GB2291259A - Manufacture of thin-film electroluminescent elements - Google Patents

Manufacture of thin-film electroluminescent elements Download PDF

Info

Publication number
GB2291259A
GB2291259A GB9512980A GB9512980A GB2291259A GB 2291259 A GB2291259 A GB 2291259A GB 9512980 A GB9512980 A GB 9512980A GB 9512980 A GB9512980 A GB 9512980A GB 2291259 A GB2291259 A GB 2291259A
Authority
GB
United Kingdom
Prior art keywords
thin
film
luminous layer
gas
luminous
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB9512980A
Other versions
GB9512980D0 (en
GB2291259B (en
Inventor
Hisato Kato
Tomoyuki Kawashima
Shinichi Nakamata
Takashi Tsuji
Yutaka Terao
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fuji Electric Co Ltd
Original Assignee
Fuji Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fuji Electric Co Ltd filed Critical Fuji Electric Co Ltd
Publication of GB9512980D0 publication Critical patent/GB9512980D0/en
Publication of GB2291259A publication Critical patent/GB2291259A/en
Application granted granted Critical
Publication of GB2291259B publication Critical patent/GB2291259B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00Electroluminescent light sources
    • H05B33/12Light sources with substantially two-dimensional radiating surfaces
    • H05B33/14Light sources with substantially two-dimensional radiating surfaces characterised by the chemical or physical composition or the arrangement of the electroluminescent material, or by the simultaneous addition of the electroluminescent material in or onto the light source
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/57Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing manganese or rhenium
    • C09K11/572Chalcogenides
    • C09K11/574Chalcogenides with zinc or cadmium
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K11/00Luminescent, e.g. electroluminescent, chemiluminescent materials
    • C09K11/08Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials
    • C09K11/77Luminescent, e.g. electroluminescent, chemiluminescent materials containing inorganic luminescent materials containing rare earth metals
    • C09K11/7701Chalogenides
    • C09K11/7702Chalogenides with zinc or cadmium
    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/0623Sulfides, selenides or tellurides
    • C23C14/0629Sulfides, selenides or tellurides of zinc, cadmium or mercury
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00Electroluminescent light sources
    • H05B33/10Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05BELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00Electroluminescent light sources
    • H05B33/12Light sources with substantially two-dimensional radiating surfaces
    • H05B33/18Light sources with substantially two-dimensional radiating surfaces characterised by the nature or concentration of the activator

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Manufacturing & Machinery (AREA)
  • Electroluminescent Light Sources (AREA)
  • Physical Vapour Deposition (AREA)

