GB2304456B - Window clamp and method of alignment of lead frame strip utilizing the same - Google Patents

Window clamp and method of alignment of lead frame strip utilizing the same

Info

Publication number
GB2304456B
GB2304456B GB9617166A GB9617166A GB2304456B GB 2304456 B GB2304456 B GB 2304456B GB 9617166 A GB9617166 A GB 9617166A GB 9617166 A GB9617166 A GB 9617166A GB 2304456 B GB2304456 B GB 2304456B
Authority
GB
United Kingdom
Prior art keywords
alignment
same
lead frame
frame strip
window clamp
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB9617166A
Other versions
GB2304456A (en
GB9617166D0 (en
Inventor
Young Kui Moon
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SK Hynix Inc
Original Assignee
Hyundai Electronics Industries Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hyundai Electronics Industries Co Ltd filed Critical Hyundai Electronics Industries Co Ltd
Publication of GB9617166D0 publication Critical patent/GB9617166D0/en
Publication of GB2304456A publication Critical patent/GB2304456A/en
Application granted granted Critical
Publication of GB2304456B publication Critical patent/GB2304456B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67144—Apparatus for mounting on conductive members, e.g. leadframes or conductors on insulating substrates
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
    • H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/787—Means for aligning
    • H01L2224/78703—Mechanical holding means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01006—Carbon [C]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01021—Scandium [Sc]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01027—Cobalt [Co]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01039—Yttrium [Y]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01051—Antimony [Sb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01052—Tellurium [Te]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01054—Xenon [Xe]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01075—Rhenium [Re]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
GB9617166A 1995-08-17 1996-08-15 Window clamp and method of alignment of lead frame strip utilizing the same Expired - Fee Related GB2304456B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
KR1019950025229A KR0152607B1 (en) 1995-08-17 1995-08-17 A window clamp and align method of lead frame strip using a window clamp

Publications (3)

Publication Number Publication Date
GB9617166D0 GB9617166D0 (en) 1996-09-25
GB2304456A GB2304456A (en) 1997-03-19
GB2304456B true GB2304456B (en) 2000-03-22

Family

ID=19423622

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9617166A Expired - Fee Related GB2304456B (en) 1995-08-17 1996-08-15 Window clamp and method of alignment of lead frame strip utilizing the same

Country Status (4)

Country Link
US (1) US5796161A (en)
KR (1) KR0152607B1 (en)
CN (1) CN1082247C (en)
GB (1) GB2304456B (en)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5890644A (en) * 1996-01-26 1999-04-06 Micron Technology, Inc. Apparatus and method of clamping semiconductor devices using sliding finger supports
US5673845A (en) * 1996-06-17 1997-10-07 Micron Technology, Inc. Lead penetrating clamping system
KR20010068587A (en) * 2000-01-07 2001-07-23 이수남 Apparatus for clamping substrate of semiconductor package
JP2002009105A (en) * 2000-06-10 2002-01-11 Amkor Technology Korea Inc Pattern regonition method and clamp therefor
KR20010111438A (en) * 2000-06-10 2001-12-19 마이클 디. 오브라이언 method for detecting orientation of lead frame and heat block clamp for using thereof
US6678926B2 (en) * 2001-06-22 2004-01-20 Delphi Technologies, Inc. Method and apparatus for manufacturing battery plates
SG143997A1 (en) * 2006-12-21 2008-07-29 Rokko Technology Pte Ltd A clamping assembly
US7578423B1 (en) * 2008-06-06 2009-08-25 Asm Technology Singapore Pte Ltd. Assembly for reducing oxidation of semiconductor devices
WO2011011298A2 (en) * 2009-07-20 2011-01-27 Kulicke And Soffa Industries, Inc. Method of operating a clamping system of a wire bonding machine
US8381965B2 (en) 2010-07-22 2013-02-26 Taiwan Semiconductor Manufacturing Company, Ltd. Thermal compress bonding
US8104666B1 (en) * 2010-09-01 2012-01-31 Taiwan Semiconductor Manufacturing Company, Ltd. Thermal compressive bonding with separate die-attach and reflow processes
WO2012092058A2 (en) * 2010-12-29 2012-07-05 Orthodyne Electroncis Corporation Methods and systems for aligning tooling elements of ultrasonic bonding systems
US10541223B2 (en) * 2017-05-05 2020-01-21 Kulicke And Soffa Industries, Inc. Methods of operating a wire bonding machine to improve clamping of a substrate, and wire bonding machines
US10763236B2 (en) * 2018-01-09 2020-09-01 Kulicke And Soffa Industries, Inc. Systems and methods of operating wire bonding machines including clamping systems
KR20220160553A (en) * 2020-03-29 2022-12-06 쿨리케 앤드 소파 인더스트리즈, 인코포레이티드 Method for optimizing clamping of a semiconductor device to a support structure on a wire bonding machine, and related methods
US11826861B1 (en) * 2020-08-12 2023-11-28 Sion Power Corporation Joining systems, clamping fixtures, and related systems and methods
US20220230314A1 (en) * 2021-01-15 2022-07-21 Kulicke And Soffa Industries, Inc. Intelligent pattern recognition systems for wire bonding and other electronic component packaging equipment, and related methods

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07302806A (en) * 1994-05-06 1995-11-14 Hitachi Ltd Lead frame positioning apparatus

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4049903A (en) * 1974-10-23 1977-09-20 Amp Incorporated Circuit film strip and manufacturing method
JPH0770550B2 (en) * 1990-04-23 1995-07-31 三菱電機株式会社 Semiconductor frame transfer device and transfer method
US5035034A (en) * 1990-07-16 1991-07-30 Motorola, Inc. Hold-down clamp with mult-fingered interchangeable insert for wire bonding semiconductor lead frames
JP2890335B2 (en) * 1991-07-15 1999-05-10 株式会社新川 Tape clamp mechanism
US5322307A (en) * 1992-07-31 1994-06-21 Tilton Equipment Company Chassis for transportable mounting of vibrating equipment

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07302806A (en) * 1994-05-06 1995-11-14 Hitachi Ltd Lead frame positioning apparatus

Non-Patent Citations (1)

* Cited by examiner, † Cited by third party
Title
JAPIO abstract number 05010206 & JP07-302806A (HITACHI), seeabstract. *

Also Published As

Publication number Publication date
CN1082247C (en) 2002-04-03
US5796161A (en) 1998-08-18
CN1150330A (en) 1997-05-21
GB2304456A (en) 1997-03-19
KR970013135A (en) 1997-03-29
GB9617166D0 (en) 1996-09-25
KR0152607B1 (en) 1998-12-01

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 20130815