GB2410328B - Multiple source alignment sensor with improved optics - Google Patents

Multiple source alignment sensor with improved optics

Info

Publication number
GB2410328B
GB2410328B GB0505532A GB0505532A GB2410328B GB 2410328 B GB2410328 B GB 2410328B GB 0505532 A GB0505532 A GB 0505532A GB 0505532 A GB0505532 A GB 0505532A GB 2410328 B GB2410328 B GB 2410328B
Authority
GB
United Kingdom
Prior art keywords
alignment sensor
multiple source
source alignment
improved optics
optics
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB0505532A
Other versions
GB2410328A (en
GB0505532D0 (en
Inventor
David D Madsen
David M Kranz
Frederick M Ii Cash
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Cyberoptics Corp
Original Assignee
Cyberoptics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cyberoptics Corp filed Critical Cyberoptics Corp
Publication of GB0505532D0 publication Critical patent/GB0505532D0/en
Publication of GB2410328A publication Critical patent/GB2410328A/en
Application granted granted Critical
Publication of GB2410328B publication Critical patent/GB2410328B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08Monitoring manufacture of assemblages
    • H05K13/081Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0812Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines the monitoring devices being integrated in the mounting machine, e.g. for monitoring components, leads, component placement
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04Mounting of components, e.g. of leadless components
    • H05K13/0404Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0413Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01BMEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00Measuring arrangements characterised by the use of optical techniques
    • G01B11/14Measuring arrangements characterised by the use of optical techniques for measuring distance or clearance between spaced objects or spaced apertures

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Operations Research (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Optical Measuring Cells (AREA)
  • Infusion, Injection, And Reservoir Apparatuses (AREA)
  • Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
GB0505532A 2002-08-29 2003-08-29 Multiple source alignment sensor with improved optics Expired - Fee Related GB2410328B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US40682202P 2002-08-29 2002-08-29
PCT/US2003/027236 WO2004021759A1 (en) 2002-08-29 2003-08-29 Multiple source alignment sensor with improved optics

Publications (3)

Publication Number Publication Date
GB0505532D0 GB0505532D0 (en) 2005-04-27
GB2410328A GB2410328A (en) 2005-07-27
GB2410328B true GB2410328B (en) 2006-06-07

Family

ID=31978363

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0505532A Expired - Fee Related GB2410328B (en) 2002-08-29 2003-08-29 Multiple source alignment sensor with improved optics

Country Status (5)

Country Link
JP (1) JP2005537648A (en)
KR (1) KR101022302B1 (en)
DE (1) DE10393193T5 (en)
GB (1) GB2410328B (en)
WO (1) WO2004021759A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IES20040818A2 (en) 2004-12-06 2006-06-14 Brian Francis Mooney Method and apparatus for measuring a golf stroke
US7623250B2 (en) * 2005-02-04 2009-11-24 Stryker Leibinger Gmbh & Co. Kg. Enhanced shape characterization device and method
JP4975508B2 (en) * 2007-04-19 2012-07-11 株式会社 ソキア・トプコン Tilt angle detector
JP5202100B2 (en) * 2008-05-20 2013-06-05 富士機械製造株式会社 Holding device with imaging device
GB2465024B (en) * 2008-11-08 2011-01-12 Adaptive Automation Ltd Shadow sensing apparatus
KR101270007B1 (en) * 2011-10-13 2013-06-03 경북대학교 산학협력단 An apparatus of measuring positional information of an object

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5897611A (en) * 1994-08-11 1999-04-27 Cyberoptics Corporation High precision semiconductor component alignment systems
US6292261B1 (en) * 1998-05-22 2001-09-18 Cyberoptics Corporation Rotary sensor system with at least two detectors
US20020070362A1 (en) * 1998-10-30 2002-06-13 Duquette David W. Angle rejection filter
WO2002060232A1 (en) * 2001-01-22 2002-08-01 Cyberoptics Corporation Improved laser align sensor for positioning components

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5897611A (en) * 1994-08-11 1999-04-27 Cyberoptics Corporation High precision semiconductor component alignment systems
US6292261B1 (en) * 1998-05-22 2001-09-18 Cyberoptics Corporation Rotary sensor system with at least two detectors
US20020070362A1 (en) * 1998-10-30 2002-06-13 Duquette David W. Angle rejection filter
WO2002060232A1 (en) * 2001-01-22 2002-08-01 Cyberoptics Corporation Improved laser align sensor for positioning components

Also Published As

Publication number Publication date
KR101022302B1 (en) 2011-03-21
GB2410328A (en) 2005-07-27
KR20050059149A (en) 2005-06-17
JP2005537648A (en) 2005-12-08
GB0505532D0 (en) 2005-04-27
DE10393193T5 (en) 2005-09-29
WO2004021759A1 (en) 2004-03-11

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20090829