GB2207669A - Providing metallised pads on transparent electrically conductive tracks on glass substrates - Google Patents
Providing metallised pads on transparent electrically conductive tracks on glass substrates Download PDFInfo
- Publication number
- GB2207669A GB2207669A GB08718625A GB8718625A GB2207669A GB 2207669 A GB2207669 A GB 2207669A GB 08718625 A GB08718625 A GB 08718625A GB 8718625 A GB8718625 A GB 8718625A GB 2207669 A GB2207669 A GB 2207669A
- Authority
- GB
- United Kingdom
- Prior art keywords
- substrate
- electrically conductive
- pads
- solderable
- paste
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 14
- 239000011521 glass Substances 0.000 title claims abstract description 12
- 238000010438 heat treatment Methods 0.000 claims abstract description 12
- 239000002184 metal Substances 0.000 claims abstract description 7
- 229910052751 metal Inorganic materials 0.000 claims abstract description 7
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 claims abstract description 3
- 238000000034 method Methods 0.000 claims description 14
- 239000011248 coating agent Substances 0.000 claims description 9
- 238000000576 coating method Methods 0.000 claims description 9
- 239000004973 liquid crystal related substance Substances 0.000 claims description 5
- 230000001427 coherent effect Effects 0.000 claims description 3
- 210000002858 crystal cell Anatomy 0.000 claims description 3
- 239000012799 electrically-conductive coating Substances 0.000 claims description 2
- 230000005855 radiation Effects 0.000 claims 2
- 230000000593 degrading effect Effects 0.000 abstract 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 8
- 238000010304 firing Methods 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 6
- 239000010949 copper Substances 0.000 description 6
- 229910052759 nickel Inorganic materials 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 210000004027 cell Anatomy 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 238000000151 deposition Methods 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 239000011230 binding agent Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 239000005407 aluminoborosilicate glass Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000005329 float glass Substances 0.000 description 1
- 239000007789 gas Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
- HUAUNKAZQWMVFY-UHFFFAOYSA-M sodium;oxocalcium;hydroxide Chemical compound [OH-].[Na+].[Ca]=O HUAUNKAZQWMVFY-UHFFFAOYSA-M 0.000 description 1
- XOLBLPGZBRYERU-UHFFFAOYSA-N tin dioxide Chemical compound O=[Sn]=O XOLBLPGZBRYERU-UHFFFAOYSA-N 0.000 description 1
- 229910001887 tin oxide Inorganic materials 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1343—Electrodes
- G02F1/13439—Electrodes characterised by their electrical, optical, physical properties; materials therefor; method of making
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022466—Electrodes made of transparent conductive layers, e.g. TCO, ITO layers
- H01L31/022475—Electrodes made of transparent conductive layers, e.g. TCO, ITO layers composed of indium tin oxide [ITO]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/245—Reinforcing conductive patterns made by printing techniques or by other techniques for applying conductive pastes, inks or powders; Reinforcing other conductive patterns by such techniques
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/38—Conductors
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
- H05K1/092—Dispersed materials, e.g. conductive pastes or inks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/032—Materials
- H05K2201/0326—Inorganic, non-metallic conductor, e.g. indium-tin oxide [ITO]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/035—Paste overlayer, i.e. conductive paste or solder paste over conductive layer
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Nonlinear Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Mathematical Physics (AREA)
- Crystallography & Structural Chemistry (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Optics & Photonics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Electromagnetism (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Liquid Crystal (AREA)
Abstract
Transparent electrically conductve indium tin oxide tracks (2) upon a glass substrate (1) are provided with solderable metallised pads (3) using a conventional screen printed metal-loaded paste which is fired by local heating with a CO2 laser in order to avoid degrading the conductivity of the rest of the tracks. <IMAGE>
Description
PROVIDING METALLISED PADS ON TRANSPARENT ELECTRICAL > Y CONDUCTIVE TRACKS ON GLASS SUBSTRATES
This invention relates to the providing of solderable pads upon selected regions of transparent electrically conductive coating supported upon a substrate, and finds a particular application in the provision of terminal pads for mounting integrated circuits upon the transparent conductor tracks of a liquid crystal display cell.
