GB2493045A - A receiver amplifier configurable for common-gate or inductively-degenerated operation - Google Patents

A receiver amplifier configurable for common-gate or inductively-degenerated operation Download PDF

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Publication number
GB2493045A
GB2493045A GB1207237.7A GB201207237A GB2493045A GB 2493045 A GB2493045 A GB 2493045A GB 201207237 A GB201207237 A GB 201207237A GB 2493045 A GB2493045 A GB 2493045A
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United Kingdom
Prior art keywords
low noise
noise amplifier
configurable
text
topology
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GB1207237.7A
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GB201207237D0 (en
Inventor
Jari Johannes Heikkinen
Jonne Juhani Riekki
Jouni Kristian Kaukovuori
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Renesas Electronics Corp
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Renesas Mobile Corp
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Priority claimed from US13/111,423 external-priority patent/US8378748B2/en
Priority claimed from GB1108444.9A external-priority patent/GB2481487B/en
Application filed by Renesas Mobile Corp filed Critical Renesas Mobile Corp
Publication of GB201207237D0 publication Critical patent/GB201207237D0/en
Publication of GB2493045A publication Critical patent/GB2493045A/en
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    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03FAMPLIFIERS
    • H03F1/00Details of amplifiers with only discharge tubes, only semiconductor devices or only unspecified devices as amplifying elements
    • H03F1/02Modifications of amplifiers to raise the efficiency, e.g. gliding Class A stages, use of an auxiliary oscillation
    • H03F1/0205Modifications of amplifiers to raise the efficiency, e.g. gliding Class A stages, use of an auxiliary oscillation in transistor amplifiers
    • H03F1/0277Selecting one or more amplifiers from a plurality of amplifiers
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03FAMPLIFIERS
    • H03F1/00Details of amplifiers with only discharge tubes, only semiconductor devices or only unspecified devices as amplifying elements
    • H03F1/08Modifications of amplifiers to reduce detrimental influences of internal impedances of amplifying elements
    • H03F1/22Modifications of amplifiers to reduce detrimental influences of internal impedances of amplifying elements by use of cascode coupling, i.e. earthed cathode or emitter stage followed by earthed grid or base stage respectively
    • H03F1/223Modifications of amplifiers to reduce detrimental influences of internal impedances of amplifying elements by use of cascode coupling, i.e. earthed cathode or emitter stage followed by earthed grid or base stage respectively with MOSFET's
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03FAMPLIFIERS
    • H03F1/00Details of amplifiers with only discharge tubes, only semiconductor devices or only unspecified devices as amplifying elements
    • H03F1/26Modifications of amplifiers to reduce influence of noise generated by amplifying elements
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03FAMPLIFIERS
    • H03F1/00Details of amplifiers with only discharge tubes, only semiconductor devices or only unspecified devices as amplifying elements
    • H03F1/30Modifications of amplifiers to reduce influence of variations of temperature or supply voltage or other physical parameters
    • H03F1/301Modifications of amplifiers to reduce influence of variations of temperature or supply voltage or other physical parameters in MOSFET amplifiers
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03FAMPLIFIERS
    • H03F1/00Details of amplifiers with only discharge tubes, only semiconductor devices or only unspecified devices as amplifying elements
    • H03F1/56Modifications of input or output impedances, not otherwise provided for
    • H03F1/565Modifications of input or output impedances, not otherwise provided for using inductive elements
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03FAMPLIFIERS
    • H03F3/00Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
    • H03F3/189High-frequency amplifiers, e.g. radio frequency amplifiers
    • H03F3/19High-frequency amplifiers, e.g. radio frequency amplifiers with semiconductor devices only
    • H03F3/195High-frequency amplifiers, e.g. radio frequency amplifiers with semiconductor devices only in integrated circuits
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03FAMPLIFIERS
    • H03F3/00Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
    • H03F3/45Differential amplifiers
    • H03F3/45071Differential amplifiers with semiconductor devices only
    • H03F3/45076Differential amplifiers with semiconductor devices only characterised by the way of implementation of the active amplifying circuit in the differential amplifier
    • H03F3/45179Differential amplifiers with semiconductor devices only characterised by the way of implementation of the active amplifying circuit in the differential amplifier using MOSFET transistors as the active amplifying circuit
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03FAMPLIFIERS
    • H03F3/00Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
    • H03F3/45Differential amplifiers
    • H03F3/45071Differential amplifiers with semiconductor devices only
    • H03F3/45076Differential amplifiers with semiconductor devices only characterised by the way of implementation of the active amplifying circuit in the differential amplifier
    • H03F3/45179Differential amplifiers with semiconductor devices only characterised by the way of implementation of the active amplifying circuit in the differential amplifier using MOSFET transistors as the active amplifying circuit
    • H03F3/45183Long tailed pairs
    • H03F3/45188Non-folded cascode stages
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03FAMPLIFIERS
    • H03F3/00Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
    • H03F3/45Differential amplifiers
    • H03F3/45071Differential amplifiers with semiconductor devices only
    • H03F3/45479Differential amplifiers with semiconductor devices only characterised by the way of common mode signal rejection
    • H03F3/45632Differential amplifiers with semiconductor devices only characterised by the way of common mode signal rejection in differential amplifiers with FET transistors as the active amplifying circuit
    • H03F3/45636Differential amplifiers with semiconductor devices only characterised by the way of common mode signal rejection in differential amplifiers with FET transistors as the active amplifying circuit by using feedback means
    • H03F3/45641Measuring at the loading circuit of the differential amplifier
    • H03F3/45645Controlling the input circuit of the differential amplifier
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03FAMPLIFIERS
    • H03F3/00Amplifiers with only discharge tubes or only semiconductor devices as amplifying elements
    • H03F3/72Gated amplifiers, i.e. amplifiers which are rendered operative or inoperative by means of a control signal
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03FAMPLIFIERS
    • H03F2200/00Indexing scheme relating to amplifiers
    • H03F2200/135Indexing scheme relating to amplifiers there being a feedback over one or more internal stages in the global amplifier
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03FAMPLIFIERS
    • H03F2200/00Indexing scheme relating to amplifiers
    • H03F2200/144Indexing scheme relating to amplifiers the feedback circuit of the amplifier stage comprising a passive resistor and passive capacitor
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03FAMPLIFIERS
    • H03F2200/00Indexing scheme relating to amplifiers
    • H03F2200/156One or more switches are realised in the feedback circuit of the amplifier stage
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03FAMPLIFIERS
    • H03F2200/00Indexing scheme relating to amplifiers
    • H03F2200/159Indexing scheme relating to amplifiers the feedback circuit being closed during a switching time
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03FAMPLIFIERS
    • H03F2200/00Indexing scheme relating to amplifiers
    • H03F2200/165A filter circuit coupled to the input of an amplifier
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03FAMPLIFIERS
    • H03F2200/00Indexing scheme relating to amplifiers
    • H03F2200/294Indexing scheme relating to amplifiers the amplifier being a low noise amplifier [LNA]
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03FAMPLIFIERS
    • H03F2200/00Indexing scheme relating to amplifiers
    • H03F2200/39Different band amplifiers are coupled in parallel to broadband the whole amplifying circuit
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03FAMPLIFIERS
    • H03F2203/00Indexing scheme relating to amplifiers with only discharge tubes or only semiconductor devices as amplifying elements covered by H03F3/00
    • H03F2203/45Indexing scheme relating to differential amplifiers
    • H03F2203/45306Indexing scheme relating to differential amplifiers the common gate stage implemented as dif amp eventually for cascode dif amp
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03FAMPLIFIERS
    • H03F2203/00Indexing scheme relating to amplifiers with only discharge tubes or only semiconductor devices as amplifying elements covered by H03F3/00
    • H03F2203/45Indexing scheme relating to differential amplifiers
    • H03F2203/45318Indexing scheme relating to differential amplifiers the AAC comprising a cross coupling circuit, e.g. two extra transistors cross coupled
    • HELECTRICITY
    • H03ELECTRONIC CIRCUITRY
    • H03FAMPLIFIERS
    • H03F2203/00Indexing scheme relating to amplifiers with only discharge tubes or only semiconductor devices as amplifying elements covered by H03F3/00
    • H03F2203/45Indexing scheme relating to differential amplifiers
    • H03F2203/45386Indexing scheme relating to differential amplifiers the AAC comprising one or more coils in the source circuit

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Abstract

A low-noise amplifier (LNA) may be configured as an inductively-degenerated LNA or as a common-gate LNA. Inductively-degenerated operation is selected by disabling the series switches SW1, enabling the common-source transistors M2p,m, and disabling the common-gate transistors M1p,M1m. Conversely, the LNA is configured in common-gate mode by enabling SW1, M1p, M1m, and disabling M2p,M2m. The inductively-degenerated LNA has a lower noise figure but requires external inductors Lextp, Lextm. The common-gate LNA has a higher noise figure, but has better linearity and bandwidth and it requires no external matching components. A shunt capacitor may be placed in parallel with the inductors (figure 9) to allow use of smaller inductors. Cross-coupling of input signals (figure 6) allows lower operating current. Feedback may be used (figure 5) to reduce the noise figure.

