GB2300752B - Method of manufacturing bonding wire for semiconductor device - Google Patents

Method of manufacturing bonding wire for semiconductor device

Info

Publication number
GB2300752B
GB2300752B GB9509683A GB9509683A GB2300752B GB 2300752 B GB2300752 B GB 2300752B GB 9509683 A GB9509683 A GB 9509683A GB 9509683 A GB9509683 A GB 9509683A GB 2300752 B GB2300752 B GB 2300752B
Authority
GB
United Kingdom
Prior art keywords
wire
bonding wire
lubricant
semiconductor device
manufacturing bonding
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB9509683A
Other versions
GB2300752A (en
GB9509683D0 (en
Inventor
Taeko Tobiyama
Hiroto Iga
Ichiro Nagamatsu
Keiko Itabashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tanaka Denshi Kogyo KK
Original Assignee
Tanaka Denshi Kogyo KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tanaka Denshi Kogyo KK filed Critical Tanaka Denshi Kogyo KK
Priority to GB9509683A priority Critical patent/GB2300752B/en
Publication of GB9509683D0 publication Critical patent/GB9509683D0/en
Priority to SG1996009322A priority patent/SG64376A1/en
Publication of GB2300752A publication Critical patent/GB2300752A/en
Application granted granted Critical
Publication of GB2300752B publication Critical patent/GB2300752B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

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    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B21—MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL; PUNCHING METAL
    • B21C—MANUFACTURE OF METAL SHEETS, WIRE, RODS, TUBES OR PROFILES, OTHERWISE THAN BY ROLLING; AUXILIARY OPERATIONS USED IN CONNECTION WITH METAL-WORKING WITHOUT ESSENTIALLY REMOVING MATERIAL
    • B21C9/00—Cooling, heating or lubricating drawing material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/40—Making wire or rods for soldering or welding
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/08—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of copper or alloys based thereon
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22F—CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS AND NON-FERROUS ALLOYS
    • C22F1/00—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working
    • C22F1/14—Changing the physical structure of non-ferrous metals or alloys by heat treatment or by hot or cold working of noble metals or alloys based thereon
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Abstract

A bonding wire for semiconductor devices is manufactured by a process which includes applying a lubricant to a wire and taking measures to ensure good adhesion between the lubricant and the wire. In particular wire may be cooled to directly after final annealing at a rate of 1000{C/sec. or more. Alternatively, the wire may be withdrawn form the lubricant solution at an angle of between 50 and 60{ to the surface of the solution. In a yet further alternative the wire is given a surface removal treatment after annealing.
GB9509683A 1995-05-12 1995-05-12 Method of manufacturing bonding wire for semiconductor device Expired - Fee Related GB2300752B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
GB9509683A GB2300752B (en) 1995-05-12 1995-05-12 Method of manufacturing bonding wire for semiconductor device
SG1996009322A SG64376A1 (en) 1995-05-12 1996-04-20 Method of manufacturing bonding wire for semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB9509683A GB2300752B (en) 1995-05-12 1995-05-12 Method of manufacturing bonding wire for semiconductor device

Publications (3)

Publication Number Publication Date
GB9509683D0 GB9509683D0 (en) 1995-07-05
GB2300752A GB2300752A (en) 1996-11-13
GB2300752B true GB2300752B (en) 1999-12-15

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
GB9509683A Expired - Fee Related GB2300752B (en) 1995-05-12 1995-05-12 Method of manufacturing bonding wire for semiconductor device

Country Status (2)

Country Link
GB (1) GB2300752B (en)
SG (1) SG64376A1 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6894398B2 (en) 2001-03-30 2005-05-17 Intel Corporation Insulated bond wire assembly for integrated circuits
CN102764787B (en) * 2012-07-03 2015-04-22 广西泰星电子焊接材料有限公司 Solder cooling device for extruding-rolling on-line automatic production line
CN111604620A (en) * 2020-06-08 2020-09-01 郑州机械研究所有限公司 Binderless coated electrode and method and apparatus for making same
CN114345962A (en) * 2022-01-06 2022-04-15 马鞍山法尔盛科技有限公司 Steel wire rod wire drawing production facility

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0163471A2 (en) * 1983-06-20 1985-12-04 Sumitomo Metal Industries, Ltd. Method for continuous drawing of wire rod
JPH01251727A (en) * 1988-03-31 1989-10-06 Mitsubishi Metal Corp Bonding wire for element of semiconductor and the like
JPH0294534A (en) * 1988-09-30 1990-04-05 Tanaka Electron Ind Co Ltd Wire for bonding of semiconductor element
JPH06196485A (en) * 1992-12-25 1994-07-15 Tanaka Denshi Kogyo Kk Bump forming wire of semiconductor element

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0163471A2 (en) * 1983-06-20 1985-12-04 Sumitomo Metal Industries, Ltd. Method for continuous drawing of wire rod
JPH01251727A (en) * 1988-03-31 1989-10-06 Mitsubishi Metal Corp Bonding wire for element of semiconductor and the like
JPH0294534A (en) * 1988-09-30 1990-04-05 Tanaka Electron Ind Co Ltd Wire for bonding of semiconductor element
JPH06196485A (en) * 1992-12-25 1994-07-15 Tanaka Denshi Kogyo Kk Bump forming wire of semiconductor element

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
Patent Abstracts of Japan Section E-1617 & JP 06 196 485 A *
Patent Abstracts of Japan Section E-868 & JP 01 251 727 A *
Patent Abstracts of Japan Section E-944 & JP 02 094 534 A *

Also Published As

Publication number Publication date
GB2300752A (en) 1996-11-13
GB9509683D0 (en) 1995-07-05
SG64376A1 (en) 1999-04-27

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