GB2390477A - Electron beam plotter - Google Patents

Electron beam plotter Download PDF

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Publication number
GB2390477A
GB2390477A GB0302450A GB0302450A GB2390477A GB 2390477 A GB2390477 A GB 2390477A GB 0302450 A GB0302450 A GB 0302450A GB 0302450 A GB0302450 A GB 0302450A GB 2390477 A GB2390477 A GB 2390477A
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United Kingdom
Prior art keywords
electron
electron beam
apertures
sample
electron gun
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Granted
Application number
GB0302450A
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GB2390477B (en
GB0302450D0 (en
Inventor
Nobuki Yamaoka
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Pioneer Corp
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Pioneer Corp
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Publication of GB0302450D0 publication Critical patent/GB0302450D0/en
Publication of GB2390477A publication Critical patent/GB2390477A/en
Application granted granted Critical
Publication of GB2390477B publication Critical patent/GB2390477B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/04—Arrangements of electrodes and associated parts for generating or controlling the discharge, e.g. electron-optical arrangement, ion-optical arrangement
    • H01J37/045—Beam blanking or chopping, i.e. arrangements for momentarily interrupting exposure to the discharge
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B7/00—Recording or reproducing by optical means, e.g. recording using a thermal beam of optical radiation by modifying optical properties or the physical structure, reproducing using an optical beam at lower power by sensing optical properties; Record carriers therefor
    • G11B7/24—Record carriers characterised by shape, structure or physical properties, or by the selection of the material
    • G11B7/26—Apparatus or processes specially adapted for the manufacture of record carriers
    • G11B7/261—Preparing a master, e.g. exposing photoresist, electroforming
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/02—Details
    • H01J37/023—Means for mechanically adjusting components not otherwise provided for
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B11/00—Recording on or reproducing from the same record carrier wherein for these two operations the methods are covered by different main groups of groups G11B3/00 - G11B7/00 or by different subgroups of group G11B9/00; Record carriers therefor
    • G11B11/03—Recording on or reproducing from the same record carrier wherein for these two operations the methods are covered by different main groups of groups G11B3/00 - G11B7/00 or by different subgroups of group G11B9/00; Record carriers therefor using recording by deforming with non-mechanical means, e.g. laser, beam of particles
    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
    • G11B5/84—Processes or apparatus specially adapted for manufacturing record carriers
    • G11B5/8404—Processes or apparatus specially adapted for manufacturing record carriers manufacturing base layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/20—Positioning, supporting, modifying or maintaining the physical state of objects being observed or treated
    • H01J2237/2007—Holding mechanisms

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  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Electron Beam Exposure (AREA)
  • Electron Sources, Ion Sources (AREA)
  • Optical Recording Or Reproduction (AREA)

Abstract

An electron beam plotter for plotting a pattern on the surface of a sample, includes an electron gun 41, an electron gun barrel 48, an electron beam ejection head section 40, an adjusting mechanism 57 and current amount measurement means 71,72. The electron gun 41 irradiates electron beams onto a surface of the sample 15. The electron beam ejection head section 40 is provided on an electron beam path from the electron gun to the sample. The electron beam ejection head section has a plurality of apertures 44a,44b, each made of conductive material. The adjusting mechanism 57 holds the plurality of apertures via insulators in a position-adjustable way and the current amount measurement means 71,72 measures the amount of current flowing across each of the plurality of apertures and the ground. This allows sequential determination on whether the apertures are correctly aligned and also allows for secure adjustment so as to prevent unintended cut off action of electron beam.

