GB2349985A - Liquid-cooling system for a computer - Google Patents

Liquid-cooling system for a computer Download PDF

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Publication number
GB2349985A
GB2349985A GB9910948A GB9910948A GB2349985A GB 2349985 A GB2349985 A GB 2349985A GB 9910948 A GB9910948 A GB 9910948A GB 9910948 A GB9910948 A GB 9910948A GB 2349985 A GB2349985 A GB 2349985A
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GB
United Kingdom
Prior art keywords
cooling
computer
liquid
heat
case
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB9910948A
Other versions
GB9910948D0 (en
Inventor
Ben Has Yu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to GB9910948A priority Critical patent/GB2349985A/en
Priority to DE29908672U priority patent/DE29908672U1/en
Priority to FR9906214A priority patent/FR2793900A3/en
Publication of GB9910948D0 publication Critical patent/GB9910948D0/en
Publication of GB2349985A publication Critical patent/GB2349985A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/181—Enclosures
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
    • G06F2200/20—Indexing scheme relating to G06F1/20
    • G06F2200/201—Cooling arrangements using cooling fluid

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

A liquid-cooling system for a computer, comprises a cooling tube 11 allowing cooling liquid flowing therein; a pump 12 connected between the cooling tube and driving the cooling liquid within the cooling tube to form a circulation loop; at least one heat sink 13 arranged on at least one chip to be cooled, and having a cooling conduit connected with the cooling tube; and at least one heat-dissipating plate 14 arranged on a computer case 30 or outside the case, and having a cooling conduit connected with the cooling tube. The heat generated within the computer is delivered to the computer case or outside the computer case by circulation of cooling liquid. The cooling effect is enhanced and the operation noise is reduced.

Description

2349985 Liquid-cooling device for computer Field of the invention ne
present invention relates to a liquid-cooling device for computer, which brings heat ( generated with the computer to the heat sink on the case or outside the case by liquid circulation.
Background of the invention
As the processing speed of the computer increases. the computer generates more heat by the internal circuits thereof. Therefore, the present computer generally has been provided with cooling fan on the CPU or other chips thereof to take away heat generated therein. However, the air-cooling etTect provided by the cooling fan is practically notsufficient and running of the cooling fan has annoying noise.
It is the object of the invention to provides a liquid-cooling device for computer, wherein the heat sink is arr anged on the computer case or outside the computer case, and the heat generated within the computer is delivered to the computer case or outside the computer case by circulation of cooling liquid. The cooling effect is enhanced and the operation noise is reduced.
The various objects and ad-vantagCs of the present invention will be more readily understood from the f61lowing detailed description when read in conjunction with the appended drawing, in which:
Brief description of drawing:
Fig. 1 is the schematic view showing the arrangement of the inventive liquid cooling device.
Fig. 2 is the schematic view of the inventive liquid-cooling device.
Fig. 3 shows the planar view of a heat sink in the inventive liquidcooling, device.
9 -coob Fi. 4 shows the planar View of another heat sink m the inventive liquid ung device.
Fig. 5 shows the cross sectional view of a heat sink in the inventive liquidcooling device.
Fig. 6 show3 the arran cmcnt of tho liquid-cooling dcvicc according to anothcr 9 emboditnept of the present invention and arrang ged within a computer.
Ficr. 7 shows the liquid-cooling device accordincr to -another embodiment of the present invention.
Fig. 8 shows the cross sectional view of a two-laver type heat sink in the inventive liquid-cooling device.
Detail description of preferred embodiment
With reference now to Figs. 1 and 2, the inventive liquid-cooling device 10 is arranged within a computer case 30 and comprises a cooling tube 11. a pump 12. at least one heat sink 13 and at least one heat-dissipating plate 14. The cooling tube 11 has a predeterrnined length and allows the cooling liquid flowing therein. The cooling tube 11 is designed to pass the components to be cooled.
The pump 12 is arranged at a predetermined position of the cooling tube 11 and functions to drive the cooling liquid within cooling tube 11 to form a circulation loop.
The heat sink 13 is of plate shape and made of material with e,-,-, cellent thermal conductivity such as g and the amount thereof depends on the chips to be cooled. In the preferred embodiment, there are four heat sinks 13 and_diose heat sinks 13 are attached to the chip 31 to be cooled such as CPU by thermal-conductive paste. As shown in Fi 3 and 4 the size of the heat sink 13 is varied with the size. of the chip 8s 31 to be cooled. A coolingbonduit 15 of straight shap., U-shape, or s "entine shape P em isjarranged on the heat sink 13 and connected with the cooling tube 11 to brinúf the heat generated by the chip 31 to the heat sink 13 through the circulation of the cooling .. liquid within the cooling tube 11, 2 The heat-dissipating plate 14 is of plate shape and made of material with excellent thermal conductivity such as AI. The heat-dissipating plate 14 may have a plurality of fins (not shown) to increase the hcat-cxchangc area. As shown in Figs. 6 and 7, the. heat-dis"sipating plate 14 is attached to. the case 30 or the slot 32 on rear side of the case 30 by thermal-conductive paste. Moreover, as shown in Figs. 6-8 the amount of the heat-dissipating plate 14 is varied with the size of the chip 31 to be cooled, and the heat-dissipating plate 14 can be multi-layer structure such as double layer or triple layer structure. As shown in Fig. 57 a cooling conduit 16 of straight shape, U-shape, or serpentine shape is arranged on the heat-dissipating plate 14 and connected with the cooling tube 11 to bring the heat generated within computer 31 to the heat-dissipating plate 14 through the circulation of the cooling liquid within the coolinLY tube 11. It should be noted the heat-dissipating plate 14 is preferably of serpentine shape if the heat- dissipating plate 14 has larger area.
To sum up, in the presenf invention, the heat-dissipating plate 14 is attached to the case 30 or the slot 32 an rear side of the case 30, and the heat generated by chip 31 is taken away to the case 30 or outside the case 30 by the circulation of the cooling liquid within the- cooling tube 11.
Although the present invention has been described with reference to the preferred embodiment thereof, it will be understood that the invention is not limited to the details thereof. Various substitutions and modifications have suggested in the foregoing description. and other wW occur to those of ordinary skill in the art. Thereforc,.,ill such substitutions and modifications are intended to be embraced within the scope of the invention as defined in the appended claims.
3 1 claim 1. A nquid-cooling device for computer, comprising cooling tubc allowing cooling liquid flowing thcrein:
pump connected between said cooling tube and driving said cooling liquid within said cooling tube to form a circulation loop; at least one heat sink arranged on at least one chip to be cooled. and having a cooling conduit connected with said cooling tube; and at least one heat-dissipating plate arranged on a computer case or outside the case, and having a cooling conduit connected with said cooling tube.
2. The liquid-cooling device for computer as in claim 1, wherein said heat sinks is attached to the chip to e cooled by thermal-conductive paste.
3. The liquid-cooling device for computer as in claim 1, whemin said heatdissipating plate is multi-layer structure.
4. The liquid-cooling device for computer as in claim 1. wherein said cooling conduit on said heat sink is of straight shape, U-shape, or serpentine shape.
5. The liquid-cooling device for computer as in claim 1, wherein said cooling conduit on said heat-dissipating platc is of serpcntine shapc.
6. A liquid-cooling device for a computer, as described herein with reference to and as illustrated in the accompanying drawings.
4
GB9910948A 1999-05-11 1999-05-11 Liquid-cooling system for a computer Withdrawn GB2349985A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
GB9910948A GB2349985A (en) 1999-05-11 1999-05-11 Liquid-cooling system for a computer
DE29908672U DE29908672U1 (en) 1999-05-11 1999-05-17 Liquid cooling device for computers
FR9906214A FR2793900A3 (en) 1999-05-11 1999-05-17 Fluid cooling apparatus for a computer

