GB2219960A - Manufacturing small articles - Google Patents

Manufacturing small articles Download PDF

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Publication number
GB2219960A
GB2219960A GB8814664A GB8814664A GB2219960A GB 2219960 A GB2219960 A GB 2219960A GB 8814664 A GB8814664 A GB 8814664A GB 8814664 A GB8814664 A GB 8814664A GB 2219960 A GB2219960 A GB 2219960A
Authority
GB
United Kingdom
Prior art keywords
components
articles
mould
injection moulding
reaction injection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB8814664A
Other versions
GB2219960B (en
GB8814664D0 (en
Inventor
Charles Richard Jarvis
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Avery Weigh Tronix Ltd
Original Assignee
W&T Avery Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by W&T Avery Ltd filed Critical W&T Avery Ltd
Priority to GB8814664A priority Critical patent/GB2219960B/en
Publication of GB8814664D0 publication Critical patent/GB8814664D0/en
Priority to PCT/GB1989/000693 priority patent/WO1989012871A1/en
Priority to AT89306256T priority patent/ATE100616T1/en
Priority to KR1019900700341A priority patent/KR900702481A/en
Priority to EP89306256A priority patent/EP0350179B1/en
Priority to JP1507039A priority patent/JPH03500033A/en
Priority to DE89306256T priority patent/DE68912426T2/en
Publication of GB2219960A publication Critical patent/GB2219960A/en
Priority to US07/750,597 priority patent/US5387306A/en
Application granted granted Critical
Publication of GB2219960B publication Critical patent/GB2219960B/en
Expired legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
    • B32B37/22—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of both discrete and continuous layers
    • B32B37/223—One or more of the layers being plastic
    • B32B37/226—Laminating sheets, panels or inserts between two continuous plastic layers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/34—Moulds or cores; Details thereof or accessories therefor movable, e.g. to or from the moulding station
    • B29C33/36—Moulds or cores; Details thereof or accessories therefor movable, e.g. to or from the moulding station continuously movable in one direction, e.g. in a closed circuit
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
    • B29C33/68—Release sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • B29C70/68—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts by incorporating or moulding on preformed parts, e.g. inserts or layers, e.g. foam blocks
    • B29C70/70—Completely encapsulating inserts
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C67/00—Shaping techniques not covered by groups B29C39/00 - B29C65/00, B29C70/00 or B29C73/00
    • B29C67/24—Shaping techniques not covered by groups B29C39/00 - B29C65/00, B29C70/00 or B29C73/00 characterised by the choice of material
    • B29C67/246—Moulding high reactive monomers or prepolymers, e.g. by reaction injection moulding [RIM], liquid injection moulding [LIM]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/189—Printed circuits structurally associated with non-printed electric components characterised by the use of a flexible or folded printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components

Abstract

A small article, such as a portable electronic token, is manufactured by means of a reaction injection moulding process in which a plurality of components are encapsulated in a plastics material. Two materials, such as resin and hardener, are combined immediately before moulding. High temperatures and pressures are not required. The electronic token, of credit and size, comprises integrated circuits (1), capacitors (2), rigid inserts (3), inductive coils (5) mounted on substrate (4), printed labels (6), copper layers (7) and encapsulating material (8). <IMAGE>