Description

ELECTRON BEAM PLOTTER
Thepresentinventionrelatestoanelectronbeamplotter, and in particular to an electron beam plotter used to irradiate electron beams onto a disc such es en optical disc es a recording medium for recording audio data and image data as digital data 10 to manufacture an original disc.
Conventionally,varioustechnologieshavebeendeveloped as recording media for recording audio data and image data as 15 digital data. Optical discs such as DVDs (Digital Versatile Discs) have been developed in the course of such development of technologies. In recent years, ongoing Research and Development (R&D) effortshavefocusedonpackingalargestorage capacity of 30 GB (Gigabytes) onto an optical disc 12 cm in 20 diameter.
Similarly, electron beams are used and R&D efforts made for high density integration in the manufacturing of disc substrates such as hard disks ofthe magnetic recording System.
In order to attain such high density integration, use 25 of an electron beam instead of related art laser beams in the
visible and ultraviolet spectrums enhances the recording resolution. In the case of manufacturing optical discs for example, a resist layer for electron rays is applied on the surface of a substrate, electron beams are irradiated onto the 5 substrate surface in a vacuum atmosphere, development, patterning and resist removal processing is made, then a fine irregularity pattern is formed on the substrate surface for later data recording.
Also in the manufacture of disc substrate such as hard 10 disks ofthemagnetic recording system, electron beams are used to form a fine irregularity pattern.
To obtain high resolution via such electron beam exposure means, itisnecessarytoconvergetheelectronbeamsirradiated onto the substrate surface as fine as possible. Such control 15 results in the speed of the electron beams being unnecessarily high and the irradiated electron beams are not completely absorbed by a resist layer for electron rays but part of the electron beams passes through the layer, thus reducing the exposure amount and lowering recording resolution.
20 The following paragraphs describe a related art electron beam plotter that employs the technologies for solving the problems caused by acceleration of electron beams mentioned earlier. Fig. 3 is a block diagram showing the configuration of a related art electron beam plotter.
25 ArelatedartelectronbeamplottershowninFig.3includes,
as major components, a vacuum chamber 911 for processing a disc substrate915inavacuumatmosphere, a height defecting section 924 for detecting the height of the main surface of the disc substrate 915, a CPU 925 for controlling the entire system, 5 a vacuum pump 928 for maintaining the internal atmosphere of the vacuum chamber 911 under vacuum, a drive controller 930 for performing spindle control of the disc substrate 915, an electron beam ejection head 940 for generating electron beams irradiated onto the surface of the disc substrate 915, an 10 electron gun power source951 for supplying power to an electron gun941mentionedlater, a recording controller952 for seeding an operation signal to a blanking drive section 954 mentioned later, a drive section 957 for controlling the components in the electron beam ejection head 940, and a voltage source 960 15 for decelerating the electron ray speed of electron beams.
The vacuum chamber 911 comprises a light source 922 and aphotodetector923fordetectingtheheightofthemainsurface of the disc substrate 915, a turntable 916 for mounting the disc substrate 915, an air spindle motor 917 for rotating the 20turntable 916, and a feed stage 918 for horizontally feeding the turntable gl6 and the air spindle motor 917.
The electron beam ejection head 940 includes an electron gun 941 for irradiating electron beams, a convergent lens 942 for converging electron beams, blanking electrodes 943 and 25apertures 944a, 944b for controlling on/off of the electron
gun, beam polarization electrodes 945 for controlling the position of the electron beam spot irradiated onto the surface of the disc substrate 915, a focus adjusting lens 946 for adjustingthefocusofelectronbeamsirradiatedontothesurface 5 of the disc substrate 915, an objectivelens 947 for converging the electron beams to an electron beam spot, an electron gun barrel 948 for storing these components, and an electron beam irradiation port 949 for irradiating electron beams from the electron gun barrel 948.
10 The drive section 957 includes a blanking drive section 954 for controlling an applied voltage to cause the blanking electrodes 943 to perform on/off control of the electron gun, adeflectingdrivesection955forcontrollinganappliedvoltage tocausethebeampolarizationelectrodes945todeflectelectron 15 beams, and a focus drive section 956 for controlling en applied voltage to cause the focus adjusting lens 946 to adjust the focus of an electron beam spot.
Fig. 4 is a schematic diagram showing turntable and feed stage sections of a related art electron beam plotter shown 20 in Fig. 3.
Operations characteristic of a related art electron beam plotter shown in Figs. 3 and 4 will be described.
When beam exposure is performed on the surface of a disc substrate 915, impinging electron beams at a high speed onto 25 a resist layer for electron rays formed on the disc substrate
915 as in the related art procedure causes the irradiated electron beams to pass through the resist layer for electron rays thus reducing the exposure amount in the surface layer of the disc substrate 915 thereby lowering the resolution, as 5 described above.
On a related art electron beam plotter shown in Fig. 3, anegative voltage (_VR) called"retardingvoltage"largeenough to decelerate the electron ray speed of electron beams is obtained from a voltage source 960 and applied to the disc 10 substrate 915.
On the turntable 916 formed with a ceramic substrate is provided a chucking electrode 921 comprising a conductor for causing electrostatic polarization to occur as shown in Fig. 4. To the chucking electrode 921 is constantly applied a 15 negative DC voltage (_VR_VC) obtained from the voltage source 960 via a connector (not shown) even when the turntable 916 is rotated (note that -Vc is called "chucking voltage"). This causes the electrostatic polarization to occur on the turntable 916 formed with a ceramic substrate and increases the absorption 20 of electron ray beams on the disc substrate 915.
