GB1563753A - Pressure mounting assemblies - Google Patents

Pressure mounting assemblies Download PDF

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Publication number
GB1563753A
GB1563753A GB4151677A GB4151677A GB1563753A GB 1563753 A GB1563753 A GB 1563753A GB 4151677 A GB4151677 A GB 4151677A GB 4151677 A GB4151677 A GB 4151677A GB 1563753 A GB1563753 A GB 1563753A
Authority
GB
United Kingdom
Prior art keywords
indicating member
assembly
force
component
moved
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB4151677A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
AEI Semiconductors Ltd
Original Assignee
AEI Semiconductors Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by AEI Semiconductors Ltd filed Critical AEI Semiconductors Ltd
Priority to GB4151677A priority Critical patent/GB1563753A/en
Publication of GB1563753A publication Critical patent/GB1563753A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/32—Holders for supporting the complete device in operation, i.e. detachable fixtures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4018—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by the type of device to be heated or cooled
    • H01L2023/4025—Base discrete devices, e.g. presspack, disc-type transistors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4081—Compliant clamping elements not primarily serving heat-conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4087—Mounting accessories, interposers, clamping or screwing parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mounting Components In General For Electric Apparatus (AREA)

Description

(54) PRESSURE MOUNTING ASSEMBLIES (71) We, AEI SEMICONDUCTORS LIMITED, a British Company, of Carholme Road, Lincoln, LN1 1SG, do hereby declare the invention, for which we pray that a patent may be granted to us, and the method by which it is to be performed, to be particularly described in and by the following statement:- This invention relates to pressure mounting assemblies, and is primarily concerned with such assemblies intended for use in mounting high power electronic components on to thermal and/or electrical conductors.
It is concerned with improvements in or modifications to the invention which is the subject of U.K. Patent No. 1,470,958.
In order to ensure the existence of a sufficiently good thermal and/or electrical path between a conductor and such a component it is usually necessary to provide some means for holding the two in intimate pressure contact, as the alternative of providing a permanent bond between the two, for example by means of soldering or welding, is unacceptable in many instances because of the nature of the component and/or the need to replace easily the component from time to time. In practice, it is difficult to ensure that just the right degree of pressure exists between a high power electronic component and a thermal or electrical conductors. If the pressure is too low the poor thermal or electrical contact respectively may impair the satisfactory operation of the component and may even seriously damage it, whilst if the pressure is too high the component may suffer irreparable mechanical damage. In fact, for many high power electronic components the correct pressure is rather critical. The difficulty is aggravated by the fact that components are often sold for installation by a customer who, even if he takes the trouble to ascertain the correct mounting pressure, may well have no way of checking that the correct pressure is being applied.
According to the parent invention, a pressure mounting assembly for pressure mounting an electronic component to a body includes spaced first and second reaction members with resilient means positioned therebetween and an indicating member held firmly in one position by means of force exerted on the reaction members by the resilient means, the arrangement being such that when the assembly is used to pressure mount the component to a body the resilient means are compressed in the mounting operation so that when a predetermined desired mounting force is reached the indicating member is no longer firmly held.
When the pressure mounting assembly is in use, it is possible that during its life time structural members of the assembly might relax over a period of time due, possibly, to thermal expansion or thermal-cycling conditions, allowing the resilient means to take up the freedom of movement in the indicating member, causing it to lock tight and remove part, if not all, of the force applied to the high power electronic component.
The present invention seeks to reduce this difficulty.
According to the present invention, a pressure mounting assembly as claimed in the Specification of the parent invention has an indicating member which, when the predetermined mounting force is reached, is capable of being moved from the position where it was firmly held (the first position) to a second position in which it may be moved by a predetermined amount towards and away from one of the reaction members.
Preferably, the indicating member is provided with two portions, arranged in a overlapping structure, the thickness of one portion being equal to the pre-determined amount; the two-layer part (the two portions in combination) is that part of the indicating member which is firmly held in the first position, while the one-layer part (a single portion) is that part which in the second position allows the indicating member to be moved. The two portions preferably are of equal thickness.
In use, by means of studs or screws linking the first reaction member to the body, the force on the component may be increased until it is just equal to the predetermined force, at which point the indicating member is released thereby informing the operator that the component is subject to exactly the correct predetermined force.
Generally, the body is an electrical conductor, and usually a second conductor will be provided between the second reaction member and the component prior to mounting in those cases where the second reaction member is not itself a suitable conductor.
The indicating member is advantageously provided with a resilient stop portion which prevents it from being inadvertently returned to the first position once it has been moved to the second position.
To prevent the indicating member rattling or vibrating when in service, that part which in the second position allows the indicating member to be moved is preferably provided with a resiliently deformable portion which, whilst to a limited extent restraining movement of the indicating member towards and away from the reaction member (and so preventing rattling), allows such movement to take place if required to avoid force being removed from the electronic component mounted by the pressure mounting assembly.
