GB2320250A - Polyesterimide varnishes - Google Patents
Polyesterimide varnishes Download PDFInfo
- Publication number
- GB2320250A GB2320250A GB9726275A GB9726275A GB2320250A GB 2320250 A GB2320250 A GB 2320250A GB 9726275 A GB9726275 A GB 9726275A GB 9726275 A GB9726275 A GB 9726275A GB 2320250 A GB2320250 A GB 2320250A
- Authority
- GB
- United Kingdom
- Prior art keywords
- glycol
- propanediol
- methane
- added
- polyesterimide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002966 varnish Substances 0.000 title claims abstract description 14
- 229920003055 poly(ester-imide) Polymers 0.000 title claims abstract description 13
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 claims abstract description 41
- WOZVHXUHUFLZGK-UHFFFAOYSA-N dimethyl terephthalate Chemical compound COC(=O)C1=CC=C(C(=O)OC)C=C1 WOZVHXUHUFLZGK-UHFFFAOYSA-N 0.000 claims abstract description 20
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 claims abstract description 18
- 239000011347 resin Substances 0.000 claims abstract description 15
- 229920005989 resin Polymers 0.000 claims abstract description 15
- 239000000203 mixture Substances 0.000 claims abstract description 14
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 claims abstract description 10
- 239000003054 catalyst Substances 0.000 claims abstract description 9
- QWGRWMMWNDWRQN-UHFFFAOYSA-N 2-methylpropane-1,3-diol Chemical compound OCC(C)CO QWGRWMMWNDWRQN-UHFFFAOYSA-N 0.000 claims abstract description 8
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims abstract description 7
- DSKYSDCYIODJPC-UHFFFAOYSA-N 2-butyl-2-ethylpropane-1,3-diol Chemical compound CCCCC(CC)(CO)CO DSKYSDCYIODJPC-UHFFFAOYSA-N 0.000 claims abstract description 6
- YBRVSVVVWCFQMG-UHFFFAOYSA-N 4,4'-diaminodiphenylmethane Chemical compound C1=CC(N)=CC=C1CC1=CC=C(N)C=C1 YBRVSVVVWCFQMG-UHFFFAOYSA-N 0.000 claims abstract description 6
- 239000003960 organic solvent Substances 0.000 claims abstract description 6
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 claims abstract description 6
- BPXVHIRIPLPOPT-UHFFFAOYSA-N 1,3,5-tris(2-hydroxyethyl)-1,3,5-triazinane-2,4,6-trione Chemical compound OCCN1C(=O)N(CCO)C(=O)N(CCO)C1=O BPXVHIRIPLPOPT-UHFFFAOYSA-N 0.000 claims abstract description 5
- 238000005809 transesterification reaction Methods 0.000 claims abstract description 5
- 238000004132 cross linking Methods 0.000 claims abstract 3
- 238000000034 method Methods 0.000 claims description 10
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 6
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 claims description 5
- 150000002334 glycols Chemical class 0.000 claims description 4
- 238000006358 imidation reaction Methods 0.000 claims description 4
- 238000006068 polycondensation reaction Methods 0.000 claims description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 abstract description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 15
- -1 200 g Chemical compound 0.000 description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 11
- 239000011248 coating agent Substances 0.000 description 8
- 238000000576 coating method Methods 0.000 description 8
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 8
- 239000002904 solvent Substances 0.000 description 6
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 5
- ZFSLODLOARCGLH-UHFFFAOYSA-N isocyanuric acid Chemical compound OC1=NC(O)=NC(O)=N1 ZFSLODLOARCGLH-UHFFFAOYSA-N 0.000 description 5
- 239000000243 solution Substances 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 125000000954 2-hydroxyethyl group Chemical group [H]C([*])([H])C([H])([H])O[H] 0.000 description 4
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 4
- ZOIORXHNWRGPMV-UHFFFAOYSA-N acetic acid;zinc Chemical compound [Zn].CC(O)=O.CC(O)=O ZOIORXHNWRGPMV-UHFFFAOYSA-N 0.000 description 4
