GB2396748A - Integrated pcb support and screening can - Google Patents
Integrated pcb support and screening can Download PDFInfo
- Publication number
- GB2396748A GB2396748A GB0230182A GB0230182A GB2396748A GB 2396748 A GB2396748 A GB 2396748A GB 0230182 A GB0230182 A GB 0230182A GB 0230182 A GB0230182 A GB 0230182A GB 2396748 A GB2396748 A GB 2396748A
- Authority
- GB
- United Kingdom
- Prior art keywords
- pcb
- assembly
- screening
- fingers
- screened
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000012216 screening Methods 0.000 title claims abstract description 47
- 230000002093 peripheral effect Effects 0.000 claims abstract description 17
- 238000007747 plating Methods 0.000 claims abstract description 9
- 239000000853 adhesive Substances 0.000 claims abstract description 5
- 230000001070 adhesive effect Effects 0.000 claims abstract description 5
- 238000000034 method Methods 0.000 claims description 20
- 239000007769 metal material Substances 0.000 claims description 3
- FPWNLURCHDRMHC-UHFFFAOYSA-N 4-chlorobiphenyl Chemical compound C1=CC(Cl)=CC=C1C1=CC=CC=C1 FPWNLURCHDRMHC-UHFFFAOYSA-N 0.000 abstract description 9
- 238000005476 soldering Methods 0.000 abstract description 4
- 238000000429 assembly Methods 0.000 description 4
- 230000000712 assembly Effects 0.000 description 2
- XOMKZKJEJBZBJJ-UHFFFAOYSA-N 1,2-dichloro-3-phenylbenzene Chemical compound ClC1=CC=CC(C=2C=CC=CC=2)=C1Cl XOMKZKJEJBZBJJ-UHFFFAOYSA-N 0.000 description 1
- MTLMVEWEYZFYTH-UHFFFAOYSA-N 1,3,5-trichloro-2-phenylbenzene Chemical compound ClC1=CC(Cl)=CC(Cl)=C1C1=CC=CC=C1 MTLMVEWEYZFYTH-UHFFFAOYSA-N 0.000 description 1
- XBBZAULFUPBZSP-UHFFFAOYSA-N 2,4-dichloro-1-(3-chlorophenyl)benzene Chemical compound ClC1=CC(Cl)=CC=C1C1=CC=CC(Cl)=C1 XBBZAULFUPBZSP-UHFFFAOYSA-N 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
- H05K9/0026—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields integrally formed from metal sheet
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0382—Continuously deformed conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10371—Shields or metal cases
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
Abstract
A PCB 3 is supported by and within a shielding can 4 along its extreme peripheral edges only, e.g. by snapping into engagement with half shear portions 6a and dimples 6c on support fingers 6. An electrically conductive plating 3a ensures good electrical contact between the printed circuit board 3 and the screening can 4. The shielding arrangement may be attached to the motherboard 1 by the free ends of the support fingers by soldering or by a conductive adhesive.
Description
1 - 2396748
Screening Electrical / Electronic Components This invention relates to a method of screening electrical/electronic components mounted on a support surface such as a printed circuit board (PCB), and to a PCB 5 assembly constituted by a PCB and screen the electrical/electronic components.
Small electrical/electronic components, modules or sub-assemblies mounted on a PCB can require screening from other components or devices, to minimise electromagnetic interference (EMI). Known screening mechanisms are constituted by metal cans, or 10 metalised parts made of plastics material. These can be expensive to produce and/or assemble, and consume space, which makes it difficult to accommodate them in high density circuits. Thus, many known types of screening can require areas on the PCB surface for mounting, either by soldering or by fixing using conductive adhesive. It is also known to fix a screening can to a PCB using clip-on techniques. Unfortunately, 15 known clip-on cans also require some PCB surface area for clip-on contact, and consist of two or even three pieces for double-sided screening. This adds to the cost of screening, and increases the height of the overall screened assemblies.
The aim of the invention is to provide a single-piece clip-on screening can that requires 20 substantially less of the PCB surface area for mounting.
The present invention provides a PCB assembly comprising a PCB and a screening can, the screening can being formed with means for supporting the PCB at the extreme peripheral edge portions thereof only.
Advantageously, the screening can support means contact the peripheral side edges of the PCB and the immediately adjacent portions of the major surfaces of the PCB only.
Preferably, the screening can is made of a resilient metallic material.