Liquid crystal cells have a number of transparent electrode tracks to which terminal connection needs to be made. Typically such tracks are made of indium tin oxide (ITO), and these tracks may be provided with metal pads to which such connection may be made by means of soldering. Particularly in the case of relatively small cells having relatively few tracks these pads can satisfactorily be provided by conventional screen printing of a metal-loaded paste which is subsequently fired in a belt-furnace to produce a metallic pad that is readily solderable.In the case of other types of liquid crystal cell, particularly large area matrix addressed cells with closely spaced long firm tracks, this method is not satisfactory in view of the not insubstantial increase in sheet resistivity of the ITO that is found to occur as the result of the firing. Accordingly, an alternative method of providing these pads has been sought.
In principle, one solution to this problem is provided by depositing a layer of copper over the ITO layer before the ITO has been patterned to create the electrode tracks. The copper and the ITO is next patterned to form these tracks, and then the remaining copper is removed from the display area to leave the transparent ITO. A significant drawback of this approach is the cost of depositing the copper having particular regard to the fact that most of it is then going to have to be removed. Less copper would need to be deposited if it could be selectively electroless plated upon already patterned ITO, but difficulties with this approach include the fact that electroless copper plating solutions tend to etch ITO and also tend to fail the selectivity requirement for plating on the ITO without plating on the intervening regions from which.
the ITO has been removed.
An alternative approach would be to use electroless plating of nickel which has the advantage that the plating solution does not appear to attack the
ITO. However, the disadvantage of this approach is that if the electroless nickel deposit is made thick enough to be reliable for soldering purposes the coating tends to be stressed and in consequence poorly adhering to the underlying ITO. This problem of stress can be avoided by changing the deposition method, but this raises different problem, namely that etchants designed to remove the electroless nickel deposit from the ITO in the display area tend to be insufficiently selective and remove not only the nickel but also the underlying ITO.
The present invention is concerned with a method of providing solderable pads on transparent conductor tracks that on the one hand avoids the electrical conductivity degradation problem encountered with oven firing of screen printed metal-loaded paste, and on the othet hand also avoid the adhesion and selectivity problems associated with electroless plating.
According to the present invention there is provided a method of providing one or more solderable metallised pads on selected regions of one or more areas of electrically conductive transparent coating supported upon a substrate, which method includes the step of applying a metal-loaded glass frit paste to one or more localised regions of the conductive coating, and the step of selectively heating the or each localised region, so as to fire the paste to render it solderable, while leaving substantially unheated one or more other regions of the conductive coating to which the paste has not been applied.
There follows a description of the provision of solderable pads upon the ends of electrically conductive tracks formed Dy the patterning of an ITO layer deposited upon a glass substrate which is to for part of a large area liquid crystal display device. The description refers to the accompanying drawing whicr depicts a perspective view of a portion of the electroded substrate.
A glass sheet 1, which may typically be a soda lime float glass such as that made by Pilkington under the designation PERMABLOC or an alumino borosilicate glass such as Corning 7059, is provided with a pattern of transparent electrically conductive ITO tracks 2.
Typically such tracks are formed by photolithographic selective etching of an ITO layer that initially covered the whole surface of the glass sheet 1. Localized regions at the end of these tracks need to be metallised in order to enable electrical connection to be made between the tracks and associated drive circuitry by means of soldering. To this end pads 3 of a metal-loaded low firing temperature conductor paste, for instance the silver-loaded paste marketed by Electro Science
Laboratories under the designation 590G or that marketed by Du Pont under the designation 7713, are applied by screen printing. The thickness of the paste is typically that which upon conventional firing would produce a metallisation 15 to 20.
The conventional process for firing such a paste involves heating the paste for a short period at about 0 100 C to drive off the printing vehicle, and then baking the residue first to drive off the binder and then to sinter the glass frit. Typically such sintering requires a temperature of about 5500C.However baking at a temperature even only as high as about 4500C has a marked effect upon ITO, typically increasing its sheet resistance about fourfold. (Baking at temperatures lower than 450 0C also increase sheet resistance : but by smaller factors.)
