GB2516318B - Etched silicon structures, method of forming etched silicon structures and uses thereof - Google Patents
Etched silicon structures, method of forming etched silicon structures and uses thereofInfo
- Publication number
- GB2516318B GB2516318B GB1312984.6A GB201312984A GB2516318B GB 2516318 B GB2516318 B GB 2516318B GB 201312984 A GB201312984 A GB 201312984A GB 2516318 B GB2516318 B GB 2516318B
- Authority
- GB
- United Kingdom
- Prior art keywords
- etched silicon
- silicon structures
- forming
- structures
- etched
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M10/00—Secondary cells; Manufacture thereof
- H01M10/05—Accumulators with non-aqueous electrolyte
- H01M10/052—Li-accumulators
- H01M10/0525—Rocking-chair batteries, i.e. batteries with lithium insertion or intercalation in both electrodes; Lithium-ion batteries
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M4/00—Electrodes
- H01M4/02—Electrodes composed of, or comprising, active material
- H01M4/13—Electrodes for accumulators with non-aqueous electrolyte, e.g. for lithium-accumulators; Processes of manufacture thereof
- H01M4/139—Processes of manufacture
- H01M4/1395—Processes of manufacture of electrodes based on metals, Si or alloys
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K13/00—Etching, surface-brightening or pickling compositions
- C09K13/04—Etching, surface-brightening or pickling compositions containing an inorganic acid
- C09K13/08—Etching, surface-brightening or pickling compositions containing an inorganic acid containing a fluorine compound
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1851—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material
- C23C18/1872—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment
- C23C18/1875—Pretreatment of the material to be coated of surfaces of non-metallic or semiconducting in organic material by chemical pretreatment only one step pretreatment
- C23C18/1882—Use of organic or inorganic compounds other than metals, e.g. activation, sensitisation with polymers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02002—Preparing wafers
- H01L21/02005—Preparing bulk and homogeneous wafers
- H01L21/02008—Multistep processes
- H01L21/0201—Specific process step
- H01L21/02019—Chemical etching
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M4/00—Electrodes
- H01M4/02—Electrodes composed of, or comprising, active material
- H01M4/04—Processes of manufacture in general
- H01M4/0402—Methods of deposition of the material
- H01M4/0404—Methods of deposition of the material by coating on electrode collectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M4/00—Electrodes
- H01M4/02—Electrodes composed of, or comprising, active material
- H01M4/04—Processes of manufacture in general
- H01M4/0402—Methods of deposition of the material
- H01M4/0416—Methods of deposition of the material involving impregnation with a solution, dispersion, paste or dry powder
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M4/00—Electrodes
- H01M4/02—Electrodes composed of, or comprising, active material
- H01M4/36—Selection of substances as active materials, active masses, active liquids
- H01M4/38—Selection of substances as active materials, active masses, active liquids of elements or alloys
- H01M4/386—Silicon or alloys based on silicon
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB1312984.6A GB2516318B (en) | 2013-07-19 | 2013-07-19 | Etched silicon structures, method of forming etched silicon structures and uses thereof |
PCT/GB2014/052219 WO2015008093A1 (en) | 2013-07-19 | 2014-07-21 | Method of forming etched silicon structures |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB1312984.6A GB2516318B (en) | 2013-07-19 | 2013-07-19 | Etched silicon structures, method of forming etched silicon structures and uses thereof |
Publications (3)
Publication Number | Publication Date |
---|---|
GB201312984D0 GB201312984D0 (en) | 2013-09-04 |
GB2516318A GB2516318A (en) | 2015-01-21 |
GB2516318B true GB2516318B (en) | 2017-02-15 |
Family
ID=49119020
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB1312984.6A Expired - Fee Related GB2516318B (en) | 2013-07-19 | 2013-07-19 | Etched silicon structures, method of forming etched silicon structures and uses thereof |
Country Status (2)
Country | Link |
---|---|
GB (1) | GB2516318B (en) |
WO (1) | WO2015008093A1 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20210035811A1 (en) * | 2019-08-01 | 2021-02-04 | West Chester University | Injection metal assisted catalytic etching |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20110086165A1 (en) * | 2009-10-08 | 2011-04-14 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Metallization of a porous silicon zone by in situ reduction and application to a fuel cell |
GB2492167A (en) * | 2011-06-24 | 2012-12-26 | Nexeon Ltd | Pillared particles for metal ion battery |
US20130040412A1 (en) * | 2010-05-07 | 2013-02-14 | Unist Academy-Industry Research Corporation | Method of forming silicon nanowires and method of fabricating lithium secondary battery using the same |
-
2013
- 2013-07-19 GB GB1312984.6A patent/GB2516318B/en not_active Expired - Fee Related
-
2014
- 2014-07-21 WO PCT/GB2014/052219 patent/WO2015008093A1/en active Application Filing
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20110086165A1 (en) * | 2009-10-08 | 2011-04-14 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Metallization of a porous silicon zone by in situ reduction and application to a fuel cell |
US20130040412A1 (en) * | 2010-05-07 | 2013-02-14 | Unist Academy-Industry Research Corporation | Method of forming silicon nanowires and method of fabricating lithium secondary battery using the same |
GB2492167A (en) * | 2011-06-24 | 2012-12-26 | Nexeon Ltd | Pillared particles for metal ion battery |
Non-Patent Citations (2)
Title |
---|
Japanese Journal of Applied Physics, Vol. 51, 2012, Kato et al., "Metal-Assisted Chemical Etching Using Silica Nanoparticle for the Fabrication of a Silicon Nanowire Array", pp. 02BP09-1 to 02BP09-4. * |
SHIU et al., "Influence of pre-surface treatment on the morphology of silicon nanowires fabricated by metal-assisted etching", 1 January 2011, Applied Surface Science, Vol. 257, pp. 1829 - 1834. * |
Also Published As
Publication number | Publication date |
---|---|
WO2015008093A1 (en) | 2015-01-22 |
GB2516318A (en) | 2015-01-21 |
GB201312984D0 (en) | 2013-09-04 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 20170719 |