GB2202993A - Arrangement for mounting a chip carrier on a printed circuit board - Google Patents
Arrangement for mounting a chip carrier on a printed circuit board Download PDFInfo
- Publication number
- GB2202993A GB2202993A GB08710951A GB8710951A GB2202993A GB 2202993 A GB2202993 A GB 2202993A GB 08710951 A GB08710951 A GB 08710951A GB 8710951 A GB8710951 A GB 8710951A GB 2202993 A GB2202993 A GB 2202993A
- Authority
- GB
- United Kingdom
- Prior art keywords
- pcb
- chip carrier
- mounting
- moulding
- socket
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/325—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by abutting or pinching, i.e. without alloying process; mechanical auxiliary parts therefor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/10—Plug-in assemblages of components, e.g. IC sockets
- H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
- H05K7/1061—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/12—Resilient or clamping means for holding component to structure
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Metallurgy (AREA)
- Manufacturing & Machinery (AREA)
- Connecting Device With Holders (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
An arrangement for mounting a chip carrier (14) to a printed circuit board (10), wherein a lock nut (18) is cemented to the chip carrier to extend through an aperture (28) in a socket moulding (26) and into an aperture (30) in the pcb, the latter also receiving from the opposite direction a mounting screw (36) which screws into the lock nut to clamp the assembly together, with interface contacts (16) on the chip carrier connected to contact pads (12) on the pcb by interconnecting elements principally accommodated in slots (38) in the socket moulding. The interconnecting elements may comprise elastomeric strips having alternate conducting and non-conducting sections, or may comprise individual springs. <IMAGE>
Description
Title Mounting Arrangement for a Chip Carrier
Field of the invention
This invention relates to an arrangement for mounting an integrated circuit chip carrier to a printed circuit board (pcb) and also to a pcb/chip carrier combination incorporating said mounting arrangement.
Background to the invention
In mounting arrangement known from U.S. Patent No.
4506938, a socket is cemented to the pcb and receives both a contact interface member equipped with conductive interconnecting elements and the chip carrier, together with a compression spring which acts on the chip carrier to clamp the interface member between said pcb and said chip carrier with the interconnecting elements in electrical contact both with interface contacts on the chip carrier and contact pads on the pcb. In practical form the known arrangement is relatively complicated and there is risk of non-uniformly distributed clamping forces acting at the electrical interfaces.
It is an object of this invention to provide an improved arrangement for mounting a chip carrier to a pcb.
The invention
Accordng to one aspect of the invention, there is provided a mountinq arrangement for mounting an integrated circuit chip carrier to a printed circuit board (pcb), comprising a screwthreaded mounting insert for fixedly attaching to the chip carrier, a socket moulding carrying interconnection elements for establishing electrical connections between interface contacts on the chip carrier and interface contact pads on the pcb, said socket moulding being apertured to receive the mounting insert of the chip carrier, and a screwthreaded mounting member for extending through an aperture in the pcb and to be threaded into engagement with the mounting insert to clamp the socket moulding between the chip carrier and the pcb with said interface contacts and said contact pads interconnected by said interconnection elements.
Desirably, the mounting insert and the socket moulding are provided with means for orientating said insert and said moulding so that the interconnecting elements engage the chip carrier interface contacts. Preferably, moreover, the socket moulding and the pcb are provided with means for orientating said moulding and said pcb so that the interconnecting elements engage the pcb contact pads.
In one embodiment, the mounting insert comprises an internally screwthreaded boss externally shaped to be received in a correspondingly shaped aperture of the socket moulding in only one angular orientation of said insert and said moulding, the mounting member comprising a mounting screw. In this embodiment, the socket moulding preferably carries one or more projecting pins to be received in one or more corresponding apertures in the pcb in only one angular orientation of said moulding and said pcb.
he invention also extends to a ncb/chip carrier combination incorporating the above-described mounting arranqement. Thus, according to another aspect of the invention, there is provided a printed circuit board/integrated circuit chip carrier combination, wherein the chip carrier is mounted to the pcb by means of a mounting insert in the form of a lock nut bonded to the chip carrier and received in an aperture in a socket moulding clamped between the pcb and the chip carrier by a mounting screw which passes through an aperture in the pcb into threaded engagement with the lock nut, the socket moulding also having slots accommodating interconnecting elements which establish conductive contact both with interface contacts on the chip carrier and with contact pads on the pcb.
If the mounting screw inlcudes or comprises a conductive portion between the head end and the threaded shank, and the bus on the chip carrier includes a conductive element which will make contact with the conductive portion of the screw, then an electrical path will be established between the pcb and the chip carrier, when the screw is inserted.
This will for example allow electrical grounding of the chip carrier to a suitable point on the pcb which may for example make contact with a conductive washer, which may be spring loaded with into contact therewith, hold captive below the screw head.
