GB2227122B - Semi-conductor modules - Google Patents

Semi-conductor modules

Info

Publication number
GB2227122B
GB2227122B GB9002694A GB9002694A GB2227122B GB 2227122 B GB2227122 B GB 2227122B GB 9002694 A GB9002694 A GB 9002694A GB 9002694 A GB9002694 A GB 9002694A GB 2227122 B GB2227122 B GB 2227122B
Authority
GB
United Kingdom
Prior art keywords
semi
conductor modules
conductor
modules
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
GB9002694A
Other versions
GB9002694D0 (en
GB2227122A (en
Inventor
Peter Richard Ewer
Jeffrey Robert Ellard
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Infineon Technologies Reigate Ltd
Infineon Technologies Americas Corp
Original Assignee
International Rectifier Company Great Britain Ltd
International Rectifier Corp USA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Rectifier Company Great Britain Ltd, International Rectifier Corp USA filed Critical International Rectifier Company Great Britain Ltd
Priority to GB9002694A priority Critical patent/GB2227122B/en
Publication of GB9002694D0 publication Critical patent/GB9002694D0/en
Publication of GB2227122A publication Critical patent/GB2227122A/en
Application granted granted Critical
Publication of GB2227122B publication Critical patent/GB2227122B/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Rectifiers (AREA)
  • Power Conversion In General (AREA)
GB9002694A 1986-04-02 1990-02-07 Semi-conductor modules Expired - Lifetime GB2227122B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB9002694A GB2227122B (en) 1986-04-02 1990-02-07 Semi-conductor modules

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB8608094A GB2189343B (en) 1986-04-02 1986-04-02 Semi-conductor modules
GB9002694A GB2227122B (en) 1986-04-02 1990-02-07 Semi-conductor modules

Publications (3)

Publication Number Publication Date
GB9002694D0 GB9002694D0 (en) 1990-04-04
GB2227122A GB2227122A (en) 1990-07-18
GB2227122B true GB2227122B (en) 1990-11-14

Family

ID=10595579

Family Applications (2)

Application Number Title Priority Date Filing Date
GB8608094A Expired - Lifetime GB2189343B (en) 1986-03-27 1986-04-02 Semi-conductor modules
GB9002694A Expired - Lifetime GB2227122B (en) 1986-04-02 1990-02-07 Semi-conductor modules

Family Applications Before (1)

Application Number Title Priority Date Filing Date
GB8608094A Expired - Lifetime GB2189343B (en) 1986-03-27 1986-04-02 Semi-conductor modules

Country Status (1)

Country Link
GB (2) GB2189343B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2991010B2 (en) * 1993-09-29 1999-12-20 富士電機株式会社 Semiconductor device and manufacturing method thereof
DE10113192B4 (en) * 2001-03-19 2007-03-01 Infineon Technologies Ag Semiconductor device
DE10239866B3 (en) 2002-08-29 2004-04-08 Infineon Technologies Ag Production of a semiconductor component used in circuit boards comprises forming electrical contact surfaces together within a smaller contacting region as the whole surface of the front side of the chip and further processing

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB502306A (en) * 1938-06-03 1939-03-15 Mallory & Co Inc P R Improvements relating to dry disc electric rectifiers
BE620870A (en) * 1961-08-04 1900-01-01
US3447118A (en) * 1966-08-16 1969-05-27 Westinghouse Electric Corp Stacking module for flat packaged electrical devices
GB1191887A (en) * 1966-09-02 1970-05-13 Gen Electric Semiconductor Rectifier Assemblies
FR1577384A (en) * 1968-04-17 1969-08-08
US3651383A (en) * 1970-02-05 1972-03-21 Gen Electric Unitary high power semiconductor subassembly suitable for mounting on a separable heat sink
GB1296158A (en) * 1970-10-06 1972-11-15
US3753052A (en) * 1972-03-01 1973-08-14 Gen Electric Rectifier bridge assembly comprising stack of high-current pn semiconductor wafers in a sealed housing whose end caps comprise ac terminals of the bridge
GB1563753A (en) * 1978-03-09 1980-04-02 Aei Semiconductors Ltd Pressure mounting assemblies
GB2135119A (en) * 1983-01-19 1984-08-22 Westinghouse Electric Corp Self-aligning, self-loading semiconductor clamp
JPS6060172U (en) * 1983-09-13 1985-04-26 本田技研工業株式会社 Transformer device with rectifier

Also Published As

Publication number Publication date
GB2189343B (en) 1990-11-14
GB2189343A (en) 1987-10-21
GB8608094D0 (en) 1986-05-08
GB9002694D0 (en) 1990-04-04
GB2227122A (en) 1990-07-18

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 19950402