30 In a preferred embodiment, the screening can is constituted by a generally planar base plate and a plurality of fingers extending substantially perpendicular thereto in a given
direction for engagement with the peripheral side edges of the PCB, the fingers being formed with inwardly-extending support portions for engagement with said immediately adjacent portions of the major surfaces of the PCB. In this case, the arrangement may be such that the PCB is snap-engageable with the screening can with 5 the peripheral side edges of the PCB in electrical contact with adjacent surfaces of the fingers. Conveniently, the peripheral side edges of the PCB are provided with an electrically-conductive plating, and preferably, the electricallyconductive plating l O extends over said immediately adjacent portions of the major surfaces of the PCB.
Advantageously, a first plurality of fingers each has a first support portion positioned a first predetermined distance from the free end of that finger, and a second plurality of fingers each has a second support portion positioned a second predetermined distance 15 from the free end of that finger. Each first support portion may be constituted by a respective in-turned, partially cut-out part of the respective finger, and each second support portion may be constituted by a respective in- turned dimpled part of the respective finger. Preferably, the distance between the first and second predetermined distances is substantially equal to the thickness of the PCB.
The invention also provides a method of assembling a screened PCB assembly, the method comprising the step of mounting a PCB within a screening can with substantially only the peripheral side walls of the PCB and the immediately adjacent portions of the major surfaces of the PCB in contact with the screening can.
Preferably, the method further comprises the step of snap engaging the PCB within support means formed within the screening can.
This method may further comprise step of plating the peripheral side walls of the PCB 30 and said immediately adjacent portions of the major surfaces of the PCB prior to mounting the PCB within the screening can.
The invention further provides a method of providing a screened PCB assembly on a motherboard, the method comprising assembling a screened PCB assembly as defined above, and fixing the screened PCB assembly to the motherboard.
5 The invention still further provides a method of providing a screened PCB assembly on a motherboard, the screened PCB assembly being as defined above, the method comprising assembling the screened PCB assembly as defined above, and fixing the screened PCB assembly to the motherboard at the free ends of the fingers.
10 Preferably, the free ends of the fingers are soldered to the motherboard, or are fixed to the motherboard by means of a conductive adhesive.
The invention will now be described in greater detail, by way of example, with reference to the drawings, in which: 15 Figure 1 is a plan view of a motherboard provided with a screened PCB assembly constructed in accordance with the invention; Figure 2 is a cross section taken on the line AA of Figure 1; Figure 3 is an enlarged view of that part of Figure 2 contained within the circle Z.; Figure 4 is a perspective view of the screened PCB assembly from one side 20 thereof; and Figure 5 is a perspective view of the screened PCB assembly from the other side thereof. Referring to the drawings, Figure 1 shows a motherboard 1 and screened PCB 25 assembly, indicated generally by the reference numeral 2. As shown in Figure 2, the assembly 2 is constituted by a PCB 3 and a screening can 4.
The screening can 4 (see Figure 4) is constituted by a generally rectangular base plate 5 and a plurality of fingers 6 positioned along the peripheral edges of the base plate and 30 extending at right-angles thereto. The screening can 4 is formed by punching and forming from sheet metal material which is substantially 0.2mm thick. The two fingers 6 at each end of each side of the base plate 5 (that is to say the fingers immediately
adjacent to the corners of the base plate) are each formed with a semicircular indented portion 6a whose diametrical upper portion is cut away from the rest of that finger, thereby defining a half-shear portion having a planar support surface 6b (see Figure 3) which is inwardly offset from the plane of that finger. Each of the remaining fingers 6 5 is formed with a respective inwardly-extending dimple 6c. The dimples 6c are aligned with one and other, and spaced from the half-shear portions 6a so that, in use, the PCB 3 can be snapped into position so as to be firmly held between the half-shear portions and the dimples (see Figure 5) .
10 In use, the PCB 3 is snapped into position between the half-shear portions 6a and the dimples 6c so that a plating 3a around the edge of the PCB contacts the inside surface of the screening can 4 between the half-shear portions and the dimples (see Figure 3).
The half-shear portions 6a and the dimples 6c ensure correct positioning of the PCB 3 within the screening can 4. The contact between the plating 3a and the inside surface of 15 the screening can 4 ensures good electrical contact therebetween. This electrical contact over the entire thickness of the PCB 3 is ensured by the natural resilience of the fingers 6 once the PCB 3 has been snapped into position inside the screening can 4.