- 210000003298 dental enamel Anatomy 0.000 description 4
- 239000004246 zinc acetate Substances 0.000 description 4
- WVDDGKGOMKODPV-UHFFFAOYSA-N Benzyl alcohol Chemical compound OCC1=CC=CC=C1 WVDDGKGOMKODPV-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- 150000008064 anhydrides Chemical class 0.000 description 3
- 239000010936 titanium Substances 0.000 description 3
- 229910052719 titanium Inorganic materials 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 2
- JGFBRKRYDCGYKD-UHFFFAOYSA-N dibutyl(oxo)tin Chemical compound CCCC[Sn](=O)CCCC JGFBRKRYDCGYKD-UHFFFAOYSA-N 0.000 description 2
- 125000003253 isopropoxy group Chemical group [H]C([H])([H])C([H])(O*)C([H])([H])[H] 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- RUOJZAUFBMNUDX-UHFFFAOYSA-N propylene carbonate Chemical compound CC1COC(=O)O1 RUOJZAUFBMNUDX-UHFFFAOYSA-N 0.000 description 2
- YPFDHNVEDLHUCE-UHFFFAOYSA-N 1,3-propanediol Substances OCCCO YPFDHNVEDLHUCE-UHFFFAOYSA-N 0.000 description 1
- 229940035437 1,3-propanediol Drugs 0.000 description 1
- WAUNMVYXQAKNLE-UHFFFAOYSA-N 2,2-diphenylpropan-1-ol Chemical compound C=1C=CC=CC=1C(CO)(C)C1=CC=CC=C1 WAUNMVYXQAKNLE-UHFFFAOYSA-N 0.000 description 1
- HYFFNAVAMIJUIP-UHFFFAOYSA-N 2-ethylpropane-1,3-diol Chemical compound CCC(CO)CO HYFFNAVAMIJUIP-UHFFFAOYSA-N 0.000 description 1
- 239000007983 Tris buffer Substances 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 235000019445 benzyl alcohol Nutrition 0.000 description 1
- 230000001588 bifunctional effect Effects 0.000 description 1
- 125000004106 butoxy group Chemical group [*]OC([H])([H])C([H])([H])C(C([H])([H])[H])([H])[H] 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 125000000853 cresyl group Chemical group C1(=CC=C(C=C1)C)* 0.000 description 1
- HPXRVTGHNJAIIH-UHFFFAOYSA-N cyclohexanol Chemical compound OC1CCCCC1 HPXRVTGHNJAIIH-UHFFFAOYSA-N 0.000 description 1
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N dimethylmethane Natural products CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000166 polytrimethylene carbonate Polymers 0.000 description 1
- 239000011541 reaction mixture Substances 0.000 description 1
- PTCSYKMYHDPUDF-UHFFFAOYSA-N zinc acetyl acetate Chemical compound [Zn+2].C(C)(=O)OC(C)=O PTCSYKMYHDPUDF-UHFFFAOYSA-N 0.000 description 1
- NHXVNEDMKGDNPR-UHFFFAOYSA-N zinc;pentane-2,4-dione Chemical compound [Zn+2].CC(=O)[CH-]C(C)=O.CC(=O)[CH-]C(C)=O NHXVNEDMKGDNPR-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
- C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
- C08G73/10—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08G73/16—Polyester-imides
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
- C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C09J179/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
- H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
- H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
- H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
- H01B3/303—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups H01B3/38 or H01B3/302
- H01B3/306—Polyimides or polyesterimides
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Paints Or Removers (AREA)
- Organic Insulating Materials (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
Abstract
Polyesterimide varnishes are made by polycondensing and imidating a mixture of trimellitic anhydride, 4,4'-diamino-diphenyl methane, glycol, dimethyl terephthalate and trihydric alcohol (eg tris(hydroxyethyl) isocyanurate or glycerol) and optionally p,p'-dihydroxy-diphenyl-dimethyl methane, wherein the glycol or part of the glycol is 2-methyl-1,3-propanediol and/or 2-butyl-2-ethyl-1,3-propanediol. A transesterification catalyst may be added to the mixture and the resulting polyesterimide resin may subsequently be dissolved in an organic solvent with a crosslinking catalyst added.