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
GB9910948A GB2349985A (en) 1999-05-11 1999-05-11 Liquid-cooling system for a computer
DE29908672U DE29908672U1 (en) 1999-05-11 1999-05-17 Liquid cooling device for computers
FR9906214A FR2793900A3 (en) 1999-05-11 1999-05-17 Fluid cooling apparatus for a computer

Publications (2)

Publication Number Publication Date
GB9910948D0 GB9910948D0 (en) 1999-07-14
GB2349985A true GB2349985A (en) 2000-11-15

Family

ID=27220247

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9910948A Withdrawn GB2349985A (en) 1999-05-11 1999-05-11 Liquid-cooling system for a computer

Country Status (3)

Country Link
DE (1) DE29908672U1 (en)
FR (1) FR2793900A3 (en)
GB (1) GB2349985A (en)

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1207446A1 (en) * 1999-06-02 2002-05-22 Guangji Dong A computer heat-radiation system
US6725682B2 (en) 2001-07-13 2004-04-27 Coolit Systems Inc. Computer cooling apparatus
US6856510B2 (en) 2001-03-26 2005-02-15 Chi Mei Chang Efficient cooler
WO2005051065A2 (en) * 2003-11-12 2005-06-02 Intel Corporation Pumped liquid cooling for computer systems using liquid metal coolant
GB2410133A (en) * 2003-12-17 2005-07-20 Hewlett Packard Development Co Heat exchanger component located in major part outside computer chassis
GB2413707A (en) * 2004-04-29 2005-11-02 Hewlett Packard Development Co Liquid loop cooling apparatus
GB2413708A (en) * 2004-04-29 2005-11-02 Hewlett Packard Development Co Cooling system
NL1026846C2 (en) * 2004-08-17 2006-02-20 Jakob Roelof Van Den Berg Desktop PC.
ES2249998A1 (en) * 2004-09-24 2006-04-01 Investronica, S.A. Refrigeration system for computers has radiator that dissipates heat from thermal transmission liquid to outside of computer
FR2876812A1 (en) * 2004-10-15 2006-04-21 J C C Chereau Aeronautique COOLING FLUID DEVICE FOR COMPUTER
CN1299356C (en) * 2002-06-28 2007-02-07 株式会社日立制作所 Electronic device
US7174738B2 (en) 2001-07-13 2007-02-13 Coolit Systems Inc. Computer cooling apparatus
US7991515B2 (en) 2007-01-15 2011-08-02 Coolit Systems Inc. Computer cooling system with preferential cooling device selection
US8369090B2 (en) 2009-05-12 2013-02-05 Iceotope Limited Cooled electronic system

