GB2307345A - Semiconductor device contact structure - Google Patents
Semiconductor device contact structure Download PDFInfo
- Publication number
- GB2307345A GB2307345A GB9703577A GB9703577A GB2307345A GB 2307345 A GB2307345 A GB 2307345A GB 9703577 A GB9703577 A GB 9703577A GB 9703577 A GB9703577 A GB 9703577A GB 2307345 A GB2307345 A GB 2307345A
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- Prior art keywords
- layer
- semiconductor
- resistance control
- contact structure
- contact
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 49
- 239000000758 substrate Substances 0.000 claims abstract description 23
- 239000000463 material Substances 0.000 claims abstract description 21
- 230000004888 barrier function Effects 0.000 claims abstract description 13
- 239000012535 impurity Substances 0.000 claims description 11
- 238000006243 chemical reaction Methods 0.000 claims description 3
- 239000002184 metal Substances 0.000 abstract description 15
- 229910052751 metal Inorganic materials 0.000 abstract description 15
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 7
- 229910052710 silicon Inorganic materials 0.000 abstract description 7
- 239000010703 silicon Substances 0.000 abstract description 7
- 229910052732 germanium Inorganic materials 0.000 abstract description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 abstract 1
- 238000000034 method Methods 0.000 description 12
- 238000010438 heat treatment Methods 0.000 description 9
- 239000010936 titanium Substances 0.000 description 9
- 239000002019 doping agent Substances 0.000 description 8
- 238000000151 deposition Methods 0.000 description 7
- 230000008021 deposition Effects 0.000 description 6
- 238000009792 diffusion process Methods 0.000 description 6
- 238000002513 implantation Methods 0.000 description 6
- 238000004519 manufacturing process Methods 0.000 description 6
- 229910052719 titanium Inorganic materials 0.000 description 6
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 5
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 description 5
- 230000015572 biosynthetic process Effects 0.000 description 5
- 230000008569 process Effects 0.000 description 5
- 238000004151 rapid thermal annealing Methods 0.000 description 4
- 239000007789 gas Substances 0.000 description 3
- 238000005468 ion implantation Methods 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- 229910003818 SiH2Cl2 Inorganic materials 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 150000002500 ions Chemical class 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 239000005368 silicate glass Substances 0.000 description 2
- 229910008479 TiSi2 Inorganic materials 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 238000000137 annealing Methods 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- DFJQEGUNXWZVAH-UHFFFAOYSA-N bis($l^{2}-silanylidene)titanium Chemical compound [Si]=[Ti]=[Si] DFJQEGUNXWZVAH-UHFFFAOYSA-N 0.000 description 1
- 239000012159 carrier gas Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000000737 periodic effect Effects 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 239000012495 reaction gas Substances 0.000 description 1
- 229920006395 saturated elastomer Polymers 0.000 description 1
- 239000004460 silage Substances 0.000 description 1
- 229910021332 silicide Inorganic materials 0.000 description 1
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 1
- 239000013589 supplement Substances 0.000 description 1
- 238000007669 thermal treatment Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/45—Ohmic electrodes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
- H01L21/28506—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers
- H01L21/28512—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table
- H01L21/28525—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation of conductive layers on semiconductor bodies comprising elements of Group IV of the Periodic Table the conductive layers comprising semiconducting material
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/40—Electrodes ; Multistep manufacturing processes therefor
- H01L29/43—Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/45—Ohmic electrodes
- H01L29/456—Ohmic electrodes on silicon
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Ceramic Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Electrodes Of Semiconductors (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Abstract
An ohmic contact structure for connection of an electrode to a highly integrated semiconductor device, is made by forming, in a contact hole, a semiconductor material (23) having a smaller bandgap than that of a substrate semiconductor material (10) to lower a contact resistance and by forming a semiconductor material (21) of hetero-junction structure and also of smaller bandgap under the material (23) to minimize stress and strain between metal wiring layer (19) and semiconductor substrate (10). A barrier layer (17) of TiN may be provided. For a doped silicon substrate, the material (23) may be germanium and the material (21) Si 1-x Ge x .
Description
SEMICONDUCTOR DEVICES
The present invention relates to manufacture of a semiconductor device. More particularly, it relates to an ohmic contact structure for connecting an electrode to a high integrated semiconductor device and a method for making the ohmic contact structure.
High density degree of integration circuits has been improved double every year. Nowadays, there has begun mass production of 16M dynamic random access memory devices with a sub-half micron design rule, performance speed is improved but resistance-capacitance delay and characteristics of the lines are degraded due to microminiaturization of lines by high integration of circuits and increase in the length of the lines.