Description

Amplifier
Field of the Invention
This invention relates to low noise amplifiers. In particular, but not exclusively, this invention relates to configurable low noise amplifier circuits.
Backzround of the Invention Radio frequency receivers can be configured to operate within a number of different radio frequency bands. For example a receiver for a mobile station (or cellular telephony device) can be configured to opcratc within any of the following bands: Global System for Mobile Communications (OSM), 850, 900, 1800, and/or 1900, Wideband Code Division Multiple Access (WCDMA), High Speed Packet Access (HSPA) and/or Long Tcrm Evolution (LTE) Bands 1, 2, 3, etc. This allows a mobile station containing such a receiver to be used in different areas where varying subsets of the above radio frequency bands are supported (e.g. to enable roaming).
Receivers typically incorporate one or more Radio-Frequency Integrated Circuits (REICs) including a Low Noise Amplifier (LNA) as the first amplifying stage in the receiver. For example, one or more LNAs are typically used to amplify the radio frequency signals gathered by an antenna, and the amplified signals generated by the LNA(s) are then used by other components in the receiver.
Receivers typically include one or more radio frequency (RE) filters located between the antenna and the LNA(s) that form the first amplifring stage of the receiver. Figure 1 illustrates an exemplary receiver comprising an RE module 100 and antenna 130. RE module 100 comprises an RE Front End Module 132 which in turn includes one or more (up to a total of n) RE filters -112 that filter radio frequency signals gathered by antenna 130. RE module 100 also comprises an RFIC 134 which in turn comprises one or more (up to a total of m) LNAs 120 -122 that amplify thc filtered signals generated bythe RF filters 110-112.
As is known from Friis' formula for noise factor, the LNA that forms the first amplifying stage of a receiver dominates the noise figure of the receiver.
The [NA that forms the first stage also has a key role in determining the input impedance of the receiver. The input impedance of this LNA must be carefully matched to a certain impedance, as otherwise the performance of an RF fiher (e.g. 110-112) preceding the LNA will be degraded. Additionally, an RE filter preceding the LNA will typically have a fixed frequency range which requires thc inputs of the LNA to also be matched to that frequency range.
Typically, differential inputs are used in order to get better rejection against interfering signals. Single-ended blocker signals from the antenna port are attenuated by the RE-filters. In addition, in Frequency Division Duplex (FDD) systems, transmitter (TX) leakage from the TX port is attenuated by the duplex filter. Single-ended interfering signals at the antenna and transmitter ports tend to have high common-mode characteristics at the differential LNA input. However, only differential attenuation of the duplex and RE-filter is typically guaranteed according to the specification. These high-level common-mode blocker signals can desensitize the receiver front-end and create undesirable intermodulation products. Since the unmatched [NA input typically experiences up to 6 dB higher blocker signals compared to a matched case if the input impedance is relatively higher at the blocker frequency than at the wanted signal frequency, it is desirable to create a differential LNA topology with good common-mode matching. In addition, if the input matching is wide enough in order to give good matching for far away blocker signals such as TX, Wireless Local Area Network (WLAN) and BluetootlYTM, the blocker signals are rejected already at the input. Tn addition, as mentioned above, the duplex filter performance is degraded in those frequencies if the input is not matched.
As a result, depending on the [NA structure, it may be necessary to utilize matching components external to the RFIC containing the LNA to appropriately set the input impedance and frequency range matching. However, these external matching components can be expensive, and in some cases it is preferable to use an LNA with internal matching capabilities to appropriately set its input impedance and frequency range matching.
Another measure of receiver performance is its sensitivity (reference sensitivity level), which measures the minimum detectable signal level at the receiver input. The signal quality of the received signal is typically determined by bit error rate or throughput. The sensitivity level S is determined by the equation: S = -174 dBm/Hz + lOlog(BW) + SNRmin + NF (1) where -174 dBmiHz is the available noise power density from an input source at a temperature of 290 K, BW is the channel bandwidth, SNR111 is the required signal-to-noise ratio, and NE is the receiver noise figure. The SNRmin depends on the targeted bit error rate and the modulation method used, for example.
The RE filter preceding the LNA that forms the first amplifying stage in a receiver may have significant insertion loss in some of the radio frequency bands within which the receiver is configured to operate. The insertion loss can cause the receiver to be less sensitive and have a higher noise figure for these radio frequency bands. Since the receiver sensitivity in these radio frequency bands is worse, the range between the transmitter and the receiver over which the receiver may be required to operate is reduced, thus making the cellular network design more challenging and more expensive. In addition, the size of the antenna connected to the receiver may be limited due to space constraints in devices such as mobile stations, thus restricting the performance of the antenna; this is exacerbated at lower frequencies, for example below I GHz, where the size of an antenna tends to become larger due to the longer wavelength. The receiver capability can therefore be degraded leading to decreased link performance.
To mitigate the above effects, the LNA noise figure should be as good as possible. However, achieving good noise performance without using external matching components prior to the LNA and with adequate current consumption is a challenging task. Additionally, as wefl as the expensive and size consuming external components, the cost of the RFIC containing the LNA must also be considered. To keep the semiconductor die area of the RFIC small, the number of on-chip inductors should be kept at a minimum, because high quality inductors require significant die area and their size does not downscale along with reductions in the features widths of integrated circuits.