Having regard to the effect of resistance upon the time constant involved in the addressing of the pixels, and also having regard to the length and slenderness of the tracks, some of which for an A size display are over 300mm long and, depending upon the resolution required, typically between 0.1 and 0.4mm wide, an increase in sheet resistance of anything approaching a factor of four can be quite unacceptable.
Such an increase can in principle be avoided by ensuring that the baking is in a tcompletely oxygen-free atmosphere, but this is not a practical way round the problem since conventional glass frit pastes require oxygen to drive off the binder satisfactorily.
This problem is resolved by localised heating to bake the paste. This localised heating may produce an equivalent increase in sheet resistivity, but any such increase is confined to the area heated which is a small proportion of the total area of the tracks.
A convenient heat source for this localised heating is a CO2 laser operational at 10.6 microns.
Using an 80 watt CO2 laser, satisfactory baking was found to result from the use of a 500ms pulse with the laser beam defocussed to provide a spot size of about 1cam. A much shorter pulse length, for instance of about 10ms, with a corresponding reduction in spot size in order to attain the same temperature, can give rise to problems of crazing. This crazing is believed to result from the sharper temperature gradients believed to be set up in the glass when using the shorter duration pulses. With the 500ms pulse and a laser beam spot size of lcm the resulting temperature distribution is sufficient to produce an adequate firing of the paste over less than the whole area of the spot, typically providing a satisfactorily metallised spot size of about half the diameter of the laser beam spot size.
It should be appreciated that the energy density requirements for baking the paste are not so high as to make it necessary to use coherent light for this purpose, and there may well be applications for which the use of non-coherent light from an infra-red lamp or lamp array may be preferred. Another alternative is to provide localised heating by means of a jet of hot gas.
A further advantage of this localised heating is that it speeds total processing time. Thus baking the paste in a furnace typically takes up to 40 minutes, whereas, with a single CO2 80 watt laser, the pads for mounting about 40 dual-in-line integrated circuit chips can be metallised in about one minute. With this saving in time the invention finds application not only in the metallising transparent electrically conductive tracks formed in ITO, but also those formed in other materials, such as tin oxide or zinc oxide, for which heating to the paste firing temperature presents no particular problem. Successful trials have also been conducted in which a YAG-laser has been substituted for the CO2 laser.
Claims (8)
1. A method of providing one or more solderable metallised pads on selected regions of one or more areas of electrically conductive transparent coating supported upon a substrate, which method includes the step of applying a metal-loaded glass frit paste to one or more localised regions of the conductive coating, and the step of selectively heating the or each localised region, so as to fire the paste to render it solderable, while leaving substantially unheated one or more other regions of the conductive coating to which the paste has not been applied.
2. A method as claimed in claim 1, wherein the electrically conductive transparent coating is made of indium tin oxide.
3. A method as claimed in claim 1 or 2, wherein coherent radiation from a laser is used for the step of selective heating.
4. A method as claimed in claim 1 or 2, wherein radiation from one or more infra red lamps is used for the step of selective heating.
5. A method of providing one or more solderable metallised pads on selected regions of one or more areas of electrically conductive transparent coating supported upon a substrate, which method is substantially as hereinbefore described with reference to the accompanying drawing.
6. A substrate supporting one or more areas of transparent electrically conductive coating selective regions of which have been provided with one or more solderable metallisd pads by the method claimed in any preceding claim.