The PCB/screening can assembly is then fixed to the motherboard 1 by fixing the free edge portions 6d of the fingers 6 to the motherboard. This fixing is effected by either 20 reflow soldering with solder paste applied to the motherboard 1, by hand soldering, or by the use of a conductive adhesive.
It will be apparent that the PCB/screening can assembly 2 described above has a number of advantages when compared with known such assemblies. In particular, the 25 screening can 4 is fixed to the PCB 3 in such a manner that the screening can contacts the major surfaces of the PCB only at the extreme peripheral portions thereof, thereby ensuring that practically all of those major surfaces can be used for mounting electrical/electronic components, modules or sub-assemblies. Moreover, the screening can 4 is of one-piece construction which ensures reduced costs. The screening can 4 30 also has a configuration which permits the motherboard 1 itself to form the "lid" of the screening can, thereby obviating the need for a separate component, and hence resulting in an overall motherboard/PCB/screening can assembly of reduced height. Moreover,
manufactureability is increased, as the screening can 4 is fitted to the PCB 3 after SMT assembly, thereby allowing easy access to all components during all stages of assembly and rework.
Claims (18)
1. A PCB assembly comprising a PCB and a screening can, the screening can being formed with means for supporting the PCB at the extreme peripheral edge 5 portions thereof only.
2. An assembly as claimed in claim 1, wherein the screening can support means contact the peripheral side edges of the PCB and the immediately adjacent portions of the major surfaces of the PCB only.
3. An assembly as claimed in claim I or claim 2, wherein the screening can is made of a resilient metallic material.
4. An assembly as claimed in any one of claims I to 3, wherein the screening can 15 is constituted by a generally planar base plate and a plurality of fingers extending substantially perpendicular thereto in a given direction for engagement with the peripheral side edges of the PCB, the fingers being formed with inwardly-extending support portions for engagement with said immediately adjacent portions of the major surfaces of the PCB.
5. An assembly as claimed in claim 4, wherein the arrangement is such that the PCBis snap-engageable with the screening can with the peripheral side edges of the PCB in electrical contact with adjacent surfaces of the fingers.
25
6. An assembly as claimed in claim 4 or claim 5, wherein the peripheral side edges of the PCB are provided with an electrically- conductive plating.
7. An assembly as claimed in claim 6, wherein the electrically-conductive plating extends over said immediately adjacent portions of the major surfaces of the PCB.
8. An assembly as claimed in any one of claims 4 to 7, wherein a first plurality of fingers each has a first support portion positioned a first predetermined distance from
the free end of that finger, and a second plurality of fingers each has a second support portion positioned a second predetermined distance from the free end of that finger.
9. An assembly as claimed in claim 8, wherein each first support portion is 5 constituted by a respective in-turned, partially cut-out part of the respective finger.
10. An assembly as claimed in claim 8 or claim 9, wherein each second support portion is constituted by a respective in-turned dimpled part of the respective finger.
10
11. An assembly as claimed in any one of claims 8 to 10, wherein the distance between the first and second predetermined distances is substantially equal to the thickness of the PCB.
12. A method of assembling a screened PCB assembly, the method comprising the 15 step of mounting a PCB within a screening can with substantially only the peripheral side walls of the PCB and the immediately adjacent portions of the major surfaces of the PCB in contact with the screening can.
13. A method as claimed in claim 12, further comprising the step of snap engaging 20 the PCB within support means formed within the screening can.
14. A method as claimed in claim 11 or claim 12, further comprising the step of plating the peripheral side walls of the PCB and said immediately adjacent portions of the major surfaces of the PCB prior to mounting the PCB within the screening can.
15. A method of providing a screened PCB assembly on a motherboard, the method comprising assembling a screened PCB assembly as claimed in any one of claims 12 to 14, and fixing the screened PCB assembly to the motherboard.
30
16. A method of providing a screened PCB assembly on a motherboard, the screened PCB assembly being as claimed in any one of claims 4 to 11, the method comprising assembling the screened PCB assembly as claimed in any one of claims 12
to 14, and fixing the screened PCB assembly to the motherboard at the free ends of the fingers.