From the above it can be seen that there are a number of different design factors to bc considered when designing an LNA, and that accommodating some or all of these factors simultaneously can provc difficult. There is therefore a need to enhance LNA design by providing improved ways of accommodating various design factors. (\J
Summary of the Invention
0') 15 In accordance with a first aspect, there is provided a configurable low noise amplifier circuit, the low noise amplifier circuit being configurable 0° between one of: a first topology in which the low noise amplifier circuit comprises a degeneration inductance stage whereby the low noise amplifier circuit operates as an inductively degenerated low noise amplifier; and a second topology in which the low noise amplifier circuit comprises a common-gate low noise amplifier stage whereby the low noise amplifier circuit operates as a common-gate low noise amplifier, wherein the common-gate low noise amplifier stage comprises a given input transistor which acts as an internal input impedance matching component for the second topology, and wherein the first topology does not comprise the given input transistor and requires one or more components external to the low noise amplifier circuit for input impedance matching.
Hence, the present invention allows provision of either inductively degenerated low noise amplifier thnctionality or common-gate bw noise amplifier thnctionality via a single low noise amplifier circuit. Only a single instance of some components common to both of the top&ogies is required and such component re-use helps to reduce the cost and die area. For example, an inductor tends to be a large component and the embodiments advantageously re-use an inductor in both the first and second topologies. The first topology requires one or more external components for input impedance matching, whereas the sccond topology includes one or more internal input impedance matching components within the topology.
In some embodiments, the circuit comprises a switching arrangement, the circuit being configurable between one of the first topology and the second C\J topology via the switching arrangement. Hence, the circuit can be configured in r the first or second topology according to the desired performance of the circuit.
0') 15 In some embodiments, the switching arrangement comprises a topology switching means connected between an output of the degeneration inductance CO stage and an input of the configurable low noise amplifier circuit. The circuit is configurable in the first topology by configuring the topology switching means in an open state, and the circuit is configurable in the second topology by configuring the topology switching means in a closed state. Hence, efficient configuration of the LNA circuit between the first and second topologies is provided.
In some embodiments, the topology switching means comprises a sw-itching transistor, the switching transistor is configurable in the open state via input of an open state configuration control signal to its input terminal, and the switching transistor is configurable in the closed state via input of a closed state configuration control signal to its input terminal. Hence, the topology of the LNA circuit can be conveniently configured by applying appropriate control signals, for example digital control signals, to a number of switching transistors within the LNA circuit.
In some embodiments, the degeneration inductance stage comprises a first input transistor coupled to the input of the configurable low noise amplifier (4 r a) Co circuit and a degeneration inductor connected between a first output of the first input transistor and ground. Hence, the invention provides an LNA topology with associated good noise figure and sensitivity performance. Input impedance matching is provided via the degeneration inductance and one or more cxtcrna matching components.
In some embodiments, the degeneration inductance stage comprises a first bias resistor coupled to the input of the first input transistor and a first bias voltage. Hence, the degeneration inductance stage can be set in an appropriate operating mode.
In some embodiments, the degeneration inductance stage comprises a first decoupling capacitor connected between the input of the configurable low noise amplifier circuit and the input of the first input transistor. Hence, DC decoupling and AC coupling to the first input transistor is provided.
In some embodiments, the common-gate low noise amplifier stage comprises a second input transistor and an inductor, and the inductor is coupled to a first output of the second input transistor and ground. In this topology, improved linearity performance at the expense of noise figure is achieved. The transconductance of the second input transistor determines the input impedance and the inductor provides a high impedance towards ground. There is therefore no requirement for impedance matching using external matching components.
In some embodiments, the common-gate low noise amplifier stage comprises one or more feedback loops from the input of the second input transistor to an output of the second input transistor. In some embodiments, one of the one or more feedback loops comprises the inductor of the common-gate amplifier stage. In some embodiments, at least one of the one or more feedback loops comprises a feedback capacitor. Hence, a separation between noise factor and input matching can be achieved allowing a larger transconductance with decreased noise figure.
In some embodiments, the common-gate low noise amplifier stage comprises a second bias resistor coupled to the input of the second input transistor and a second bias voltage. Hence, the common-gate low noise amplifier stage can be set in an appropriate operating mode.
In some embodiments, the common-gate low noise amplifier stage comprises a second decoupling capacitor connected between the input of the configurable low noise amplifier circuit and the input of the second input transistor. Hence, DC decoupling and AC coupling to the second input transistor is provided.
In some embodiments, the inductor of the common-gate amplifier stage comprises the degeneration inductor of the degeneration inductance stage, whereby the inductor remains in the circuit in both the first topology and the second topology. Hence, a single inductor can be employed in both topologies thus helping to reduce cost and die area.
In some embodiments, the switching arrangement comprises a first bias voltage switching means adapted to set the first bias voltage to either a relatively high or a relatively low bias voltage, and the configurable low noise amplifier circuit is configurabLe in the first topology by setting the first bias voltage to a relatively high bias voltage and configurable in the second topology by setting the first bias voltage to a relatively low bias voltage. Hence, the first input transistor can be opened in the first topology and closed in the second topology.
In some embodiments, the switching arrangement comprises a second bias voltage switching means adapted to set the second bias voltage to either a relatively high or a relatively low bias voltage, and the configurable low noise amplifier circuit is configurable in the first topology by setting the second bias voltage to a relatively low bias voltage and configurable in the second topology by setting the first bias voltage to a relatively high bias voltage. Hence, the second input transistor can be opened in the second topology and closed in the first topology.
in some embodiments, the circuit comprises a common output terminal at which the output of the configurable low noise amplifier circuit is provided when configured in either the first topology or the second topology. Re-use of a single output terminal for both topologies provides a lower cost solution for the configurable LNA and connections to components interfacing with the configurable LNA are simplified.
In some embodiments, the configurable low noise amplifier circuit comprises one or more current easeodes located before the output of the low noise amplifier circuit. The current cascodes allow a current signal to be buffered before being output by the configurable low noise amplifier. One or more current easeodes enable gain control to be added to the configurable low noise amplifier, while the parasitic capacitance seen at the LNA output is reduced.
In some embodiments, the circuit comprises a configurable load connected to the output of the circuit. The configurable load may for example comprise an LC (inductor/capacitor) resonator load.
In some embodiments, the configurable low noise amplifier circuit comprises a differential amplifier, the stages forming one side of the differential amplifier. Certain embodiments are particularly suited to implementations that use differential sigiials, such as low noise amplifiers in radio-frequency communications systems.
In some embodiments, the input of one side of the common-gate low noise amplifier differential pair is cross-coupled to an output of the other side of the common-gate low noise amplifier differential pair via a cross-coupling capacitor. Hence, input impedance matching is provided in the second topology with decreased current consumption.
In some embodiments, the degeneration inductor comprises a centre-tap differential degeneration inductor connected between respective outputs of each differential circuit and ground.
In accordance with a second aspect, there is provided a radio-frequency semiconductor integrated circuit comprising one or more configurable low noise amplifier circuits according to the first aspect.
In accordance with a third aspect, there is provided a radio-frequency module comprising one or more radio-frequency filter circuits coupled to one or more configurable low noise amplifier circuits according to the first aspect.
In accordance with a fourth aspect, there is provided a device comprising a configurable low noise amplifier circuit according to the first aspect. The device may for example comprise a mobile telephone.
In accordance with a fifth aspect, there is provided a method of manufacturing a low noise amplifier circuit according to the first aspect.