The actions of the retarding voltage and chucking voltage eliminates the defects of reduction in exposure amount on the disc substrate 915 and lower resolution of a general related art electron beam plotter.
Asmentionedearlier,arelatedartelectronbeamplotter, when controlled to converge the electron beams as fine as possible to raise the resolution, results in the speed of the S electron beams being unnecessarily high and the irradiated electron beams are not completely absorbed by a resist layer for electron rays but part of the electron beams passes through the layer, thus reducing the exposure amount and lowering recording resolution.
10 Inordertosolvetheproblem,intherelatedarttechnology mentioned earlier, a negative voltage called retarding voltage is applied to the disc substrate 915 and a negative voltage with larger absolute value than that of the retarding voltage is applied to the chucking electrode provided on the turntable 15 916. These technicalefforts greatly contributed to upgrading of resolution although electron beams passing through an electron gun are cut off due to a lower accuracy of aperture mounting. In general, in the electron beamplotter, in the electron 20 gun barrel of the electron beam ejection head section for ejecting electron beams are arranged an electron gun, a convergent lens, blanking electrodes, apertures, deflecting electrodes, and an objective lens. The apertures are components used to control the shape and area of the spot of 25 electron beams and are arranged in a plurality of locations
in the electron bun barrel. The center axis of each of the plurality of apertures must be arranged to coincide with the center axis of electron beams. In case an aperture with low mounting accuracy is present in the path where electron beams 5 pass through apertures to reach the exposed surface of a disc substrate place on the turntable, part or all of the electron beams is cut off or rejected by way of the action of the aperture thus deforming the shape of the beam spot on the exposed surface, and in the worst case, preventing electron beams from reaching 10 the exposed surface.
Another problem is that it is impossible to identify the aperture causing the cutoff action from among the plurality of apertures.
The invention has been proposed in view of the 15 aforementioned circumstances and aims at providing an electron beam plotter with enhanced resolution that prevents electron beams from undergoing an unintended cutoff action by an aperture in the electron beam ejection head section.
The invention provides an electron beam plotter for 20 plotting a pattern on the surface of a sample, which includes: an electron gun for irradiating electron beams onto the sample surface; an electron gun barrel for accoranodating the electron gun; an electron beam ejection head section provided on an electron beam path from the electron gun to the sample, the 25 electron beam ejection head section having a plurality of
apertures, each made of conductive material; an adjusting mechanism for hording the plurality of apertures viainsulators in a position-adjustable way; and current amount measurement means for measuring amount of current flowing across each of S the plurality of apertures and the ground.
Thus it is possible to provide an electron beam plotter with enhanced resolution that can adjust the mounting position of the apertures in the electron beam ejection head section so as to prevent electron beams from undergoing an unintended 10 cutoff action.
Preferably, the adjusting mechanism can adjust the plurality of apertures in the directions of X axis and Y axis of predetermined rectangular coordinatesin ahorizontalcross section of the electron gun barrel.
15 Preferably,thecurrentamountmeasurementmeansincludes a plurality of ammeters each corresponding to the apertures.
The current amount measurement means may use a common ammeter selectively for each of the apertures.
Preferably, the sample is a disc substrate.
In it. rbiR.
Fig. 1 is a block diagram showing the configuration of as electron beam plotter according to the invention.
Fig. 2 is a schematic diagram showing turntable and feed 25 stage sections of a related art electron beam plotter according
to this embodiment.
Fig. 3 is a block diagram showing the configuration of a related art electron beam plotter.
Fig. 4 is a schematic diagram showing turntable and feed 5 stage sections of a related art electron beam plotter shown in Fig. 3.
An embodiment of an electron beam plotter according to 10 the invention will be detailed referring to drawings. Fig. 1 is a block diagram showing the configuration of as electron beam plotter according to the invention.
As shown in Fig. 1, an electron beam plotter according totheinventionincludes,asmajorcomponents,avacuumchamber 15 11 for processing a disc substrate 15 in a vacuum atmosphere, a height detecting section 24 for detecting the height of the main surface of the disc substrate 15, a CPU 25 for controlling the entire system, avacuumpump28formaintainingtheinternal atmosphere of the vacuum chamber 11 under vacuum, a drive 20 controller 30 for performing spindle control of the disc substrate 15, an electron beam ejection head 40 for generating electronbeamsirradiatedontothesurfaceofthediscsubstrate 15, an electron gun power source 51 for supplying power to an electron gun 41 mentioned later, a recording controller 52 for 25 sending an operation signal to a blanking drive section 54
mentioned later, a drive section 57 for controlling the components in the electron beam ejection head 40, a voltage source 60 for decelerating the electron ray speed of electron beams, an ammeter 71 for detecting the magnitude of an electron 5 beam component falling into an aperture 44a mentioned later as a current value, and an ammeter 72 for detecting the magnitude of an electron beam component falling into an aperture 44b mentioned later as a current value.
The vacuum chamber 11 comprises a light source 22 and 10 a photo-detector 23 for detecting the height of the main surface of the disc substrate 15, a turntable 16 for mounting the disc substrate 15, an air spindle motor 17 for rotating the turntable 16, and a feed stage 18 for horizontally feeding the turntable 16 and the air spindle motor 17, and a feed motor 19 as a 15 translation drive unit.
