GB0500987D0 - No title available - Google Patents

No title available

Info

Publication number
GB0500987D0
GB0500987D0 GBGB0500987.3A GB0500987A GB0500987D0 GB 0500987 D0 GB0500987 D0 GB 0500987D0 GB 0500987 A GB0500987 A GB 0500987A GB 0500987 D0 GB0500987 D0 GB 0500987D0
Authority
GB
United Kingdom
Prior art keywords
title available
title
available
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GBGB0500987.3A
Other versions
GB2427909A (en
GB2427909B (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Speedline Technologies Inc
Original Assignee
Speedline Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US10/734,395 external-priority patent/US6891967B2/en
Application filed by Speedline Technologies Inc filed Critical Speedline Technologies Inc
Publication of GB0500987D0 publication Critical patent/GB0500987D0/en
Publication of GB2427909A publication Critical patent/GB2427909A/en
Application granted granted Critical
Publication of GB2427909B publication Critical patent/GB2427909B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00Image analysis
    • G06T7/70Determining position or orientation of objects or cameras
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08Auxiliary devices therefor
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956Inspecting patterns on the surface of objects
    • G01N21/95607Inspecting patterns on the surface of objects using a comparative method
    • G06K9/4647
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06TIMAGE DATA PROCESSING OR GENERATION, IN GENERAL
    • G06T7/00Image analysis
    • G06T7/0002Inspection of images, e.g. flaw detection
    • G06T7/0004Industrial image inspection
    • G06T7/004
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06VIMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
    • G06V10/00Arrangements for image or video recognition or understanding
    • G06V10/40Extraction of image or video features
    • G06V10/50Extraction of image or video features by performing operations within image blocks; by using histograms, e.g. histogram of oriented gradients [HoG]; by summing image-intensity values; Projection analysis
    • G06V10/507Summing image-intensity values; Histogram projection analysis
    • H05K3/3484
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457Solder materials or compositions; Methods of application thereof
    • H05K3/3485Applying solder paste, slurry or powder
GB0500987A 2003-12-12 2004-12-10 Systems and methods for machine vision systems Expired - Fee Related GB2427909B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/734,395 US6891967B2 (en) 1999-05-04 2003-12-12 Systems and methods for detecting defects in printed solder paste
PCT/US2004/041462 WO2005059823A2 (en) 2003-12-12 2004-12-10 Systems and methods for detecting defects in printed solder paste

Publications (3)

Publication Number Publication Date
GB0500987D0 true GB0500987D0 (en) 2005-02-23
GB2427909A GB2427909A (en) 2007-01-10
GB2427909B GB2427909B (en) 2007-09-26

Family

ID=34227134

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0500987A Expired - Fee Related GB2427909B (en) 2003-12-12 2004-12-10 Systems and methods for machine vision systems

Country Status (1)

Country Link
GB (1) GB2427909B (en)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19825829C2 (en) * 1998-06-10 2000-07-27 Leica Microsystems Method for determining the distance P of an edge of a structural element on a substrate
US6366690B1 (en) * 1998-07-07 2002-04-02 Applied Materials, Inc. Pixel based machine for patterned wafers

Also Published As

Publication number Publication date
GB2427909A (en) 2007-01-10
GB2427909B (en) 2007-09-26

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20191210