The invention is further described, though only by way of illustration, with reference to the drawings accompanying the Provisional Specification, in which drawings: Figure 1 shows a pressure mounting assembly in accordance with the present invention when used to mount a high power electronic component with an indicating member in a first position; and Figure 2 illustrates the indicating member in its second position.
Referring to the drawings, a high power electronic component, in this case a thyristor 1, is mounted on a relatively massive body 3 which is provided with fins (not shown) to cool the thyristor. The thyristor 1 is held in good electrical and thermal contact with the body 3 by virtue of a force applied to the upper surface of a conductor 2 by a resilient member in the form of a series of dished spring washers 4. The spring washers 4 are held in position by means of a reaction plate 5 which is secured to the body 3 by means of studs 6 passing through appropriately positioned holes in the conductor 2. It is important that the two major faces 7 and 8 of the thyristor are electrically isolated from one another and this can conveniently be achieved by the use of nonconductive studs 6. However, this may not always be desirable, since the studs 6 can be highly stressed if the force to be applied by the spring washers 4 is very great, so instead insulating sleeves and washers could be inserted under the heads 9 of the studs 6, for example. An indicating member 10 is held in position in contact with the reaction member 5 by means of a stud 11 and threaded nut 12. The pressure mounting assembly, which comprises the reaction member 5, the spring washers 4, the indicating member 10 and the stud 11 and nut 12 is pre-tensioned in the manner described in connection with the parent invention. That is to say, before the assembly is used to mount a component a predetermined force is applied to the upper surface of the reaction member 5 and the head of the stud 11 so as to compress the spring washers 4. The direction of force is indicated by the arrows A. Whilst the predetermined force is still applied, the nut 12 is tightened down onto the indicating member 10 so that the member is still just free to move. In the present example, the indicating member 10 is, itself, resilient so that in the tightened-down position of the nut 12 there will be no clearance between the member 10 and the nut 12 or the reaction member 5, but because its resilience is insignificant compared to the strength of the spring washers 4 it is still readily movable.
In use, the pressure mounting assembly is secured to the body 3 in the manner described above so as to sandwich the thyristor 1 betwen it and the conductor 2. The two nuts 13 associated with the studs 6 are progressively tightened until the indicating member 10 is just free to move. When this point is reached, the force applied to the component 1 is exactly equal to the predetermined force to which the pressure mounting assembly was originally set.
When the indicating member 10 is just free to move, it is withdrawn by an operator into the position shown in Figure 2. It will be seen that the indicating member 10 is formed from a folded back strip of resilient material having a closed slot in its lower portion 14 and an open ended slot in its upper shorter portion 15. The shorter portion 15 springs up when withdrawn sufficiently so as to clear the nut 12 and this prevents the member 10 reverting back to its original first position inadvertently. The portion 14 of the indicating member 10 is provided with a kink or set 16 which is such as to prevent the indicating member 10 rattling or vibrating in service. However, if due to thermal expansion or thermalcycling the studs 6 expand, the amount of set is reduced as this portion of the indicating member is compressed slightly. The amount of movement allowed before any significant force is removed from the component 1 is determined by the thickness of the shorter portion 15 of the indicating member 10 which represents the difference in effective thickness of the indicating member 10 when it is moved from its first position, as shown in Figure 1, to its second position, as shown in Figure 2. Because the resilience of the material forming the indicating member 10 is, as previously mentioned, insignicant in comparison with the strength of the spring washers 4, the presence of the kink or set 16 does, itself, not allow the force applied to the component 1 to be reduced.
The form of the indicating member 10 shown in the drawings is particularly advantageous, since it allows a predetermined clearance to be provided under the nut 12 when the indicating member 10 is moved to its second position. Since the indicating member is captive on the screw 11, the amount of the clearance can be checked at any time and the indicating member 10 can be returned to its first position if it is de sired at any time to replace the component 1.
WHAT WE CLAIM IS: 1. A pressure mounting assembly, for pressure mounting an electronic component to a body, as defined in any of the claims of our Complete Specification No. 1,470,958, and thus including spaced first and second reaction members with resilient means positioned therebetween and an indicating member held firmly in one position by means of force exerted on the reaction members by the resilient means, the arrangement being such that when the assembly is used to pressure mount the component to a body the resilient means are compressed in the mounting operation so that when a predetermined desired mounting force is reached the indicating member is no longer firmly held, wherein the indicator member is such that when, in use, the predetermined mounting force is reached, it is capable of being moved from the one position (the first position) to a second position in which it may be moved by a predetermined amount towards and away from one of the reaction members.
2. An assembly as claimed in claim 1 and wherein the indicating member is provided with two portions, the thickness of one portion being equal to the predetermined amount, and the two portions in combination being that part of the indicating member which is firmly held in the first position.
3. An assembly as claimed in claim 2 wherein the two portions are of equal thickness.
4. An assembly as claimed in any of the preceding claims and wherein the indicating member is provided with a resilient stop portion which prevents it from being inadvertently returned to the first position once it has been moved to the second position.
5. An assembly as claimed in claim 5 and wherein the indicating member is provided with a further resiliently deformable portion which, whilst restraining movement of the indicating member towards and away from the reaction member, allows such movement to take place if required to avoid force being removed from the electronic component mounted by the pressure mounting assembly.
6. A pressure mounting assembly substantially as illustrated in and described with reference to the drawings accompanying the Provisional specification.
**WARNING** end of DESC field may overlap start of CLMS **.

