GB2333352A - A heat exchange unit uing peltier devices - Google Patents

A heat exchange unit uing peltier devices Download PDF

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Publication number
GB2333352A
GB2333352A GB9717916A GB9717916A GB2333352A GB 2333352 A GB2333352 A GB 2333352A GB 9717916 A GB9717916 A GB 9717916A GB 9717916 A GB9717916 A GB 9717916A GB 2333352 A GB2333352 A GB 2333352A
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GB
United Kingdom
Prior art keywords
manifolds
peltier devices
heat exchange
exchange unit
faces
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB9717916A
Other versions
GB2333352B (en
GB9717916D0 (en
Inventor
Paul Harris
John Ward
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ICEE Ltd
Original Assignee
ICEE Ltd
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Filing date
Publication date
Application filed by ICEE Ltd filed Critical ICEE Ltd
Priority to GB9717916A priority Critical patent/GB2333352B/en
Publication of GB9717916D0 publication Critical patent/GB9717916D0/en
Publication of GB2333352A publication Critical patent/GB2333352A/en
Application granted granted Critical
Publication of GB2333352B publication Critical patent/GB2333352B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25BREFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B21/00Machines, plants or systems, using electric or magnetic effects
    • F25B21/02Machines, plants or systems, using electric or magnetic effects using Peltier effect; using Nernst-Ettinghausen effect
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/13Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the heat-exchanging means at the junction
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10NELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N10/00Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects
    • H10N10/10Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects
    • H10N10/17Thermoelectric devices comprising a junction of dissimilar materials, i.e. devices exhibiting Seebeck or Peltier effects operating with only the Peltier or Seebeck effects characterised by the structure or configuration of the cell or thermocouple forming the device
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25BREFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2321/00Details of machines, plants or systems, using electric or magnetic effects
    • F25B2321/02Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
    • F25B2321/023Mounting details thereof
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25BREFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2321/00Details of machines, plants or systems, using electric or magnetic effects
    • F25B2321/02Details of machines, plants or systems, using electric or magnetic effects using Peltier effects; using Nernst-Ettinghausen effects
    • F25B2321/025Removal of heat
    • F25B2321/0252Removal of heat by liquids or two-phase fluids

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Thermal Sciences (AREA)
  • General Engineering & Computer Science (AREA)
  • Devices That Are Associated With Refrigeration Equipment (AREA)

Abstract

A cooling unit 10 comprises a stack of manifolds 11, 12 and 13 with peltier devices 14 sandwiched between each juxtaposed pair of the manifolds 11 and 12, 12 and 13. The peltier devices 14 are spaced from one another and arranged in rows along the length of the manifolds 11 to 13. A DC electrical potential is applied across each of the peltier devices 14. The cold faces of the peltier devices 14 of each row abut the adjacent faces of the middle manifold 12 and the hot faces of those peltier devices 14 abut the adjacent surfaces of the outer manifolds 11 and 12. The manifolds and peltier devices are held together using a fixing arrangment which utilises Belleville washers (32) to allow for thermal expansion and contraction.