7. A substrate as claimed in claim 6, which substrate is made of glass.
8. A glass substrate as claimed in claim 7, which substrate constitutes a part of a liquid crystal cell.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB8718625A GB2207669B (en) | 1987-08-06 | 1987-08-06 | Providing metallised pads on transparent electrically conductive tracks on glass substrates |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB8718625A GB2207669B (en) | 1987-08-06 | 1987-08-06 | Providing metallised pads on transparent electrically conductive tracks on glass substrates |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| GB8718625D0 GB8718625D0 (en) | 1987-09-09 |
| GB2207669A true GB2207669A (en) | 1989-02-08 |
| GB2207669B GB2207669B (en) | 1991-05-15 |
Family
ID=10621904
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB8718625A Expired - Lifetime GB2207669B (en) | 1987-08-06 | 1987-08-06 | Providing metallised pads on transparent electrically conductive tracks on glass substrates |
Country Status (1)
| Country | Link |
|---|---|
| GB (1) | GB2207669B (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2690597A1 (en) * | 1992-04-27 | 1993-10-29 | Futaba Denshi Kogyo Kk | Transparent conductive film wiring board mfr. - by dry process, esp. for display device front panel prodn. |
| US20120321821A1 (en) * | 2009-11-27 | 2012-12-20 | Luoyang Landglass Technology Co., Ltd | Method for Sealing Vacuum Glass and Vacuum Glass Product |
| US20130292038A1 (en) * | 2011-01-31 | 2013-11-07 | Luoyang Landglass Technology Co., Ltd | Method for Vacuum Acquisition during Manufacturing of Vacuum Glass Component |
| US20140050867A1 (en) * | 2010-12-10 | 2014-02-20 | Luoyang Landglass Technology Co., Ltd | Vacuum Glass Component |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3319915B2 (en) | 2015-07-07 | 2023-05-17 | AGC Glass Europe | Glass substrate with increased weathering and chemcial resistance |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2104058A (en) * | 1981-08-03 | 1983-03-02 | Avx Corp | Silver-filled glass metallizing paste |
-
1987
- 1987-08-06 GB GB8718625A patent/GB2207669B/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB2104058A (en) * | 1981-08-03 | 1983-03-02 | Avx Corp | Silver-filled glass metallizing paste |
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR2690597A1 (en) * | 1992-04-27 | 1993-10-29 | Futaba Denshi Kogyo Kk | Transparent conductive film wiring board mfr. - by dry process, esp. for display device front panel prodn. |
| US20120321821A1 (en) * | 2009-11-27 | 2012-12-20 | Luoyang Landglass Technology Co., Ltd | Method for Sealing Vacuum Glass and Vacuum Glass Product |
| US20120321822A1 (en) * | 2009-11-27 | 2012-12-20 | Luoyang Landglass Technology Co., Ltd | Compound Sealing Method for Vacuum Glass |
| US20130004685A1 (en) * | 2009-11-27 | 2013-01-03 | Luoyang Landglass Technology Co., Ltd | Method for Sealing Curved Vacuum Glass and Curved Vacuum Glass |
| US20130202820A1 (en) * | 2009-11-27 | 2013-08-08 | Luoyang Landglass Technology Co., Ltd | Method for Sealing Tempered Vacuum Glass and Tempered Vacuum Glass |
| US8840007B2 (en) * | 2009-11-27 | 2014-09-23 | Luoyang Landglass Technology Co., Ltd | Compound sealing method for vacuum glass |
| US8899471B2 (en) * | 2009-11-27 | 2014-12-02 | Luoyang Landglass Technology Co., Ltd | Method for sealing curved vacuum glass and curved vacuum glass |
| US8899472B2 (en) * | 2009-11-27 | 2014-12-02 | Luoyang Landglass Technology Co., Ltd | Method for sealing vacuum glass and vacuum glass product |
| US20140050867A1 (en) * | 2010-12-10 | 2014-02-20 | Luoyang Landglass Technology Co., Ltd | Vacuum Glass Component |
| US9815737B2 (en) * | 2010-12-10 | 2017-11-14 | Luoyang Landglass Technology Co., Ltd | Vacuum glass component |
| US20130292038A1 (en) * | 2011-01-31 | 2013-11-07 | Luoyang Landglass Technology Co., Ltd | Method for Vacuum Acquisition during Manufacturing of Vacuum Glass Component |
Also Published As
| Publication number | Publication date |
|---|---|
| GB8718625D0 (en) | 1987-09-09 |
| GB2207669B (en) | 1991-05-15 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| 732 | Registration of transactions, instruments or events in the register (sect. 32/1977) | ||
| 732E | Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977) | ||
| 732E | Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977) | ||
| 732E | Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977) | ||
| PE20 | Patent expired after termination of 20 years |
Effective date: 20070805 |