GB2471186B - Avionics chassis - Google Patents

Avionics chassis

Info

Publication number
GB2471186B
GB2471186B GB1009835.8A GB201009835A GB2471186B GB 2471186 B GB2471186 B GB 2471186B GB 201009835 A GB201009835 A GB 201009835A GB 2471186 B GB2471186 B GB 2471186B
Authority
GB
United Kingdom
Prior art keywords
avionics chassis
avionics
chassis
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
GB1009835.8A
Other languages
English (en)
Other versions
GB201009835D0 (en
GB2471186A (en
Inventor
Meredith Marie Steenwyk
Danny Weldon Coxon
John Jay Streyle
Benjamin Jon Vander Ploeg
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
General Electric Co
Original Assignee
General Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by General Electric Co filed Critical General Electric Co
Publication of GB201009835D0 publication Critical patent/GB201009835D0/en
Publication of GB2471186A publication Critical patent/GB2471186A/en
Application granted granted Critical
Publication of GB2471186B publication Critical patent/GB2471186B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B64AIRCRAFT; AVIATION; COSMONAUTICS
    • B64DEQUIPMENT FOR FITTING IN OR TO AIRCRAFT; FLIGHT SUITS; PARACHUTES; ARRANGEMENT OR MOUNTING OF POWER PLANTS OR PROPULSION TRANSMISSIONS IN AIRCRAFT
    • B64D47/00Equipment not otherwise provided for
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20536Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
    • H05K7/20545Natural convection of gaseous coolant; Heat transfer by conduction from electronic boards
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00Casings, cabinets or drawers for electric apparatus
    • H05K5/02Details
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Casings For Electric Apparatus (AREA)
GB1009835.8A 2009-06-19 2010-06-14 Avionics chassis Active GB2471186B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US12/487,797 US8059409B2 (en) 2009-06-19 2009-06-19 Avionics chassis

Publications (3)

Publication Number Publication Date
GB201009835D0 GB201009835D0 (en) 2010-07-21
GB2471186A GB2471186A (en) 2010-12-22
GB2471186B true GB2471186B (en) 2013-10-02

Family

ID=42471537

Family Applications (1)

Application Number Title Priority Date Filing Date
GB1009835.8A Active GB2471186B (en) 2009-06-19 2010-06-14 Avionics chassis

Country Status (5)

Country Link
US (1) US8059409B2 (enExample)
JP (1) JP5624381B2 (enExample)
CA (1) CA2706208C (enExample)
DE (1) DE102010017437B4 (enExample)
GB (1) GB2471186B (enExample)

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US8427828B2 (en) * 2010-07-20 2013-04-23 Themis Computer Printed circuit board module enclosure and apparatus using same
US8345426B2 (en) * 2010-08-16 2013-01-01 Tyco Electronics Corporation Guide system for a card module
US8358506B2 (en) * 2010-08-27 2013-01-22 Direct Grid Technologies, LLC Mechanical arrangement for use within galvanically-isolated, low-profile micro-inverters for solar power installations
JP2013254784A (ja) * 2012-06-05 2013-12-19 Toshiba Corp 電子機器筐体のシャシー構造
US8873238B2 (en) * 2012-06-11 2014-10-28 The Boeing Company Chassis system and method for holding and protecting electronic modules
US8976525B2 (en) 2012-07-31 2015-03-10 General Electric Company Systems and methods for dissipating heat in an enclosure
US9198309B2 (en) * 2013-01-29 2015-11-24 Dell Products L.P. Carbon-fiber chassis of an information handling system
US20150000871A1 (en) * 2013-07-01 2015-01-01 Hamilton Sundstrand Corporation Housing with heat pipes integrated into enclosure fins
JP6344982B2 (ja) * 2014-06-04 2018-06-20 三菱重工業株式会社 複合材構造
US10120423B1 (en) * 2015-09-09 2018-11-06 Amazon Technologies, Inc. Unibody thermal enclosure
WO2017091997A1 (zh) * 2015-12-03 2017-06-08 深圳市大疆创新科技有限公司 散热系统及具有散热系统的飞行器
US10029808B2 (en) * 2016-02-29 2018-07-24 The Boeing Company Structurally integrated thermal management system for aerospace vehicles
US10039203B2 (en) 2016-07-12 2018-07-31 Hamilton Sundstrand Corporation Molded card guide chassis
US10727566B2 (en) 2017-02-10 2020-07-28 Dell Products L.P. Electrically functional structure integration in ultrathin foldable device
US10723437B2 (en) 2017-05-30 2020-07-28 The Boeing Company System for structurally integrated thermal management for thin wing aircraft control surface actuators
US11021271B2 (en) 2018-05-10 2021-06-01 SpinLaunch Inc. Ruggedized reaction wheel for use on kinetically launched satellites
US10645848B1 (en) * 2018-10-24 2020-05-05 Baidu Usa Llc Container structure with builtin heatsink for housing a sensor unit of an autonomous driving vehicle
FR3091140B1 (fr) * 2018-12-19 2020-12-11 Safran Electronics & Defense Boîtier comportant un dispositif de transfert de chaleur a base de picots metalliques inseres dans une paroi du boitier
US11483942B2 (en) 2019-12-18 2022-10-25 SpinLaunch Inc. Ruggedized avionics for use on kinetically launched vehicles
US11997815B2 (en) 2020-04-01 2024-05-28 Hamilton Sundstrand Corporation Wedge lock support columns in electronic chassis
US12213285B2 (en) * 2021-07-23 2025-01-28 Ametek, Inc. Conduction cooled chassis
US11825633B2 (en) * 2022-02-17 2023-11-21 Hamilton Sundstrand Corporation Circuit card assembly (CCA) module thermal interface devices
CN117163308A (zh) * 2023-07-27 2023-12-05 中电科微波通信(上海)股份有限公司 一种带有新型散热模块的机载吊舱
CN120528143B (zh) * 2025-07-25 2025-10-10 冈田精机(常州)有限公司 高速电主轴电机的转子结构及加工方法

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Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2145290A (en) * 1983-08-10 1985-03-20 Smiths Industries Plc Cooling avionics circuit modules
US4958257A (en) * 1989-03-29 1990-09-18 Hughes Aircraft Company Heat conducting interface for electronic module
US20090178821A1 (en) * 2008-01-16 2009-07-16 Zavidniak Martin P Modular Rack for Mounting Avionics Equipment
EP2159257A1 (en) * 2008-08-25 2010-03-03 Honeywell International Inc. Composite avionics chassis

Also Published As

Publication number Publication date
JP5624381B2 (ja) 2014-11-12
US8059409B2 (en) 2011-11-15
DE102010017437B4 (de) 2023-02-23
GB201009835D0 (en) 2010-07-21
JP2011003904A (ja) 2011-01-06
CA2706208A1 (en) 2010-12-19
DE102010017437A1 (de) 2011-01-05
GB2471186A (en) 2010-12-22
US20100321891A1 (en) 2010-12-23
CA2706208C (en) 2017-09-05

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