Description

A HEAT EXCHANGE UNIT This invention relates to a heat exchange unit and more particularly to a cooling unit for use in an enclosed space or in other enclosures such as in computer housings or in computer rooms to achieve an optimum working temperature for communication equipment. Such equipment can be run satisfactorily at higher temperatures but its life span will be cut down progressively as those temperatures are increased.
It is preferable to use air to air heat exchange units rather than domestic air conditioning units for cooling enclosures within which electronic apparatus is stored. This is because domestic air conditioning units liberate water in their operation so that cool air they would direct around the electronic apparatus is damp. Hence provision needs to be made to collect the water and for its drainage which adds to expense. However, air to air heat exchange units have their limitations because they are only effective to maintain an air flow within an enclosure at a level which is approximately 150C above ambient temperature. As a result on hot days in a temperate climate or frequently in mediterranean or tropical climates, the temperature within an enclosure is excessive for electronic apparatus within that enclosure even when it is cooled by such air to air heat exchange units.
An alternative form of cooling which can be used is natural air convection, air being circulated by a fan. This can be satisfactory but its effect varies with ambient temperature and it suffers because it causes ingress of moisture, dust, dirt and wildlife such as insects.
Systems which use domestic air conditioning units or air to air heat exchanger units are closed systems, the cooling unit being housed within the enclosure. Hence that enclosure has an oven effect, heat being generated within it by operation of electrical equipment within it. This is compounded by the effect of solar gain on the exterior of the enclosure when the latter is outside. This results in necessary cooling apparatus being large if the required cooling level is to be achieved. That can be a problem, as in certain installations, such as roadside apparatus, there may be space constraints. This leads to two irreconcilable conflicting requirements, the desire to maximise space within the enclosure for the electrical equipment it is to house on the one hand and the need to provide space for the necessary large cooling apparatus on the other hand.
An object of this invention is to provide cooling equipment which is economical in space, which is more effective than an air to air heat exchanger within an enclosed cabinet, and which will not create moisture by its operation.
According to this invention there is provided a heat exchange unit comprising a row of peltier devices sandwiched between a pair of manifolds, each peltier device being adapted to be cannected across an electrical potential so that it has a hot face and a cold face when it is so connected, the manifolds being arranged so that each surface of one of them is in intimate thermal contact with the surfaces of each of the peltier devices that are the hot faces when the electrical potential is connected across them and so that a surface of the other of the manifolds is in intimate thermal contact with the other surfaces of each of the peltier devices, and each of the manifolds having a coolant flow passage formed in it so that the coolant flow passages extend alongside the row of peltier devices whereby coolant fluid passed through the coolant flow passage in said one manifold is heated by heat transferred to it from the hot faces of the peltier devices through intervening structure of said one manifold and coolant fluid passed through the coolant flow passage in said other manifold is cooled by heat exchange with the cold faces of the peltier devices through intervening structure of said other manifold.
Preferably there are three such manifolds and two rows of peltier devices, the cold faces of the peltier devices each being in intimate thermal contact with the adjacent surface of one of the three manifolds which is positioned between the other two manifolds which in turn are each in intimate thermal contact with the hot faces of a respective one of the rows of peltier devices.
Conveniently each of said other two manifolds is provided with two laterally projecting flanges which extend one on either side of it, generally in the direction in which the coolant flow passages extend, the two flanges on either side of the stack of three manifolds and two rows of peltier devices being joined together by a respective fixing arrangement. In a preferred embodiment means such as Belleville washers, are incorporated in each such fixing arrangement in order to allow for thermal expansion of the stack. The fixing arrangements are either spaced from or are thermally insulated from said other manifold.
In the preferred embodiment means are provided to cause turbulent flow of coolant through each of the coolant flow passages.
One form of cooling unit which embodies this invention and which is for use to cool the interior of a roadside cabinet which accommodates telecommunication equipment, is described now by way of example with reference to the accompanying drawings of which: Figure 1 is a diagrammatic representation of the cooling unit connected into electrical and cooling fluid circuitry; Figure 2 is an end view of the cooling unit illustrated diagrammatically in Figure 1; Figure 3 is a side elevation of the central manifold of the cooling unit shown in Figure 2; and Figure 4 is a fragmentary view on arrow A in Figure 3.
Figure 1 diagrammatically illustrates a cooling system for installation in a roadside cabinet which houses telecommunications equipment. The cooling system comprises a cooling unit 10 which comprises a stack of three manifolds 11, 12 and 13 with peltier devices 14 sandwiched between each juxtaposed pair of the manifolds 11 and 12, 12 and 13. The peltier devices 14 between each pair of manifolds 11 and 12, 12 and 13 are spaced from one another and arranged in a row along the length of the manifolds 11 to 13.
A DC electrical potential from any suitable source is applied across each of the peltier devices 14, as is shown diagrammatically at 15, 16 in Figure 1. Each peltier device 14 has an opposed pair of faces. Due the peltier effect, one of those faces is a hot face and the other is a cold face.
The cold faces of the peltier devices 14 of each row abut the adjacent surface of the middle manifold 12 of the stack and the hot faces of those peltier devices 14 abut the adjacent surface of the nearer one of the two outer manifolds 11 and 13.
Figures 2 and 3 show that each manifold 11 to 13 is a metal block which has three through bores 17, 18 and 19 formed in it from end to end. The block also has two blind ended lateral bores 21 and 22 (see Figure 3) formed in it, one adjacent either end of that block. Each lateral bore 21, 22 intersects each of the through bores 17 to 19 and receives a fluid connector (not shown) in its mouth which opens in a side wall of the block. Each through bore 17 to 19 has a wire insert (not shown) fitted into it and is plugged at either end.
The external surfaces of the manifolds 11 to 13 that are abutted by the adjacent peltier devices 14 are formed with a high quality finish, say by fly cutting or lapping, so that an intimate thermal contact is established between each peltier device 14 and the respective manifold 11 to 13.
Each of the upper and lower manifolds 11 and 13 has flanges 23 and 24, 25 and 26 which project outwardly from each of its side walls and which are fixed together to complete assembly of the stack. The flanges 23 and 25, 24 and 26 on either side of the stack are fixed together by nuts 27 and 28 and bolts 29 and 31 which have long shanks.
A Belleville washer 32 is fitted between each nut 27, 28 and adjacent flange 23, 24 so as to allow for thermal expansion and contraction. The shank of the bolts 29 and 31 is spaced from the middle manifold 12 so that there is no heat bridge therebetween.
Figure 1 shows that the fluid connector at one end of the middle manifold 12 is connected to the output of a water pump 32 which is operable to draw water from a reservoir 33 and pump it through the passages formed by the three bores 17 to 19 of the middle manifold 12. The wire insert fitted into each of those bores 17 to 19 ensures that water flow through those passages is turbulent. Hence, as it flows through the middle manifold 12, that water is cooled by heat exchange with the structure of the middle manifold 12 which is cooled by the intimate contact with the cold faces of the peltier devices 14. The cooled water emerges from the middle manifold 12 through the fluid connector at its other end from where it is conveyed to a heat exchanger 34 which is located within the compartment within the cabinet in which the telecommunications equipment is housed. Air within that compartment is cooled by heat exchange with the cooled water that flows through the heat exchanger 34. Water which emerges from the heat exchanger 34 is returned to the reservoir 33.
Fans may be provided within the compartment for circulating air cooled by heat exchange with the heat exchanger 34.
The fluid connectors at one end of each of the upper and lower manifolds 11 and 13 are connected in parallel to the output of a pump 35 which is operable to draw water from a reservoir 36 and pump it through the passages 17 to 19 of the upper and lower manifolds 11 and 13. The wire insert fitted into each of those bores 17 to 19 ensures that water flow through those passages is turbulent. Hence, as it flows through the upper and lower manifolds 11 and 13, that water extracts heat from the structure of the manifolds 11 and 13 and thus takes heat away from the hot faces of the peltier devices 14 so that the cooling effect of those peltier devices 14 on the middle manifold 12 is maintained. The water that emerges from the upper and lower manifolds 11 and 13 through the fluid connectors at their other end is conveyed in parallel to a heat exchanger 37 which is mounted so as to be exposed to ambient atmosphere. As a result that water is cooled by passage through the heat exchanger 37 by heat exchange with ambient air. Water emerging from the heat exchanger 37 is returned to the reservoir 36.
Anti-freeze may be added to the water in each of the two water cooling systems.