The electron beam ejection head 40 includes an electron gun 41 for irradiating electron beams, a convergent lens 42 for converging electron beams, blanking electrodes 43 and apertures 44a, 44b for controlling on/off of the electron gun, 20 beam polarization electrodes 45 for controlling the position of the electron beam spot irradiated onto the surface of the disc substrate 15, a focus adjusting lens 46 for adjusting the focus of electron beams irradiated onto the surface of the disc substrate 15, an objective lens 47 for converging the electron 25 beams to an electron beam spot, an electron gun barrel 48 for T Star _ _
storing these components, end en electron beamirradiation port 49 forirradiating electron beams from the electron gun barrel 48. The drive section 57 includes a blanking drive section 5 54 for controlling an applied voltage to cause the blanking electrodes 43 to perform on/off control of the electron gun, adeflectingdrivesection55forcontrollingtheapplieavoltage tocausethebeampolarizationelectrodes45todeflectelectron beams, and a focus drive section 56 for controlling an applied 10 voltage to cause the focus adjustinglens46to adjust the focus of an electron beam spot.
The apertures 44a, 44b includes metallic plates each haying en opening in the shape ofa circle end held by adjusting mechanisms 62a, 62b for moving the apertures via insulators 15 61a, 61b in the directions of X axis end Y axis of predetermined rectangular coordinates in a horizontal cross section of the electron gun barrel 48.
Fig. 2 is a schematic diagram showing turntable and feed stage sections of a related art electron beam plotter according 20 to this embodiment.
Operation of the same components as those of the related art electron beam plotter will be described concerning an electron beam plotter shown in Figs. 1 and 2.
A CPU 25 for controlling the entire system controls main 25 components of the electron beam plotter. In a vacuum chamber
11 for processing a disc substrate 15 in a vacuum atmosphere, a disc substrate 15 as a sample is placed on a turntable 16.
A feed stage 18 can move the turntable 16 and an air spindle motor 17 in the horizontal direction. The air spindle motor 5 17 rotates the turntable 16.
At the periphery of the vacuum chamber 11, a height detecting section 24 detects the height of the main surface of the disc substrate 15 teased on a photo-detection signal from aphoto-detector23. The photo-detector23 detects a reflected 10 light of a light from a light source 22 impinging on the disc substrate 15.
A vacuum pump 28 maintains the internal atmosphere of the vacuum chamber 11 under vacuum. A feed motor 19 serves as a translation drive unit for moving the feed stage 18 in 15 the horizontal direction.
A drive controller 30 performs spindle control of the disc substrate 15 based on an instruction from the CPU 25. A voltage source 60 supplies a voltage applied to the disc substrate IS and the turntable 16 in order to decelerate the 20 electron ray speed of electron beams (details concerning this will be given later).
In an electron beam ejection head 40 for generating electronbeamsirradiatedontothesurfaceofthediscaubstrate 15, an electron gun 41 uses the power supplied from an electron 25 gun power source 51 to eject electron beams into the center
of an electron gun barrel 48.
A convergent lens 42 converges electron beams ejected from the electron gun 41 and guides the electron beams to the apertures 44a, 44b. Blanking electrodes 43 performs on/off 5 controlof the electron gun depending on whether a voltage drawn from a blanking drive section 54 is applied across electrodes, based on the control by a recording controller 52.
To be more specific, in case no voltage is applied across the blanking electrodes 43, electron beams ejected from the 10 electron gun 41 is guided to the apertures 44a, 44b via the convergent lens 42 and the electron gun on state is entered.
Incaseavoltageisappliedacrosstheblankingelectrodes 43, electron beams passing through the electrodes is significantly deflected and could be converged to the shutter 15 hole of the aperture 44b. As a results, electron beams pass the aperture 44b and the electron gun off state is entered.
Beam polarization electrodes 45 control the position of an electron beam spot irradiated onto the surface of the disc substrate15basedon a voltage controlled by a deflection drive 20 section 55 and drawn the applied across electrodes.
Afocusadjustinglens46 adjusts the focus of an electron beam spot based on an applied voltage controlled by a focus drive section 56 then drawn. Finally, an electron beam irradiationport49emitselectronbeamscontrolledasmentioned 25 earlier from the electron gun barrel 48.
Ablanking drive section 54 in the drive section 57 applies a voltage to cause the blanking electrodes 43 to perform on/off control of the electron gun based on the control by a recording controller 52. A deflecting drive section 55 controls a voltage 5 applied to cause the beampolarization electrodes 45 to deflect electron beams.
A focus drive section 56 for controls a voltage applied to cause the focus adjusting lens 46 to adjust the focus of an electron beam spot.
10 A recording controller 52 sends an operation signal to the blanking drive section 54 and controls an applied voltage output by the blanking drive section 54.
An ammeter 71 detects the magnitude of an electron beam component falling into an aperture 44a as a current value, and 15 an ammeter 72 detects the magnitude of an electron beam component falling into an aperture 44b as a current value (details concerning this will be given later).
The electron gun 41 uses the power from the electron gun power source 51 to eject electron beams, which impinge onto 20 a resist layer for electron rays formed on the disc substrate 15 through the center of the electron gun barrel 48. When beam exposure is performed on the surface of the disc substrate 15, impinging electron beams at a high speed onto a resist layer for electron rays formed on the disc substrate 15 as in the 25 related art procedure causes the irradiated electron beams to
pass through the resist layer for electron rays thus reducing the exposure amount in the surface layer of the disc substrate 15 thereby lowering the resolution, as described above.
