GB2508912A

GB2508912A - Vacuum chamber for processing semiconductor wafers

Info

Publication number: GB2508912A
Application number: GB201222645A
Authority: GB
Inventors: Lars Allers
Original assignee: Mantis Deposition Ltd
Current assignee: Mantis Deposition Ltd
Priority date: 2012-12-14
Filing date: 2012-12-14
Publication date: 2014-06-18
Also published as: GB201222645D0

Abstract

The vacuum chamber comprises a frame 1 on which interchangeable modular panels 10a can be attached. The vacuum chamber provides easy reconfiguration of processing systems to adapt the provision and/or the positions of processing components such as evaporation sources, ion sources, etc which are attached to the panels. The chamber may have a hexagonal shape to facilitate the assembly of an interconnected cluster of vacuum chambers.

Description

Vacuum Processing System

Field of the Invention

The present invention is related to vacuum processing systems, in particular but not limited to, high-vacuum processing systems.

Introduction

Vacuum processing systems are used to process a sample, such as a semiconductor wafer, in a desired manner. Examples of such processes include sputter deposition of metallic contacts, optical coatings on lenses, semiconductor device manufacture and high precision nanoparticle deposition.

A vacuum processing system will generally comprise a vacuum chamber pumped to either a high vacuum (-lOPa to -106Pa) (_101 mBarto i08 mBar) or an ultra-high vacuum (<1O6Pa) (c108 mBar), a port for access to the vacuum chamber such that the sample can be inserted and removed from the chamber, and at least one further port such that a processing component can be mounted to the chamber. The processing component is chosen for the desired process to be performed. For example, if metallic contacts are to be deposited onto a wafer, a sputtering source may be mounted to the chamber using the further port.

High or ultra-high vacuums are desired to reduce contamination of the sample during the processing. The requirement of a port for the sample has led to complex loading apparatuses to ensure that the required vacuum can be maintained within the vacuum chamber. Additionally, the ports for the processing components are typically welded to the vacuum chamber, meaning that only processing components with the correct mating flange can be mounted. If a different processing component is required in the future this can often not be accommodated with the existing port structure.

In order to overcome this problem, it is possible to weld a number of different processing components to the vacuum chamber such that a number of options are available for the processing of a sample loaded into such a system.

However, this greatly increases the size of the processing system, taking up valuable laboratory floor space. The complexity of the system is also increased.

There is therefore a requirement to provide a more flexible vacuum processing system.

Summary of the Invention

In accordance with a first aspect of the present invention there is provided a vacuum processing system comprising; a support structure comprising a plurality of panel frames surrounding a working region for maintaining a vacuum when in use, each panel frame defining a frame aperture and being adapted to receive a panel, and; a plurality of panels, each panel being removeably mountable to at least one of the panel frames so as to seal the working region from the environment external to the support structure.

Typically the vacuum maintained within the working region is a high vacuum (-lOPe to -106Pa) (_101 mBar to io mBar) although the working region may maintain an ultra-high vacuum (<106Pa) (<icY8 mBar).

The present invention provides a flexible vacuum processing system where the working region is surrounded by mounting a plurality of panels to a support structure. The panels are removeably mountable, such that panels may be mounted to and removed from the support structure quickly and easily.

Typically the vacuum processing system further comprises two opposing end faces such that the working region is contained within a chamber fully defined by the surrounding removeably mountable "side" panels and the opposing ("top" and "bottom") end faces. The opposing end faces may be an integral feature (in other words permanently attached) of the support structure, or may be separately mounted. Alternatively, the chamber may be fully enclosed by removeably mountable panels mounted to panel frames within the support structure.

Preferably at least one of the plurality of panels comprises a port for accessing the working region. The processing system may further comprise a processing component removeably mountable to the port. Examples of such processing components include: a sputter deposition source; an electron beam evaporator; a plasma source; a thermal gas cracker; an ion source; a nanoparticle source, and; a thermal boat source.