Claims (9)

  1. CLAIMS 1. A heat exchange unit comprising a row of peltier devices sandwiched between a pair of manifolds, each peltier device being adapted to be connected across an electrical potential so that it has a hot face and a cold face when it is so connected, the manifolds being arranged so that a surface of one of them is in intimate thermal contact with the surfaces of each of the peltier devices that are the hot faces when the electrical potential is connected across them and so that a surface of the other of the manifolds is in intimate thermal contact with the other surfaces of each of the peltier devices, and each of the manifolds having a coolant flow passage formed in it so that the coolant flow passages extend alongside the row of peltier devices whereby coolant fluid passed through the coolant flow passage in said one manifold is heated by heat transferred to it from the hot faces of the peltier devices through intervening structure of said one manifold and coolant fluid passed through the coolant flow passage in said other manifold is cooled by heat exchange with the cold faces of the peltier devices through intervening structure of said other manifold.
  2. 2. A heat exchange unit according to claim 1, wherein there are three such manifolds and two rows of peltier devices, the cold faces of the peltier devices each being in intimate thermal contact with the adjacent surface of one of the three manifolds which is positioned between the other two manifolds which in turn are each in intimate thermal contact with the hot faces of a respective one of the rows of peltier devices.
  3. 3. A heat exchange unit'according to claim 2, wherein each of said other two manifolds is provided with two laterally projecting flanges which extend one on either side of it, generally in the direction in which the coolant flow passages extend, the two flanges on either side of the stack of three manifolds and two rows of peltier devices being joined together by a respective fixing arrangement.
  4. 4. A heat exchange unit according to claim 3, wherein means are incorporated in each such fixing arrangement in order to allow for thermal expansion of the stack.
  5. 5. A heat exchange unit according to claim 4, wherein said means comprise Belleville washers.
  6. 6. A heat exchange unit according to any one of claims 3 to 5, wherein the fixing arrangements are spaced from said other manifolds.
  7. 7. A heat exchange unit accorfding to any one of claims 3 to 5, wherein the fixing arrangements are thermally insulated from said other manifolds.
  8. 8. A heat exchange unit according to any one of claims 1 to 8, wherein means are provided to cause turbulent flow of coolant through each of the coolant flow passages.
  9. 9. A heat exchange unit substantially as described hereinbefore with reference to and as shown in the accompanying drawings.
GB9717916A 1997-08-22 1997-08-22 A heat exchange unit Expired - Fee Related GB2333352B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB9717916A GB2333352B (en) 1997-08-22 1997-08-22 A heat exchange unit

