CA2706208C - Avionics chassis - Google Patents
Avionics chassis Download PDFInfo
- Publication number
- CA2706208C CA2706208C CA2706208A CA2706208A CA2706208C CA 2706208 C CA2706208 C CA 2706208C CA 2706208 A CA2706208 A CA 2706208A CA 2706208 A CA2706208 A CA 2706208A CA 2706208 C CA2706208 C CA 2706208C
- Authority
- CA
- Canada
- Prior art keywords
- heat
- avionics chassis
- housing
- card rail
- chassis assembly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 229920000049 Carbon (fiber) Polymers 0.000 claims description 42
- 239000004917 carbon fiber Substances 0.000 claims description 42
- 239000000835 fiber Substances 0.000 claims description 21
- 239000002131 composite material Substances 0.000 claims description 20
- 239000000853 adhesive Substances 0.000 claims description 17
- 230000001070 adhesive effect Effects 0.000 claims description 17
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 15
- 229910052751 metal Inorganic materials 0.000 claims description 14
- 239000002184 metal Substances 0.000 claims description 14
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 5
- 229910052799 carbon Inorganic materials 0.000 claims description 5
- 230000002787 reinforcement Effects 0.000 claims description 3
- 230000008878 coupling Effects 0.000 claims 1
- 238000010168 coupling process Methods 0.000 claims 1
- 238000005859 coupling reaction Methods 0.000 claims 1
- QHZSDTDMQZPUKC-UHFFFAOYSA-N 3,5-dichlorobiphenyl Chemical compound ClC1=CC(Cl)=CC(C=2C=CC=CC=2)=C1 QHZSDTDMQZPUKC-UHFFFAOYSA-N 0.000 description 34
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 19
- 229910052782 aluminium Inorganic materials 0.000 description 17
- 238000000034 method Methods 0.000 description 11
- 239000003351 stiffener Substances 0.000 description 10
- 239000011159 matrix material Substances 0.000 description 9
- 229920002239 polyacrylonitrile Polymers 0.000 description 9
- 239000004593 Epoxy Substances 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- 239000011295 pitch Substances 0.000 description 7
- 230000008901 benefit Effects 0.000 description 5
- 239000004020 conductor Substances 0.000 description 5
- 230000009286 beneficial effect Effects 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- 239000013585 weight reducing agent Substances 0.000 description 4
- 230000000712 assembly Effects 0.000 description 3
- 238000000429 assembly Methods 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- CREMABGTGYGIQB-UHFFFAOYSA-N carbon carbon Chemical compound C.C CREMABGTGYGIQB-UHFFFAOYSA-N 0.000 description 2
- 239000011203 carbon fibre reinforced carbon Substances 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000037361 pathway Effects 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 229910000952 Be alloy Inorganic materials 0.000 description 1
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- AZDRQVAHHNSJOQ-UHFFFAOYSA-N alumane Chemical group [AlH3] AZDRQVAHHNSJOQ-UHFFFAOYSA-N 0.000 description 1
- 230000003466 anti-cipated effect Effects 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 150000001721 carbon Chemical class 0.000 description 1
- 239000011304 carbon pitch Substances 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 238000007596 consolidation process Methods 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 230000005672 electromagnetic field Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000003733 fiber-reinforced composite Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 230000003116 impacting effect Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000011156 metal matrix composite Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000013508 migration Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000002296 pyrolytic carbon Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B64—AIRCRAFT; AVIATION; COSMONAUTICS
- B64D—EQUIPMENT FOR FITTING IN OR TO AIRCRAFT; FLIGHT SUITS; PARACHUTES; ARRANGEMENT OR MOUNTING OF POWER PLANTS OR PROPULSION TRANSMISSIONS IN AIRCRAFT
- B64D47/00—Equipment not otherwise provided for
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20536—Modifications to facilitate cooling, ventilating, or heating for racks or cabinets of standardised dimensions, e.g. electronic racks for aircraft or telecommunication equipment
- H05K7/20545—Natural convection of gaseous coolant; Heat transfer by conduction from electronic boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Aviation & Aerospace Engineering (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Casings For Electric Apparatus (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US12/487,797 US8059409B2 (en) | 2009-06-19 | 2009-06-19 | Avionics chassis |
| US12/487,797 | 2009-06-19 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CA2706208A1 CA2706208A1 (en) | 2010-12-19 |
| CA2706208C true CA2706208C (en) | 2017-09-05 |
Family
ID=42471537
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA2706208A Expired - Fee Related CA2706208C (en) | 2009-06-19 | 2010-06-03 | Avionics chassis |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US8059409B2 (enExample) |