A retarding voltage (_VR) large enough to decelerate the 5 electron ray speed of electron beams is obtained from a voltage source 60 and applied to the disc substrate 15.
On the turntable 16 formed with a ceramic substrate is provided a chucking electrode 21 comprising a conductor for causing electrostatic polarization to occur as shown in Fig. 10 2. Tothechuckingelectrode21isconstantlyappliedanegative DC voltage (_VR_VC) obtained from the voltage source 60 via a connector (not shown) even when the turntable 16 is rotated (note that -Vc is called "chucking voltage" as mentioned earlier). 15 This causes the electrostatic polarization to occur on the turntable 16 formed with a ceramic substrate and increases the absorption of electron ray beams on the disc substrate 15.
The actions of the retarding voltage and chucking voltage eliminates the defects of reduction in exposure amount on the 20 disc substrate 15 and lower resolution.
The features mentioned in the foregoing are the same as those of the relate art technology. Features characteristic of the invention will be described.
A plurality of apertures 44a, 44b mounted on an electron 25 gun barrel 48 of an electron beam ejection head section 40
comprises metallic plates each having an opening in the shape of a circle and held via insulators 61a, 61b so as to allow the electron gun barrel 48 of the electron beam ejection head section 40 to adjust the mounting position.
5 As mentioned earlier, the apertures 44a, 44b comprises metallic plates each having an opening in the shape of a circle and held by adjusting mechanisms 62a, 62b for moving the apertures via insulators 61a, 61b in the directions of X axis and Y axis of predetermined rectangular coordinates in a 10 horizontal cross section of the electron gun barrel 48. Thus, adjustment of the aforementioned mounting position is made in the X axis and Y axis directions. Via this movement, it is possible to make adjustment in principle so that the center axis of each of the apertures 44a, 44b will coincide with the 15 center axis of electron beams.
The electron gun barrel 48 is not a transparent body so that it is not possible to externally observe the adjustment to check the mounting position of the center axis of each of the apertures 44a, 44b.
20 Thus, it is determined whether a current flows to the ammeters 71, 72 connected (by wire) between the apertures 44a, 44b and the ground, and in case yes, the amount of current is used to determine the degree of coincidence of the center of the electron beams and the center of the aperture.
25 The most favorable mounting position of the apertures
44a, 44biswheretheammeter71,72 defects en amount of current of 0. In case the amount of current detected by the ammeters 71, 72 is not 0, it is determined that an unfavorable contact 5 of electron beams and an aperture is present. Adjustment of the position of the apertures 44a, 44b is continued until the he ammeters 71, 72 detects an amount of current of 0.
The adjustment can be made with a dummy sample (disc substrate) placedontheturntable16priortothemainprocess. 10 While the number of apertures is 2 (aperture 44a and aperture 44b) in this embodiment, it is generally possible to place a plurality of apertures in the electron gun barrel 48 in the invention.
While two ammeters (ammeters 71, 71) corresponding to 15 the aperture 44a and aperture 44b in this embodiment, a same ammeter can be used selectively for each of the apertures.
As mentioned earlier, according to the invention, an electron beam plotter of the invention is an electron beam plotter for plotting a fineirregularitypatternon the surface 20 of a sample by irradiating electron beams ejected from an electron gun in an electron gun barrel onto the sample surface comprising an electron beam ejection head section where a plurality of apertures are arranged in an electron beam path from the electron gun to the sample, each of the plurality of 25 apertures being composed of with a conductive material,
characterized in that the electron beam plotter comprises an adjusting mechanism for hording the plurality of apertures via insulators in the electron beam ejection head section in a position-adjustable way and current amount measurement means 5 for measuring the amount of a current flowing across each of the plurality of apertures end the ground. Thus it is possible to provide an electron beam plotter with enhanced resolution that can adjust the mounting position of the apertures in the electron beam ejection head section so as to prevent electron 10 beams from undergoing an unintended cutoff action.
According to the invention, an electron beam plotter of the invention is characterizedin that the adjusting mechanism can adjust the plurality of apertures in the directions of X axis and Y axis of predetermined rectangular coordinates in 15 a horizontal cross section of the electron gun barrel. This makesit possible to adjust themountingpositionof en aperture in the electron gun in the horizontal cross section of the electron gun barrel.
According to the invention, an electron beam plotter of 20 the invention is characterized in that the current amount measurement means uses a plurality of ammeters corresponding to the apertures. It is thus possible to provide an electron beam plotter that allows determination on whether each-of the plurality of apertures is placed in a favorable location in 25 the electron gun barrel at the same time as well as quick
adjustment so as to prevent electron beams from undergoing an unintended cutoff action.
According to the invention, an electron beam plotter of the invention is characterized in that the current amount 5 measurement means uses a same ammeter selectively for each of the apertures. It is thus possible to provide a low-cost electron beam plotter that allows sequential determination on whether each of the plurality of apertures is placed in a favorablelocationin the electron gun barrel as well as secure 10 adjustment so as to prevent electron beams from undergoing an unintended cutoff action.
According to the invention, an electron beam plotter of the invention is characterized in that the sample is a disc substrate. This provides an electron beam plotter that allows 15 high-density recording of digital data onto a disc substrate.

