GB2486361B - Light guide array for an image sensor - Google Patents

Light guide array for an image sensor

Info

Publication number
GB2486361B
GB2486361B GB1203302.3A GB201203302A GB2486361B GB 2486361 B GB2486361 B GB 2486361B GB 201203302 A GB201203302 A GB 201203302A GB 2486361 B GB2486361 B GB 2486361B
Authority
GB
United Kingdom
Prior art keywords
light guide
image sensor
guide array
array
sensor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB1203302.3A
Other versions
GB2486361A (en
GB201203302D0 (en
Inventor
Thanh-Trung Do
Hiok-Nam Tay
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Candela Microsystems S Pte Ltd
Original Assignee
Candela Microsystems S Pte Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Candela Microsystems S Pte Ltd filed Critical Candela Microsystems S Pte Ltd
Priority claimed from PCT/IB2009/006148 external-priority patent/WO2011001196A1/en
Priority claimed from US12/806,192 external-priority patent/US20110031381A1/en
Publication of GB201203302D0 publication Critical patent/GB201203302D0/en
Publication of GB2486361A publication Critical patent/GB2486361A/en
Application granted granted Critical
Publication of GB2486361B publication Critical patent/GB2486361B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/1462—Coatings
    • H01L27/14621—Colour filter arrangements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14625—Optical elements or arrangements associated with the device
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14601—Structural or functional details thereof
    • H01L27/14625—Optical elements or arrangements associated with the device
    • H01L27/14629—Reflectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
    • H01L27/14685—Process for coatings or optical elements
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
    • H01L27/144—Devices controlled by radiation
    • H01L27/146—Imager structures
    • H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
    • H01L27/14687—Wafer level processing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0216—Coatings
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/02—Details
    • H01L31/0232—Optical elements or arrangements associated with the device
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4202—Packages, e.g. shape, construction, internal or external details for coupling an active element with fibres without intermediate optical elements, e.g. fibres with plane ends, fibres with shaped ends, bundles
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/24—Coupling light guides
    • G02B6/42—Coupling light guides with opto-electronic elements
    • G02B6/4201—Packages, e.g. shape, construction, internal or external details
    • G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
    • G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
    • G02B6/423—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using guiding surfaces for the alignment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Electromagnetism (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Multimedia (AREA)
  • Signal Processing (AREA)
  • Solid State Image Pick-Up Elements (AREA)
  • Facsimile Heads (AREA)
GB1203302.3A 2009-07-02 2009-07-02 Light guide array for an image sensor Expired - Fee Related GB2486361B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
PCT/IB2009/006148 WO2011001196A1 (en) 2009-07-02 2009-07-02 Light guide array for an image sensor
US12/806,192 US20110031381A1 (en) 2007-12-28 2009-07-02 Light guide array for an image sensor

Publications (3)

Publication Number Publication Date
GB201203302D0 GB201203302D0 (en) 2012-04-11
GB2486361A GB2486361A (en) 2012-06-13
GB2486361B true GB2486361B (en) 2012-10-10

Family

ID=45218963

Family Applications (2)

Application Number Title Priority Date Filing Date
GB1203302.3A Expired - Fee Related GB2486361B (en) 2009-07-02 2009-07-02 Light guide array for an image sensor
GB1011222.5A Expired - Fee Related GB2481651B (en) 2009-07-02 2009-07-02 Light guide array for an image sensor

Family Applications After (1)

Application Number Title Priority Date Filing Date
GB1011222.5A Expired - Fee Related GB2481651B (en) 2009-07-02 2009-07-02 Light guide array for an image sensor

Country Status (2)

Country Link
GB (2) GB2486361B (en)
HK (1) HK1171567A1 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6173259B2 (en) * 2014-06-02 2017-08-02 キヤノン株式会社 Photoelectric conversion device and imaging system
JP6444066B2 (en) 2014-06-02 2018-12-26 キヤノン株式会社 Photoelectric conversion device and imaging system

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040070039A1 (en) * 2002-10-09 2004-04-15 Canon Kabushiki Kaisha Solid state image pickup element and method of manufacturing a solid state pickup element
US20060158547A1 (en) * 2005-01-18 2006-07-20 Matsushita Electric Industrial Co., Ltd. Solid state imaging device and fabrication method thereof, and camera incorporating the solid state imaging device
US20070103572A1 (en) * 2005-11-10 2007-05-10 Matsushita Electric Industrial Co., Ltd. Solid-state imaging device and method of manufacturing the same
JP2007288057A (en) * 2006-04-19 2007-11-01 Toppan Printing Co Ltd Color imaging element, and method of manufacturing same

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003103087A2 (en) * 2002-06-04 2003-12-11 Skycross, Inc. Wideband printed monopole antenna
KR101550866B1 (en) * 2009-02-09 2015-09-08 삼성전자주식회사 Method for manufacturing a image sensor by filling a upper part of dielectric trench and forming air gap to improve optical cross-talk

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20040070039A1 (en) * 2002-10-09 2004-04-15 Canon Kabushiki Kaisha Solid state image pickup element and method of manufacturing a solid state pickup element
US20060158547A1 (en) * 2005-01-18 2006-07-20 Matsushita Electric Industrial Co., Ltd. Solid state imaging device and fabrication method thereof, and camera incorporating the solid state imaging device
US20070103572A1 (en) * 2005-11-10 2007-05-10 Matsushita Electric Industrial Co., Ltd. Solid-state imaging device and method of manufacturing the same
JP2007288057A (en) * 2006-04-19 2007-11-01 Toppan Printing Co Ltd Color imaging element, and method of manufacturing same

Also Published As

Publication number Publication date
GB201011222D0 (en) 2010-08-18
GB2481651B (en) 2012-10-10
HK1171567A1 (en) 2013-03-28
GB2486361A (en) 2012-06-13
GB2481651A (en) 2012-01-04
GB201203302D0 (en) 2012-04-11

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