| JP (1) | JP5624381B2 (enExample) |
| CA (1) | CA2706208C (enExample) |
| DE (1) | DE102010017437B4 (enExample) |
| GB (1) | GB2471186B (enExample) |
Families Citing this family (24)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8427828B2 (en) * | 2010-07-20 | 2013-04-23 | Themis Computer | Printed circuit board module enclosure and apparatus using same |
| US8345426B2 (en) * | 2010-08-16 | 2013-01-01 | Tyco Electronics Corporation | Guide system for a card module |
| US8358506B2 (en) * | 2010-08-27 | 2013-01-22 | Direct Grid Technologies, LLC | Mechanical arrangement for use within galvanically-isolated, low-profile micro-inverters for solar power installations |
| JP2013254784A (ja) * | 2012-06-05 | 2013-12-19 | Toshiba Corp | 電子機器筐体のシャシー構造 |
| US8873238B2 (en) * | 2012-06-11 | 2014-10-28 | The Boeing Company | Chassis system and method for holding and protecting electronic modules |
| US8976525B2 (en) | 2012-07-31 | 2015-03-10 | General Electric Company | Systems and methods for dissipating heat in an enclosure |
| US9198309B2 (en) * | 2013-01-29 | 2015-11-24 | Dell Products L.P. | Carbon-fiber chassis of an information handling system |
| US20150000871A1 (en) * | 2013-07-01 | 2015-01-01 | Hamilton Sundstrand Corporation | Housing with heat pipes integrated into enclosure fins |
| JP6344982B2 (ja) * | 2014-06-04 | 2018-06-20 | 三菱重工業株式会社 | 複合材構造 |
| US10120423B1 (en) * | 2015-09-09 | 2018-11-06 | Amazon Technologies, Inc. | Unibody thermal enclosure |
| WO2017091997A1 (zh) * | 2015-12-03 | 2017-06-08 | 深圳市大疆创新科技有限公司 | 散热系统及具有散热系统的飞行器 |
| US10029808B2 (en) * | 2016-02-29 | 2018-07-24 | The Boeing Company | Structurally integrated thermal management system for aerospace vehicles |
| US10039203B2 (en) | 2016-07-12 | 2018-07-31 | Hamilton Sundstrand Corporation | Molded card guide chassis |
| US10727566B2 (en) | 2017-02-10 | 2020-07-28 | Dell Products L.P. | Electrically functional structure integration in ultrathin foldable device |
| US10723437B2 (en) | 2017-05-30 | 2020-07-28 | The Boeing Company | System for structurally integrated thermal management for thin wing aircraft control surface actuators |
| US11021271B2 (en) | 2018-05-10 | 2021-06-01 | SpinLaunch Inc. | Ruggedized reaction wheel for use on kinetically launched satellites |
| US10645848B1 (en) * | 2018-10-24 | 2020-05-05 | Baidu Usa Llc | Container structure with builtin heatsink for housing a sensor unit of an autonomous driving vehicle |
| FR3091140B1 (fr) * | 2018-12-19 | 2020-12-11 | Safran Electronics & Defense | Boîtier comportant un dispositif de transfert de chaleur a base de picots metalliques inseres dans une paroi du boitier |
| US11483942B2 (en) | 2019-12-18 | 2022-10-25 | SpinLaunch Inc. | Ruggedized avionics for use on kinetically launched vehicles |
| US11997815B2 (en) | 2020-04-01 | 2024-05-28 | Hamilton Sundstrand Corporation | Wedge lock support columns in electronic chassis |
| US12213285B2 (en) * | 2021-07-23 | 2025-01-28 | Ametek, Inc. | Conduction cooled chassis |
| US11825633B2 (en) * | 2022-02-17 | 2023-11-21 | Hamilton Sundstrand Corporation | Circuit card assembly (CCA) module thermal interface devices |
| CN117163308A (zh) * | 2023-07-27 | 2023-12-05 | 中电科微波通信(上海)股份有限公司 | 一种带有新型散热模块的机载吊舱 |
| CN120528143B (zh) * | 2025-07-25 | 2025-10-10 | 冈田精机(常州)有限公司 | 高速电主轴电机的转子结构及加工方法 |
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| US7508670B1 (en) | 2007-08-14 | 2009-03-24 | Lockheed Martin Corporation | Thermally conductive shelf |
| US20090147472A1 (en) | 2007-12-11 | 2009-06-11 | Honeywell International Inc. | Means to Utilize Conduction-cooled Electronics Modules in an Air Cooled System |
| US8297450B2 (en) | 2008-01-16 | 2012-10-30 | Northrop Grumman Systems Corporation | Modular rack for mounting avionics equipment |
| US7869216B2 (en) | 2008-08-25 | 2011-01-11 | Honeywell International Inc. | Composite avionics chassis |
| US8222541B2 (en) * | 2009-06-19 | 2012-07-17 | General Electric Company | Avionics chassis |
| US8023267B2 (en) * | 2009-06-19 | 2011-09-20 | General Electric Company | Avionics chassis |
| US7911796B2 (en) * | 2009-06-19 | 2011-03-22 | General Electric Company | Avionics chassis |
-
2009
- 2009-06-19 US US12/487,797 patent/US8059409B2/en active Active
-
2010
- 2010-06-03 CA CA2706208A patent/CA2706208C/en not_active Expired - Fee Related
- 2010-06-14 GB GB1009835.8A patent/GB2471186B/en active Active
- 2010-06-17 DE DE102010017437.8A patent/DE102010017437B4/de active Active
- 2010-06-18 JP JP2010138952A patent/JP5624381B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP5624381B2 (ja) | 2014-11-12 |
| US8059409B2 (en) | 2011-11-15 |
| DE102010017437B4 (de) | 2023-02-23 |
| GB201009835D0 (en) | 2010-07-21 |
| JP2011003904A (ja) | 2011-01-06 |
| CA2706208A1 (en) | 2010-12-19 |
| DE102010017437A1 (de) | 2011-01-05 |
| GB2471186A (en) | 2010-12-22 |
| GB2471186B (en) | 2013-10-02 |
| US20100321891A1 (en) | 2010-12-23 |
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