Claims (6)

**WARNING** start of CLMS field may overlap end of DESC **. amount of movement allowed before any significant force is removed from the component 1 is determined by the thickness of the shorter portion 15 of the indicating member 10 which represents the difference in effective thickness of the indicating member 10 when it is moved from its first position, as shown in Figure 1, to its second position, as shown in Figure 2. Because the resilience of the material forming the indicating member 10 is, as previously mentioned, insignicant in comparison with the strength of the spring washers 4, the presence of the kink or set 16 does, itself, not allow the force applied to the component 1 to be reduced. The form of the indicating member 10 shown in the drawings is particularly advantageous, since it allows a predetermined clearance to be provided under the nut 12 when the indicating member 10 is moved to its second position. Since the indicating member is captive on the screw 11, the amount of the clearance can be checked at any time and the indicating member 10 can be returned to its first position if it is de sired at any time to replace the component 1. WHAT WE CLAIM IS:
1. A pressure mounting assembly, for pressure mounting an electronic component to a body, as defined in any of the claims of our Complete Specification No. 1,470,958, and thus including spaced first and second reaction members with resilient means positioned therebetween and an indicating member held firmly in one position by means of force exerted on the reaction members by the resilient means, the arrangement being such that when the assembly is used to pressure mount the component to a body the resilient means are compressed in the mounting operation so that when a predetermined desired mounting force is reached the indicating member is no longer firmly held, wherein the indicator member is such that when, in use, the predetermined mounting force is reached, it is capable of being moved from the one position (the first position) to a second position in which it may be moved by a predetermined amount towards and away from one of the reaction members.
2. An assembly as claimed in claim 1 and wherein the indicating member is provided with two portions, the thickness of one portion being equal to the predetermined amount, and the two portions in combination being that part of the indicating member which is firmly held in the first position.
3. An assembly as claimed in claim 2 wherein the two portions are of equal thickness.
4. An assembly as claimed in any of the preceding claims and wherein the indicating member is provided with a resilient stop portion which prevents it from being inadvertently returned to the first position once it has been moved to the second position.
5. An assembly as claimed in claim 5 and wherein the indicating member is provided with a further resiliently deformable portion which, whilst restraining movement of the indicating member towards and away from the reaction member, allows such movement to take place if required to avoid force being removed from the electronic component mounted by the pressure mounting assembly.
6. A pressure mounting assembly substantially as illustrated in and described with reference to the drawings accompanying the Provisional specification.
GB4151677A 1978-03-09 1978-03-09 Pressure mounting assemblies Expired GB1563753A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB4151677A GB1563753A (en) 1978-03-09 1978-03-09 Pressure mounting assemblies

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB4151677A GB1563753A (en) 1978-03-09 1978-03-09 Pressure mounting assemblies

Publications (1)

Publication Number Publication Date
GB1563753A true GB1563753A (en) 1980-04-02

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ID=10420051

Family Applications (1)

Application Number Title Priority Date Filing Date
GB4151677A Expired GB1563753A (en) 1978-03-09 1978-03-09 Pressure mounting assemblies

Country Status (1)

Country Link
GB (1) GB1563753A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2189343A (en) * 1986-04-02 1987-10-21 Int Rectifier Co Ltd Semi-conductor modules
EP0272743A2 (en) * 1986-12-19 1988-06-29 SGE BOSARI S.r.l. Improved device for clamping together a semiconductor and its related heat sink
CN102184899A (en) * 2011-04-14 2011-09-14 北京荣科恒阳整流技术有限公司 Two-point form clamping device for high-power thyristor

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2189343A (en) * 1986-04-02 1987-10-21 Int Rectifier Co Ltd Semi-conductor modules
GB2189343B (en) * 1986-04-02 1990-11-14 Int Rectifier Co Ltd Semi-conductor modules
EP0272743A2 (en) * 1986-12-19 1988-06-29 SGE BOSARI S.r.l. Improved device for clamping together a semiconductor and its related heat sink
EP0272743A3 (en) * 1986-12-19 1990-01-31 SGE BOSARI S.r.l. Improved device for clamping together a semiconductor and its related heat sink
CN102184899A (en) * 2011-04-14 2011-09-14 北京荣科恒阳整流技术有限公司 Two-point form clamping device for high-power thyristor
WO2012139437A1 (en) * 2011-04-14 2012-10-18 北京荣科恒阳整流技术有限公司 Two-point clamping device for high-power thyristor

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