The feature of a panel comprising a port for accessing the working region such that a processing component may be removeably mountable to the port advantageously allows "retro-fitting" of new components. For example, yet to be developed processing components may be fitted to the vacuum processing system in the future without the requirement to upgrade the processing system as a whole. This ensures that the vacuum processing system of the present invention may easily be kept up to date with the latest processing components.

Alternatively or in addition, an external analysis component, such as a pressure sensor, optical sensor or x-ray spectrometer may be mounted to a panel comprising a port for accessing the working region.

At least one of the plurality of panels may comprise a sealed window. Such a window typically has a high optical transparency such that a user may, for example, view the sample within the working region through the window, or impinge laser radiation upon the sample through the window. As another example, the vacuum processing system may comprise two opposing panels having sealed windows such that a laser may be directed through the working region through the opposing windows. Here, the windows are sealed such that the working region is sealed from the environment external to the support structure. Here "optical transparency" is used to refer to any part of the electromagnetic spectrum. For example, the sealed window may be transparent to x-rays, and an x-ray detector may be placed adjacent the window to detect x-rays from the sample due to x-ray spectrometry analysis.

The advantages of the present invention over conventional vacuum processing systems can be clearly seen. Through the use of a plurality of removeably mountable panels, a tailored working region can be formed quickly and easily.

For example, in a scenario where only one of the plurality of panels comprises a port, processing components can be quickly and easily changed such that the processing system does not have to have multiple processing components welded to it which would increase its complexity and size. This could be particularly advantageous in a teaching environment. For example, in a morning lesson, a sputter deposition source may be mounted to the panel comprising a port in order to demonstrate sputtering, and in the afternoon it may be replaced with a nanoparticle source. Furthermore, in a research environment, the system may be adapted quickly to enable different experiments or processing to be performed by different researchers.

Particularly advantageously, the plurality of panels may be interchangeably mountable to the plurality of panel frames. This means that preferably the panels are arranged to be mountable to a number of different panel frames such that a panel may be mounted at a number of different positions on the support structure. More preferably, all panels and panel frames have similar mountings and dimensions such that any panel may be positioned on the support structure interchangeably with any other. The panels are preferably mounted at their periphery, such that any features within the panel such as a port or sealed window are not affected by the mounting.

This allows for further flexibility of the vacuum processing system. For example, in one set-up, the user may use one panel comprising a port (processing panel") and one panel comprising a sealed window ("monitoring panel") with the remainder of the panels being "wall" panels (i.e. not comprising a port), such that the processing system comprises one processing component. As the panels are interchangeably mountable to the plurality of panel frames, in another set-up, the user may replace one wall panel with a processing panel such that the processing system comprises two processing components. In one example, all the panels may be processing panels.

In the case where two or more processing panels are used, the respective processing components are preferably confocal, meaning that the "focus points" of the processing components (where a sample is placed with respect to the processing component in order to be processed) are identical. In other words, a sample may be placed at a single location within the working region and be processed by any of the processing components.

The support structure may comprise an integrated panel so as to partially enclose the working region. Here, "integrated" means that the integrated panel is permanently coupled to the support structure, in contrast to the removeably mountable panels. Such an integrated panel may comprise a processing component, or alternatively may simply seal a section of the support structure so as to partially enclose the working region.

The support structure can be manufactured from stainless steel or aluminium, and the panels may be manufactured from aluminium (in order to minimise weight). However, other manufacturing materials are envisaged, for example the panels may be manufactured from stainless steel. The plurality of panel frames making up the support structure are preferably a unitary member, although alternatively may be joined together by welding or the like.

Typically, an elastomer seal is used to seal the working region from the environment external to the support structure when a panel is mounted to a panel frame. Preferably, the elastomer seal is an 0-ring. An 0-ring in this context is a deformable toroidal sealing member. For example, the panel frames are typically rectangular is shape, and the 0-ring is deformable to fit the rectangular shape. The use of an elastomer seal advantageously reduces the time taken and the difficulty of mounting and removing panels from the support structure. Again, this increases the flexibility of the processing system which is not possible in conventional apparatus. Elastomer seals allow a high vacuum (lOOmPa to lOOnPa, provided by a vacuum pump) to be maintained within the processing system. Where a processing component is mounted to a port within a panel, the processing component is typically mounted using an elastomer seal, preferably an 0-ring.