Description

Manufacturing Small Articles This invention relates to manufacturing small articles and in particular, but not exclusively, it relates to the manufacture of small, portable, articles which include an electronic circuit encapsulated within a plastics material, such as an electronic token of the "smart card" type.
Injection moulding is often used as a method of manufacturing small plastic articles. In such methods, usually small granules of the plastics material are heated so as to melt the material and the resulting fluid is injected at high temperature and pressure, perhaps 300 0c and 2,000 PSI into a mould of a desired shape. The material is then allowed to set in the mould as it cools.
Such a method is fine for the manufacture of small, homogeneous, articles. However, articles such as those commonly known as "smart cards" which comprise a number of components such as electronic circuits, input/output interfaces, substrates and labels are less well suited to the process since the high pressures and temperatures involved tend to displace inserts and indeed can damage the functioning thereof.
The present invention seeks to provide an improved moulding technique for such articles.
According to the present invention there is provided a method for manufacturing small portable articles, each article comprising a plurality of components, which method comprises encapsulating the components within a plastics material by means of a reaction injection moulding process.
Preferably, the articles are electronic tokens of the "smart card" type including an electronic circuit mounted on a substrate, one or more labels and an input/output interface, which may be an inductive loop, encapsulated within a plastics or resin material, the components being suitably positioned and the plastics material being added by means of reaction injection moulding so as to encapsulate the components to form a small portable token.
The technique of inmould labelling may be used to provide the surface grahics and to position the components in the cavity before the moulding process.
An embodiment of the invention will now be described by way of example only with reference to the accompanying drawing which shows schematically the cross section of an electronic token when manufactured by a method embodying the present invention.
Referring to the figure the token has credit card sized dimensions, typically 8.5 by 5.4 by 0.075 cm.
Conventional cards of this type are generally made by lamination techniques.
The token or card incorporates one or more integrated circuits 1 and capacitors 2. Rigid inserts 3, which may be made of strong metal or a rigid moulded compound, surround the circuits and capacitors so as to provide strengthening and to resist damage caused by flexing the card. The power and input/output/requirements of such a card are achieved by means of inductive coils 4 mounted on a substrate 5 and disposed generally around the periphery of the card. Printed labels 6 are positioned on the face of the card, or alternatively the labels may be printed on after manufacture. The electronic components within the card are inter-connected by means of for example copper layers 7. The remainder of the material of the card is made from a moulded plastics or resin material such as polyurethane 8 or epoxy.
The card is assembled by means of a moulding process known as reaction injection moulding (RIM). This is a well known process which is often used in the manufacture of large plastics articles such as car bumpers, surfboards, and the like. The difference from conventional injection moulding techniques is that two materials are used which are combined immediately before moulding.
These are a resin and a hardener which, when combined together harden within a fixed time period which is dependent upon the constituents. With conventional injection moulding, heat and pressure are required to melt the resin and inject it into a mould, whereupon the resin sets as it cools. RIM is characterised by the fact that since the resin and hardener mixture is a liquid at a low temperature then high pressures and temperatures are not required.
In a first embodiment of the present invention the components of the card, other than the molten plastics material are fixed in place within a mould and then the resin is added at a low pressure and temperature. Since the resin is in a fluid state, typically having the consistency of for example milk or thin cream, then the resin flows throughout the mould, making good contact with all the components and eventually completely covering and encapsulating them. It then begins to set after the fixed time period, perhaps two to ten minutes. After the resin has set then the complete token is removed from the mould and the process can be repeated.
The labels act as a release film to allow the inherently adhesive resin to release from the mould cavity walls.
The die can consist of a cavity formed by two recessed endless belts runing back to back to form a continously moving mould cavity.
In order to speed up the production rate the preprinted labels and components can be fed into a die which is also supplied with RIM fluid resin from a nozzle.
The components, labels and fluid, in the required configuration are then coextruded from the die to form continuous strips of completed cards, which subsequently set and are then separated as desired.

Claims (7)

1. A method for manufacturing small portable articles, each article comprising a plurality of components, which method comprises encapsulating the components within a plastics material by means of a reaction injection moulding process.
2. A method as claimed in claim 1 wherein the components are suitably positioned within a mould and the plastics material, adapted for reaction injection moulding, is added so as to encapsulate and spatially fix the components.
3. A method as claimed in claim 1 or claim 2 wherein the articles are electronic tokens including electronic circuitry and an input/output interface.
4. A method as claimed in any of the preceding claims wherein the articles include at least one label on one or more faces and are manufactured using an in-mould labelling process where the label acts a mould release agent.
5. A method as claimed in any of the preceding claims wherein the constituents of the articles are co-extruded during the reaction injection moulding process.
6. A method as claimed in claim 5 wherein a die is used, which die comprises a cavity formed by two endless belts which cooperate in use to form a continously moving mould cavity.
7. A method for manufacturing small portable articles substantially as hereinbefore described with reference to, and as illustrated by the accompanying drawing.
GB8814664A 1988-06-21 1988-06-21 Manufacture of electronic tokens Expired GB2219960B (en)

Priority Applications (8)