Typically the screw will be of a conductive material as will also be at least the screw threaded region of the bus on the chip carrier. An electrical connection between the conductive path of the bus (if the whole is not found from conduction material) will complete the path.
Brief description of drawings
The mountinq arrangement in accordance with the invention will now be exemplified in the following description, making reference to the accompanying drawings, in which:
Figure 1 is an exploded perspective view of a practical
embodiment of mounting arrangement shown
somewhat diagrammatically;
Figure 2 is an exploded view of the mounting arrangement
in side elevation; and
Figure 3 is a side elevational view of an assembled
pcb/chip carrier.
Description of embodiment ReferrIng to the drawings, a pcb 10 has on its rear face an arrangement of twenty-eight contact pads 12, positioned in a generally square configuration with seven pads per side.
An integrated circuit chip carrier 14 has a corresponding configuration of interface contacts 16 around its square periphery. Cemented or otherwise bonded to the central region 17 of the chip carrier 14 is a mounting insert in the form of a lock nut 18. The nut is internally threaded at 20 within a projecting boss 22, the latter having a flat 24 on its external surface.
Reference 26 denotes a socket moulding having a shaped central aperture 28 for receiving the boss 22 of the mounting insert 18 when the chip carrier 14 and the socket moulding 26 are in a correct angular relationship, initially determined when the mounting insert 18 is bonded to the chip carrier 14.
The pcb 10 has an aperture 30 disposed centrally with respect to the contact pads 12, also receiving the boss 22 of the mounting insert after passage of the latter through the apertured socket moulding 26. Correct angular orientation and positioning of the socket moulding 26 with respect to the pcb 10 is achieved by means of a pair of pins 32 on the socket moulding which engage into a pair of holes 34 formed in the pcb.
The parts can be clamped together by a mounting screw 36 which passes through the aperture 30 in the pcb into threaded engagement with the lock nut 18 which constitutes the mounting insert. The socket moulding 26 is thus tightly sandwiched between the chip carrier 14 and the pcb in The socket moulding 26 has four elongated slots 38 arranged in a square configuration which matches that of the contact pads 12 and interface contacts 16. These slots 38 accommodate elastomeric strips 40 (see Figure 2), which each have alternate conducting and non-conducting sections of which the former constitute interconnecting elements for electrically contacting both the interface contacts 16 and the contact pads 12 in order to connect corresponding such contacts and pads together, thereby electrically to connect the i.c. chip carrier with the pcb on which the chip carrier is now mounted. The elastomeric strips 40 could be replaced by individual sprung contact elements, seven per elongated slot 38 in the socket moulding.
It will be noted that the mounting screw 36 has an enlarged head 42 with a flat undersurface for ensuring an even distribution of clamping pressure at the spread electrical interfaces when the parts are assembled. An enlarged locking washer 44 may be interposed beneath the head, as shown in Figure 2.
Figure 3 shows the completed assembly incorporating the mounting arrangement in accordance with the invention.
The mounting arrangement as described is both simple and easily practised without the need of any special tools, as only a screwdriver or the like is required to effect assembly and dis-assembly, thus facilitating servicing and maintenance.
Although the drawing shows four elongated slots 38 in socket moulding 26, arranged parallel to the four edges, each of the slots 38 may be sub-divided if desired for example into two aligned slots to allow pairing.
It is to be noted that screw 36 may be rendered more or less tamperproof by incorporating different tool engaging features in its enlarged head and may be secured using a proprietory locking adhesive if a more permanent bond is required.
Various modifications of the above-described embodiment are possible within the scope of the invention as defined in the appended claims. For example, various means of correctly orientating the chip carrier, socket moulding and pcb contact pads may be employed instead of the means described, and in some instances it may be possible to use a common means for orientating both the socket moulding and the chip carrier with respect to the pcb.
Claims (12)
1. A mounting arrangement for mounting an lnt era ted
circuit chip carri er to a printed circuit bo ard (pcb),
comprising a screwthreaded mounting in insert for fixedly
attaching to the chip carr ler, a socket mouldi ng carrying
interconnection elem ents for establishing electrical connection between interface contacts on the chip carrier and interface contact pads on the pcb, said socket
moulding being apertured to receive the mounting insert of
the chip carrier, and a screwthreaded mounting member tor extending through an aperture in the pcb and to be threaded into engagement with the mounting insert to clamp the socket moulding between the chip carrier and the pcb with said interface contacts and said contact pads interconnected by said interconnection elements.
2. An arrangement according to claim 1, wherein the mounting insert and the socket moulding are provided with means for orientating said insert and said moulding so that the interconnecting elements engage the chip carrier interface contacts.
3. An arrangement according to claim 1 or claim 2, wherein the socket moulding and the pcb are provided with means for orientating said moulding and said pcb so that the interconnecting elements engage the pcb contact pads.