The vacuum processing system may further comprise a sample holder for supporting a sample within the working region. Preferably, the sample holder seals the working region from the environment external to the support structure and supports the sample within the working region. The sample holder generally seals a sample pod located within the support structure, with the sample holder being complementary to the sample port (for example both being circular in plan form). The sample pod may be integrated into an end face or into the support structure itself Alternatively, one of the removeably mountable panels may comprise the sample port.

Preferably, the sample holder is slideably mounted to the support structure, meaning that the sample holder may be moved from an "open" position where the sample is outside the working region and accessible to a user, to a "closed" position where the sample holder seals the working region and supports the sample within the working region, in a sliding fashion. This advantageously allows for easy loading and handling of the sample. This is particularly important as it is envisaged that due to the flexibility of the present invention, the processing system will be used for a wide range of different processes on different samples.

Preferably, the sample holder is slideably mounted to the support structure on at least one guide rod, and wherein, in a first mounting mode, the sample holder is mounted on the at least one guide rod such that the sample holder seals the working region from the environment external to the support structure and the sample is supported within the working region ("closed" position), and; in a second mounting mode, the sample holder is mounted on the at least one guide rod such that the sample is supported in the environment external to the working region ("open" position). Preferably, the sample holder is rotated between the first and second mounting modes such that the orientation of the sample with respect to the working region is changed between the first and second mounting modes. Preferably, the sample holder is rotated such that, in the second mounting mode, the sample holder is positioned between the sample and support structure. This allows an increased ease of access to the sample. The rotation may be performed by the user, or by an automated process. In the case of the sample holder being slideably mounted to the support structure on at least one guide rod, this defines the positioning of the sample within the working region through the use of the rod. This is particularly advantageous where repeat experiments are to be performed on a sample, and the sample is desired to be positioned in the same location in each experiment.

The at least one guide rod may comprise a first portion having a first diameter, and a second portion having a second diameter smaller than the first diameter so as to define a mounting flange; wherein the sample holder comprises a first orifice complementary to the first portion for mounting in the first mounting mode, and a second orifice complementary to the second portion for mounting in the second mode such that the sample holder is supported on the mounting flange in the second mode. Therefore, between mounting modes, the sample holder is removed from the at least one guide rod and re-mounted using the correct orifice for the mounting mode. Preferably, the vacuum processing system comprises four parallel rods, each with first and second portions as described above, and the sample holder therefore comprises eight orifices for mounting to the rods.

The sample holder is preferably further operable to control the positioning of the sample within the working region, either manually or automatically.

Alternative ways of loading and removing a sample from the vacuum system are envisages, such as a load-lock system.

The support structure may define a wide range of working region geometries in plan form, for example a square. However, preferably, the support structure surrounds, in plan form, a substantially regular hexagonal working region. In such a case, the processing system preferably comprises six panel frames. A significant advantage of a regular hexagonal working region is bome out by the tessellation qualities of hexagons. A further benefit of the invention is that multiple instances of the vacuum processing system may be connected together using the panel frames such that larger working regions are provided.

Therefore, in a second aspect of the present invention there is provided a modular vacuum processing system comprising a plurality of vacuum processing systems as defined in the first aspect, wherein adjacent vacuum processing system panel frames are coupled together. This feature further increases the flexibility of the present invention.

Typically, a common working region may be provided between the plurality of vacuum processing systems. Advantageously, this means that a number of samples may be loaded into the common working region and processed simultaneously. Alternatively, two or more separate working regions may be provided between the plurality of vacuum processing systems. For example, in a modular system of three processing systems, two of the systems may define a first working region and be sealed from the other system which defines a second working region. Different pressure environments may be provided within the two or more separate working regions. For example, the first working region may be at a first pressure and the second working region at a second, different pressure.