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Application Number Priority Date Filing Date Title
GB9717916A GB2333352B (en) 1997-08-22 1997-08-22 A heat exchange unit

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GB9717916D0 GB9717916D0 (en) 1997-10-29
GB2333352A true GB2333352A (en) 1999-07-21
GB2333352B GB2333352B (en) 2000-12-27

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Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2322863A1 (en) * 2009-11-13 2011-05-18 Acome Société Coopérative de Production, Société Anonyme, à capital variable Thermoelectric reversible heat pump
EP2147860A3 (en) * 2008-07-21 2013-03-06 Hamilton Sundstrand Corporation Heat exchanger assembly for an aircraft control
US9306143B2 (en) 2012-08-01 2016-04-05 Gentherm Incorporated High efficiency thermoelectric generation
JP2016200316A (en) * 2015-04-08 2016-12-01 セイコーエプソン株式会社 Heat exchange device, cooling device and projector
US9719701B2 (en) 2008-06-03 2017-08-01 Gentherm Incorporated Thermoelectric heat pump
US9863672B2 (en) 2005-04-08 2018-01-09 Gentherm Incorporated Thermoelectric-based air conditioning system
US10106011B2 (en) 2009-05-18 2018-10-23 Gentherm Incorporated Temperature control system with thermoelectric device
US10270141B2 (en) 2013-01-30 2019-04-23 Gentherm Incorporated Thermoelectric-based thermal management system
US10464391B2 (en) 2007-05-25 2019-11-05 Gentherm Incorporated System and method for distributed thermoelectric heating and cooling
US10603976B2 (en) 2014-12-19 2020-03-31 Gentherm Incorporated Thermal conditioning systems and methods for vehicle regions
US10625566B2 (en) 2015-10-14 2020-04-21 Gentherm Incorporated Systems and methods for controlling thermal conditioning of vehicle regions
US10991869B2 (en) 2018-07-30 2021-04-27 Gentherm Incorporated Thermoelectric device having a plurality of sealing materials
FR3105821A1 (en) * 2019-12-31 2021-07-02 Altran Prototypes Automobiles Thermal heating and cooling device.
US11152557B2 (en) 2019-02-20 2021-10-19 Gentherm Incorporated Thermoelectric module with integrated printed circuit board
US11264655B2 (en) 2009-05-18 2022-03-01 Gentherm Incorporated Thermal management system including flapper valve to control fluid flow for thermoelectric device