Description

2291259 MANUFACTURE OF THIN-FILM ELECTROLUMiNESCENT ELEMENTS The present
invention relates to the manufacture of electroluminescent elements, and particularly concerns the formation of a luminous layer for a thin-film electroluminescent element, which has enhanced luminous brightness.
Thin-film eiectroluminescent elements that are totally solid are noted as flat display elements with high resolution and large display capacity.
Figure 7 shows a cross section ofa conventional thin-film electroluminescent element. The thin-film electroluminescent element has a double-insulation structure in which a transparent electrode 2, a first insulating layer 3, a luminous layer 4, a second insulating layer 5, and a back-plate electrode 6 are sequentially laminated onto a glass substrate 1. Zinc sulphide (ZnS) is a base material of the luminous layer in the thin-film electroluminescent element, to which a small amount of emission centre material, for example Mn, has been added.
Vacuum deposition methods, ALE methods classified into MID methods, and sputtering methods are currently used in the manufacture of luminous layers for thin-film electroiuminescent elements. Of these, sputtering methods allow uniform films with a large area to be formed at a very high speed, resulting in high productivity.
In the manufacture of luminous layers for thin-film electroiuminescent elements, using a sputtering method, however, it is difficult to provide a layer with sufficient luminous brightness (ACTA POLYTECHNICA SCANDINAVICA Applied Physics Series No. 170 'Sh International Workshop on Electroluminescence" pp 41 to 48).
Our research has shown that the different physical properties of zinc, sulphur, and manganese cause resultant films to have a composition which is significantly different from the target composition, and which deviates from the ideal stoichiometric composition of the film, resulting in reduced brightness of the electroluminescent element.
2 To solve this problem, the film formation techniques used to produce zinc sulphide based luminous layers have been studied, to determine how luminous brightness can be improved. Film formation at a substrate temperature of 300 to 35M (a conventional requirement) leads to improved luminous brightness, but also the generation (in the early phase of film formation) of dead layers with a thickness of about 10 nm, which are made up of regions with a small particle size. In addition, the luminous layers obtained have an average crystal particle size of 260 nm, which is so small that practical luminous brightness cannot be obtained. In other words, the presence of dead layrs and a small crystal particle size of the remainder of the film hinders the acceleration of electrons, causing them to excite dopants insufficiently, thereby reducing luminous brightness.
Figure 6 is a cross section showing the integral part of a conventional thin-film eiectroluminescent element. A dead layer 4A of small crystal size is seen in the luminous layer.
The present invention aims at solving the above problem, and takes as its objective the provision of a thin-film electroluminescent element with high luminous brightness. This is achieved by optimising the substrate temperature during reactive sputtering to prevent the generation of dead layers in the early phase of luminous layer generation and to increase the crystal particle size of the zinc sulphide during the formation of the luminous layer.
According to the present invention, the above objective can be achieved by manufacturing a thin-film electroluminescent element using as a luminous layer a zinc sulphide ZnS thin film with a dopant added as an emission centre, wherein a luminous layer is formed by a reactive sputtering method that uses a mixture of a sulphur-containing gas and a rare gas to sputter zinc and a dopant while the substrate temperature is maintained at 380 to 4800C.
In the manufacture of the above thin-film electroluminescent element, the dopant is effective when it is either manganese, manganese sulphide, a manganese halide, a rare-earth element, a rare-earth sulphide, or a rareearth halide.
3 Furthermore, the mixture of a sulphur-containing gas and a rare gas should preferably be composed of hydrogen sulphide and argon.
The melting points of zinc and sulphur are 4200C and 1200C, respectively. If, however, the substrate temperature is set at the melting point of zinc or higher, temperatures at which film formation is ordinarily considered difficult, the high temperature of the substrate increases the growing speed of crystals and causes any excess amounts of zinc and sulphur to evaporate quickly.
Embodiments of the invention will now be described in detail with reference to the drawings, in which:
Figure 1 is a schematic drawing showing a sputtering apparatus capable of producing a thin-film electroluminescent element according to an embodiment of this invention; Figure 2 is a target to be sputtered according to another embodiment of this invention, wherein Figure 2(a) shows the target in plan and wherein Figure 2(b) shows the target in cross section; Figure 3 is a cross section of another target to be processed according to the second embodiment of this invention; Figure 4 is a graph showing the dependency of luminous brightness on the substrate temperature of the thin-film electroluminescent element according to the first embodiment of this invention; Figure 5 is a cross section showing the integral part of the thin-film electroluminescent element according to the various embodiments of this invention; Figure 6 is a cross section showing the integral part of a conventional thin-film electroluminescent element; and Figure 7 is a cross section of the thin-film electroluminescent element.