This allows simultaneous processing of samples using different processes.

Brief Description of the Drawings

The present invention will now be described with reference to the attached drawings, in which: Figure 1 is a perspective view of a vacuum processing system according to an embodiment of the invention; Figure 2 is a perspective view of a support structure according to the embodiment of the invention; Figure 3A is a perspective view of a wall panel according to the embodiment of the invention; Figure 3B is a perspective view of a monitoring panel according to the embodiment of the invention; Figure 4A is a perspective view of a processing panel according to the embodiment of the invention; Figure 4B is a further perspective view of a processing panel according to the embodiment of the invention; Figure 5 is a perspective view of a sample holder according to the embodiment of the invention; Figure 6 is a flow diagram illustrating the steps performed in using a vacuum processing system according to the embodiment of the invention, and; Figure 7 is a plan view of a plurality of high-vacuum processing systems according an embodiment of the invention.

Detailed Description of the Drawings

Commercially preferred embodiments of the invention will now be described.

However, it will be understood that features of these embodiments may be changed or altered without affecting the scope of the present invention.

Figure 1 is a perspective view of a high-vacuum processing system 100 according to one embodiment of the present invention. The system comprises a support structure I (seen more clearly in, and described in reference to, Figure 2) onto which a plurality of panels ba, lOb, bc, lOd, iDe and lOf are removeably mounted so as to surround a substantially hexagonal working region 70 when viewed in plan form. The view of Figure 1 only allows panels iDa and lOf to be seen, although the skilled person will appreciate that the four panels lOb, bc, lOd and be are also present so as to define a chamber and enclose the working region 70.

Panel ba is an example of a "wall panel", that is, a panel configured as a solid planar structure which acts as a wall for the chamber formed by the sealed support structure.

Panel lOf, comprising pod 12, is an example of a "processing panel", that is, a substantially planar panel which includes a port allowing access to the chamber for the attachment of equipment for processing the sample or otherwise modifying or analysing the environment within the working region.

Although not visible in the view of Figure 1, panel lOb (illustrated in Figure SB) is an example of a "monitoring panel", that is a substantially planar panel that comprises a window 15 to allow viewing access to the chamber formed by the sealed support structure. The window is formed from a material having good optical transparency, such as glass.

A top plate 22 is mounted to the top of the support stwcture I via top 0-ring flange 20. The top 0-ring flange 20 comprises a groove (not shown) adapted to receive an 0-ring, such that when the top plate 22 is mounted, the 0-ring is compressed, thereby sealing the top plate to the support structure. The top 0-ring flange 20 ensures that a high vacuum may be maintained within the working region 70 when the processing system 100 is in use. Alternatively, the top plate 22 could be welded to the support structure.

Top plate 22 comprises a sample port (not shown) which in the view of Figure 1 is sealed by sample holder 27. The face of the sample port 27 distal to the external environment (i.e. the face inside the working region in the view of figure 1) comprises a support for supporting the sample within the working region. As seen in Figure 1, the sample holder 27 is mounted to four spaced rods, indicated at 25. Each rod comprises a first portion 25a and a second portion 25b. The first portion 25a has a larger diameter than the second portion 25b such that a mounting flange 26 is defined between the first and second portions.

Figure 5 shows a perspective view of the sample holder 27. As can be seen in Figure 5, the sample holder comprises a plurality of orifices shown generally at 27a (first mounting orifices) and 27b (second mounting orifices). The diameters of first mounting orifices 27a correspond to the diameter of the first portion 25a of the mounting rods, and the diameters of second mounting orifices 27b correspond to the diameter of the second portion 25b of the rods. In the view of Figure 1, the sample holder is mounted in a first mounting position (or "closed" position) where the sample holder is mounted using the first mounting orifices 27a such that it can slide along the length of the mounting rods and seal the sample port, typically through the use of an 0-ring.