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1419430B1 (en) * 2001-03-21 2010-12-29 Hush Technologies Investments Ltd. Computer housing
EP1422594A3 (en) * 2002-11-22 2005-08-17 Contec Steuerungstechnik & Automation Gesellschaft m.b.H. A method and an apparatus for cooling a portable computer
DE102004002375B4 (en) * 2004-01-15 2006-03-09 Dirk Heuvel Radiator for liquid-cooled computers
CN107831864A (en) * 2017-10-24 2018-03-23 惠安华晨贸易有限公司 It is a kind of to handle official business with the placing box for being easy to cool for host computer

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0454123A2 (en) * 1990-04-26 1991-10-30 Nec Corporation Cooling apparatus
WO1998008038A1 (en) * 1996-08-22 1998-02-26 Kioan Cheon Cooling system for computer

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0454123A2 (en) * 1990-04-26 1991-10-30 Nec Corporation Cooling apparatus
WO1998008038A1 (en) * 1996-08-22 1998-02-26 Kioan Cheon Cooling system for computer

Cited By (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1207446A4 (en) * 1999-06-02 2002-08-28 Guangji Dong A computer heat-radiation system
EP1207446A1 (en) * 1999-06-02 2002-05-22 Guangji Dong A computer heat-radiation system
US6856510B2 (en) 2001-03-26 2005-02-15 Chi Mei Chang Efficient cooler
US6725682B2 (en) 2001-07-13 2004-04-27 Coolit Systems Inc. Computer cooling apparatus
US7739883B2 (en) 2001-07-13 2010-06-22 Coolit Systems Inc. Computer cooling apparatus
US7174738B2 (en) 2001-07-13 2007-02-13 Coolit Systems Inc. Computer cooling apparatus
CN1299356C (en) * 2002-06-28 2007-02-07 株式会社日立制作所 Electronic device
WO2005051065A2 (en) * 2003-11-12 2005-06-02 Intel Corporation Pumped liquid cooling for computer systems using liquid metal coolant
WO2005051065A3 (en) * 2003-11-12 2005-10-06 Intel Corp Pumped liquid cooling for computer systems using liquid metal coolant
GB2410133A (en) * 2003-12-17 2005-07-20 Hewlett Packard Development Co Heat exchanger component located in major part outside computer chassis
US7273088B2 (en) 2003-12-17 2007-09-25 Hewlett-Packard Development Company, L.P. One or more heat exchanger components in major part operably locatable outside computer chassis
GB2410133B (en) * 2003-12-17 2007-05-02 Hewlett Packard Development Co One or more heat exchanger components in major part operably locatable outside computer chassis
GB2413707B (en) * 2004-04-29 2007-11-21 Hewlett Packard Development Co Liquid loop cooling apparatus
US6989990B2 (en) 2004-04-29 2006-01-24 Hewlett-Packard Development Company, Lp. High serviceability liquid cooling loop using tubing hinge
GB2413708A (en) * 2004-04-29 2005-11-02 Hewlett Packard Development Co Cooling system
GB2413707A (en) * 2004-04-29 2005-11-02 Hewlett Packard Development Co Liquid loop cooling apparatus
NL1026846C2 (en) * 2004-08-17 2006-02-20 Jakob Roelof Van Den Berg Desktop PC.
ES2249998A1 (en) * 2004-09-24 2006-04-01 Investronica, S.A. Refrigeration system for computers has radiator that dissipates heat from thermal transmission liquid to outside of computer
WO2006042945A1 (en) * 2004-10-15 2006-04-27 J.C.C. Chereau Aeronautique Liquid cooling device for a computer
FR2876812A1 (en) * 2004-10-15 2006-04-21 J C C Chereau Aeronautique COOLING FLUID DEVICE FOR COMPUTER
US7991515B2 (en) 2007-01-15 2011-08-02 Coolit Systems Inc. Computer cooling system with preferential cooling device selection
US8369090B2 (en) 2009-05-12 2013-02-05 Iceotope Limited Cooled electronic system
US9516791B2 (en) 2009-05-12 2016-12-06 Iceotope Limited Cooled electronic system
US10306804B2 (en) 2009-05-12 2019-05-28 Iceotope Limited Cooled electronic system
US12022638B2 (en) 2009-05-12 2024-06-25 Iceotope Group Limited Cooled electronic system

Also Published As

Publication number Publication date
FR2793900A3 (en) 2000-11-24
GB9910948D0 (en) 1999-07-14
DE29908672U1 (en) 1999-08-26

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Legal Events

Date Code Title Description
COOA Change in applicant's name or ownership of the application
COOA Change in applicant's name or ownership of the application
AT Applications terminated before publication under section 16(1)
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)