GB2438800B8 - Apparatus and method for increased device lifetimein an organic electroluminescent device. - Google Patents

Apparatus and method for increased device lifetimein an organic electroluminescent device.

Info

Publication number
GB2438800B8
GB2438800B8 GB0718945A GB0718945A GB2438800B8 GB 2438800 B8 GB2438800 B8 GB 2438800B8 GB 0718945 A GB0718945 A GB 0718945A GB 0718945 A GB0718945 A GB 0718945A GB 2438800 B8 GB2438800 B8 GB 2438800B8
Authority
GB
United Kingdom
Prior art keywords
lifetimein
organic electroluminescent
increased
electroluminescent device
increased device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB0718945A
Other versions
GB0718945D0 (en
GB2438800A8 (en
GB2438800B (en
GB2438800A (en
Inventor
Russell Lees
Martin Richardson
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Cambridge Display Technology Ltd
Original Assignee
Cambridge Display Technology Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cambridge Display Technology Ltd filed Critical Cambridge Display Technology Ltd
Publication of GB0718945D0 publication Critical patent/GB0718945D0/en
Publication of GB2438800A publication Critical patent/GB2438800A/en
Application granted granted Critical
Publication of GB2438800B publication Critical patent/GB2438800B/en
Publication of GB2438800B8 publication Critical patent/GB2438800B8/en
Publication of GB2438800A8 publication Critical patent/GB2438800A8/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8428—Vertical spacers, e.g. arranged between the sealing arrangement and the OLED
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
    • H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
    • H01L23/26—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device including materials for absorbing or reacting with moisture or other undesired substances, e.g. getters
    • H01L51/5237—
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/842—Containers
    • H10K50/8426—Peripheral sealing arrangements, e.g. adhesives, sealants
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/846—Passivation; Containers; Encapsulations comprising getter material or desiccants
GB0718945A 2005-03-22 2006-03-17 Apparatus and method for increased device lifetimein an organic electroluminescent device. Expired - Fee Related GB2438800B8 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GBGB0505680.9A GB0505680D0 (en) 2005-03-22 2005-03-22 Apparatus and method for increased device lifetime in an organic electro-luminescent device
PCT/GB2006/000968 WO2006100444A1 (en) 2005-03-22 2006-03-17 Apparatus and method for increased device lifetime in an organic electro-luminescent device.

Publications (5)

Publication Number Publication Date
GB0718945D0 GB0718945D0 (en) 2007-11-07
GB2438800A GB2438800A (en) 2007-12-05
GB2438800B GB2438800B (en) 2010-09-22
GB2438800B8 true GB2438800B8 (en) 2011-01-26
GB2438800A8 GB2438800A8 (en) 2011-01-26

Family

ID=34531536

Family Applications (2)

Application Number Title Priority Date Filing Date
GBGB0505680.9A Ceased GB0505680D0 (en) 2005-03-22 2005-03-22 Apparatus and method for increased device lifetime in an organic electro-luminescent device
GB0718945A Expired - Fee Related GB2438800B8 (en) 2005-03-22 2006-03-17 Apparatus and method for increased device lifetimein an organic electroluminescent device.

Family Applications Before (1)

Application Number Title Priority Date Filing Date
GBGB0505680.9A Ceased GB0505680D0 (en) 2005-03-22 2005-03-22 Apparatus and method for increased device lifetime in an organic electro-luminescent device

Country Status (2)

Country Link
GB (2) GB0505680D0 (en)
WO (1) WO2006100444A1 (en)

