GB2476178B - Downhole tool with thin film thermoelectric cooling - Google Patents
Downhole tool with thin film thermoelectric coolingInfo
- Publication number
- GB2476178B GB2476178B GB1101610.2A GB201101610A GB2476178B GB 2476178 B GB2476178 B GB 2476178B GB 201101610 A GB201101610 A GB 201101610A GB 2476178 B GB2476178 B GB 2476178B
- Authority
- GB
- United Kingdom
- Prior art keywords
- thin film
- downhole tool
- thermoelectric cooling
- film thermoelectric
- cooling
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000001816 cooling Methods 0.000 title 1
- 239000010409 thin film Substances 0.000 title 1
Classifications
-
- E—FIXED CONSTRUCTIONS
- E21—EARTH OR ROCK DRILLING; MINING
- E21B—EARTH OR ROCK DRILLING; OBTAINING OIL, GAS, WATER, SOLUBLE OR MELTABLE MATERIALS OR A SLURRY OF MINERALS FROM WELLS
- E21B47/00—Survey of boreholes or wells
- E21B47/01—Devices for supporting measuring instruments on drill bits, pipes, rods or wirelines; Protecting measuring instruments in boreholes against heat, shock, pressure or the like
- E21B47/017—Protecting measuring instruments
- E21B47/0175—Cooling arrangements
-
- E—FIXED CONSTRUCTIONS
- E21—EARTH OR ROCK DRILLING; MINING
- E21B—EARTH OR ROCK DRILLING; OBTAINING OIL, GAS, WATER, SOLUBLE OR MELTABLE MATERIALS OR A SLURRY OF MINERALS FROM WELLS
- E21B47/00—Survey of boreholes or wells
- E21B47/01—Devices for supporting measuring instruments on drill bits, pipes, rods or wirelines; Protecting measuring instruments in boreholes against heat, shock, pressure or the like
- E21B47/017—Protecting measuring instruments
-
- E—FIXED CONSTRUCTIONS
- E21—EARTH OR ROCK DRILLING; MINING
- E21B—EARTH OR ROCK DRILLING; OBTAINING OIL, GAS, WATER, SOLUBLE OR MELTABLE MATERIALS OR A SLURRY OF MINERALS FROM WELLS
- E21B36/00—Heating, cooling or insulating arrangements for boreholes or wells, e.g. for use in permafrost zones
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/38—Cooling arrangements using the Peltier effect
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Geology (AREA)
- Life Sciences & Earth Sciences (AREA)
- Mining & Mineral Resources (AREA)
- General Life Sciences & Earth Sciences (AREA)
- Fluid Mechanics (AREA)
- Environmental & Geological Engineering (AREA)
- Geochemistry & Mineralogy (AREA)
- Geophysics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Extrusion Moulding Of Plastics Or The Like (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US12/184,684 US20100024436A1 (en) | 2008-08-01 | 2008-08-01 | Downhole tool with thin film thermoelectric cooling |
PCT/US2009/004411 WO2010014243A2 (en) | 2008-08-01 | 2009-07-30 | Downhole tool with thin film thermoelectric cooling |
Publications (3)
Publication Number | Publication Date |
---|---|
GB201101610D0 GB201101610D0 (en) | 2011-03-16 |
GB2476178A GB2476178A (en) | 2011-06-15 |
GB2476178B true GB2476178B (en) | 2013-02-20 |
Family
ID=41606905
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB1101610.2A Expired - Fee Related GB2476178B (en) | 2008-08-01 | 2009-07-30 | Downhole tool with thin film thermoelectric cooling |
Country Status (5)
Country | Link |
---|---|
US (1) | US20100024436A1 (en) |
BR (1) | BRPI0917426A2 (en) |
GB (1) | GB2476178B (en) |
NO (1) | NO20110208A1 (en) |
WO (1) | WO2010014243A2 (en) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2477230B (en) * | 2008-11-13 | 2012-12-05 | Halliburton Energy Serv Inc | Downhole thermal component temperature management system and method |
US8826984B2 (en) * | 2009-07-17 | 2014-09-09 | Baker Hughes Incorporated | Method and apparatus of heat dissipaters for electronic components in downhole tools |
US8695729B2 (en) * | 2010-04-28 | 2014-04-15 | Baker Hughes Incorporated | PDC sensing element fabrication process and tool |
US8746367B2 (en) * | 2010-04-28 | 2014-06-10 | Baker Hughes Incorporated | Apparatus and methods for detecting performance data in an earth-boring drilling tool |
EP2487327B1 (en) * | 2011-02-09 | 2015-10-14 | Siemens Aktiengesellschaft | Subsea electronic system |
US20140252531A1 (en) * | 2013-03-07 | 2014-09-11 | Qualcomm Incorporated | Systems and methods for harvesting dissipated heat from integrated circuits (ics) in electronic devices into electrical energy for providing power for the electronic devices |
