GB2312554B - Process for the manufacture of semiconductor components comprising micromechanical structures - Google Patents

Process for the manufacture of semiconductor components comprising micromechanical structures

Info

Publication number
GB2312554B
GB2312554B GB9708501A GB9708501A GB2312554B GB 2312554 B GB2312554 B GB 2312554B GB 9708501 A GB9708501 A GB 9708501A GB 9708501 A GB9708501 A GB 9708501A GB 2312554 B GB2312554 B GB 2312554B
Authority
GB
United Kingdom
Prior art keywords
manufacture
semiconductor components
micromechanical structures
micromechanical
structures
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB9708501A
Other versions
GB9708501D0 (en
GB2312554A (en
Inventor
Franz Laermer
Andrea Schilp
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of GB9708501D0 publication Critical patent/GB9708501D0/en
Publication of GB2312554A publication Critical patent/GB2312554A/en
Application granted granted Critical
Publication of GB2312554B publication Critical patent/GB2312554B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C3/00—Assembling of devices or systems from individually processed components
    • B81C3/001—Bonding of two components
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/0802—Details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01P—MEASURING LINEAR OR ANGULAR SPEED, ACCELERATION, DECELERATION, OR SHOCK; INDICATING PRESENCE, ABSENCE, OR DIRECTION, OF MOVEMENT
    • G01P15/00—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration
    • G01P15/02—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses
    • G01P15/08—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values
    • G01P15/125—Measuring acceleration; Measuring deceleration; Measuring shock, i.e. sudden change of acceleration by making use of inertia forces using solid seismic masses with conversion into electric or magnetic values by capacitive pick-up

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Pressure Sensors (AREA)
GB9708501A 1996-04-27 1997-04-25 Process for the manufacture of semiconductor components comprising micromechanical structures Expired - Fee Related GB2312554B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE1996116970 DE19616970B4 (en) 1996-04-27 1996-04-27 Method for producing semiconductor devices having micromechanical structures

Publications (3)

Publication Number Publication Date
GB9708501D0 GB9708501D0 (en) 1997-06-18
GB2312554A GB2312554A (en) 1997-10-29
GB2312554B true GB2312554B (en) 1998-06-17

Family

ID=7792688

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9708501A Expired - Fee Related GB2312554B (en) 1996-04-27 1997-04-25 Process for the manufacture of semiconductor components comprising micromechanical structures

Country Status (3)

Country Link
DE (1) DE19616970B4 (en)
FR (1) FR2748159B1 (en)
GB (1) GB2312554B (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1991016608A1 (en) * 1990-04-14 1991-10-31 Robert Bosch Gmbh Process for manufacturing mechanical micro-structures
EP0594182A2 (en) * 1992-10-22 1994-04-27 Canon Kabushiki Kaisha Anode bonding method and acceleration sensor obtained by using the anode bonding method

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5855732A (en) * 1981-09-30 1983-04-02 Hitachi Ltd Electrostatic capacity type pressure sensor
JP3214631B2 (en) * 1992-01-31 2001-10-02 キヤノン株式会社 Semiconductor substrate and method of manufacturing the same
US5236118A (en) * 1992-05-12 1993-08-17 The Regents Of The University Of California Aligned wafer bonding
FR2700065B1 (en) * 1992-12-28 1995-02-10 Commissariat Energie Atomique Method of manufacturing accelerometers using silicon on insulator technology.
DE4331798B4 (en) * 1993-09-18 2004-08-26 Robert Bosch Gmbh Process for the production of micromechanical components
DE4418163B4 (en) * 1994-05-25 2007-04-05 Robert Bosch Gmbh Process for the production of micromechanical structures
SE504962C2 (en) * 1995-11-01 1997-06-02 Split Vision Dev Ab Device for a sewerage system in a building for various degrees of contaminated wastewater
DE19616014B4 (en) * 1996-04-23 2006-04-20 Robert Bosch Gmbh Method for producing semiconductor devices having micromechanical structures

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1991016608A1 (en) * 1990-04-14 1991-10-31 Robert Bosch Gmbh Process for manufacturing mechanical micro-structures
EP0594182A2 (en) * 1992-10-22 1994-04-27 Canon Kabushiki Kaisha Anode bonding method and acceleration sensor obtained by using the anode bonding method

Also Published As

Publication number Publication date
DE19616970A1 (en) 1997-10-30
DE19616970B4 (en) 2012-04-12
FR2748159B1 (en) 2005-09-02
GB9708501D0 (en) 1997-06-18
FR2748159A1 (en) 1997-10-31
GB2312554A (en) 1997-10-29

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20130425