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US7485968B2 (en) 2005-08-11 2009-02-03 Ziptronix, Inc. 3D IC method and device
DE102006061943B4 (en) 2006-12-29 2023-03-30 Pictiva Displays International Limited Light Emitting Device
US8830695B2 (en) 2007-01-25 2014-09-09 Osram Opto Semiconductors Gmbh Encapsulated electronic device
US8735219B2 (en) 2012-08-30 2014-05-27 Ziptronix, Inc. Heterogeneous annealing method and device
US20150262902A1 (en) 2014-03-12 2015-09-17 Invensas Corporation Integrated circuits protected by substrates with cavities, and methods of manufacture
US11069734B2 (en) 2014-12-11 2021-07-20 Invensas Corporation Image sensor device
CN104979373A (en) * 2015-05-26 2015-10-14 京东方科技集团股份有限公司 Substrate for display and display device
US9741620B2 (en) 2015-06-24 2017-08-22 Invensas Corporation Structures and methods for reliable packages
US9953941B2 (en) 2015-08-25 2018-04-24 Invensas Bonding Technologies, Inc. Conductive barrier direct hybrid bonding
US9852988B2 (en) 2015-12-18 2017-12-26 Invensas Bonding Technologies, Inc. Increased contact alignment tolerance for direct bonding
US10446532B2 (en) 2016-01-13 2019-10-15 Invensas Bonding Technologies, Inc. Systems and methods for efficient transfer of semiconductor elements
US10204893B2 (en) 2016-05-19 2019-02-12 Invensas Bonding Technologies, Inc. Stacked dies and methods for forming bonded structures
US10446487B2 (en) 2016-09-30 2019-10-15 Invensas Bonding Technologies, Inc. Interface structures and methods for forming same
US10580735B2 (en) 2016-10-07 2020-03-03 Xcelsis Corporation Stacked IC structure with system level wiring on multiple sides of the IC die
US10002844B1 (en) 2016-12-21 2018-06-19 Invensas Bonding Technologies, Inc. Bonded structures
JP2020503692A (en) 2016-12-29 2020-01-30 インヴェンサス ボンディング テクノロジーズ インコーポレイテッド Joint structure with integrated passive components
CN106784381B (en) * 2016-12-30 2019-04-19 固安翌光科技有限公司 A kind of encapsulating structure and the OLED device using encapsulating structure encapsulation
US10522499B2 (en) 2017-02-09 2019-12-31 Invensas Bonding Technologies, Inc. Bonded structures
WO2018169968A1 (en) 2017-03-16 2018-09-20 Invensas Corporation Direct-bonded led arrays and applications
US10508030B2 (en) 2017-03-21 2019-12-17 Invensas Bonding Technologies, Inc. Seal for microelectronic assembly
US10784191B2 (en) 2017-03-31 2020-09-22 Invensas Bonding Technologies, Inc. Interface structures and methods for forming same
US10879212B2 (en) 2017-05-11 2020-12-29 Invensas Bonding Technologies, Inc. Processed stacked dies
US10217720B2 (en) 2017-06-15 2019-02-26 Invensas Corporation Multi-chip modules formed using wafer-level processing of a reconstitute wafer
US10840205B2 (en) 2017-09-24 2020-11-17 Invensas Bonding Technologies, Inc. Chemical mechanical polishing for hybrid bonding
US11380597B2 (en) * 2017-12-22 2022-07-05 Invensas Bonding Technologies, Inc. Bonded structures
US10923408B2 (en) 2017-12-22 2021-02-16 Invensas Bonding Technologies, Inc. Cavity packages
US11169326B2 (en) 2018-02-26 2021-11-09 Invensas Bonding Technologies, Inc. Integrated optical waveguides, direct-bonded waveguide interface joints, optical routing and interconnects
US11056348B2 (en) 2018-04-05 2021-07-06 Invensas Bonding Technologies, Inc. Bonding surfaces for microelectronics
US11004757B2 (en) 2018-05-14 2021-05-11 Invensas Bonding Technologies, Inc. Bonded structures
US11276676B2 (en) 2018-05-15 2022-03-15 Invensas Bonding Technologies, Inc. Stacked devices and methods of fabrication
US11393779B2 (en) 2018-06-13 2022-07-19 Invensas Bonding Technologies, Inc. Large metal pads over TSV
EP3807927A4 (en) 2018-06-13 2022-02-23 Invensas Bonding Technologies, Inc. Tsv as pad
WO2020010056A1 (en) 2018-07-03 2020-01-09 Invensas Bonding Technologies, Inc. Techniques for joining dissimilar materials in microelectronics
WO2020010136A1 (en) 2018-07-06 2020-01-09 Invensas Bonding Technologies, Inc. Molded direct bonded and interconnected stack
WO2020010265A1 (en) 2018-07-06 2020-01-09 Invensas Bonding Technologies, Inc. Microelectronic assemblies
US11515291B2 (en) 2018-08-28 2022-11-29 Adeia Semiconductor Inc. Integrated voltage regulator and passive components
US11011494B2 (en) 2018-08-31 2021-05-18 Invensas Bonding Technologies, Inc. Layer structures for making direct metal-to-metal bonds at low temperatures in microelectronics
US11158573B2 (en) 2018-10-22 2021-10-26 Invensas Bonding Technologies, Inc. Interconnect structures
US11476213B2 (en) 2019-01-14 2022-10-18 Invensas Bonding Technologies, Inc. Bonded structures without intervening adhesive
US11901281B2 (en) 2019-03-11 2024-02-13 Adeia Semiconductor Bonding Technologies Inc. Bonded structures with integrated passive component
US11296053B2 (en) 2019-06-26 2022-04-05 Invensas Bonding Technologies, Inc. Direct bonded stack structures for increased reliability and improved yield in microelectronics
CN110429206B (en) * 2019-08-07 2021-11-23 京东方科技集团股份有限公司 Packaging cover plate, display device, display panel and packaging method of display panel
CN111048686A (en) * 2019-11-19 2020-04-21 Tcl华星光电技术有限公司 Display device and packaging method adopting same
US11762200B2 (en) 2019-12-17 2023-09-19 Adeia Semiconductor Bonding Technologies Inc. Bonded optical devices
US11631647B2 (en) 2020-06-30 2023-04-18 Adeia Semiconductor Bonding Technologies Inc. Integrated device packages with integrated device die and dummy element
US11728273B2 (en) 2020-09-04 2023-08-15 Adeia Semiconductor Bonding Technologies Inc. Bonded structure with interconnect structure
US11764177B2 (en) 2020-09-04 2023-09-19 Adeia Semiconductor Bonding Technologies Inc. Bonded structure with interconnect structure
US11264357B1 (en) 2020-10-20 2022-03-01 Invensas Corporation Mixed exposure for large die

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US6081071A (en) * 1998-05-18 2000-06-27 Motorola, Inc. Electroluminescent apparatus and methods of manufacturing and encapsulating
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TWI299632B (en) * 2001-09-28 2008-08-01 Sanyo Electric Co
JP3977669B2 (en) * 2002-03-07 2007-09-19 双葉電子工業株式会社 Organic EL device
US6998648B2 (en) * 2003-08-25 2006-02-14 Universal Display Corporation Protected organic electronic device structures incorporating pressure sensitive adhesive and desiccant
JP4534064B2 (en) * 2003-08-27 2010-09-01 奇美電子股▲ふん▼有限公司 Manufacturing method of organic EL display

Also Published As

Publication number Publication date
GB0505680D0 (en) 2005-04-27
GB0718945D0 (en) 2007-11-07
GB2438800A8 (en) 2011-01-26
GB2438800B (en) 2010-09-22
WO2006100444A1 (en) 2006-09-28
GB2438800A (en) 2007-12-05

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20180317