Description
1 2320250 METHOD FOR MAKING POLYESTERIMIDE VARNISHES The ob). ect of the
present invention is a method for making polyesterimide varnishes, comprising polycondensation and imidation of a mixture of bifunctional and trifunctional monomers and subsequent dissolution of the resulting polyesterimide resin in an organic solvent. The polyestenimide varnishes according to the present invention can be used to enamel magnet wires to be applied in electnic motors and other electric equipment.
Phior-art polyestenimide varnishes have been prepared by dissolving polyesterimide resins in organic solvents including tricresol containing aromatic hydrocarbons as additives, Nmethylpyrrolidinone or a mixture of solvents contaning cyclohexanone. Polyestenmide resins are prepared by well-known methods involving polycondensation and imidation of a mixture of trimellitic anhydnide, 4,4'-diamino-diphenyl methane, alycol, a trihydric alcohol, and dimethyl terephthalate or optionally p.p -di hydroxy-diphenyl-di methyl methane (bisphenol A) (cf. US Pat. 2 421 024 and 3 435 002 and Polish Pat. 125 456 and 164 804). Ethylene glycol is generally used as the glycol. Glycerol or tris(2-hydroxyethyl) isocyanurate is used as the tn'hydnc alcohol.
The polyesterlimide varnishes prepared by pn'or-ari methods contain at most 3) 5% of dry matter. If the dry matter content is raised, the varnish becomes too "scous to be applied to a magnet wire, especially a large-diameter wire, so as to furnish a coating that is suitably smooth.
-I- The purpose of the present invention is to develop a method for preparing polyesterimide varnishes with an increased dry matter content and at the same time modest viscosity that would enable the varnish to be applied onto a magnet mre so as to produce a smooth coating.
Surprisingly, it has been found that the desired efiect can be achieved by polycondensing and 1Midating a mixture of trimellitic anhydride, 4,4'diamino-diphenyl methane, dimethyl terephthalate, glycoL trihydfic alcohol and optionally pp -dihydroxydiphenyi-dimethyl methane with a transesterification catalyst added and subsequently "Iving the resulting polyesterimide resin Mi an organic solvent with a crosslffildng catalyst added, provided 2-methyl-1,3-propanediol andlor 2- 2-ethyl-1,3-propanediol is used as the glycol or as one of the glycols.
Additionally, in the method according to the present invention, ethylene glycol andlor neopentyl glycol may be used, whereby 0.05-0.50 mol 2methyl-1,3-propanediol and/or 2butyl-2-ethyl-1,3-propanediol is used per 1 mol ethylene glycol and/or neopentyl glycol.
? r,,ef erAU j As the trihydnic alcohol, tris(2-hydroxyethyi) isocyanurate or glycerol isjused. Zinc acetate, zinc acetylacetate or dibutyl tin oxide is used preferably as the transesterification catalyst. As the crossfinking catalys a compound selected from the group of esters and polyesters of orthotitnic acid e.g., tetabutoxy titanium.
m. a -, As the solvent for the polyestedmide resin, tricresol used, containing aromatic hydrocarbons as an additive, or N-methylpyrrofidinone, or a mixture of solvents containing cyclohexanone.
The method according to the present invention enables the dry matter content in the h the coating produced by applying the varnish to a largediameter varnish to be increased, wit copper wire displaying the desired smoothness. This effect nigy h aqbutgo tp the asymmetric structure of the glycols used in' ihe method according to the present invention, viz., 2methyl-1,3-propanediol and 2-butyl-2-ethyl-1,3-propanediol.
Eple 1 Trimellitic anhydride, 225 g, 4,4'-&aniino-diphenyl methane, 115 g, 2- methyl-1,3propanediol, 10 & &is(2-hydroxyethyl) isocyanurate, 190 & dimethyl terephthalate, 140 & P,P'-dlydro?cy-&phenyl-dimethyI methane, 200 g, and zinc acetylacetonate, 1.5 g, were aded to a reactor, 1 d& in capacity. The temperature of the reaction mixture was raised progressively to 210T and water and methanol were distified ofr. The resulting polyesterimide resin, 560 & was dissolved in a mixture composed of 50 g cyclohexanoL 300 g cyclohexanone, 200 g propylene carbonate, 200 g benzyl alcohol and 14 g poly(butyl titanate).