17. A method as claimed in claim 16, wherein the free ends of the fingers are 5 soldered to the motherboard.
18. A method as claimed in claim 16, wherein the free ends of the fingers are fixed to the motherboard by means of a conductive adhesive.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB0230182A GB2396748B (en) | 2002-12-24 | 2002-12-24 | Screening electrical/electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB0230182A GB2396748B (en) | 2002-12-24 | 2002-12-24 | Screening electrical/electronic components |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| GB0230182D0 GB0230182D0 (en) | 2003-02-05 |
| GB2396748A true GB2396748A (en) | 2004-06-30 |
| GB2396748B GB2396748B (en) | 2006-06-07 |
Family
ID=9950440
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB0230182A Expired - Fee Related GB2396748B (en) | 2002-12-24 | 2002-12-24 | Screening electrical/electronic components |
Country Status (1)
| Country | Link |
|---|---|
| GB (1) | GB2396748B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2031950A1 (en) * | 2007-08-31 | 2009-03-04 | Laird Technologies, Inc. | Electromagnetic interference shields and related manufacturing methods |
| KR20170066990A (en) * | 2015-12-07 | 2017-06-15 | 삼성전자주식회사 | Electronic device having cable supporting structure |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4339628A (en) * | 1980-08-20 | 1982-07-13 | Northern Telecom Limited | RF Shielding support for stacked electrical circuit boards |
| JPH01322074A (en) * | 1988-06-24 | 1989-12-27 | Takenaka Komuten Co Ltd | Vibro-isolating device for building |
| DE19622837A1 (en) * | 1995-06-08 | 1996-12-12 | Alps Electric Co Ltd | Shielding housing |
| DE19630966A1 (en) * | 1995-08-31 | 1997-03-06 | Siemens Ag | Process for producing a housing part with shielding effect for radio devices |
| EP0888040A2 (en) * | 1997-06-25 | 1998-12-30 | Nec Corporation | Structure for shielding an electronic circuit from radio waves |
| US6118347A (en) * | 1998-01-30 | 2000-09-12 | Mitsumi Electric Co., Ltd. | Voltage controlled oscillator mounting assembly |
| JP2001332832A (en) * | 2000-05-19 | 2001-11-30 | Olympus Optical Co Ltd | Medical electric apparatus |
-
2002
- 2002-12-24 GB GB0230182A patent/GB2396748B/en not_active Expired - Fee Related
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4339628A (en) * | 1980-08-20 | 1982-07-13 | Northern Telecom Limited | RF Shielding support for stacked electrical circuit boards |
| JPH01322074A (en) * | 1988-06-24 | 1989-12-27 | Takenaka Komuten Co Ltd | Vibro-isolating device for building |
| DE19622837A1 (en) * | 1995-06-08 | 1996-12-12 | Alps Electric Co Ltd | Shielding housing |
| DE19630966A1 (en) * | 1995-08-31 | 1997-03-06 | Siemens Ag | Process for producing a housing part with shielding effect for radio devices |
| EP0888040A2 (en) * | 1997-06-25 | 1998-12-30 | Nec Corporation | Structure for shielding an electronic circuit from radio waves |
| US6118347A (en) * | 1998-01-30 | 2000-09-12 | Mitsumi Electric Co., Ltd. | Voltage controlled oscillator mounting assembly |
| JP2001332832A (en) * | 2000-05-19 | 2001-11-30 | Olympus Optical Co Ltd | Medical electric apparatus |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP2031950A1 (en) * | 2007-08-31 | 2009-03-04 | Laird Technologies, Inc. | Electromagnetic interference shields and related manufacturing methods |
| US7504592B1 (en) | 2007-08-31 | 2009-03-17 | Laird Technologies, Inc. | Electromagnetic interference shields and related manufacturing methods |
| KR20170066990A (en) * | 2015-12-07 | 2017-06-15 | 삼성전자주식회사 | Electronic device having cable supporting structure |
| EP3196980A1 (en) * | 2015-12-07 | 2017-07-26 | Samsung Electronics Co., Ltd. | Electronic device including cable supporting structure |
| US9854678B2 (en) | 2015-12-07 | 2017-12-26 | Samsung Electronics Co., Ltd | Electronic device including cable supporting structure |
| KR102420101B1 (en) | 2015-12-07 | 2022-07-13 | 삼성전자주식회사 | Electronic device having cable supporting structure |
Also Published As
| Publication number | Publication date |
|---|---|
| GB0230182D0 (en) | 2003-02-05 |
| GB2396748B (en) | 2006-06-07 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 732E | Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977) | ||
| PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 20061224 |