Accordingly, a technique of forming a contact hole in the sub-half micron age takes up an important position in respect of low resistance and high reliability of the semiconductor devices.
Connecting an electrode to a semiconductor device is generally performed through a contact hole formed on an insulating layer such as a silica glass or a borophosphorous silicate glass. Junction between a metal and a semiconductor through a contact hole is characterized as a rectifying contact and a non-rectifying contact first proposed by Shottky in 1940. In the theory, the non-rectifying contact is formed in the following two cases: first, a work function of a metal material is smaller than a work function of a semiconductor material in an n-type semiconductor substrate; second, a work function of a metal material is larger than a work function of a semiconductor substrate in a p-type semiconductor substrate.
It is too difficult for today's art technology to form an ideal Shottky contact, i.e. achieve a contact between a metal and a semiconductor with a resistance near zero. A hypothesis thereabout is described in detail in U.S. Patent No. 4,738,937.
A representative technique for forming a contact hole to lower the contact resistance is shown in FIG. 1 (refer to U.S. Patent No. 5,108,954). As illustrated, a junction region 3 to which impurity of a predetermined contact hole is implanted, is formed on a part within a semiconductor substrate 1, and a metal layer 9, wiring electrode, is deposited on a surface of an insulating layer 5 including the region of a contact hole (not illustrated) to cover a part of the above junction region 3 exposed by the contact hole by a metal layer 9.
If the metal layer having a considerable thickness is formed serially from the bottom of the contact hole to the surface of the insulating layer 5 along sidewalls of the contact hole, electrical contact is formed between a substrate and a wiring electrode. A diffusion prevention layer 7 of titanium nitride (TiN) or titanium tungstenite (TiW) is formed in order to prevent metal or silicon electromigration resulted from diffusion of metal and silicon between the substrate 1 and wiring electrode 9.
At the time of subsequent thermal treatment, i.e.
formation of silicide TiSi2 made by heat treatment of titanium and silicon, out-diffusion occurs, which causes a sharp drop of the concentration of the dopant in the interface of the diffusion-prevention layer 7. The contact resistance is increased thereby. The relationship between the contact resistance and the dopant concentration will be described.
A plug implantation technique of additionally ionimplanting the dopant after the contact hole formation is used to prevent the out-diffusion of the dopant and supplement the reduced dose.
As shown in FIG. 2, according to such a plug implantation, a protrusion 3a is formed under the junction region 3 adjacent to the contact hole. This protrusion 3a does not cause any serious problem in a conventional semiconductor device having a relativelydeep junction in a substrate.
However, as in the case of a very large-sized integrated circuit (VLSI) in which a large number of devices are assembled in a unit area, this protrusion may cause short-circuit conductivity in a semiconductor device having a shallow junction, which is adverse to the requirement for improving the performance speed.
Besides, the impurity level exceeds the solubility limit in a junction area, the junction area is saturated with the impurity and a deposit of the doped impurity is shown as a separate phase.
Therefore, the impurity level in the junction area is limited. If the deposit is shown in the junction region, the increase of the impurity or dose cannot increase carrier density any more.
The deposit in a lot of silicon grains causes diffusion of carrier and facilitates reunion of the carrier.
The present invention seeks to lower a contact resistance of a semiconductor device.
It is a first object of the present invention to provide a low resistance contact structure of a high integrated semiconductor device that may reduce a contact resistance by forming selectively on a contact hole a material having a band gap smaller than that of a substrate material on the contact hole, and may minimize stress and strain between a metal and a semiconductor by forming a material having a heterojunction structure thereunder.
It is a second object to provide a method for forming effectively an ohmic contact structure having a hetero-junction.
According to this invention, an ohmic contact structure of a semiconductor device, comprises:
a junction region doped with an impurity on a semiconductor substrate;
a first resistance control layer having a reduced resistivity and selectively provided on a contact hole over the junction region with a. material of a heterojunction structure whose work function is lower than a substrate material;
a second resistance control layer having a reduced resistivity provided with a material whose work function is lower than a substrate material on said first resistance control layer; and
a conductive layer forming a wiring electrode provided on the second resistance control layer.
