GB2419893A - A method and a system for automatically controlling a current distribution of a multi-anode arrangement during the plating of a metal on a substrate surface - Google Patents

A method and a system for automatically controlling a current distribution of a multi-anode arrangement during the plating of a metal on a substrate surface Download PDF

Info

Publication number
GB2419893A
GB2419893A GB0605102A GB0605102A GB2419893A GB 2419893 A GB2419893 A GB 2419893A GB 0605102 A GB0605102 A GB 0605102A GB 0605102 A GB0605102 A GB 0605102A GB 2419893 A GB2419893 A GB 2419893A
Authority
GB
United Kingdom
Prior art keywords
plating
metal
substrate surface
current distribution
automatically controlling
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB0605102A
Other versions
GB0605102D0 (en
GB2419893B (en
Inventor
Matthias Bonkass
Dirk Wollstein
Axel Preusse
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advanced Micro Devices Inc
Original Assignee
Advanced Micro Devices Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE10345376A external-priority patent/DE10345376B4/en
Application filed by Advanced Micro Devices Inc filed Critical Advanced Micro Devices Inc
Publication of GB0605102D0 publication Critical patent/GB0605102D0/en
Publication of GB2419893A publication Critical patent/GB2419893A/en
Application granted granted Critical
Publication of GB2419893B publication Critical patent/GB2419893B/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors
    • C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/16—Electroplating with layers of varying thickness
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/12—Semiconductors

Abstract

An electroplating tool (200) is operated in combination with a controller (250), which automatically determines the individual currents for a multi-anode configuration (102A, ..., 102N) of the plating tool. The calculation of the anode currents may be based on sensitivity data and measurement data as well as on a desired target profile, so that a fast response with respect to process variations may be achieved even for a plating tool including a plurality of process chambers (101A, 101B).

Description

GB 2419893 A continuation (72) Inventor(s): Matthias Bonkass Dirk
Wolistein Axel Preusse (74) Agent and/or Address for Service: Brookes Batchellor LLP 102-1 08 Clerkenwell Road, LONDON, EC1M 5SA, United Kingdom
GB0605102A 2003-09-30 2004-09-17 A method and a system for automatically controlling a current distribution of a multi-anode arrangement during the plating of a metal on a substrate surface Expired - Fee Related GB2419893B (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10345376A DE10345376B4 (en) 2003-09-30 2003-09-30 A method and system for automatically controlling a current distribution of a multi-anode array during plating a metal onto a substrate surface
US10/861,997 US20050067290A1 (en) 2003-09-30 2004-06-04 Method and system for automatically controlling a current distribution of a multi-anode arrangement during the plating of a metal on a substrate surface
PCT/US2004/030761 WO2005033377A2 (en) 2003-09-30 2004-09-17 A method and a system for automatically controlling a current distribution of a multi-anode arrangement during the plating of a metal on a substrate surface

Publications (3)

Publication Number Publication Date
GB0605102D0 GB0605102D0 (en) 2006-04-26
GB2419893A true GB2419893A (en) 2006-05-10
GB2419893B GB2419893B (en) 2008-04-02

Family

ID=34424309

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0605102A Expired - Fee Related GB2419893B (en) 2003-09-30 2004-09-17 A method and a system for automatically controlling a current distribution of a multi-anode arrangement during the plating of a metal on a substrate surface

Country Status (4)

Country Link
JP (1) JP2007507615A (en)
KR (1) KR20060090822A (en)
GB (1) GB2419893B (en)
WO (1) WO2005033377A2 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2017295870B2 (en) 2016-07-13 2022-04-28 Iontra Inc Electrochemical methods, devices and compositions
CN110512248B (en) * 2018-05-21 2022-04-12 盛美半导体设备(上海)股份有限公司 Electroplating apparatus and electroplating method
IT201900013626A1 (en) 2019-08-01 2021-02-01 Fluid Metal 3D As PROCEDURE AND SYSTEM OF LOCALIZED ELECTROFORMING BY JETS WITH CLOSED-LOOP FEEDBACK IN REAL TIME
US10914000B1 (en) 2019-08-23 2021-02-09 Fabric8Labs, Inc. Method for manufacturing a printhead of an electrochemical additive manufacturing system
US11512404B2 (en) * 2019-08-23 2022-11-29 Fabric8Labs, Inc. Matrix-controlled printhead for an electrochemical additive manufacturing system
US11521864B2 (en) 2019-08-23 2022-12-06 Fabric8Labs, Inc. Electrochemical additive manufacturing method using deposition feedback control

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6027631A (en) * 1997-11-13 2000-02-22 Novellus Systems, Inc. Electroplating system with shields for varying thickness profile of deposited layer
WO2001091163A2 (en) * 2000-05-24 2001-11-29 Semitool, Inc. Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7189318B2 (en) * 1999-04-13 2007-03-13 Semitool, Inc. Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US7102763B2 (en) * 2000-07-08 2006-09-05 Semitool, Inc. Methods and apparatus for processing microelectronic workpieces using metrology

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6027631A (en) * 1997-11-13 2000-02-22 Novellus Systems, Inc. Electroplating system with shields for varying thickness profile of deposited layer
WO2001091163A2 (en) * 2000-05-24 2001-11-29 Semitool, Inc. Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece

Also Published As

Publication number Publication date
GB0605102D0 (en) 2006-04-26
KR20060090822A (en) 2006-08-16
GB2419893B (en) 2008-04-02
WO2005033377A2 (en) 2005-04-14
WO2005033377A3 (en) 2005-11-03
JP2007507615A (en) 2007-03-29

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20080917