GB2352999A - Smart card with chip carrier with contact pads fitted into aperture of card base - Google Patents

Smart card with chip carrier with contact pads fitted into aperture of card base Download PDF

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Publication number
GB2352999A
GB2352999A GB9916960A GB9916960A GB2352999A GB 2352999 A GB2352999 A GB 2352999A GB 9916960 A GB9916960 A GB 9916960A GB 9916960 A GB9916960 A GB 9916960A GB 2352999 A GB2352999 A GB 2352999A
Authority
GB
United Kingdom
Prior art keywords
card
aperture
chip
contact pads
smart
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB9916960A
Other versions
GB9916960D0 (en
Inventor
Allan Walter Sills
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to GB9916960A priority Critical patent/GB2352999A/en
Publication of GB9916960D0 publication Critical patent/GB9916960D0/en
Publication of GB2352999A publication Critical patent/GB2352999A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07743—External electrical contacts
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Credit Cards Or The Like (AREA)

Abstract

The card has a carrier 12 for a chip 13 embedded in potting compound 14 mounted over a through aperture 18 in the card base 17 and secured therein by adhesive 19. The chip carrier 12 has contact pads 15 which stand proud of the top surface of the card. The card is thinner than conventional smart cards so that the depth or thickness 21 of the card is within the ISO standard. The card is manufactured by stamping out the aperture 19, mounting the chip carrier 12 over the aperture and simultaneously injecting glue 19 into the aperture from the bottom surface 20 of the card.

Description

1 2352999 SMARTCARD The present invention relates to an electronic card,
that is to say a so- called smart card, having a micro-clip with contact pads.
Standards have been drawn up to prescribe certain dimensional characteristics of smart cards and in particular the position of their contact pads, relative t -0 datum edges. A typical standard is ISO standard No. 7816. It specifies the overall thickness of the smart card. This must be within the ranges 0. 76mm 10%. It is the thickness from the contact pad surface to the opposite surface of the card.
Known smart cards have their chips on carriers embedded in the card. The contact pads are on the opposite side of the carrier from the chip. A contoured recess is milled or otherwise formed in the card to suit the contoured shaped of the chip carrier. Adhesive is applied and the chip carrier is carefully placed into the recess. Machining of the card, in particular, renders smart card manufacture an expensive and time consuming process.
A difficulty in making smart cards is that the ISO standard was established for credit cards, which do not require chips set in them. To accommodate the chips in standard smart cards, the card material is usually at the upper end of the tolerance range. This causes two costs, firstly in increased material cost and secondly in holding tighter tolerances.
The object of my invention is to provide a smart card whose method of manufacture is more economic.
According to one aspect of my invention there is provided a smart card comprising a card as such and a chip carrier with contact pads on one side and a chip on the other side, the carrier being adhered onto a surface of the card, with the contact pads standing proud of the surface of the card, 2 the chip being received in an aperture in the card.
The smart card can still comply with the ISO standard, by use of thinner than normal card material. It is also possible in a non standard card to use card material which is thinner still, to reduce its cost.
According to a second aspect of my invention there is provided a method of producing smart cards of the first aspect, the method consisting in the steps of.
providing a card, making an aperture in the card, adhesively mounting a chip carrier on a surface of the card over said aperture, with the contact pads standing proud of the surface of the card and the chip received in the aperture in the card.
To help understanding of the invention, a specific embodiment thereof will now be described by way of example and with reference to the accompanying drawing, in which:
Figure I is a cross-sectional view of a smart card made in accordance with conventional methods; Figure 2 is a sirnilar view of a smart card made in accordance -,krith the present invention; Figure 3 is a top view of the card as such without the chip carrier; and Figure 4 is a similar view of the card as such with the chip carrier attached.
A conventional smart card I is shown in Figure 1. A chip carrier 2 is provided as a substrate on the underside of which a chip 3 is adhered and encapsulated in potting compound 4. On the top surface of the carrier is provided a series of contact pads 5. In order to provide a smart card I with its contact pads flush with an upper surface 6 of the card as such 7, a recess 8 has been milled into the card 7 to suit the contours of a chip carrier 2. Between the card 7 and the chip carrier 2 a layer of adhesive 9 is applied. With top of the contact pads 5 on the chip carrier 2 flush with the top surface 6 of the card 7, the smart cards' dimensions are within the ISO standard.
3 The smart card. I I shown in Figure 2 is made according to the present invention. The card as such 17 has the same length and width dimensions as the one shown in Figure 1. The card has an aperture 18. The chip carrier 12 is mounted over this aperture 18 with the chip 13 embedded in the potting compound 14 fitting into the aperture 18. Adhesive 19 is applied to the underside 21 of the card 17 while the chip carrier 12 is applied to the top surface 16.
As can be seen in Figure 2, the contact pads 15 stand proud of the top surface io 16 of the card 17 by the-thickness of the carrier 12., i.e. 0.1mm. The total depth 21 of the smart card I I is dependant upon the card material 17 used. If card material slightly thinner than used in conventional smart cards meeting the ISO standard, as shown in Figure 1, is used, then the depth 21 of the smart card at the contact pads will be within the ISO standard. Alternatively, the card material may be thinner still to reduce the cost, and the card produced will be non ISO standard.
For manufacture of the card, the card as such 17 is stamped out of a large sheet of plastics material. The aperture 18 is also stamped in the card. These two stamping processes may be carried out simultaneously or consecutively. The chip carrier 12 is mounted over the aperture 18 from the top face 16 of the card 17, and simultaneously a small portion of glue 19 is injected into the aperture 18 from the bottom surface 20 of the base card 17.
4