Referring now to the drawings, Figure 5 is a cross section showing the integral part of the thin-film electroluminescent element according to this invention. A transparent electrode 2, is formed from indium-tin oxide with a thickness of 1700 A. A first insulating film 3 with a thickness of 2100 A consisting of silicon oxide or silicon nitride, a luminous layer 4 with a thickness of 7000 A, a second insulation film 5 4 with a thickness of 2100 A consisting of silicon nitride or silicon oxide, and a back-piate electrode 6 with a thickness of 7000 A consisting of aluminium, were sequentially laminated in this order.
Figure 1 shows a sputtering apparatus for producing a luminous layer for a thin-film electroluminescent element according to this invention. In this Figure, a cathode 9 attached to a target 8 is connected to a 13.56 MHz RF power supply 11 via a matching circuit 121 An anode 10 is located opposite the target, and a substrate 1 is placed on the anode 10.
To form the luminous layer, zinc with manganese concentration [Mn/(Zn + Mn)] of 0.3 wr/G was selected as the target.
In a first example of the method, the sputtering gas was a mixture of a sulphur-containing gas and a rare gas, that is, argon gas with a hydrogen sulphide addition of 20 to 40%. The gas was introduced into a reaction chamber 14 from a gas inlet 13. Sputtering was carried out under a gas pressure of 10 mTorr, a substrate temperature of 350 to 5OWC, and a discharge power of 3 W1CM2. Under these conditions, the surface of the target was sulphurised to reduce the sputtering rate of zinc, resulting in a zinc-sulphide film with a composition close to the stoichiometric composition. The luminous layer thus formed was then thermally treated at 500%.
The luminous layer obtained in this manner at a substrate temperature within a wide range of 380 to 4800C, has a large crystal particle size of about 450 nm, and achieves a luminous brightness of 200 cd/M2or more. This luminous brightness is twice that of a conventional film formed at a substrate temperature of 35TC.
Figure 4 is a graph showing the relationship between luminous brightness and the substrate temperature during sputtering for the thin-film electroluminescent element according to this embodiment of the invention.
This graph shows that the luminous brightness is about 200 cd/M2 or more when the substrate temperature is maintained at 3800C or higher during sputtering. The elevated substrate temperature increases the growing speed of crystals and causes any excess amounts of zinc and sulphur to evaporate. Large crystals of about 450 nm thus grow from the surface of the first insulating layer to prevent dead layers from being generated thereon, thereby allowing the crystals to obtain a stoichiometric composition.
Figure 2 shows a target to be sputtered according to a second embodiment of this invention, wherein Figure 2(a) shows the plan and Figure 2(b) shows the cross section. Terbium fluoride TbF3 is spotted on the zinc target 41 at doped areas 42.
The apparatus used in this example was similar to the apparatus used for the first example. The target used was Zn with TbF3 appropriately spotted thereon, and the surface of the target was adjusted to have an average terbium concentration [Th/(Zn + Th)] of 2.5 WC/0. Sputtering was carried out using argon gas with a hydrogen sulphide addition of 40%, at a gas pressure of 10 mTorr, a substrate temperature of 4000C, and a discharge power of 3 WICM2. Once formed, the luminous layer was thermally treated at 6000C.
A luminous layer with a large crystal particle size resulted and a thinfilm electroluminescent element with high luminous brightness was obtained using this luminous layer.
Although Th was used as a rare-earth element in the examples, other rareearth elements including Sm, Tm, Pr, Ho, Er, Dy, Eu, and Ce can also be used as alternatives in combination.
Figure 3 is a plan view showing a different target to be sputtered using the method of the second example of this invention. This target is a mosaic target where Zn is dotted with Tb which is inlaid therein in the above-mentioned concentration.
This example is the same as example 1 except that a gaseous mixture of sulphur vapour and argon was used as the sputtering gas to form a film instead of a mixture of hydrogen sulphide and argon.
The luminous layer obtained in this manner at a substrate temperature within a wide range of 380 to 4801C, had a large crystal particle size of about 430 nm and a luminous brightness of 200 cd/M2 or more. This luminous brightness is twice that in conventional film formed at a substrate temperature of 3500C.
6 As an alternative to the above gases, sulphur hexafluoride may also be used as the sputtering gas.
According to this invention, a luminous layer is formed by a reactive sputtering method using a mixture of a gas containing sulphur elements and a rare gas at a substrate temperature of 380 to 4800C. A luminous layer, in which no dead layers are generated and which has a large crystal particle size, can thus be obtained, and the crystals can be controlled so that they retain a stoichiometric composition. The luminous layer, when incorporated in a thin-film electroluminescent element results in a luminous brightness twice that obtaMed by the prior art.
7