When the sample is to be modified or changed, the sample holder is removed from the closed position by sliding along the mounting rods 25 until it is spaced from the rods. The sample holder may then be re-mounted to the rods 25 (in a second mounting position) by using second mounting orifices 27b. As these orifices have a smaller diameter than the first portion 25a of the mounting rods, the sample holder therefore rests upon and is supported by mounting flanges 26.

The second mounting orifices 27b extend through the thickness of the sample holder such that the sample holder may be mounted in the second mounting position either in the orientation illustrated in Figures 1 and 5 (where the sample is located between the sample holder and the support structure), or preferably, in the reverse orientation such that the sample holder is located between the sample and the support structure. This second orientation is desirable as it allows increased access to the sample.

Once the sample has been modified or changed, the sample holder is then re-mounted in the closed position using first mounting orifices 27a. Typically, the above manipulation of the sample holder is performed by the user, using handles 29 attached to the sample holder by extensions 29a. However, the above described process may alternatively be carried out automatically.

The system 100 further comprises a bottom plate 32 coupled to the base of the support structure, through a bottom 0-ring flange 30 in the same manner as described above in relation to the top plate 22. Alternatively, the bottom plate could be welded to the support structure. The working region is therefore fully defined through the support structure 1, the plurality of panels ba, lOb, bc, lad, be and bOf, and the opposing top 22 and bottom 32 plates. The bottom plate 22 comprises ports for a vacuum pump 50 and a vacuum gauge 60. The vacuum pump 50 is used to generate a high vacuum within the working region 70, typically between bRa and bO6Ra (b01 mBarto bO8mBar).

In the present embodiment, the support structure I is mounted to base 40 via legs 35a, 35b, 35c. This arrangement advantageously provides room for the vacuum pump 50 and the vacuum gauge 60 to be mounted to the bottom plate 32. In other embodiments, the vacuum pump and vacuum gauge may instead be mounted to the top plate 22 or a side panel 1 0a, 1 0b, 1 Oc, 1 3d, 1 0e, i of.

As well as providing a platform for the support structure, base 40 also houses water lines 42 for providing water for cooling purposes.

Figure 2 depicts a perspective view of the support structure 1, which is typically manufactured out of a single block of aluminium. In the present embodiment, the support structure I comprises six panel frames Ia, Ib, Ic, Id, le and If arranged in a regular hexagon (when viewed in plan form) so as to surround the working region 70. The panel frames are welded together along joints 8, although in alternative embodiments, the support structure may be a unitary member.

Each panel frame defines a frame apertureS which is sealable by a panel frame.

In the present embodiment, the frame apertures 3 are substantially rectangular in shape, although other geometries are envisaged, such as a square or circle.

Each panel frame 3 comprises a groove 5 surrounding the frame aperture into which an elastomer 0-ring is inserted when a panel is mounted to the panel frame, such that the frame aperture is sealed. Due to the deformable nature of the elastomer, the 0-ring can be deformed to fit a wide range of panel aperture shapes -in this case the groove 5 surrounds a rectangular panel frame. Each panel frame also comprises screw holes 7a, 7b at opposing corners of the panel frame for mounting a panel. The mounting of a panel will now be described.

As more clearly seen in Figure 3A, a typical wall panel ba comprises a projection 11 located on its bottom side. When mounting panel iDa to panel frame la (as illustrated in Figure 2), the panel ba is first presented to the panel frame Ia at an angle such that projection 11 is inserted into corresponding panel groove (not shown) in bottom 0-ring flange 30. The panel groove is located on the bottom 0-ring flange 30 in the opposing face to that of the groove adapted to receive an 0-ring. The top of the panel bOa is then presented to the top of the panel frame la such that the screw holes 17 in the panel ba align with the screw holes 7a in the panel frame. The panel ba is then screwed to the panel frame and the aperture 3 is sealed through the use of an 0-ring provided in groove 5, as described above. Screw holes Tb, although not necessary, may be used if required to provide further support. Any processing panels or monitoring panels are mounted in the same manner. Figures SB and 4A shows the projection Ii and screw holes 17 present on a monitoring panel lOb and a processing panel 1 Of respectively.

