GB2299891B - Integrated circuit packages - Google Patents

Integrated circuit packages

Info

Publication number
GB2299891B
GB2299891B GB9508238A GB9508238A GB2299891B GB 2299891 B GB2299891 B GB 2299891B GB 9508238 A GB9508238 A GB 9508238A GB 9508238 A GB9508238 A GB 9508238A GB 2299891 B GB2299891 B GB 2299891B
Authority
GB
United Kingdom
Prior art keywords
integrated circuit
circuit packages
packages
integrated
circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB9508238A
Other versions
GB2299891A (en
GB9508238D0 (en
Inventor
David Yorke Armstrong
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HYBRID MEMORY PRODUCTS Ltd
Original Assignee
HYBRID MEMORY PRODUCTS Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by HYBRID MEMORY PRODUCTS Ltd filed Critical HYBRID MEMORY PRODUCTS Ltd
Publication of GB9508238D0 publication Critical patent/GB9508238D0/en
Priority to EP96909280A priority Critical patent/EP0820643A1/en
Priority to AU52840/96A priority patent/AU5284096A/en
Priority to JP8530806A priority patent/JPH11503569A/en
Priority to PCT/GB1996/000873 priority patent/WO1996032746A1/en
Publication of GB2299891A publication Critical patent/GB2299891A/en
Application granted granted Critical
Publication of GB2299891B publication Critical patent/GB2299891B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/144—Stacked arrangements of planar printed circuit boards
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/105—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L27/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
    • H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/1011—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
    • H01L2225/1017—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement the lowermost container comprising a device support
    • H01L2225/1023—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement the lowermost container comprising a device support the support being an insulating substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
    • H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
    • H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
    • H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
    • H01L2225/1011—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
    • H01L2225/1047—Details of electrical connections between containers
    • H01L2225/107—Indirect electrical connections, e.g. via an interposer, a flexible substrate, using TAB
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/095—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00 with a principal constituent of the material being a combination of two or more materials provided in the groups H01L2924/013 - H01L2924/0715
    • H01L2924/097—Glass-ceramics, e.g. devitrified glass
    • H01L2924/09701—Low temperature co-fired ceramic [LTCC]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Combinations Of Printed Boards (AREA)
GB9508238A 1995-04-08 1995-04-24 Integrated circuit packages Expired - Fee Related GB2299891B (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
EP96909280A EP0820643A1 (en) 1995-04-08 1996-04-09 Integrated circuit packages
AU52840/96A AU5284096A (en) 1995-04-08 1996-04-09 Integrated circuit packages
JP8530806A JPH11503569A (en) 1995-04-08 1996-04-09 Integrated circuit package
PCT/GB1996/000873 WO1996032746A1 (en) 1995-04-08 1996-04-09 Integrated circuit packages

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB9507360A GB9507360D0 (en) 1995-04-08 1995-04-08 Integrated circuit packages

Publications (3)

Publication Number Publication Date
GB9508238D0 GB9508238D0 (en) 1995-06-14
GB2299891A GB2299891A (en) 1996-10-16
GB2299891B true GB2299891B (en) 1999-06-16

Family

ID=10772800

Family Applications (2)

Application Number Title Priority Date Filing Date
GB9507360A Pending GB9507360D0 (en) 1995-04-08 1995-04-08 Integrated circuit packages
GB9508238A Expired - Fee Related GB2299891B (en) 1995-04-08 1995-04-24 Integrated circuit packages

Family Applications Before (1)

Application Number Title Priority Date Filing Date
GB9507360A Pending GB9507360D0 (en) 1995-04-08 1995-04-08 Integrated circuit packages

Country Status (1)

Country Link
GB (2) GB9507360D0 (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4250536A (en) * 1978-12-26 1981-02-10 General Electric Company Interconnection arrangement for circuit boards
US4998180A (en) * 1989-05-23 1991-03-05 Clearpoint Research Corporation Bus device with closely spaced double sided daughter board
EP0434543A2 (en) * 1989-12-20 1991-06-26 Digital Equipment Corporation High-density memory array packaging
US5220491A (en) * 1990-04-09 1993-06-15 Hitachi, Ltd. High packing density module board and electronic device having such module board
US5279029A (en) * 1990-08-01 1994-01-18 Staktek Corporation Ultra high density integrated circuit packages method

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4250536A (en) * 1978-12-26 1981-02-10 General Electric Company Interconnection arrangement for circuit boards
US4998180A (en) * 1989-05-23 1991-03-05 Clearpoint Research Corporation Bus device with closely spaced double sided daughter board
EP0434543A2 (en) * 1989-12-20 1991-06-26 Digital Equipment Corporation High-density memory array packaging
US5220491A (en) * 1990-04-09 1993-06-15 Hitachi, Ltd. High packing density module board and electronic device having such module board
US5279029A (en) * 1990-08-01 1994-01-18 Staktek Corporation Ultra high density integrated circuit packages method

Also Published As

Publication number Publication date
GB2299891A (en) 1996-10-16
GB9508238D0 (en) 1995-06-14
GB9507360D0 (en) 1995-05-31

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 19990916