Claims (5)

  1. crew 1. An electron beam plotter for plotting a pattern on the surface of
    a sample, comprising: an electron gun (41) for irradiating electron beams onto 5 a surface of the sample (15); anelectrongunbarrel(48) foraccommodatingtheelectron gun; an electron beam ejection head section (40) provided on an electron beam path from the electron gun to the sample, the 10 electron beam ejection head section having a plurality of apertures (44a,44b), each made of conductive material; an adjusting mechanism (57) for holding the plurality of apertures via insulators in a position-adjustable way; and current amount measurement means (71,72) for measuring 15 amount of current flowing across each of the plurality of apertures and the ground.
  2. 2. The electron beam plotter according to claim 1, wherein the adjusting mechanism (57) can adjust the plurality of 20 apertures (44a, 44b) in the directions of X axis and Y axis of predetermined rectangular coordinatesinahorizontalcross section of the electron gun barrel (48).
  3. 3. Theelectronbeamplotteraccordingtoclaimlor2,wherein 25 the current amount measurement means (71,72) includes a
    plurality of ammeters t71,72) each corresponding to the apertures (44a, 44b).
  4. 4. Theelectronbeamplotteraccordingtoclaimlor2,wherein 5 the current amount measurement means (71, 72) uses a common ammeter selectively for each of the apertures (44a, 44b).
  5. 5. An electron beam plotter according any one of claims 1 through 4, wherein the sample is a disc substrate (15).
GB0302450A 2002-02-21 2003-02-03 Electron beam plotter Expired - Fee Related GB2390477B (en)