Advantageously, each panel and each panel frame comprises the same mounting features and dimensions such that any panel ba, lob, bc, lOd, be, lOf may be mounted onto any panel frame la, ib, lc, id, le, if This allows for a high level of flexibility of the processing system 100. For example, in the view of Figure 1, wall panel iDa is mounted to panel frame la and processing panel lOf is mounted to panel frame if. However, processing panel lOf may be mounted to panel frame ba, and wall panel ba may be mounted to panel frame if. Also, as described above, the mounting (and subsequent removal) of a panel is very straightforward, allowing for fast and efficient set-up of a desired working region configuration.

Wall panel I Oa has a substantially planar face with no aperture such that it seals a panel frame. Conversely, processing panel bOf comprises a port 12 as clearly seen in Figures 1 and 4A. Processing panel lOf also comprises connecting rods i4a, 14b, b4c, b4d and connecting sockets 16a, b6b, b6c on its face and surrounding port 12. In the present embodiment the panel bOf and connecting rods and connecting sockets are machined as a unitary member, although in alternative embodiments they may be machined and joined separately.

As illustrated in Figure 4B, the connecting rods and sockets allows an external processing component to be connected to the port 12. Figure 4B shows a sputter deposition source as an example of such an external processing component shown generally at 80 mounted to port 12 in processing panel lOt In the view of Figure 4B, the left hand side of the panel is exposed to the working region 70 (distal to the external environment).

The sputter deposition source 80 comprises a flange 81 having a profile complementary to that of port 12. Flange 81 also comprises holes (not shown) corresponding to connecting rods 14a, 14b, 14c and 14d; and locking screws 86a, 86b and 86c complementary to connecting sockets 16a, 16b, 16c such that the flange 81 is easily mounted to the port 12. A vacuum seal is provided by an 0-ring located in groove 12a in port 12 (seen in Figure 4A).

The internal face of the flange 81 (i.e. the face exposed to the working region 70) comprises the sputtering target 90. In the present embodiment, this is a magnetron target and is surrounded by gas hood 86. The sputtering gas (such as Argon) is supplied through gas line 89.

As an example, if the working region 70 is defined by wall panels iDa, bc, lOd and be, monitoring panel lOb and processing panel lOf which comprises port 12 to which a sputter deposition source 80 is mounted, a sample supported within the working region by sample holder 27 may be processed in the desired manner. For example, the sputter deposition source may be used to deposit electrodes on a semiconductor wafer sample. The window 15 in the monitoring panel lOb may be used to monitor the process.

Although the above description is in relation to a sputter deposition source, a wide variety of external processing components may be mounted to a panel comprising a port, for example: Electron beam evaporators Plasma sources Thermal gas crackers Ion sources Nanoparticle sources In addition, external analysis components may be mounted to a processing panel for analysing the conditions within the working region 70. Examples of such external analysis components include optical sensors and x-ray spectrometers. Alternatively, due to the high optical transparency of the window 15, such analysis components may be mounted external to the window 15 in a monitoring panel. As an example, if x-ray spectrometry is to be performed on the sample, an x-ray source may be mounted to port 12 present in a processing panel, and an x-ray detector adapted to receive x-rays from the sample mounted external to and adjacent an x-ray transparent window 15 in a monitoring panel.

Further, in the present embodiment, the ports 12 and connecting features 14a..., 16a... are standard across all processing panels and external processing components. This ensures that any external processing component may be mounted to any processing panel comprising a port 12. This allows for quick and efficient changes between processing applied to the sample, and for retro-fitting of new components to existing vacuum processing systems.

For example, a university laboratory may have a support structure, five wall panels, one monitoring panel, two processing panels and three external processing components -a sputter deposition source, a plasma source and a nanoparticle source. The high-vacuum processing system will typically be constructed using four wall panels, one monitoring panel and one processing panel, with the external processing component exchanged as desired between experiments. Alternatively, the high-vacuum processing system may be constructed using four wall panels and two processing panels, with two external processing components being mounted simultaneously. Of course, as each panel is interchangeable, the external processing components can be positioned as required, for example on adjacent wall panels or on opposing wall panels.