In accordance with a sixth aspect, there is provided a method of configuring a low noise amplifier circuit comprising applying one of a first set of one or more control signals to the circuit to configure the circuit in a first topology in which the low noise amplifier circuit comprises a degeneration C\J inductance stage whereby the low noise amplifier circuit operates as an r inductively degenerated low noise amplifier, or a second set of one or more 0') 15 control signals to the circuit to configure the circuit in a second topology in which the low noise amplifier circuit comprises a common-gate low noise CO amplifier stage whereby the low noise amplifier circuit operates as a common-gate low noise amplifier, wherein the common-gate low noise amplifier stage comprises a given input transistor which acts as an internal input impedance matching component for the second topology, and wherein the first topology does not comprise the given input transistor and requires one or more components external to the low noise amplifier circuit for input impedance matching. When configured in the second topology, no external input impedance matching components are required.
Further features and advantages will become apparent from the following description of preferred embodiments, given by way of example only, which is made with reference to the accompanying drawings.
Brief Description of the Drawings
Figure 1 illustrates a radio-frequency receiver according to the prior art.
Figure 2 illustrates a differential low noise amplifier according to the
prior art.
Figure 3 is a circuit diagram of an inductively degenerated low noise
amplifier circuit according to the prior art.
Figure 4 is a circuit diagram of a common-gate low noise amplifier
circuit according to the prior art.
Figure 5 is a circuit diagram of a common-gate low noise amplifier with
feedback according to the prior art.
Figure 6 is a circuit diagram of a common-gate low noise amplifier with
cross-coupled inputs according to the prior art.
Figure 7 is a circuit diagram of a configurable low noise amplifier according to embodiments.
Figure 8 is a circuit diagram of a configurable low noise amplifier according to embodiments.
Figure 9 is a circuit diagram of a configurable low noise amplifier according to embodiments.
Detailed Description of the Invention
Sevcral LNA structures are known, each of these having certain bcncfits and drawbacks regarding their noise performance, overall cost, and input matching capabilities.
Known inductively degenerated common-source amplifier topologies typically do not provide any impedance matching internally within the LNA.
This is because the size and quality of the passive components required to provide internal matching would make it technically and economically impractical to provide such components as part of the LNA. For example, high quality inductors require a larger silicon die area, and so would be impractical to include in an integrated LNA for a mobile device. This is especially true when thcn there are several LNAs inside a single REIC. Thesc topologies thus typically use external impedance matching components, i.e. components provided separately to an integrated circuit implementing the LNA, to match input impedance. For example, often an inductor is used as an external impedance matching component coupled to each of thc diffcrential inputs. One challenge is to achieve good noise performance without external matching components and with sufficiently low current consumption for mobile devices.
The cost of a radio frequency receiver comprises the cost of a silicon area for receiver ICs, the cost of any external matching components and the cost of any printcd wiring board (PWB) arca. If there are multiplc RFIC inputs, as for example is the case in wideband receivers, the count of the external matching components can become high thus increasing the expense of the radio frequency receiver. For example, some receivers may use multiple LNAs, each receiving a different band of frequencies; any external component costs and silicon area requirements are increased. In addition, the number of on-chip inductors should be kept at a minimum to reduce costs.
Figure 2 is a schematic diagram showing the inputs and outputs of a differential LNA. The [NA of Figure 2 is an integrated differential low noise amplifier and as such has two inputs: inp and mm. For most differential signals, a signal p applied to inp will be 180 degrees out of phase with (i.e. of opposite phase to) a signal m applied to mm. The [NA of Figure 2 has two outputs, one for positive components of the differential signal and one for positive components of the differential signal: outp and outm. In some implementations the two outputs may be connected to provide a single output. The [NA of Figure 2 is powered by a voltage supply vdd and is connected to ground. The voltage supply supplies a DC voltage.
A differential amplifier typically has two parts, one for a first differential signal component, e.g. p, and one for a second differential signal component, e.g. m. These parts will be referred to herein as the positive or plus' side of the differential amplifier and the negative or minus' side of the differential amplifier. Each side of the differential amplifier will have a corresponding input and output, e.g. for a signal p, the p side will have input inp and output outp, likewise for a signal m, the m side will have input mm and output outp. In some embodiments the p and m sides of the differential amplifier are coupled at the S outputs, for example via a configurable load.
Even though some embodiments will be described below with regard to a differential amplifier, the embodiments may also be applied to amplifiers for single-ended signals. In single-ended embodiments, only the features of one side of the differential amplifier may be supplied.
A known LNA topology is the inductively degenerated LNA topology, a detailed analysis of which has been given in, for example, in D. K. Shaeffer and T. H. Lee, "A 1.5-V, 1.5-GHz CMOS low noise amplifier," IEEE J. of Solid-State Circuits, vol. 32, no. 5, May 1997, pp. 745-759.
An exemplary inductively degenerated LNA circuit is depicted in Figure 3. The LNA of Figure 3 is a differential amplifier, where transistors M2p and M3_p form the positive or plus' side of the differential amplifier, and transistors M2_m and M3m form the negative or minus' side of the differential amplifier. The plus and minus sides of the differential amplifier are each arranged in a caseode configuration, where transistors M2j and M2_m, each arranged in a common source configuration, form the input (or gain') transistors of the plus and minus sides, respectively, and transistors M3p and M3m form the caseode transistors (or current caseodes') of the plus and minus sides, respectively. In this case, each of transistors M2p, M2_m, M3p, M3m is an enhancement mode n-channel metal-ox ide-semiconductor field-effect transistor (MOSFET) (also referred to as NMOS').
The differential amplifier amplifies the difference between the two input signals inp, mm applied to its input terminals 220 and 222, where the signal applied to input terminal 222 is a signal having the same magnitude as the signal applied to input terminal 220 but being 180 degrees out of phase with that signal (i.e. the signals have opposite phase). The differential amplifier is capable of rejecting signal components common to both its input signals whilst amplifying the difference between the two signals. The degree to which the differential amplifier rejects signal components common to both its input signals whilst amplifying the difference between the two signals can be measured by the Common-Mode Rejection Ratio (CMRR) metric.
The gate terminal of input transistor M2p on the plus side of the amplifier is connected to a bias voltage source vbias Ideg via a first bias resistor Rblp. The gate terminal of input transistor M2p is also connected to an external matching component Lextp via a decoupling capacitor accip. Input terminal 220 is connected to external matching component Lextp. External matching component Lextp is located on a separate circuit or device to the circuit containing the LNA of Figure 3, i.e. matching component Lextp is off-chip' (denoted by dashed surrounding box in Figure 3). In this case, matching component Lextp is an inductor.
Similarly on the minus side of the amplifier, the gate terminal of input transistor M2_m is connected to bias voltage source vbias ldeg via a second bias resistor Rblm. The gate terminal of input transistor M2m is also connccted to an external matching component Lextm via a decoupling capacitor accirn. Input terminal 222 is connected to external matching component Lextm.
Again, matching component Lextm is located off-chip, and in this case is an inductor.
The gate terminals of input nnsistors M2p and M2_m thus each form an input terminal of their respective input transistor. The source and drain terminals of input transistors M2p and M2_m therefore form output terminals of the input transistors.
The source terminal of each of the two input transistors M2p and M2_m is connected to a different respective terminal of an inductor Ldeg. Inductor Ldeg is a centre-tap differential inductor device with mutual coupling. Inductor Ldeg provides inductive degeneration of the source terminals of the two gain transistors M2_p and M2_m. The centre-tap terminal of inductor Ldeg is connected to ground.
The drain terminal of gain transistor M2p on the plus side of the differential amplifier is connected to the source terminal of cascode transistor M3_p. Similarly, the drain terminal of gain transistor M2m on the minus side of the differential amplifier is connected to the source terminal of caseode transistor M3m.
