GB2427909A - Systems and methods for detecting defects in printed solder paste - Google Patents

Systems and methods for detecting defects in printed solder paste

Info

Publication number
GB2427909A
GB2427909A GB0500987A GB0500987A GB2427909A GB 2427909 A GB2427909 A GB 2427909A GB 0500987 A GB0500987 A GB 0500987A GB 0500987 A GB0500987 A GB 0500987A GB 2427909 A GB2427909 A GB 2427909A
Authority
GB
United Kingdom
Prior art keywords
image
systems
methods
axis
solder paste
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB0500987A
Other versions
GB2427909B (en
GB0500987D0 (en
Inventor
David P Prince
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Speedline Technologies Inc
Original Assignee
Speedline Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/734,395 external-priority patent/US6891967B2/en
Application filed by Speedline Technologies Inc filed Critical Speedline Technologies Inc
Publication of GB0500987D0 publication Critical patent/GB0500987D0/en
Publication of GB2427909A publication Critical patent/GB2427909A/en
Application granted granted Critical
Publication of GB2427909B publication Critical patent/GB2427909B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/70—Determining position or orientation of objects or cameras
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination
    • G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956—Inspecting patterns on the surface of objects
    • G01N21/95607—Inspecting patterns on the surface of objects using a comparative method
    • G06K9/4647—
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00—Image analysis
    • G06T7/0002—Inspection of images, e.g. flaw detection
    • G06T7/0004—Industrial image inspection
    • G06T7/004—
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V10/00—Arrangements for image or video recognition or understanding
    • G06V10/40—Extraction of image or video features
    • G06V10/50—Extraction of image or video features by performing operations within image blocks; by using histograms, e.g. histogram of oriented gradients [HoG]; by summing image-intensity values; Projection analysis
    • G06V10/507—Summing image-intensity values; Histogram projection analysis
    • H05K3/3484—
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3485—Applying solder paste, slurry or powder

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Computer Vision & Pattern Recognition (AREA)
  • Mechanical Engineering (AREA)
  • Analytical Chemistry (AREA)
  • Quality & Reliability (AREA)
  • Pathology (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Immunology (AREA)
  • Biochemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Multimedia (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)

Abstract

A method of analyzing an image of a substance deposited onto a substrate, the image comprising a plurality of pixels, includes defning a region of interest in the image, associating the region of interest with first and second perpendicular axis, wherein a set of pixels in the image lie along the first axis, converting the pixels in the region of interest to a single dimensional array aligned with the first axis and projecting along the second axis, and applying at least one threshold to the single dimensional array, the threshold based at least in part on a predetermined limit.
GB0500987A 2003-12-12 2004-12-10 Systems and methods for machine vision systems Expired - Fee Related GB2427909B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/734,395 US6891967B2 (en) 1999-05-04 2003-12-12 Systems and methods for detecting defects in printed solder paste
PCT/US2004/041462 WO2005059823A2 (en) 2003-12-12 2004-12-10 Systems and methods for detecting defects in printed solder paste

Publications (3)

Publication Number Publication Date
GB0500987D0 GB0500987D0 (en) 2005-02-23
GB2427909A true GB2427909A (en) 2007-01-10
GB2427909B GB2427909B (en) 2007-09-26

Family

ID=34227134

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0500987A Expired - Fee Related GB2427909B (en) 2003-12-12 2004-12-10 Systems and methods for machine vision systems

Country Status (1)

Country Link
GB (1) GB2427909B (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6366690B1 (en) * 1998-07-07 2002-04-02 Applied Materials, Inc. Pixel based machine for patterned wafers
US6549648B1 (en) * 1998-06-10 2003-04-15 Leica Microsystems Wetzlar Gmbh Method for determining a position of a structural element on a substrate

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6549648B1 (en) * 1998-06-10 2003-04-15 Leica Microsystems Wetzlar Gmbh Method for determining a position of a structural element on a substrate
US6366690B1 (en) * 1998-07-07 2002-04-02 Applied Materials, Inc. Pixel based machine for patterned wafers

Also Published As

Publication number Publication date
GB2427909B (en) 2007-09-26
GB0500987D0 (en) 2005-02-23

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20191210