Claims (8)

1. A smart card comprising a card as such and a chip carrier with contact pads on one side and a chip on the other side, 0 the carrier being adhered onto a surface of the card, with the contact pads standing proud of the surface of the card, the chip being received in an aperture in the card.
2. A smart card as claimed in claim 1, wherein the smart card complies with the ISO standard.
3- A smart card as claimed in claim 1, wherein the card as such comprises material which in thinner than the ISO standard.
4. A smart card as claimed in claim 1, claim 2 or claim 3, wherein the chip is embedded in potting compound in the aperture.
5. A method of producing smart cards as claimed in any preceding claim, the method consisting in the steps of providing a card, making an aperture in the card, adhesively mounting a chip carrier on a surface of the card over said aperture, with the contact pads standing proud of the surface of the card and the chip received in the aperture in the card.
6. A method of producing smart cards as claimed in claim 4, wherein the step of making the aperture is concurrent with the step of providing the card.
7. A smart card substantially as hereinbefore described with reference to Figures 2-4 of the accompanying drawings.
8. A method of producing smart cards substantially as hereinbefore described with reference to Figures 2-4 of the accompanying drawings.
GB9916960A 1999-07-21 1999-07-21 Smart card with chip carrier with contact pads fitted into aperture of card base Withdrawn GB2352999A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB9916960A GB2352999A (en) 1999-07-21 1999-07-21 Smart card with chip carrier with contact pads fitted into aperture of card base

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB9916960A GB2352999A (en) 1999-07-21 1999-07-21 Smart card with chip carrier with contact pads fitted into aperture of card base

Publications (2)

Publication Number Publication Date
GB9916960D0 GB9916960D0 (en) 1999-09-22
GB2352999A true GB2352999A (en) 2001-02-14

Family

ID=10857554

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9916960A Withdrawn GB2352999A (en) 1999-07-21 1999-07-21 Smart card with chip carrier with contact pads fitted into aperture of card base

Country Status (1)

Country Link
GB (1) GB2352999A (en)

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4474292A (en) * 1980-05-20 1984-10-02 Gao Gesellschaft Fur Automation Und Organisation Mbh Carrier element for an IC-chip
EP0426406A2 (en) * 1989-10-31 1991-05-08 Citizen Watch Co., Ltd. IC card having an integrated circuit module
US5851854A (en) * 1995-08-04 1998-12-22 Giesecke & Devrient Gmbh Method for producing a data carrier

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4474292A (en) * 1980-05-20 1984-10-02 Gao Gesellschaft Fur Automation Und Organisation Mbh Carrier element for an IC-chip
EP0426406A2 (en) * 1989-10-31 1991-05-08 Citizen Watch Co., Ltd. IC card having an integrated circuit module
US5851854A (en) * 1995-08-04 1998-12-22 Giesecke & Devrient Gmbh Method for producing a data carrier

Also Published As

Publication number Publication date
GB9916960D0 (en) 1999-09-22

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)