Of course, the vacuum processing system could be constructed with each panel being a processing panel having a mounted external processing component. In the present embodiment, each external processing component is manufactured such that when two components are mounted simultaneously, they are confocal, advantageously meaning that the sample does not have to be moved between different processing operations.

Figure 6 is a flow diagram illustrating the steps performed in using the vacuum processing system. At step 601 the vacuum processing system is constructed so as to define the working region. As described above, this is performed by mounting a plurality of panels to the support structure 1 in order to form a chamber. In a typical example, a hexagonal chamber is constwcted using four wall panels, a monitoring panel and a processing panel. The correct external processing component is mounted to the processing panel for the desired processing.

At step 602 the sample is inserted into the working region. This is typically done using the sample holder slideably mounted to guide rods as described above, although alternative ways may be used, such as a load lock system.

At step 603, a vacuum pump is used to introduce a vacuum into the working region. In the present embodiment, this is typically between bRa and 106Pa (10-1 rnBar and bO8mBar)(a "high vacuum").

At step 604, the desired processing is performed on the sample. For example, metallic contacts may be deposited onto a semiconductor using a sputtering source mounted to the processing panel.

Once the processing is complete, the working region is brought back to atmospheric pressure at step 605. Any modifications to the vacuum processing system may then be made. For example, the sample may be removed and inspected before being re-inserted and the process repeated as necessary.

Alternatively, a new sample may be inserted into the working region using the sample holder 27, and a different external processing component mounted to the processing panel in order to carry out a different process.

In the above description, the support structure is in the general form of a hexagon when viewed in plan form. In other embodiments, the support structure may take the form of a square or an octagon for example. However, the hexagon shape allows a plurality of vacuum processing systems to be joined together to form a larger working region. This is an example of a "modular" or "compound" system. Figure 7 shows an example of this.

Figure 7 is a plan view of four vacuum processing systems 100, 200, 300, 400 coupled together to form a modular vacuum processing system defining a common working region 700. Each vacuum processing system is as described above, although the legs 35a, 35b. 35c and base 40 are modified in order to allow adjacent systems to abut each other. Here, the internal panel frames indicated at lOla, bib, lOic, bid, lOle are coupled together using screw holes 7a, 7b so as to define an opening between adjacent systems through adjoining panel frames. The external panel frames exposed to the outside environment are each sealed with a wall panel except for processing panel lOf.

A sputter deposition source 80 is coupled to processing panel lOf.

As each vacuum processing system comprises a sample holder, this allows four samples to share a common working environment and be processed by the sputter deposition source 80 simultaneously. It is also possible to move the samples between different vacuum processing systems so that samples experience different processing locations within the common working region 700.

Additionally, it is envisaged that different pressure regions may be provided within the modular vacuum processing region. For example, the internal panel frames indicated at lOla, lOib and lOic may be sealed such that a first working environment is seen in vacuum processing system 100, and a second working environment is defined by vacuum processing systems 200, 300 and 400. The first and second working environments may be at different pressures. In such an instance, one of the external panel frames in system 200, 300, 400 will typically be a processing panel with a processing component mounted to it such that samples loaded into systems 200, 300, 400 may be processed simultaneously, and separately, to a sample loaded into system 100.

In one embodiment, an automated load-lock system is provided between adjacent vacuum processing systems so that samples may be moved between individual systems without having to bring the working environment back to atmospheric pressure. This is particularly beneficial if adjacent processing systems are at different pressures, as described above.

Although Figure 7 shows a modular vacuum processing system comprising four individual processing systems, it will be appreciated that two or three, or five or more, individual processing systems may be coupled together in such a manner.

The hexagonal shape of the support structure in the above described embodiments is particularly advantageous due to its tessellation properties and relatively large number of sides. For example, individual vacuum processing systems defining a square in plan form may be coupled together in a similar manner. However, the four sides do not provide as much processing flexibility as the current hexagonal shape. Further, there is an increased pressure differential within a square working region due to the reduced number of sides, which undesirably requires an increased amount of material to be used in the system.