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US7942010B2 (en) 2001-02-09 2011-05-17 Bsst, Llc Thermoelectric power generating systems utilizing segmented thermoelectric elements
US7946120B2 (en) 2001-02-09 2011-05-24 Bsst, Llc High capacity thermoelectric temperature control system
US6672076B2 (en) 2001-02-09 2004-01-06 Bsst Llc Efficiency thermoelectrics utilizing convective heat flow
US6959555B2 (en) 2001-02-09 2005-11-01 Bsst Llc High power density thermoelectric systems
CN100419347C (en) 2001-08-07 2008-09-17 Bsst公司 Thermoelectric personal environment appliance
US7380586B2 (en) 2004-05-10 2008-06-03 Bsst Llc Climate control system for hybrid vehicles using thermoelectric devices
EP1897153B1 (en) 2005-06-28 2012-08-01 Bsst Llc Thermoelectric power generator with intermediate loop
US7870745B2 (en) 2006-03-16 2011-01-18 Bsst Llc Thermoelectric device efficiency enhancement using dynamic feedback
US20100155018A1 (en) 2008-12-19 2010-06-24 Lakhi Nandlal Goenka Hvac system for a hybrid vehicle
US7779639B2 (en) 2006-08-02 2010-08-24 Bsst Llc HVAC system for hybrid vehicles using thermoelectric devices
US9555686B2 (en) 2008-10-23 2017-01-31 Gentherm Incorporated Temperature control systems with thermoelectric devices
US9447994B2 (en) 2008-10-23 2016-09-20 Gentherm Incorporated Temperature control systems with thermoelectric devices
CN102264563A (en) 2008-10-23 2011-11-30 Bsst有限责任公司 Multi-mode hvac system with thermoelectric device
US9006557B2 (en) 2011-06-06 2015-04-14 Gentherm Incorporated Systems and methods for reducing current and increasing voltage in thermoelectric systems
KR101654587B1 (en) 2011-06-06 2016-09-06 젠썸 인코포레이티드 Cartridge-based thermoelectric systems
DE112012002935T5 (en) 2011-07-11 2014-05-15 Gentherm Inc. Thermoelectric based thermal management of electrical devices
CN105276854B (en) * 2014-07-23 2017-11-17 武汉商学院 Liquid semiconductor cooling heat exchange module and high-power liquid semiconductor refrigerated heat exchanger

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Cited By (22)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9863672B2 (en) 2005-04-08 2018-01-09 Gentherm Incorporated Thermoelectric-based air conditioning system
US10464391B2 (en) 2007-05-25 2019-11-05 Gentherm Incorporated System and method for distributed thermoelectric heating and cooling
US10473365B2 (en) 2008-06-03 2019-11-12 Gentherm Incorporated Thermoelectric heat pump
US9719701B2 (en) 2008-06-03 2017-08-01 Gentherm Incorporated Thermoelectric heat pump
EP2147860A3 (en) * 2008-07-21 2013-03-06 Hamilton Sundstrand Corporation Heat exchanger assembly for an aircraft control
US11264655B2 (en) 2009-05-18 2022-03-01 Gentherm Incorporated Thermal management system including flapper valve to control fluid flow for thermoelectric device
US10106011B2 (en) 2009-05-18 2018-10-23 Gentherm Incorporated Temperature control system with thermoelectric device
US11203249B2 (en) 2009-05-18 2021-12-21 Gentherm Incorporated Temperature control system with thermoelectric device
FR2952708A1 (en) * 2009-11-13 2011-05-20 Acome Soc Cooperative De Production Sa A Capital Variable REVERSIBLE THERMOELECTRIC HEAT PUMP
EP2322863A1 (en) * 2009-11-13 2011-05-18 Acome Société Coopérative de Production, Société Anonyme, à capital variable Thermoelectric reversible heat pump
US9306143B2 (en) 2012-08-01 2016-04-05 Gentherm Incorporated High efficiency thermoelectric generation
US10784546B2 (en) 2013-01-30 2020-09-22 Gentherm Incorporated Thermoelectric-based thermal management system
US10270141B2 (en) 2013-01-30 2019-04-23 Gentherm Incorporated Thermoelectric-based thermal management system
US10603976B2 (en) 2014-12-19 2020-03-31 Gentherm Incorporated Thermal conditioning systems and methods for vehicle regions
US11358433B2 (en) 2014-12-19 2022-06-14 Gentherm Incorporated Thermal conditioning systems and methods for vehicle regions
JP2016200316A (en) * 2015-04-08 2016-12-01 セイコーエプソン株式会社 Heat exchange device, cooling device and projector
US10625566B2 (en) 2015-10-14 2020-04-21 Gentherm Incorporated Systems and methods for controlling thermal conditioning of vehicle regions
US10991869B2 (en) 2018-07-30 2021-04-27 Gentherm Incorporated Thermoelectric device having a plurality of sealing materials
US11075331B2 (en) 2018-07-30 2021-07-27 Gentherm Incorporated Thermoelectric device having circuitry with structural rigidity
US11223004B2 (en) 2018-07-30 2022-01-11 Gentherm Incorporated Thermoelectric device having a polymeric coating
US11152557B2 (en) 2019-02-20 2021-10-19 Gentherm Incorporated Thermoelectric module with integrated printed circuit board
FR3105821A1 (en) * 2019-12-31 2021-07-02 Altran Prototypes Automobiles Thermal heating and cooling device.

Also Published As

Publication number Publication date
GB2333352B (en) 2000-12-27
GB9717916D0 (en) 1997-10-29

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