Claims (7)

1. A method of manufacturing a zinc sulphide ZnS thin film, to which a dopant has been added as an emission centre, as a luminous layer of a thin-film electroluminescent element wherein the luminous layer is formed by a reactive sputtering method using a mixture of a sulphur-containing gas and a rare gas as a sputtering gas to sputter zinc together with a dopant while the substrate temperature is maintained at 380 to 4800C.
2. The method of Claim 1 wherein the dopant is either manganese, manganese sulphide, or a manganese halide.
3. The method of Claim 1 wherein the dopant is either a rare-earth element, a rare-earth sulphide, or a rareearth halide.
4. The method of Claim 1 wherein the mixture of a sulphurcontaining gas and a rare gas consists of hydrogen sulphide and argon.
5. A luminous layer for a thin-film electroiuminescent element formed by a method according to any of Claims 1 to 4.
6. A thin-film electroluminescent element including a luminous layer according to Claim 5.
7. A method substantially as described herein.
GB9512980A 1994-07-04 1995-06-26 Manufacture of thin-film electroluminescent elements Expired - Fee Related GB2291259B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6151387A JPH0817574A (en) 1994-07-04 1994-07-04 Manufacture of thin film electroluminecent element

Publications (3)

Publication Number Publication Date
GB9512980D0 GB9512980D0 (en) 1995-08-30
GB2291259A true GB2291259A (en) 1996-01-17
GB2291259B GB2291259B (en) 1996-11-27

Family

ID=15517475

Family Applications (1)

Application Number Title Priority Date Filing Date
GB9512980A Expired - Fee Related GB2291259B (en) 1994-07-04 1995-06-26 Manufacture of thin-film electroluminescent elements

Country Status (3)

Country Link
JP (1) JPH0817574A (en)
DE (1) DE19524359A1 (en)
GB (1) GB2291259B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100810629B1 (en) * 2004-12-08 2008-03-06 삼성에스디아이 주식회사 Method for producing Organic Light Emitting Diode by use of Mirror Shape Target Sputter

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0137850A1 (en) * 1983-02-10 1985-04-24 Matsushita Electric Industrial Co., Ltd. Electroluminescent display device and process for its production
EP0298745A2 (en) * 1987-07-08 1989-01-11 Sharp Kabushiki Kaisha Thin film electroluminescent device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0137850A1 (en) * 1983-02-10 1985-04-24 Matsushita Electric Industrial Co., Ltd. Electroluminescent display device and process for its production
EP0298745A2 (en) * 1987-07-08 1989-01-11 Sharp Kabushiki Kaisha Thin film electroluminescent device

Also Published As

Publication number Publication date
JPH0817574A (en) 1996-01-19
GB9512980D0 (en) 1995-08-30
DE19524359A1 (en) 1996-01-11
GB2291259B (en) 1996-11-27

Similar Documents

Publication Publication Date Title
US6090434A (en) Method for fabricating electroluminescent device
JPH08127771A (en) Electroluminescent element and production thereof
EP1573084B1 (en) Composite sputter target and phosphor deposition method
US4675092A (en) Method of producing thin film electroluminescent structures
US7622149B2 (en) Reactive metal sources and deposition method for thioaluminate phosphors
US6793782B2 (en) Sputter deposition process for electroluminescent phosphors
US5539424A (en) Thin-film electroluminescence display device
GB2291259A (en) Manufacture of thin-film electroluminescent elements
US7556721B2 (en) Thiosilicate phosphor compositions and deposition methods using barium-silicon vacuum deposition sources for deposition of thiosilicate phosphor films
Kim et al. Effects of ZnO buffer layer on the luminous properties of thin-film phosphors deposited on ZnO/ITO/glass substrates
JPS6141112B2 (en)
JP3584574B2 (en) EL element and manufacturing method thereof
GB2273815A (en) Method for preparing thin-film electro-luminescence element
JP3381292B2 (en) Method for forming electroluminescent element
JP3543414B2 (en) Electroluminescence device and method of manufacturing the same
US5763111A (en) Electroluminescence element and process for fabricating same
JP3487618B2 (en) Electroluminescence element
JPH0265094A (en) Thin film el element and manufacture thereof
JPH06231884A (en) Manufacture of thin film electroluminescent element
JPS61253797A (en) Manufacture of electroluminescence element
JP2001297877A (en) Manufacturing method and apparatus of thin film electroluminescence element
JPH0883684A (en) Manufacture of electroluminescence thin film and manufacturing device therefor
JPH02306591A (en) Manufacture of thin film electroluminescence element
Kim et al. Addition of He to Ar during sputter deposition of electroluminescent ZnS: TbOF thin films
JPH0355039B2 (en)

Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 19990626