A method for making a semiconductor device comprises the steps of:
forming a junction region implanted with an impurity on a predetermined portion of a semiconductor substrate;
forming an insulating layer on the semiconductor substrate and forming a contact hole by opening the insulating layer in order to expose a part of the junction region;
forming a first resistance control layer on the contact hole;
forming a second resistance control layer on the first resistance control on the first resistance control layer;
forming at least one barrier layer on the second resistance control layer and insulating layer and performing a heating treatment thereon; and
forming a conductive layer on the barrier layer.
As another aspect of the present invention, the present invention uses bandgap engineering that has been studied, making compound semiconductor an object of its study. The contact resistance depends on the following expression:
Rc : contact resistance ta : barrier layer height
N, : dopant concentration m* : effective mass
A : constant eS : permittivity h : planck constant
According to this expression, internal factors to lower a contact resistance are low barrier layer height, i.e. low work function between a metal and a semiconductor, high concentration dopant, and small effective mass, i.e. high mobility. In order to meet this requirement, Ge which has a more excellent physical characteristic than that of Si and is in the same family as Si, is used as a second resistance control layer of the present invention. For reference, table 1 shows comparison of properties of matter between two materials:: Table 1
Si Ge Structure of Crystal diamond diamond Bandgap (3000K) 1.12eV 0.66ev electron 1500 3,900 Mobility (cm2/V Sec) hole 450 1,900 In order to minimize stress and strain generated by difference of each lattice constant, a first resistance control layer of hetero-junction structure, e.g. Si!.Gex is provided to be inserted between silicon and the second resistance control layer.Accordingly, reactions between the metal and semiconductor layer such as outdiffusion of the dopant, formation of the protrusion by excessive ion-implantation and eduction phenomenon of the doped impurity is effectively controlled by the first and second resistance control layers crossing the wiring electrode and semiconductor layer. As a result of the reduced resistance, turn may reduce the size of the contact hole that makes possible miniaturization of a semiconductor device. In such a structure, the resistance control layer is formed to be even and thin by treating the surface of the semiconductor layer by means of a proper atmospheric gas, by an epitaxial process, or by depositing a proper material.
Embodiments of the invention will now be descriL d, by way of example only, with reference to the
accompanying drawings, in which:
FIG. 1 is a sectional view showing a typical contact structure of a semiconductor device in a conventional way;
FIG. 2 is a sectional view showing the other conventional contact structure and its problem;
FIGS. 3A to 3E are steps in the manufacture of a contact structure of a semiconductor device in accordance with a preferred embodiment of this invention;
FIGS. 4A to 4C are steps in the -manufacture of a contact structure of a semiconductor device in accordance with a second preferred embodiment of this invention;
FIG. 5 is a graph showing the relationship between flow rate of 10% GeH and composition ratio of Sii.rGe::; and
FIG. 6 is a graph summing up resultants produced by gauging a contact resistance between a metal and a semiconductor According to each contact structure.
FIGS. 3A to 3E show a preferred embodiment of this invention, and depict the steps in the manufacture of a contact structure by an epitaxial process.
Referring to FIG. 3A, a first step is ionimplanting impurity of a predetermined conductivity type on one portion of a semiconductor substrate 10 to form a junction region 13. As a second step, an insulating layer 15 such as silica glass or boro-phosphorous silicate glass is applied to the semiconductor substrate.
10 and the junction region 13, and a contact hole 16 is formed by opening the insulating layer 15 to expose a part of the above junction region 13.
A third step is forming an Si1.Ge epi-layer 21, a first resistance control layer 21 on the contact hole 16 (FIG. 2B). SiH2Cl2 and GeHt using H2 as a carrier gas are used as a reaction gas for the formation of the epilayer. Besides, Ge source is made by mixing 10% GeH( to
H2. A condition of formation of the S1.x Ge epi-layer 21 is as follows: 600 - 900 OC; flow rate of 20 sccm to 200 sccm. Preferably, the amount of SiH2Cl2 is changed to 20 - 200 sccm at 6250C, 20slm of H2 flow rate, and 1 - 10 sccm of GeHz flow rate.As the flow rate of 10% GeHl changes, the Ge concentration is also changed, and the thicker the Ge concentration is, the more the growth speed is increased. And the growth speed of the Silts Ge epi-layer 21 is 23 A/min, if Ge is 12%, i.e. in case of 0.88 Si and 0.12 Ge. In case of 0.67 Si and 0.36 Ge, the growth speed is 126 /min.
By increasing the flow rate of 10% GeHI gradually in such a condition, the SipsGe epi-layer 21 is grown to a thickness of 100A - 500 , preferably, about 200 A.