The gate terminals of cascode transistors M3p and M3_m are both connected to the circuit voltage supply Vdd (a DC voltage). Note that a gate terminal DC voltage can be set to a level other than Vdd, such that the drain voltages of gain transistors M2_p,m can be set to a desired level in order to increase the available voltage swing at the drain terminals of cascode transistors M 3p,m.
The drain terminals of cascode transistors M3_p and M3_m are connected to output terminals 260 and 262 respectively, where 260 is the output terminal of the plus side of the differential amplifier at which output signal outp is produced, and 262 is the output terminal of the minus side of the differential amplifier at which output signal outm is produced. The drain terminals of cascode transistors M3_p and M3m are also each connected to the voltage supply Vdd via a configurable load; in this ease the configurable load comprises an inductor 280 and variable capacitor 270 connected in parallel. Inductor 280 is a centre-tap differential inductor device and its centre-tap terminal is connected to voltage supply Vdd. The output terminals 260 and 262 of the LNA of Figure 3 are thus connected to the configurable load.
The noise performance of the LNA topology depicted in Figure 3 is typically dominated by the noise performance of input transistors M2_p and M2m. The noise performance can be improved by optimizing the input matching network (for example including gain transistors M2p and M2m and external matching components Lextp and Lextm). In this topology, the input matching network preceding the input transistors provides passive voltage gain which can be measurcd as a ratio of the voltage swing observed at the gate to source terminal junction of the corresponding input transistor, e.g. M2_p, and the voltage swing at the LNA input. A high value for this ratio, known in this context as the Q-value of the input matching network, is beneficial in reducing the drain current noise of input transistor M2_p, but it increases the induced gate current noise of the input transistor. However, the inductively degenerated LNA requires several off-chip external matching components Lextp and Lextm, and thus tends to be relatively expensive.
A second known LNA topology is the common-gate LNA, a detailed analysis of which has been given in a journal publication entitled "A 4.5-mW 900-MHz CMOS Receiver for Wireless Paging," by Hooman Darabi and Asad A. Abidi published in IEEE Journal of Solid-State Circuits, VOL. 35, NO. 8, AUGUST 2000.
An exemplary common-gate LNA circuit is depicted in Figure 4. As with the inductively degenerated LNA of Figure 3, the LNA of Figure 4 is a differential amplifier, where transistors MI_p and M3_p forrn the positive or plus' side of the differential amplifier, and transistors Mi_rn and M3m form the negative or minus' side of the differential amplifier.
The common-gate LNA of Figure 4 includes a common-gate LNA stage (labelled eg_eore in Figure 4) which includes input transistors M1_p,m which are provided with appropriate bias voltages from voltage source vbias_eg via bias resistors Rb2p,m. The common-gate LNA stage also includes cascode transistors M3_p,m and inductors 250p,m. The common-gate LNA stage of Figure 4 also contains a capacitor etbp,m between the gate of each input transistor and ground.
No external matching components Lextp and Lextm are provided in the common-gate LNA of Figure 4. Input transistors M2_p and M2_rn are thus directly connected to the input terminals 220, 222 respectively, via decoupling capacitors aee2p and acc2m.
Rather than requiring external matching components in order to match the impedance to which input terminals 220 and 222 are connected (where the impedance to be matched to is for example the output impedance of an RF filter preceding the LNA), the common-gate LNA of Figure 4 is capable oF matching the impedance connected to input terminaLs 220 and 222 internally within the LNA.
A common-gate LNA such as that depicted in Figure 4 has a capability for internal input impedance matching because the impedance at the source of an input transistor is inversely proportional to the transeonductanee g11.
typically, the single-ended termination impedance is Son, and therefore a transconductanee of approximately 20 mS is required. A large impedance towards the signal ground is required in order to steer the signal into the source terminal of the input transistors which can be achieved with a current source connected to the respective source nodes. However, such a current source topology is not typically utilised due to associated poor noise performance and stacking of several transistors can lead to technology restrictions. Instead, a better noise performance is achieved by using an inductor at the source node of the input transistors Mlp.m as depicted in Figure 4.
In the case of perfect impedance matching (l/gm= Rs), the voltage gain of the common-gate low noise amplifier becomes a division of output load versus the source impedance, i.e. Z1jR5. Such an assumption is valid if the drain-to-source resistance rd of the input transistors is much larger than the load resistance at the respective drain terminals. Since the vohage gain of the common-gate low noise amplifier is limited to load/source impedance ratios, it can be challenging to achieve a high voltage gain figure. Furthermore, the need for a high output impedance also requires special attention to he made to the interface design.
The minimum noise figure of a perfectly matched common-gate LNA
typically presented in the prior art is:
V S
NF = ioig (i + -) = iDly () = 2.2dB For short-channel devices, the noise parameter y can be much greater than unity, and a can be much less than unity. In practice, an achievable noise figures tends to be around 3dB or greater. This means that the noise figure is somewhat higher for a common-gate LNA compared to an inductively degenerated common-source LNA.
The input matching requirement prevents increasing the transconductance of the input transistors Mlp,m to lower the noise factor.
However, the link between noise factor and input matching can be separated by introducing feedback from the load to the gate node for example as in the alternative common-gate LNA depicted in Figure 5. This allows a decrease in noisc figure with a larger transconductance. Furthcr, the input impedance and frequency transfer function of the common-gate LNA can be adjusted simultancously.
The circuit of Figure 5 includes an alternative common-gate LNA stage cg_core to the circuit of Figure 4. In addition to input transistors Mlp,m, cascode transistors M3p,m and bias resistors Rb2p,m, the common-gate LNA stage of Figure 5 contains first feedback ioops between the gates of each input transistor and their output drain terminals via cascode transistors M3_p,m. In this case, each first feedback loop comprises a feedback capacitor cfb2p,m.
The common-gate LNA stage of Figure 5 also contains second feedback loops between the gate of each input transistor and their output source terminals.
In this case, cach second feedback loop includes a feedback capacitor cfblp,m.
The second feedback loops are also coupled by inductors 250p,m.
A further alternative common-gate LNA which requires less bias current to achieve the required input matching is depicted in Figure 6. The common-gate LNA of Figure 6 includes a further alternative common-gate LNA stage cg_core where inverting gain from the source to gate terminals of the input transistors Mlp,m is applied. In this case, capacitor cross-coupling suitable for differential input configurations is applied via cross-coupling capacitors cccp, cccm. The measured noise figure of a transconductance-boosted common-gate LNA using capacitor cross-coupling as per Figure 6 is approximately 3.0 dB.
Thus, such cross-coupling does not improve the noise figure conipared to the common-gate LNAs of Figure 4 and 5, but requires less bias current to achieve the required input matching.
In summary, a common-gate LNA can provide wideband matching without external matching components. In addition, a common-gate LNA offers good linearity. Furthermore, if two independent source inductors are used, good input matching is also achieved in common-mode which results in good common-mode linearity as well. Compared to the inductively degenerated LNA of Figure 3, a common-gate LNA has poorer noise performance and, depending on the application, it can require special attention in relation to interface design.