Application Number Priority Date Filing Date Title
GB8814664A GB2219960B (en) 1988-06-21 1988-06-21 Manufacture of electronic tokens
EP89306256A EP0350179B1 (en) 1988-06-21 1989-06-21 Manufacturing portable electronic tokens
AT89306256T ATE100616T1 (en) 1988-06-21 1989-06-21 MANUFACTURE OF PORTABLE ELECTRONIC CARDS.
KR1019900700341A KR900702481A (en) 1988-06-21 1989-06-21 How to manufacture a portable electronic token
PCT/GB1989/000693 WO1989012871A1 (en) 1988-06-21 1989-06-21 Manufacturing portable electronic tokens
JP1507039A JPH03500033A (en) 1988-06-21 1989-06-21 How to make portable electronic tokens
DE89306256T DE68912426T2 (en) 1988-06-21 1989-06-21 Manufacture of portable electronic cards.
US07/750,597 US5387306A (en) 1988-06-21 1991-08-28 Manufacturing integrated circuit cards

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB8814664A GB2219960B (en) 1988-06-21 1988-06-21 Manufacture of electronic tokens

Publications (3)

Publication Number Publication Date
GB8814664D0 GB8814664D0 (en) 1988-07-27
GB2219960A true GB2219960A (en) 1989-12-28
GB2219960B GB2219960B (en) 1992-12-23

Family

ID=10639033

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8814664A Expired GB2219960B (en) 1988-06-21 1988-06-21 Manufacture of electronic tokens

Country Status (1)

Country Link
GB (1) GB2219960B (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0503782A1 (en) * 1991-03-15 1992-09-16 Gec Avery Limited Integrated circuit card
GB2267682B (en) * 1992-06-09 1996-04-10 Gec Avery Ltd An integrated circuit card
US8012809B2 (en) 2005-03-23 2011-09-06 Cardxx, Inc. Method for making advanced smart cards with integrated electronics using isotropic thermoset adhesive materials with high quality exterior surfaces

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1130736A (en) * 1966-06-03 1968-10-16 Westinghouse Electric Corp Disc-type semiconductor device
GB1449684A (en) * 1972-12-04 1976-09-15 Matsushita Electric Ind Co L T Flat-winding type motor armature and method of manufacturing the same
GB1509738A (en) * 1974-09-19 1978-05-04 Ericsson Telefon Ab L M Encapsulating electrical components
EP0173907A1 (en) * 1984-09-01 1986-03-12 BASF Aktiengesellschaft Method of enveloping the edges of glass panes with elastic polyisocyanate-polyaddition products
EP0231823A1 (en) * 1986-01-23 1987-08-12 Ici Americas Inc. Metal or plastic clad polyvinal resin laminates

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1130736A (en) * 1966-06-03 1968-10-16 Westinghouse Electric Corp Disc-type semiconductor device
GB1449684A (en) * 1972-12-04 1976-09-15 Matsushita Electric Ind Co L T Flat-winding type motor armature and method of manufacturing the same
GB1509738A (en) * 1974-09-19 1978-05-04 Ericsson Telefon Ab L M Encapsulating electrical components
EP0173907A1 (en) * 1984-09-01 1986-03-12 BASF Aktiengesellschaft Method of enveloping the edges of glass panes with elastic polyisocyanate-polyaddition products
EP0231823A1 (en) * 1986-01-23 1987-08-12 Ici Americas Inc. Metal or plastic clad polyvinal resin laminates

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0503782A1 (en) * 1991-03-15 1992-09-16 Gec Avery Limited Integrated circuit card
GB2267682B (en) * 1992-06-09 1996-04-10 Gec Avery Ltd An integrated circuit card
US8012809B2 (en) 2005-03-23 2011-09-06 Cardxx, Inc. Method for making advanced smart cards with integrated electronics using isotropic thermoset adhesive materials with high quality exterior surfaces
US8324021B2 (en) 2005-03-23 2012-12-04 Paul Reed Advanced smart cards with integrated electronics in bottom layer and method of making such advanced smart cards

Also Published As

Publication number Publication date
GB2219960B (en) 1992-12-23
GB8814664D0 (en) 1988-07-27

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 19950621