GB2412790A8 - Process for the assembly of electronic devices - Google Patents

Process for the assembly of electronic devices

Info

Publication number
GB2412790A8
GB2412790A8 GB0407635A GB0407635A GB2412790A8 GB 2412790 A8 GB2412790 A8 GB 2412790A8 GB 0407635 A GB0407635 A GB 0407635A GB 0407635 A GB0407635 A GB 0407635A GB 2412790 A8 GB2412790 A8 GB 2412790A8
Authority
GB
United Kingdom
Prior art keywords
assembly
electronic devices
electronic
devices
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB0407635A
Other versions
GB2412790A (en
GB0407635D0 (en
GB2412790B (en
Inventor
Yan Cheong Chan
Tan Chee Wei
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
City University of Hong Kong CityU
Original Assignee
City University of Hong Kong CityU
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by City University of Hong Kong CityU filed Critical City University of Hong Kong CityU
Priority to GB0407635A priority Critical patent/GB2412790B/en
Publication of GB0407635D0 publication Critical patent/GB0407635D0/en
Publication of GB2412790A publication Critical patent/GB2412790A/en
Publication of GB2412790A8 publication Critical patent/GB2412790A8/en
Application granted granted Critical
Publication of GB2412790B publication Critical patent/GB2412790B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives
    • H05K3/323—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives by applying an anisotropic conductive adhesive layer over an array of pads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10128—Display
    • H05K2201/10136—Liquid Crystal display [LCD]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10636—Leadless chip, e.g. chip capacitor or resistor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10674—Flip chip
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/304—Protecting a component during manufacturing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/36—Assembling printed circuits with other printed circuits
    • H05K3/361—Assembling flexible printed circuits with other printed circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
GB0407635A 2004-04-02 2004-04-02 Process for assembly of electronic devices Expired - Fee Related GB2412790B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB0407635A GB2412790B (en) 2004-04-02 2004-04-02 Process for assembly of electronic devices

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB0407635A GB2412790B (en) 2004-04-02 2004-04-02 Process for assembly of electronic devices

Publications (4)

Publication Number Publication Date
GB0407635D0 GB0407635D0 (en) 2004-05-05
GB2412790A GB2412790A (en) 2005-10-05
GB2412790A8 true GB2412790A8 (en) 2007-10-23
GB2412790B GB2412790B (en) 2007-12-05

Family

ID=32247841

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0407635A Expired - Fee Related GB2412790B (en) 2004-04-02 2004-04-02 Process for assembly of electronic devices

Country Status (1)

Country Link
GB (1) GB2412790B (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7928591B2 (en) 2005-02-11 2011-04-19 Wintec Industries, Inc. Apparatus and method for predetermined component placement to a target platform
US20070187844A1 (en) * 2006-02-10 2007-08-16 Wintec Industries, Inc. Electronic assembly with detachable components
GB2490384B (en) * 2012-03-02 2013-07-24 Novalia Ltd Circuit board
CN104582235A (en) * 2013-10-15 2015-04-29 宏达国际电子股份有限公司 Composite type circuit board
US10394350B2 (en) * 2014-08-11 2019-08-27 Atmel Corporation Fabricated electrical circuit on touch sensor substrate
CN108777910B (en) * 2018-06-15 2020-05-12 武汉华星光电半导体显示技术有限公司 Flexible circuit board, display panel and display module

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0193102A (en) * 1987-10-05 1989-04-12 Alps Electric Co Ltd Soldering method for electronic parts
JP2002076589A (en) * 2000-08-31 2002-03-15 Hitachi Ltd Electronic device and its manufacturing method
DE10112355C1 (en) * 2001-03-13 2002-06-13 Daimler Chrysler Ag Temperature-sensitive electronic component mounting method uses removable protection device for protecting component during mounting process
JP2002299809A (en) * 2001-03-29 2002-10-11 Matsushita Electric Ind Co Ltd Electronic component mounting method and equipment

Also Published As

Publication number Publication date
GB2412790A (en) 2005-10-05
GB0407635D0 (en) 2004-05-05
GB2412790B (en) 2007-12-05

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Legal Events

Date Code Title Description
713F Application for mention of inventor (sect. 13(1)/1977) allowed
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20160402