Embodiments relate to an LNA circuit that can be configured between one of a first topology in which the low noise amplifier circuit comprises a degeneration inductance stage such that the low noise amplifier circuit operates as an inductively degenerated low noise amplifier, and a second topology in which the low noise amplifier circuit comprises a common-gate low noise amplifier stage such that the low noise amplifier circuit operates as a common-gate low noise amplifier. In the first topology, one or more external matching components are used in conjunction with the LNA for input impedance matching purposes. In the second topology, input impedance matching is carried out using components internal to the LNA topology; no external matching components are required in the second topology. Input impedance matching may for example involve matching to the output impedance of an RF filter connected to one or more inputs of the LNA.
An exemplary configurable LNA circuit according to the invention is illustrated in Figure 7. As with the LNAs of Figures 3 to 6, the exemplary LNA of Figure 7 is a differential amplifier, where transistors Mlp, M2_p and M3_p form the positive or plus' side of the differential amplifier, and transistors Mim, M2_m and M3_m form the negative or minus' side of the differential amplifier.
The exemplary configurable LNA circuit of Figure 7 contains a common-gate LNA stage (labelled cg_core) as per the common-gate LNA stage of the circuit of Figure 4. In some embodiments, the common-gate LNA stage of the configurable LNA circuit is rcpaced by the common-gate LNA stage (labelled eg core) of the circuit of Figure 5 or that of Figure 6.
The topology of the configurable LNA of Figure 7 necessarily contains some similar features to both the inductively degenerated LNA of Figure 3 and the common-gate LNA of Figure 4; however, there are several important differences which include the following: Firstly, the configurable LNA of Figure 7 contains a switching arrangement for configuring the LNA between one of the first topology and the second topology. The switching arrangement contains a topology switching means, in this case switching transistors SWI_p,m connected between an output of the degeneration inductance stage and an input of the configurable LNA. In this case, the source terminals of SWIp,m are connected to the source terminals of the input transistors M1_p,m of the common-gate LNA stage and the drain terminals of SWIp,m are connected to decoupling capacitors acc2p,m. The source terminals of switching transistors SWI_p,m are also connected to the source terminals of the input transistors M2p,m of the inductively degenerated LNA stage. The gate terminals of switching transistors SWIp,m are connected to a configuration control signal terminal, for example as labelled xLdeg in Figure 7.
Secondly, instead of including both degeneration inductors in each differential circuit as per the inductively degenerated LNA of Figure 3 and also inductors at the source of the input transistors lvii p, m in both differential circuits as per the common-gate LNA stage of Figure 4, the configurable LNA of Figure 7 only comprises inductors 250p,m. These inductors are shared between the first and the second topologies and usefully employed when the configurable LNA is configured in either topology. Such component re-use helps reduce costs and die area.
By applying appropriate configuration control signals to configuration control terminals xLdeg, switching transistors SWI_p,m can be switched between an open state, whereby the configurable LNA of Figure 7 is configured in the first topology, and a closed state, whereby the configurable LNA of Figure 7 is configured in the second topology.
The configurable LNA can be configured according to the desired use case. Sensitivity can be improved in the first, inductively degenerated configuration if required but at the cost of a requirement for external matching components. However, since in the second, common-gate configuration the configurable LNA can be matched without extemal components, a cost-efficient solution is provided. The second, common-gate configuration also provides better linearity than the first, inductively degenerated configuration. Thus, embodiments provide the possibility to trade-off between price and performance.
The first and second topologies that the configurable LNA can be configured between using the topology switching means will now be described in more detail.
When in an open state, a switching transistor provides a high resistance between its drain and source terminals which effectively disconnects (or open-circuits') the drain and source terminals. A switching transistor may be placed in the open state by applying an appropriate control signal to the respective configuration control signal terminal such that the voltage between the gate terminal and the source terminal (i.e. the voltage V) of the switching transistor is less (or approximately less) than the threshold voltage (i.e. the voltage of the switching transistor, i.e. a switching transistor may thus be described as being in cutoff mode. A configuration control signal for configuring a switching transistor into an open state may for example comprise a digital 0' signal (such as a signal comprising a first voltage level).
When in a closed state, a switching transistor provides a low resistance between its drain and source terminals which effcctively connects (or short-circuits') the drain and sourcc terminals. A switching transistor can be placed in the closed state by applying a configuration control signal to its control signal terminal such that the voltage between the gate terminal and the source terminal (i.e. the voltage Vgs) of the switching transistors is greater than the threshold voltage (i.e. the voltage V) of the switching transistor, i.e. a switching transistor may thus be described as being in triode mode. A configuration control signal for configuring a switching transistor into a closed state may for example comprise a digital 1' (such as a signal comprising a second voltage level) In the first topology, switching transistors SWI_p,m are configured to an open state.
The switching arrangement also comprises a first bias voltage switching means adapted to set the bias voltage vbias_ldeg to either a relatively high or a relatively low bias voltage. The configurable low noise amplifier circuit is configurable in the first topology by using the first bias voltage switching means to set the bias voltage vbias ldeg to a relatively high bias voltage. Applying a relatively high bias voltage to the input transistors M2p,m of the inductively degenerated LNA stage biases the M2p,m transistors to a closed state. What constitutes a relatively high bias voltage depends on the transistor technology used. Typically, a relatively high bias voltage comprises a voltage of around one third to one half of the supply voltage, although voltages outside this could be employed. In embodiments, the supply voltage is 1.2W and a relatively high bias voltage comprises 450-500mV.
The switching arrangement also comprises a second bias voltage switching means adapted to set the bias voltage vbias cg to either a relatively high or a relatively low bias voltage. The configurable low noise amplifier circuit is configurable in the first topology by using the second bias voltage switching means to set the bias voltage vbias_cg to a relatively low bias voltage.
Applying a relatively low bias voltage to the input transistors Mlp,m of the common-gate LNA stage biases the M lp,m transistors in an open state. A relatively low bias voltage may for example comprise a zero bias voltage.
By configuring switching transistor SWI_p,m to a closed state and biasing input transistors M1_p,m of the common-gate LNA stage in an open state, the source terminals of input transistors M2_p,m of the inductively degenerated stage are connected via inductors 250p,m, whose centre-tap is connected to ground. Inductors 250p,m therefore provide inductive degeneration of the source terminals of input transistors M2_p, as in the inductively degenerated LNA of Figure 3.
The configurable LNA thus operates as an inductively degenerated LNA when switching transistors SWI_p,m are switched to an open state, i.e. when the configurable LNA is configured in the first topology.
Therefore, when configured in the first topology, the configurable LNA does not provide internal input impedance matching, for example matching to the output impedance of a preceding RF filter connected to input terminals 220 and 222. As a result, the input impedance of the configurable LNA of Figure 7 can be matched, for example to a preceding RE filter, by connecting external impedance matching components. The external matching components may for example comprise external matching components Lextp and Lextm as depicted in Figure 7 (and similarly as shown in the inductively degenerated LNA of Figure 3), which are connected in-between decoupling capacitors acclp,m and input terminals 220 and 222 respectively.
The first topology of the configurable LNA of Figure 7 thus provides the benefits of the inductively degenerated LNA of Figure 3, i.e. relatively low noise figure, but requires the use of external matching components in order to provide input impedance matching.
In the second topology, switching transistors SW I p,m are configured to a closed state.
The configuraNe low noise amplifier circuit is configurable in the second topology by using the first bias voltage switching means to set the bias voltage vbias_ldeg to a relatively low bias voltage. Applying a relatively low bias voltage to the input transistors M2_p,m of the inductively degenerated LNA stage biases the M2_p,m transistors to an open state.