FIG. 5 is a graph showing a relationship of change in the content of Ge according to the flow rate of 10% GeH@. When it comes to the composition ratio of Si@@@Ge@ epi-layer, composition ratio of x is changed to 0.4 according to the graph of FIG. 5. The grown Sil.xGe epilayer 21 does not contain dopant but doped Silage may be used, if necessary.
A doped epitaxial layer is formed by flowing B2E6 gas or PH3 gas at the time of epitaxial process. A fourth step is forming a second resistance control layer 23, and uses the epi-process like the third step (FIG. 3C).
As widely known, its condition is the same as the growth condition of the Si!sGe epi-layer 21, and the flow rate of SiH2Cl, is zero to form the Ge epi-layer 23. The thickness of the Ge epi-layer 23 is about 50A - 100A. If the conductivity type of the junction region 13 is P+, the 3rd group element in the periodic table, e.g. B or
BFI is ion-implanted.
In case of N+ type junction region 13, As or P is ion-implanted. The ion-implantation is performed at 20
50 KeV, at a dose of 5X10l - 1x1015 (ions/cm-).
A fifth step is forming a barrier layer 17 on the second resistance control layer 23 and the insulating layer 15 formed through the above process, and performing heating treatment.
In this embodiment, only one barrier layer 17 is provided, and two barrier layers may be provided in a second embodiment that will be described after. First, titanium is deposited by sputtering to a thickness of about 500 - 1500A, and annealed at about 600 OC -9000C in a passive ambient of N for a short time period to form a structure as shown in FIG. 3D. Such a heating treatment performed for a very short time period may be available by means of rapid thermal annealing (RTA) device. While titanium contacting the second resistance control layer 23 comes to be TiGe by annealing, the rest titanium that does not contact the second resistance control layer 23 reacts with N2 in the atmosphere and titanium nitride serving as a diffusion barrier layer is formed thereon. Finally, a conductive layer is formed to be used as an electronic line by burying the contact hole with the metal layer, as shown in FIG. 3E.
FIGS. 4A to 4C show the steps in the manufacture of a contact structure of a semiconductor device in accordance with a second preferred embodiment of this invention, and correspond to FIGS. 3A to 3E. The common description will be omitted, and like reference numerals and letters designate like parts.
In this embodiment, a first resistance control layer is formed by post heating treatment after Ge is ion-implanted not by epitaxial process but by ionimplantation. First, by using a photosensitive layer 18 as a mask, Ge is ion-implanted at a accelerating voltage of 10 - 30 KeV and at a dose of 1x1015 - 1016 ions/cm2, with low energy to form a Ge implantation layer 22 in the junction region 13, as shown in FIG. 4A. If the accelerating voltage is 20 KeV, the projected range is about 200 , and if the accelerating voltage is 30 KeV, the projected range is about 260 A. If the accelerating voltage is 10 KeV, the projected range is about 125 A.
Referring now to FIG. 4B, after the photoresist layer 18 is removed, Ge and Ti are serially deposited on the Ge implantation layer 22 and the insulating layer 15 to form a Ge deposition layer 24 and a Ti deposition layer 17, respectively to a thickness of about 100 - 500 A at a deposition speed of 10 - 50 A/sec and at substrate temperatures of 2000C, by a sputtering device.
In the step as shown in FIG. 4C, the above Ge implantation layer 22 comes to be a first resistance control layer 21' of Si1.x Ge=, according to activation effect by high temperature heating treatment and reaction with the silicon.
The Ge deposition layer 24 on the above Ge implantation layer 22 is remained as a second resistance control layer 23' of Ge. The Ge deposition layer 24 on the upper and side portions of the insulating layer 15 comes to be a first barrier layer 17a of TiGe by reacting with Ti. TiN is deposited by sputtering to a thickness of about 500 A - 1500 A and serves as a second barrier layer 17b. After serially deposition of Ti and
TiN, heating treatment may be used. Rapid thermal annealing is performed for 20 - 60 seconds at 6000C 9000C in an ambient of N2, or the heating treatment is performed for 30 - 60 minutes in an ambient of N2 at 4500C - 6000C in an ambient of N2.For reference, the first barrier layer 17a, Tigs , is formed to have the lowest sheet resistance (20zQ/cm2), if the rapid thermal annealing is performed for 20 seconds at 8000C.
As described above, the present invention provides a contact structure of hetero-junction of Ge and Sil,Ge, whose bandgap is lower than a substrate material to the interface between the metal and semiconductor, which may be usefully applied to low resistance of electronic lines and high reliability in high integrated semiconductor device. The effect of the present invention is shown more obviously by graph of FIG. 6.