Applications Claiming Priority (1)

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JP2002044104A JP2003242924A (en) 2002-02-21 2002-02-21 Electron beam lithography device

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TW200809856A (en) 2006-03-28 2008-02-16 Pioneer Corp Recording system, recording device, and recording control signal generation device
JP4789260B2 (en) * 2006-08-23 2011-10-12 エスアイアイ・ナノテクノロジー株式会社 Charged particle beam apparatus and aperture axis adjusting method
JP2014011374A (en) 2012-07-02 2014-01-20 Nuflare Technology Inc Mask drawing method and mask drawing device

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JPS6136141A (en) * 1984-07-26 1986-02-20 Nippon Sheet Glass Co Ltd Method for bonding glass tube to metal fixture
JPS6228090A (en) * 1985-07-29 1987-02-06 Hitachi Ltd Beam aligner for electron beam
JPS6263425A (en) * 1986-08-26 1987-03-20 Toshiba Corp Electron beam exposure system
JPH10289860A (en) * 1997-04-16 1998-10-27 Nikon Corp Method for adjusting beam of projection optical system and projection optical system

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6136141A (en) * 1984-07-26 1986-02-20 Nippon Sheet Glass Co Ltd Method for bonding glass tube to metal fixture
JPS6228090A (en) * 1985-07-29 1987-02-06 Hitachi Ltd Beam aligner for electron beam
JPS6263425A (en) * 1986-08-26 1987-03-20 Toshiba Corp Electron beam exposure system
JPH10289860A (en) * 1997-04-16 1998-10-27 Nikon Corp Method for adjusting beam of projection optical system and projection optical system

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GB2390477B (en) 2005-08-03
JP2003242924A (en) 2003-08-29
GB0302450D0 (en) 2003-03-05

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