The configurable low noise amplifier circuit is configurable in the second topology by using the second bias voltage switching means to set the bias voltage vbias_cg to a relatively high bias voltage. Applying a relatively high bias voltage to the input transistors Mlp,m of the common-gate LNA stage biases the M1_p,m transistors in a closed state.
By configuring switching transistor SWIp,m to a closed state and biasing input transistors M 1_p,m of the common-gate LNA stage in a closed state, the source terminals of input transistors M1_p,m of the common-gate LNA stage are connected via inductors 250p,m, which arc connected to ground.
Inductors 250p,m connected to the source terminals of input transistors Mlp,m source are high impedance at the operating frequency and work as the DC-current path to ground for the second topology.
Inductors 250p,m remain in-circuit in both the first topology and the second topology such that embodiments use the area of an expensive (in terms of area) integrated inductor 250 for two different purposes. The same integrated inductor 250 is used as a degeneration inductor in the inductively degenerated topology and as a DC feed inductor in the common-gate LNA topology. The use of a single inductor 250 in both topologies avoids one expensive on-chip component being required for one topology and another expensive on-chip component being required for the other topology The configurable LNA of Figure 7 thus provides an LNA that can be configured according to the desired use case or design requirements.
The LNA can be configured in the first topology if a more sensitive LNA with a better noise figure is required, at the cost of a need for external matching components, e.g. Lextp and Lextm, in order to provide impedance matching for the inputs of the configurable LNA. Alternatively, the LNA can be configured in the second topology in order to provide a more cost effective solution with better linearity. Note that the external input impedance matching components which are included in Figure 7 are not included in the second topology.
The configurable LNA may be configured by its manufacturer, or by a third party installing the configurable LNA, for example in a device or module thereof; this may involve a method of configuring the LNA that comprises applying either a first set of one or more control signals to the LNA to configure it in the first topology or a second set of one or more control signals to the LNA to configure it in the second topology. A set of control signals may for example be applied to one or more of the switching transistors and bias voltage switching means.
The configurable LNA of Figure 7 can be implemented in a radio-frequency semiconductor integrated circuit (RFIC). Such an RFIC may be included in an RF module comprising an RF ifiter located in an RF Front End Module preceding the LNA. The RFIC may comprise input and output pins that may be used to connect external matching components between the configurable LNA and the RF filter. An RFIC could alternatively comprise one or more RF filters connected to one or more configurable LNAs.
The configurable LNA of Figure 7 can be incorporated in a number of different devices. Such a device could comprise a user equipment such as a mobile station, personal digital assistant or cellular telephony device etc.; the configurable LNA may for example be included in a receiver of such a user equipment Further, such a device could comprise a modem device to be attached to a user equipment, for example a Universal Serial Bus (tJSB modem).
Still further, such a device could comprise a communication module such as a Machine-to-Machine (M2M) module which can be inserted into another device such as a laptop computer or other device with communication capability (for example a vending machine). Yet, still further, such a device couLd comprise a chipset which may include radio and baseband parts.
In embodiments, the configurable low noise amplifier circuit comprises a common output terminal at which the output of the configurable low noise amplifier circuit is providcd when configured in eithcr said first topology or said second topology. For example, in the case of a non-differential circuit such as only the positive side of the configurable low noise amplifier of Figure 7 being employed, the output of the circuit when configured in the first topology is produced at output terminal 260 and the output of the circuit when configured in the second topology is also produced at output terminal 260. Such re-use of a single output terminal for both topologies provides a lower cost solution both for the configurable LNA itself and other components connecting to it than a solution requiring multiple output terminals. Similarly, a single, common, pair of output terminals can be employed for the case of a differential circuit, rather than multiple pairs of output terminals for different configurations.
In embodiments described above, reference is made to the input and outputs of a MOSFET transistor. It should be undcrstood that input refers to the gate and output refers to either the source or drain.
The above embodiments are to be understood as illustrative examples of the invention. Further embodiments of the invention are envisaged, some examples of which follow here.
In a first alternative arrangement, cascode transistors M3p,m are not included in the configurable LNA circuit of Figure 7. In such an arrangement, on the plus side of the differential amplifier, the drain terminals of input transistors Mlp,m and M2p,m are connected to output terminal 260 of the configurable LNA and to the configurable load (e.g. inductor 280 and variable capacitor 270) that is connected to the voltage supply Vdd. Similarly, on the minus side of the differential amplifier, the drain terminals of input transistors Ml p,m and M2p,m are connected to output terminal 262 of the configurable LNA and to the configurable load that is connected to the voltage supply Vdd.
The omission of the cascode transistors M3p,m may degrade the input-output isolation of the invention and worsen the Miller effect of the configurable LNA; however such an arrangement still benefits from the other advantages of the configurable LNA of Figure 7 described above.
In a second alternative arrangement, only one side of the differential amplifier is included in the configurable LNA circuit of Figure 7, for example either the plus side or the minus side. In such an arrangement only one input terminal, e.g. 220, and only one output terminal, e.g. 260, are included in the configurable LNA circuit. Similarly, only one switching transistor is employed, for example SW1p. This arrangement thus does not comprise a differential amplifier and does not benefit from the common-mode rejection capabilities of a differential amplifier; however such an arrangement still benefits from the other advantages of the configurable LNA of Figure 7 described above.
An exemplary configurable LNA circuit combining the first alternative arrangement above where the cascode transistors are omitted, and the second alternative arrangement above where only one side of the differential amplifier of the configurable LNA circuit of Figure 7 is included, is illustrated in Figure 8.
This arrangement still benefits from the many of the advantages of the configurable LNA of Figure 7 described above.
Different types of topology switching means may be used with any of the embodiments described above. For example, as opposed to n-type enhancement mode MOSFETs, p-type and1or depletion mode MOSFETs may be used. In another example, bipolar junction transistors may be used.
In further alternative embodiments, topology switching means other than switching transistors can be employed, for example mechanical switches which can be physically switched to configure the configurable LNA in the desired topology. In another further alternative embodiment, inductor 250 may comprise a centre-tap inductor whose centre tap is connected to ground.
Dc-coupling capacitors ace I p,m and acc2p,m may be omitted from any of the embodiments described above.
The configurable load, e.g. resonator load formed by inductor 280 and variable capacitor 270, may be removed from the circuit or alternatively replaced with another impedance such as a non-resonator load, wideband load, activc load etc. In a yet further alternative embodiment, the configuration control signals applied to configuration control terminals xLdeg may be provided by an RFIC containing the configurable LNA of Figure 7. For example, one or more topology switching means may be used to connect configuration control terminals xLdeg to an appropriate voltage supply (e.g. Vdd for one configuration and ground for another configuration) of the RFIC, in order to configure the LNA in either the first topology or the second topology. In another example, one or more non-volatile memory devices may be configured to provide the configuration control signals, for example the output of a static random access memory (SRAM) device, flash memory device or Electrically Erasable Programmable Read-Only Memory (EEPROM) device may provide the configuration control signals. Such a non-volatile memory device could be externally programmed to store appropriate data (e.g. a 0' bit or a 1' bit) in order to allow the memory device to provide configuration control signals that configure the LNA in either the first topology or the second topology. The method of configuring the LNA may in this case include applying a set of control signals to the LNA by programming the above non-volatile memory dcvi cc appropriately.