Although the above description relates to the working region being defined as a hexagon in plan form, other shapes that do not tessellate, such as pentagons, are also envisaged.

Claims

Claims 1. A vacuum processing system comprising; a support structure comprising a plurality of panel frames surrounding a working region for maintaining a vacuum when in use, each panel frame defining a frame aperture and being adapted to receive a panel, and; a plurality of panels, each panel being removeably mountable to at least one of the panel frames so as to seal the working region from the environment external to the support structure.
2. A vacuum processing system according to claim 1, wherein the working region maintains a high vacuum when in use.
3. A vacuum processing system according to claim 1 or claim 2, wherein the plurality of panels are interchangeably mountable to the plurality of panel frames.
4. A vacuum processing system according to any of the preceding claims, wherein at least one of the plurality of panels comprises a port for access to the
5. A vacuum processing system according to claim 4, further comprising a processing component removeably mountable to the port.
6. A vacuum processing system according to claim 5, wherein the processing component is one from the list including: a sputter deposition source, an electron beam evaporator, a plasma source, a thermal gas cracker, an ion source, a nanoparticle source, and a thermal boat source.
7. A vacuum processing system according to any of the preceding claims, wherein at least one of the plurality of panels comprises a sealed window.
8. A vacuum processing system according to any of the preceding claims, further comprising an elastomer seal to seal the working region from the environment external to the support structure when a panel is mounted to a panel frame.
9. A high vacuum processing system according to claim 8, wherein the elastomer seal is an 0-ring.
10. A vacuum processing system according to any of the preceding claims, further comprising a vacuum pump for providing the vacuum to the working region when in use.
11. A vacuum processing system according to any of the preceding claims, further comprising a sample holder for supporting a sample within the working region.
12. A vacuum processing system according to claim 11, wherein, in use, the sample holder seals the working region from the environment external to the support structure and supports the sample within the working region.
13. A vacuum processing system according to claim 11 or claim 12, wherein the sample holder is slideably mounted to the support structure.
14. A vacuum processing system according to claim 13, wherein the sample holder is slideably mounted to the support structure on at least one guide rod, and wherein, in a first mounting mode, the sample holder is mounted on the at least one guide rod such that the sample holder seals the working region from the environment external to the support structure and the sample is supported within the working region, and; in a second mounting mode, the sample holder is mounted on the at least one guide rod such that the sample is supported in the environment external to the working region.
15. A vacuum processing system according to claim 14, wherein the sample holder is rotated between the first and second mounting modes.
16. A vacuum processing system according to claim 14 or claim 15, wherein the at least one guide rod comprises a first portion having a first diameter, and a second portion having a second diameter smaller than the first diameter so as to define a mounting flange; and further wherein the sample holder comprises a first orifice complementary to the first portion for mounting in the first mounting mode, and a second orifice complementary to the second portion for mounting in the second mode such that the sample holder is supported on the mounting flange in the second mode.
17. A vacuum processing system according to any of the preceding claims, wherein the support structure is manufactured from aluminium.
18. A vacuum processing system according to any of the preceding claims, wherein the panels are manufactured from aluminium.
19. A vacuum processing system according to any of the preceding claims, wherein the support structure surrounds a substantially regular hexagonal working region in plan form.
20. A vacuum processing system according to claim 19, wherein the support structure comprises six panel frames.
21. A vacuum processing system according to any of the preceding claims, wherein the support structure is a unitary member.
22. A modular vacuum processing system comprising a plurality of vacuum processing systems as defined in any of the preceding claims, wherein adjacent vacuum processing system panel frames are coupled together.
23. A modular vacuum processing system according to claim 22, wherein a common working region is provided between the plurality of vacuum processing systems.
24. A modular vacuum processing system according to claim 22, wherein two or more separate working regions are provided between the plurality of vacuum processing systems.
25. A modular vacuum processing system according to claim 24, wherein different pressure environments are provided within the two or more separate