The resulting solution containing 42% of dry matter was used to coat a copper wire, 1.8 mm in diameter. Upon baking, a class 180 copper wire was obtained with the coating characterized by a considerable smoothness.
E'.ramIA 11 Trimellitic anhydride, 160 g, 4,4'-diamino-diptienyl methane, 82.5 g, dimethyl terephthalate, 160 g, 2-butyi-2-ethyl- 1,3-prop.anedlol, 40 g, ethylene glycol, 22 g, tris(2hydroxyethyl) isocyanurate, 130 g, and zinc acetate, 0.8 g, were added to a 1 -drn.'reactor. Temperature was progressively increased up to 225T and water and methanol were distilled off The resulting polyestenimide resin, 450 g, was dissolved in a mixture composed of 200 g trIcresol, 150 g cyclohexanone,-70 g solvent naphtha, 30 g propylene glycol, 200 g propylene carbonate, and 10 g cresyl orthotitanate.
The resulting solution containing 4 1 % of dry matter was used to enamel a copper wire, 1.2 mm in diameter. Upon baking, a class 180 copper wire was obtained with a very smooth coating.
F,x,ample 111 Tnimellitic anhydride, 200 g, 4,4'-diamino-di phenyl methane, 100 g, ethylene glycol, g, 2-methy]- 1,3-propanedlol, 25 g, Iris (2-hydroxyethyl) isocyanurate, 150 g, glycerol, -3 W dimethyl terephthalate, 100 g, p,p-dlhydroxy- diphenyl-dimethyl methane, 50 g, and zinc acetate, 1 g, were added to 1- dm.' reactor. Temperature was progressively increased up to 235 'C and water and methanol were distilled off. The resulting resin, 550 g, was dissolved in a Mixture composed of 600 g tnicresol and 200 g solvent naphtha containing 30 g letra(isopropoxy) titanate and 20 g phenol resin.
The resulting solution, dry mattter content 40%, was used to coat a copper wire, 1. 5 mm in diameter. Upon baking, a class 155 copper wire was obtained that had a very smooth coating.
a -7, 1,,xallll)le If' Tnimellitic anhydride, 200 g, 4,4'-diamino-diphenyl methane, 100 g, neopentyl glycol, 100 9, 2-buty]-2-ethyl-1,3-propanediol, 80 g, tri-s(2- hydroxyethyl) isocyanurate, 130 g, dimethyl terephthalate, 100 g, and dibutyl tin oxide, 0.6 g, were added to a 1 -dm3 reactor. Temperature was progressively raised up to 220T and water and methanol were distilled off. The resulting resin, 600 g, was dissolved in a mixture composed of 600 g tricresol, 200 g solvent naphtha and 25 g letra(butoxy) titanium.
The resulting solution, dry matter content 42%, was used to enamel a copper wire, 1. 8 mm in diameter. Subsequent baking allowed to obtain the copper wire, class 200, with a very smooth coating.
Example V
Tnimellitic anhydride, 150 g, 4,4'-diamino-di phenyl methane, 78 g, ethylene glycol, 60 g, neopentyl glycol, 50 g, 2-rnethyl-1,3-propanediol, 20 g, 2-buty]-2-ethyl-1,3-propanediol, 80 g, dimethyl terephthalate, 80 g, tri.,(2-hydroxyethyl) isocyanurate, 120 g, p,p-dlhydroxydiphenyl- dimethyl methane, 100 g, and zinc acetate, 1 a., were added to a 1 Arn reactor. Temperature was progressively raised up to 230T and water and methanol were distilled off.. The resulting polyestenirnide resin, 700 g, was dissolved in a mixture composed of 800 g trIcresol, 200 g Solvesso- 100, 30 g teli-a(isopropoxy) titanium, and 40 g phenol resin.
The resulting solution, dry matter content 40%, was used to enamel a copper wire, 1.8 mm in diameter. Subsequent baking allowed to obtain the copper wire, class 180, Ikth a very smooth coating.