Another alternative embodiment involves adding, in addition to the configurable degeneration inductance, a configurable capacitor at the source terminal of the input transistor(s) of the configurable LNA, for example as per capacitor 700 shown in the configurable LNA circuit of Figure 9. This allows setting of the resonator frequency at the source terminal to a desired frequency.
In the common-gate LNA topology, the inductor should be high impedance at the operating frequency and therefore it should be of a relatively large value.
For the inductively degenerated LNA topology, an inductor of a relatively smaller value is usually preferred in order to obtain a better noise figure and higher gain. The capacitor 700 in the common-gate LNA topology allows the inductor to be of a smaller value, thus assisting with optimisation of the inductively degenerated LNA topology.
It is to be understood that any feature described in relation to any one embodiment may be used alone, or in combination with other features described, and may also be used in combination with one or more features of any other of the embodiments, or any combination of any other of the embodiments.
Furthermore, modifications not described above may also bc employed without departing from the scope of the invention, which is defined in the accompanying claims.

Claims (1)

  1. <claim-text>Claims 1. A configurable low noise amplifier circuit, said low noise amplifier circuit being configurable between one of: a first topology in which said low noise amplifier circuit comprises a degeneration inductance stage whereby said low noise amplifier circuit operates as an inductively degenerated low noise amplifier; and a second topology in which said low noise amplifier circuit comprises a common-gate low noise amplifier stage whereby said low noise amplifier circuit operates as a common-gate low noise amplifier, wherein said common-gate low noise amplifier stage comprises a given input transistor which acts as an internal input impedance matching component for said second topology, and r wherein said first topology does not comprise said given input transistor 0') 15 and requires one or more components external to said low noise amplifier circuit for input impedance matching. Co</claim-text> <claim-text>2. A configurable low noise amplifier circuit according to claim 1, said circuit comprising a switching arrangement, said circuit being configurable between one of said first topology and said second topology via said switching arrangement.</claim-text> <claim-text>3. A configurable low noise amplifier circuit according to claim 2, wherein said switching arrangement comprises: a topology switching means connected between an output of said degeneration inductance stage and an input of said configurable low noise amplifier circuit, wherein said circuit is configurable in said first topology by configuring said topology switching means in an open state, and wherein said circuit is configurable in said second topology by configuring said topology switching means in a closed state.</claim-text> <claim-text>4. A configurable low noise amplifier circuit according to claim 3, wherein said topology switching means comprises a switching transistor, wherein said switching transistor is configurable in said open state via input of an open state configuration control signal to its input terminal, and whercin said switching transistor is configurable in said closed state via input of a closed state configuration control signal to its input terminal.</claim-text> <claim-text>5. A configurable low noise amplifier circuit according to any prcccding claim, wherein said dcgcneration inductance stage comprises a first C\J input transistor coupled to the input of said configurable low noise amplifier r circuit and a degeneration inductor connected between a first output of said first 0') 15 input transistor and ground.</claim-text> <claim-text>00 6. A configurable low noise amplifier circuit according to claim 5, wherein said degeneration inductance stage comprises a first bias resistor coupled to the input of said first input transistor and a first bias voltage.</claim-text> <claim-text>7. A configurable low noise amplifier circuit according to claim 5 or 6, wherein said degeneration inductance stage comprises a first decoupling capacitor connected between the input of said configurable low noise amplifier circuit and the input of said first input transistor.</claim-text> <claim-text>8. A configurable low noise amplifier circuit according to any preceding claim, wherein said common-gate low noise amplifier stage comprises a second input transistor and an inductor, wherein said inductor is coupled to a first output of said second input transistor and ground, and wherein said second input transistor comprises said given input transistor.</claim-text> <claim-text>9. A configurable hw noise amplifier circuit according to daim 8, wherein said common-gate low noise amplifier stage comprises a second bias resistor coupled to the input of said second input transistor and a second bias voltage.</claim-text> <claim-text>10. A configurable low noise amplifier circuit according to claims 5 and 8, wherein said inductor of said common-gate amplifier stage comprises said degeneration inductor of said degeneration inductance stage, whereby said inductor remains in said circuit in both said first topology and said sccond C\J topology. r</claim-text> <claim-text>0') 15 II. A configurable low noise amplifier circuit according to claim 6 and any of claims 7 to 10, wherein said switching arrangement comprises: CO a first bias voltage switching means adapted to set said fir st bias vohage to either a relatively high or a relatively low bias voltage, wherein said configurable low noise amplifier circuit is configurable in said first topology by setting said first bias voltage to a relatively high bias vohage and configurable in said second topology by setting said first bias voltage to a relatively low bias voltage.</claim-text> <claim-text>12. A configurable low noise amplifier circuit according to claim 9 and claim 10 or 11, wherein said switching arrangement comprises: a second bias voltage switching means adapted to set said second bias voltage to either a relativdy high or a relatively low bias voltage, wherein said configurable low noise amplifier circuit is configurable in said first topology by setting said second bias voltage to a relatively low bias voltage and configurable in said second topology by setting said second bias voltage to a relatively high bias voltage.</claim-text> <claim-text>13. A configurable low noise amplifier circuit according to any preceding claim, wherein said circuit comprises a common output terminal at which the output of said configurable low noise amplifier circuit is provided when configured in either said first topology or said second topology.</claim-text> <claim-text>14. A configurable low noise amplifier circuit according to any preceding claim, said configurable low noisc amplifier circuit comprising one or more current cascodes located before the output of the low noise amplifier circuit. (4</claim-text> <claim-text>15. A configurable low noise amplifier circuit according to any 0') 15 preceding claim, said circuit comprising a configurable load connected to the output of said circuit. Co</claim-text> <claim-text>16. A configurable low noise amplifier circuit according to any preceding claim, wherein said configurable low noise amplifier circuit comprises a differential amplifier, said stages forming one side of said differential amplificr.</claim-text> <claim-text>17. A radio-frequency semiconductor integrated circuit comprising onc or more configurable low noise amplificr circuits according to any preceding claim.</claim-text> <claim-text>18. A radio-frequency module comprising one or more radio-frequency filter circuits coupled to one or more configurable low noise amplifier circuits according to any of claims Ito 16.</claim-text> <claim-text>19. A device comprising a configurable low noise amplifier circuit according to any of claims ito 16.</claim-text> <claim-text>20. A method of manufacturing a low noise amplifier circuit according to any of claims Ito 16.</claim-text> <claim-text>21. A method of configuring a low noise amplifier circuit comprising applying one of: a first set of one or more control signals to said circuit to configure said circuit in a first topology in which said low noise amplifier circuit comprises a degeneration inductance stage whereby said low noise amplifier circuit operates as an inductively degenerated low noise amplifier; or C\J a second set of one or more control signals to said circuit to configure r said circuit in a second topology in which said low noise amplifier circuit 0') 15 comprises a common-gate low noise amplifier stage whereby said low noise amplifier circuit operates as a common-gate low noise amplifier, wherein said common-gate low noise amplifier stage comprises a given input transistor which acts as an internal input impedance matching component for said second topology, and wherein said first topology does not comprise said given input transistor and requires one or more components cxtcmal to said low noise amplifier circuit for input impedance matching.</claim-text>
GB1207237.7A 2011-05-19 2012-04-25 A receiver amplifier configurable for common-gate or inductively-degenerated operation Withdrawn GB2493045A (en)

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GB2487998B (en) 2013-03-20
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GB2487998A (en) 2012-08-15
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EP2710729A1 (en) 2014-03-26
GB201207237D0 (en) 2012-06-06

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