall 202 from the remaining part 46 of the side wall 202. In particular, the inductor or inductors 28 have an inductance that is selected to form a band stop filter with the capacitor provided by the at least one micro aperture 30. The band stop filter has a maximum impedance at the operational frequency band of the antenna 40 and first part 38 combination.
As shown, the second part 46 of the side wall 202 may optionally be coupled at one or more locations to ground 18 or, alternatively, remain electrically floating.
Fig. 7 illustrates a schematic plan view diagram of a third portable electronic device 104 according to various examples. The third portable electronic device 104 includes a first apparatus 225 and a second apparatus 226 where the side wall 202 provides the conductive member 24. The first apparatus 225 and the second apparatus 226 may have any combination of the structures of the apparatus 22, 221, 222, 223, 224, or may have a different structure. In some examples, the third portable electronic device 104 may only include one of the first apparatus 225 or the second apparatus 226.
The first part 38 of the side wall 202 is a portion of a parasitic antenna 42 of the antenna arrangement 12 by being grounded, such as by being coupled at least at one end to the parasitic antenna 42. The first part 38 may be galvanically connected to the parasitic antenna 42, or may be coupled to the parasitic antenna 42 via one or more components (for example, via a capacitor and/or an inductor). In an example where the parasitic antenna 42 is to have its distal end left open with no ground connection, the opposite end of the first part 38 of the side wall 202 may also be left open, e.g., ungrounded.
If the parasitic antenna 42 is of a loop antenna type of construction, the first part 38 of the side wall 202 may also be coupled to ground at one or more other locations, such as proximate the opposite end of the first portion as shown in Fig. 7.
The antenna arrangement 12 of this example also includes an antenna 40 connected to the radio frequency circuitry 14 via a feed point 41. The at least one micro aperture 30 and the inductor or inductors 28 of this example serve to electrically separate or isolate the first part 38 of the side wall 202 from the remaining part 46 of the side wall 202 by forming a band stop filter at the frequency band of operation of the parasitic antenna 42 and/or the antenna 40. The second pad 46 of the side wall 202 may again optionally be coupled at one or more locations 47 to ground 18 or, alternatively, remain electrically floating.
Fig. 8 illustrates a flow diagram of a method of manufacturing an apparatus according to various examples.
At block 48, the method includes forming at least one micro aperture 30 in the conductive member 24. For example, the block may include laser perforation, patterning a conductive layer on a substrate; wet or dry chemical etching; plasma arc cutting; or micromachining (using grinding tools for example).
At block 50, the method includes at least partially filling the at least one micro aperture 30 with a dielectric layer 26. Furthermore, the conductive member 24 and the dielectric layer 26 may be over molded, such as with a plastic, a resin or an adhesive.
At block 52, the method includes coupling a first inductor 28 to the conductive member 24 in parallel with the at least one micro aperture 30. In some examples, the first inductor 28 may be coupled to the conductive member 24 within the cavity 36 (as illustrated in Fig. 4A and Fig. 4B).
At block 54, the method includes coupling a second inductor 32 to the conductive member 24 in parallel with the at least one micro aperture 30. In some examples, block 54 may include coupling a plurality of inductors to the conductive member 24.
The second inductor 32 may be coupled to the conductive member 24 within the cavity 36.
At block 56, the method includes coupling an antenna 40 to radio frequency circuitry 14 via a teed point. In some examples (such as the portable electronic device 103 illustrated in Fig. 6), the antenna 40 may also be coupled to the tirst part 38 of the side wall 202.
The blocks illustrated in the Fig. 8 may represent steps in a method and/or sections of code in a computer program. For example, processing circuitry may execute the computer program to control machinery to perform the method illustrated in Fig. 8.
The illustration of a particular order to the blocks does not necessarily imply that there is a required or preferred order for the blocks and the order and arrangement of the block may be varied. Furthermore, it may be possible for some blocks to be omitted.
The term comprise' is used in this document with an inclusive not an exclusive meaning. That is any reference to X comprising Y indicates that X may comprise only one Y or may comprise more than one Y. If it is intended to use comprise' with an exclusive meaning then it will be made clear in the context by referring to "comprising only one.." or by using "consisting".
In this brief description, reference has been made to various examples. The description of features or functions in relation to an example indicates that those teatures or functions are present in that example. The use of the term example' or for example' or may' in the text denotes, whether explicitly stated or not, that such teatures or functions are present in at least the described example, whether described as an example or not, and that they can be, but are not necessarily, present in some of or all other examples. Thus example', for example' or may' refers to a particular instance in a class of examples. A property of the instance can be a property of only that instance or a property of the class or a property of a sub-class of the class that includes some but not all of the instances in the class.
Although embodiments of the present invention have been described in the preceding paragraphs with reference to various examples, it should be appreciated that modifications to the examples given can be made without departing from the scope of the invention as claimed.
For example, the conductive member 24 may be any conductive part or parts of the electronic device and in some examples, the conductive member 24 may be any part or parts of the cover 20. For example, the conductive member 24 may include a conductive end cap radiator and a conductive unibody cover. The conductive end cap radiator may be directly coupled to radio frequency circuitry via a galvanic connection, or may be indirectly coupled to radio frequency circuitry via electromagnetic coupling.
In this example, the at least one micro aperture 30 is formed between the conductive end cap radiator and the conductive unibody cover. At least two inductors are connected in parallel with the at least one aperture 30 between the conductive end cap radiator and the conductive unibody cover and may be positioned on opposing lower edges of the electronic device as illustrated in Fig. 3.
Features described in the preceding description may be used in combinations other than the combinations explicitly described.
Although functions have been described with reference to certain features, those functions may be performable by other features whether described or not.
Although features have been described with reference to certain embodiments, those features may also be present in other embodiments whether described or not.
Whilst endeavoring in the foregoing specification to draw attention to those features of the invention believed to be of particular importance it should be understood that the Applicant claims protection in respect of any patentable feature or combination of features hereinbefore referred to and/or shown in the drawings whether or not particular emphasis has been placed thereon.
I/we claim:

