GB2208971B - A reinforced porous dielectric sheet - Google Patents

A reinforced porous dielectric sheet

Info

Publication number
GB2208971B
GB2208971B GB8719883A GB8719883A GB2208971B GB 2208971 B GB2208971 B GB 2208971B GB 8719883 A GB8719883 A GB 8719883A GB 8719883 A GB8719883 A GB 8719883A GB 2208971 B GB2208971 B GB 2208971B
Authority
GB
United Kingdom
Prior art keywords
dielectric sheet
porous dielectric
reinforced porous
reinforced
sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB8719883A
Other languages
English (en)
Other versions
GB2208971A (en
GB8719883D0 (en
Inventor
Hirosuke Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Junkosha Co Ltd
Original Assignee
Junkosha Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Junkosha Co Ltd filed Critical Junkosha Co Ltd
Publication of GB8719883D0 publication Critical patent/GB8719883D0/en
Publication of GB2208971A publication Critical patent/GB2208971A/en
Application granted granted Critical
Publication of GB2208971B publication Critical patent/GB2208971B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0271—Arrangements for reducing stress or warp in rigid printed circuit boards, e.g. caused by loads, vibrations or differences in thermal expansion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0116—Porous, e.g. foam
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/015—Fluoropolymer, e.g. polytetrafluoroethylene [PTFE]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0187—Dielectric layers with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/20—Details of printed circuits not provided for in H05K2201/01 - H05K2201/10
    • H05K2201/2009—Reinforced areas, e.g. for a specific part of a flexible printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24174—Structurally defined web or sheet [e.g., overall dimension, etc.] including sheet or component perpendicular to plane of web or sheet
    • Y10T428/24182—Inward from edge of web or sheet
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
    • Y10T428/24802—Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/249921—Web or sheet containing structurally defined element or component
    • Y10T428/249953—Composite having voids in a component [e.g., porous, cellular, etc.]
    • Y10T428/249987—With nonvoid component of specified composition
    • Y10T428/249991—Synthetic resin or natural rubbers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/3154—Of fluorinated addition polymer from unsaturated monomers
    • Y10T428/31544—Addition polymer is perhalogenated

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Composite Materials (AREA)
  • Mechanical Engineering (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Laminated Bodies (AREA)
  • Manufacturing Of Printed Wiring (AREA)
GB8719883A 1986-03-17 1987-08-22 A reinforced porous dielectric sheet Expired - Fee Related GB2208971B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1986038470U JPH0246061Y2 (en, 2012) 1986-03-17 1986-03-17

Publications (3)

Publication Number Publication Date
GB8719883D0 GB8719883D0 (en) 1987-09-30
GB2208971A GB2208971A (en) 1989-04-19
GB2208971B true GB2208971B (en) 1991-05-01

Family

ID=12526127

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8719883A Expired - Fee Related GB2208971B (en) 1986-03-17 1987-08-22 A reinforced porous dielectric sheet

Country Status (4)

Country Link
US (1) US4857381A (en, 2012)
EP (1) EP0304516A1 (en, 2012)
JP (1) JPH0246061Y2 (en, 2012)
GB (1) GB2208971B (en, 2012)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5089674A (en) * 1990-04-25 1992-02-18 Microtel Pacific Research Limited Hydrostatic pressure sensor
GB9020428D0 (en) * 1990-09-19 1990-10-31 Gore W L & Ass Uk Thermal control materials
US5097099A (en) * 1991-01-09 1992-03-17 Amp Incorporated Hybrid branch cable and shield
GB2255676B (en) * 1991-05-08 1995-09-27 Fuji Electric Co Ltd Metallic printed board
JP2601128B2 (ja) * 1992-05-06 1997-04-16 松下電器産業株式会社 回路形成用基板の製造方法および回路形成用基板
WO1994007348A1 (en) * 1992-09-24 1994-03-31 Hughes Aircraft Company Dielectric vias within multilayer 3-dimensional structures/substrates
US5354603A (en) * 1993-01-15 1994-10-11 Minnesota Mining And Manufacturing Company Antifouling/anticorrosive composite marine structure
US5484641A (en) * 1993-11-01 1996-01-16 Rotter; Martin J. Process for fixing plastic reinforcing pins into non-woven filamentary material and product produced by the process
US5449427A (en) * 1994-05-23 1995-09-12 General Electric Company Processing low dielectric constant materials for high speed electronics
US5571608A (en) * 1994-07-15 1996-11-05 Dell Usa, L.P. Apparatus and method of making laminate an embedded conductive layer
US5733639A (en) * 1995-06-30 1998-03-31 Poly Circuits/M-Wave Circuit board assembly with foam substrate and method of making same
US7571139B1 (en) 1999-02-19 2009-08-04 Giordano Joseph A System and method for processing financial transactions
JP2003136623A (ja) * 2001-08-22 2003-05-14 Tdk Corp モジュール部品、コア基板要素集合体、多層基板、コア基板要素集合体の製造方法、多層基板の製造方法、及びモジュール部品の製造方法
US8125341B2 (en) * 2007-12-10 2012-02-28 Checkpoint Systems, Inc. Resonant tag with reinforced deactivation dimple
KR101057088B1 (ko) * 2011-02-16 2011-08-16 (주) 우주케이에프씨 환형도체를 사용한 플렉시블 플랫 케이블
CN102260378B (zh) * 2011-05-06 2013-03-20 广东生益科技股份有限公司 复合材料、用其制作的高频电路基板及其制作方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2789076A (en) * 1953-09-21 1957-04-16 Frieder Laminated ballistic fabric
FR1206380A (fr) * 1958-08-14 1960-02-09 Etude Des Panneaux Polyvalents Procédé de fabrication de panneaux et panneaux ainsi fabriqués
US3446692A (en) * 1964-06-01 1969-05-27 Pullman Inc Insulated panel and method of making same
US3614848A (en) * 1964-06-09 1971-10-26 Pullman Inc Foam structural element
US4518737A (en) * 1978-12-26 1985-05-21 Rogers Corporation Dielectric material and method of making the dielectric material
US4451527A (en) * 1981-07-28 1984-05-29 Minnesota Mining And Manufacturing Company Conformable metal-clad laminate
US4452657A (en) * 1982-09-15 1984-06-05 The Boeing Company Composite integral web stiffening method
US4514450A (en) * 1983-11-01 1985-04-30 Union Carbide Corporation Peg supported thermal insulation panel
US4591659A (en) * 1983-12-22 1986-05-27 Trw Inc. Multilayer printed circuit board structure
JPS60214941A (ja) * 1984-04-10 1985-10-28 株式会社　潤工社 プリント基板
JPS60169904U (ja) * 1984-04-20 1985-11-11 株式会社　潤工社 ストリップラインケーブル
JPS60225750A (ja) * 1984-04-24 1985-11-11 株式会社　潤工社 プリント基板
US4680220A (en) * 1985-02-26 1987-07-14 W. L. Gore & Associates, Inc. Dielectric materials
JPH0220857Y2 (en, 2012) * 1985-11-06 1990-06-06

Also Published As

Publication number Publication date
JPH0246061Y2 (en, 2012) 1990-12-05
GB2208971A (en) 1989-04-19
JPS62166671U (en, 2012) 1987-10-22
US4857381A (en) 1989-08-15
EP0304516A1 (en) 1989-03-01
GB8719883D0 (en) 1987-09-30

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 19920822