CN107178929B (en) * | 2017-05-18 | 2020-11-27 | 西安交通大学 | Underground semiconductor refrigeration heat pump device |
CN107178930B (en) * | 2017-05-24 | 2019-10-29 | 彭波涛 | A kind of active downhole gauges heat management system and method |
US10907446B2 (en) * | 2019-03-21 | 2021-02-02 | Dmytro KHACHATUROV | Telemetry system and method for cooling downhole electronics |
US20230221188A1 (en) * | 2022-01-07 | 2023-07-13 | Baker Hughes Oilfield Operations Llc | High temperature sensor and system |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5547028A (en) * | 1994-09-12 | 1996-08-20 | Pes, Inc. | Downhole system for extending the life span of electronic components |
US5931000A (en) * | 1998-04-23 | 1999-08-03 | Turner; William Evans | Cooled electrical system for use downhole |
US20030236628A1 (en) * | 2002-06-25 | 2003-12-25 | Martorana Richard T. | Environmentally mitigated navigation system |
US20040199226A1 (en) * | 2000-12-09 | 2004-10-07 | Shadduck John H. | Thermotherapy device with superlattice cooling |
US20050115601A1 (en) * | 2003-12-02 | 2005-06-02 | Battelle Memorial Institute | Thermoelectric devices and applications for the same |
US20060213660A1 (en) * | 2005-03-23 | 2006-09-28 | Baker Hughes Incorporated | Downhole cooling based on thermo-tunneling of electrons |
US20080178920A1 (en) * | 2006-12-28 | 2008-07-31 | Schlumberger Technology Corporation | Devices for cooling and power |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4375157A (en) * | 1981-12-23 | 1983-03-01 | Borg-Warner Corporation | Downhole thermoelectric refrigerator |
US5817188A (en) * | 1995-10-03 | 1998-10-06 | Melcor Corporation | Fabrication of thermoelectric modules and solder for such fabrication |
US6134892A (en) * | 1998-04-23 | 2000-10-24 | Aps Technology, Inc. | Cooled electrical system for use downhole |
US6253556B1 (en) * | 2000-04-06 | 2001-07-03 | Texas Components Corporation | Electrical system with cooling or heating |
US6548894B2 (en) * | 2000-11-30 | 2003-04-15 | International Business Machines Corporation | Electronic module with integrated programmable thermoelectric cooling assembly and method of fabrication |
KR100933967B1 (en) * | 2001-10-05 | 2009-12-28 | 넥스트림 써멀 솔루션즈, 인크. | Phonon blocking electron permeation compact structure |
US6841413B2 (en) * | 2002-01-07 | 2005-01-11 | Intel Corporation | Thinned die integrated circuit package |
US7308795B2 (en) * | 2004-12-08 | 2007-12-18 | Hall David R | Method and system for cooling electrical components downhole |
US7527101B2 (en) * | 2005-01-27 | 2009-05-05 | Schlumberger Technology Corporation | Cooling apparatus and method |
-
2008
- 2008-08-01 US US12/184,684 patent/US20100024436A1/en not_active Abandoned
-
2009
- 2009-07-30 GB GB1101610.2A patent/GB2476178B/en not_active Expired - Fee Related
- 2009-07-30 BR BRPI0917426A patent/BRPI0917426A2/en not_active IP Right Cessation
- 2009-07-30 WO PCT/US2009/004411 patent/WO2010014243A2/en active Application Filing
-
2011
- 2011-02-07 NO NO20110208A patent/NO20110208A1/en not_active Application Discontinuation
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5547028A (en) * | 1994-09-12 | 1996-08-20 | Pes, Inc. | Downhole system for extending the life span of electronic components |
US5931000A (en) * | 1998-04-23 | 1999-08-03 | Turner; William Evans | Cooled electrical system for use downhole |
US20040199226A1 (en) * | 2000-12-09 | 2004-10-07 | Shadduck John H. | Thermotherapy device with superlattice cooling |
US20030236628A1 (en) * | 2002-06-25 | 2003-12-25 | Martorana Richard T. | Environmentally mitigated navigation system |
US20050115601A1 (en) * | 2003-12-02 | 2005-06-02 | Battelle Memorial Institute | Thermoelectric devices and applications for the same |
US20060213660A1 (en) * | 2005-03-23 | 2006-09-28 | Baker Hughes Incorporated | Downhole cooling based on thermo-tunneling of electrons |
US20080178920A1 (en) * | 2006-12-28 | 2008-07-31 | Schlumberger Technology Corporation | Devices for cooling and power |
Also Published As
Publication number | Publication date |
---|---|
WO2010014243A3 (en) | 2010-04-15 |
GB2476178A (en) | 2011-06-15 |
GB201101610D0 (en) | 2011-03-16 |
US20100024436A1 (en) | 2010-02-04 |
NO20110208A1 (en) | 2011-02-22 |
BRPI0917426A2 (en) | 2015-12-01 |
WO2010014243A2 (en) | 2010-02-04 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 20140730 |