- S_ 6
Claims (5)
1. A polyesterimide resin formed by the polycondensation and imidation of a mixture of trimellitic anhydride, 4,4'-diamino-diphenyl methane, glycol, dimethyl terephthalate and trihydric alcohol and optionally pp-dihydroxydiphenyl-dimethyl methane in the presence of a transesterification catalyst, wherein 2-methyl-1,3-propanediol and/or 2-butyl-2-ethyl-1,3propanediol is used as the glycol component or as one of the glycols.
2. A resin according to claim 1, wherein the trihydric alcohol is glycerol or tris(hydroxyethyl)isocyanurate.
3. A varnish comprising a resin according to claim 1 or 2, dissolved in an organic solvent containing a cross-linking catalyst.
4. A method for preparing polyesterimide varnishes comprising polycondensation and imidation of a mixture of trimellitic anhydride, 4, 4'-diamino-diphenyl methane, glycol, dimethyl terephthalate and glycerol or tris(hydroxyethyl) isocyanurate or optionally p,pdihydroxy-diphenyldimethyl methane, a transesterification catalyst having been added, and subsequently dissolving the resulting polyesterimide resin in an organic solvent with a cross-linking catalyst added, characterised by the feature that 2-methyl-1,3-propanediol and/or 2-butyl-2-ethyl-1,3-propanediol is added as the glycol or as one of the glycols.
-1
5. A method as claimed in claim 4, characterised by the feature that 0.05 to 0.5 mol 2-methyl-1,3-propanediol and/or 2-butyl-2-ethyl-1,3propanediol is added per 1 mol ethylene glycol and/or neopentyl glycol.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PL96317440A PL189058B1 (en) | 1996-12-11 | 1996-12-11 | Method of making polyesterimide lacquers |
Publications (4)
| Publication Number | Publication Date |
|---|---|
| GB9726275D0 GB9726275D0 (en) | 1998-02-11 |
| GB2320250A true GB2320250A (en) | 1998-06-17 |
| GB2320250A8 GB2320250A8 (en) | 1999-01-18 |
| GB2320250B GB2320250B (en) | 2000-07-12 |
Family
ID=20068804
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB9726275A Expired - Fee Related GB2320250B (en) | 1996-12-11 | 1997-12-11 | Method for making polyesteride varnishes |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPH10168388A (en) |
| DE (1) | DE19754445A1 (en) |
| FR (1) | FR2756839B1 (en) |
| GB (1) | GB2320250B (en) |
| PL (1) | PL189058B1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111978767A (en) * | 2020-09-01 | 2020-11-24 | 安徽晟然绝缘材料有限公司 | High-breakdown-voltage mosaic modified polyester enameled wire insulating paint and preparation method thereof |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4732947A (en) * | 1986-12-02 | 1988-03-22 | General Electric Company | Block polyetherimide ester polymers |
| JP2652017B2 (en) * | 1987-05-08 | 1997-09-10 | 大日精化工業株式会社 | Polyester imide insulating paint |
-
1996
- 1996-12-11 PL PL96317440A patent/PL189058B1/en unknown
-
1997
- 1997-12-08 DE DE1997154445 patent/DE19754445A1/en not_active Withdrawn
- 1997-12-11 GB GB9726275A patent/GB2320250B/en not_active Expired - Fee Related
- 1997-12-11 FR FR9715690A patent/FR2756839B1/en not_active Expired - Fee Related
- 1997-12-11 JP JP34148597A patent/JPH10168388A/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| GB9726275D0 (en) | 1998-02-11 |
| GB2320250A8 (en) | 1999-01-18 |
| DE19754445A1 (en) | 1998-06-18 |
| JPH10168388A (en) | 1998-06-23 |
| FR2756839A1 (en) | 1998-06-12 |
| PL189058B1 (en) | 2005-06-30 |
| GB2320250B (en) | 2000-07-12 |
| FR2756839B1 (en) | 2000-08-11 |
| PL317440A1 (en) | 1998-06-22 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 711B | Application made for correction of error (sect. 117/77) | ||
| PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 20041211 |