Claims (25)

  1. CLAIMS1. An apparatus comprising: a conductive member having at least one micro aperture defined therein; a dielectric layer that at least partially fills the at least one micro aperture; and a first inductor coupled to the conductive member in parallel with the at least one micro aperture.
  2. 2. An apparatus as claimed in claim 1, wherein the dielectric layer is an anodization layer.
  3. 3. An apparatus as claimed in claim 1 or 2, wherein the at least one micro aperture is dimensioned to not be visible to a human eye.
  4. 4. An apparatus as claimed in any of the preceding claims, wherein the at least one micro aperture is configured to enable the passage of radio waves there through.
  5. 5. An apparatus as claimed in any of the preceding claims, wherein the at least one micro aperture is formed in the conductive member by laser perforation.
  6. 6. An apparatus as claimed in any of the preceding claims, further comprising a second inductor coupled to the conductive member in parallel with the at least one micro aperture, the second inductor having the same or a different inductance to the first inductor.
  7. 7. An apparatus as claimed in any of the preceding claims, wherein at least a first part of the conductive member has an electrical length configured to resonate in a first operational frequency band.
  8. 8. An apparatus as claimed in claim 7, wherein the first part of the conductive member is coupled to radio frequency circuitry.
  9. 9. An apparatus as claimed in claim 8, wherein the first part of the conductive member is galvanically connected to a feed point, the feed point being coupled to the radio frequency circuitry.
  10. 10. An apparatus as claimed in claim 8, further comprising an antenna coupled to the radio frequency circuitry via a feed point, the first part of the conductive member being configured to parasitically couple to the antenna.
  11. 11. An apparatus as claimed in any of the preceding claims, wherein the conductive member is a conductive cover portion.
  12. 12. An apparatus as claimed in claim 11, wherein the conductive cover portion is a bezel of a portable electronic device.
  13. 13. A portable electronic device comprising an apparatus as claimed in any of the preceding claims.
  14. 14. A method comprising: providing a conductive member having at least one micro aperture defined therein; at least partially filling the at least one micro aperture with a dielectric layer; and coupling a first inductor to the conductive member in parallel with the at least one micro aperture.
  15. 15. A method as claimed in claim 14, wherein the dielectric layer is an anodization layer.
  16. 16. A method as claimed in claim 14 or 15, wherein the at least one micro aperture is dimensioned to not be visible to a human eye.
  17. 17. A method as claimed in any of claims 14 to 16, wherein the at least one micro aperture is configured to enable the passage of radio waves there through.
  18. 18. A method as claimed in any of claims 14 to 17, further comprising forming the at least one micro aperture in the conductive member by laser perforation.
  19. 19. A method as claimed in any of claims 14 to 18, further comprising coupling a second inductor to the conductive member in parallel with the at least one micro aperture, the second inductor having the same or a different inductance to the first inductor.
  20. 20. A method as claimed in any of claims 14 to 19, wherein at least a first part of the conductive member has an electrical length configured to resonate in a first operational frequency band.
  21. 21. A method as claimed in claim 20, wherein the first part of the conductive member is coupled to radio circuitry.
  22. 22. A method as claimed in claim 21, wherein the first part of the conductive member is galvanically connected to a feed point, the feed point being coupled to the radio circuitry.
  23. 23. A method as claimed in claim 21, further comprising coupling an antenna to the radio circuitry via a feed point, the first part of the conductive member being configured to parasitically couple to the antenna.
  24. 24. A method as claimed in any of claims 14 to 23, wherein the conductive member is a conductive cover portion.
  25. 25. A method as claimed in claim 24, wherein the conductive cover portion is a bezel of a portable electronic device.
GB1311809.6A 2013-07-02 2013-07-02 Apparatus and methods for wireless communication Withdrawn GB2520228A (en)

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GB1311809.6A GB2520228A (en) 2013-07-02 2013-07-02 Apparatus and methods for wireless communication
PCT/FI2014/050524 WO2015001181A1 (en) 2013-07-02 2014-06-26 Apparatus and methods for wireless communication

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
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WO2015001181A1 (en) 2015-01-08

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