FIG. 6 sums up resultants produced by gauging a contact- resistance between the metal and semiconductor by using as a test pattern a contact string having 1200 contact holes.
A resultant of Ge/Si! Ge hetero-contact structure of this invention is indicated by "A" in the graph. "B" is a contact structure to which only Ge is ionimplanted, and "C" is a conventional contact structure to which Ge is not ion-implanted. The size of each contact hole is 0.sum and the semiconductor layer is a
P+ type area to which BF2 is ion-implanted at a dose of lox1015. . The heating treatment is performed for 120 minutes at 8500C at an ambient of N2. According to the contact structure of this invention, the contact resistance is reduced about twice.
While this invention has been described in connection with what is presently considered to be the most practical and preferred embodiments, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary, it is intended to cover various modifications and equivalent arrangements included within the spirit and scope of the appended claims.
Claims (5)
1. An ohmic contact structure of a semiconductor device, comprising:
a junction region doped with an impurity on a semiconductor substrate;
a first resistance control layer having a resistivity and selectively provided in a contact hole over the junction region with a semiconductor material of a hetero-junction structure whose energy bandgap is narrower than the substrate material;
a second resistance control layer having a resistivity comprising a semiconductor material whose energy bandgap is narrower than the substrate material; and
a conductive layer forming a wiring electrode provided on the second resistance control layer.
2. An ohmic contact structure according to Claim 1, wherein said first resistance control layer is formed of SilxGex.
3. An ohmic contact structure according to Claim 1 or 2, wherein said second resistance control layer is formed of Ge.
4. An ohmic contact structure according to any one of Claims 1 to 3, further comprising at least one barrier layer inserted between the conductive layer and the second resistance control layer in order to prevent reaction between the junction region and conductive layer.
5. An ohmic contact structure according to Claim 2, wherein said x is in a range of o < x < 1.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR930002962 | 1993-03-02 | ||
| GB9403816A GB2275822B (en) | 1993-03-02 | 1994-02-28 | Semiconductor devices |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| GB9703577D0 GB9703577D0 (en) | 1997-04-09 |
| GB2307345A true GB2307345A (en) | 1997-05-21 |
Family
ID=26304400
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB9703577A Withdrawn GB2307345A (en) | 1993-03-02 | 1994-02-28 | Semiconductor device contact structure |
| GB9703514A Expired - Fee Related GB2309337B (en) | 1993-03-02 | 1994-02-28 | Semiconductor devices |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB9703514A Expired - Fee Related GB2309337B (en) | 1993-03-02 | 1994-02-28 | Semiconductor devices |
Country Status (1)
| Country | Link |
|---|---|
| GB (2) | GB2307345A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| RU186972U1 (en) * | 2018-04-09 | 2019-02-12 | федеральное государственное бюджетное образовательное учреждение высшего образования "Омский государственный университет им. Ф.М. Достоевского" | Device for controlling the resistivity of ohmic contacts to semiconductor layers |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0568050A2 (en) * | 1992-04-28 | 1993-11-03 | Nec Corporation | Ohmic contact on a compound semiconductor layer |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5126805A (en) * | 1989-11-24 | 1992-06-30 | Gte Laboratories Incorporated | Junction field effect transistor with SiGe contact regions |
| KR960001601B1 (en) * | 1992-01-23 | 1996-02-02 | 삼성전자주식회사 | Contact-hole burying method of semiconductor device and its |
| JP2841976B2 (en) * | 1990-11-28 | 1998-12-24 | 日本電気株式会社 | Semiconductor device and manufacturing method thereof |
-
1994
- 1994-02-28 GB GB9703577A patent/GB2307345A/en not_active Withdrawn
- 1994-02-28 GB GB9703514A patent/GB2309337B/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0568050A2 (en) * | 1992-04-28 | 1993-11-03 | Nec Corporation | Ohmic contact on a compound semiconductor layer |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| RU186972U1 (en) * | 2018-04-09 | 2019-02-12 | федеральное государственное бюджетное образовательное учреждение высшего образования "Омский государственный университет им. Ф.М. Достоевского" | Device for controlling the resistivity of ohmic contacts to semiconductor layers |
Also Published As
| Publication number | Publication date |
|---|---|
| GB9703514D0 (en) | 1997-04-09 |
| GB2309337A (en) | 1997-07-23 |
| GB9703577D0 (en) | 1997-04-09 |
| GB2309337B (en) | 1997-10-08 |
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