4. An arrangement according to claim 2 or claim 3 when appendant to claim 2, wherein said mounting insert comprises an internally screwthreaded boss externally shaped to be received in a correspondingly shaped aperture of the socket moulding in only one angular orientation of said insert and said moulding, the mounting member comprisinq a mounting screw.
5. An arrangement according to claimm 3 or claim 4 when appendant to claim 3, wherein the socket moulding carries at least one projecting pin to be received in a corresponding aperture in the pcb in only one angular orientation of said moulding and said pcb.
6. An arrangement according to any one of claims 1 to 5, wherein said interconnection elements are principally accommodated in apertures in the socket moulding.
7. An arrangement according to claim 6, wherein said apertures are elongate slots each for accommodating a plurality of interconnecting elements.
8. An arrangement according to claim 7, wherein each said plurality of interconnecting elements is formed by an elastomeric strip having alternate non-conducting and conducting sections of which the latter constitute said interconnecting elements.
9. An arrangement according to claim 4 or any claim appendant thereto, wherein said boss is dimensioned to extend at least partly through the aperture in the pcb into which the mounting screw is received, the latter having an enlarged head with a flat undersurface for pressing against the pcb around said aperture therein either directly or through an enlarged washer.
10. A mounting arrangement for mounting a chip carrier to a printed circuit board substantially as hereinbefore described with reference to the accompanying drawings.
11. A printed circuit board (pcb)/integrated circuit chip carrier combination, wherein the chip carrier is mounted to the pcb by means of a mounting insert in the form of a lock nut bonded to the chip carrier and received in an aperture in a socket moulding clamped between the pcb and the chip carrier by a mounting screw which passes through an aperture in the pcb into threaded engagement with the lock nut, the socket moulding also having slots accommodating interconnecting elements which establish conductive contact both with interface contacts on the chip carrier and with contact sads on the pcb.
12. A printed circuit board/chip carrier combination substantially as hereinbefore described with reference to the accompanying drawings.
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE8888902178T DE3865159D1 (en) | 1987-03-31 | 1988-03-10 | MOUNTING DEVICE FOR A CHIP HOLDER. |
DE8890026U DE8890026U1 (en) | 1987-03-31 | 1988-03-10 | Device for mounting an IC chip carrier |
PCT/GB1988/000183 WO1988007808A1 (en) | 1987-03-31 | 1988-03-10 | Mounting arrangement for a chip carrier |
US07/269,740 US4874318A (en) | 1987-03-31 | 1988-03-10 | Mounting arangement for a chip carrier |
EP88902178A EP0307425B1 (en) | 1987-03-31 | 1988-03-10 | Mounting arrangement for a chip carrier |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB878707663A GB8707663D0 (en) | 1987-03-31 | 1987-03-31 | Mounting arrangement |
Publications (3)
Publication Number | Publication Date |
---|---|
GB8710951D0 GB8710951D0 (en) | 1987-06-10 |
GB2202993A true GB2202993A (en) | 1988-10-05 |
GB2202993B GB2202993B (en) | 1990-10-03 |
Family
ID=10614973
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB878707663A Pending GB8707663D0 (en) | 1987-03-31 | 1987-03-31 | Mounting arrangement |
GB8710951A Expired - Lifetime GB2202993B (en) | 1987-03-31 | 1987-05-08 | Mounting arrangement for a chip carrier |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB878707663A Pending GB8707663D0 (en) | 1987-03-31 | 1987-03-31 | Mounting arrangement |
Country Status (1)
Country | Link |
---|---|
GB (2) | GB8707663D0 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2284713A (en) * | 1993-12-08 | 1995-06-14 | Sony Uk Ltd | Mounting of an intergrated circuit package on a circuit board |
WO2004075611A1 (en) * | 2003-02-24 | 2004-09-02 | Brenton O'brien | Pcb connector |
GB2407917A (en) * | 2003-10-07 | 2005-05-11 | Hewlett Packard Development Co | Component retention means |
EP4440250A1 (en) * | 2023-03-28 | 2024-10-02 | Siemens Aktiengesellschaft | Tolerance compensation in the event of current contact to a printed circuit board |
-
1987
- 1987-03-31 GB GB878707663A patent/GB8707663D0/en active Pending
- 1987-05-08 GB GB8710951A patent/GB2202993B/en not_active Expired - Lifetime
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB2284713A (en) * | 1993-12-08 | 1995-06-14 | Sony Uk Ltd | Mounting of an intergrated circuit package on a circuit board |
GB2284713B (en) * | 1993-12-08 | 1997-11-12 | Sony Uk Ltd | Integrated circuit package |
WO2004075611A1 (en) * | 2003-02-24 | 2004-09-02 | Brenton O'brien | Pcb connector |
GB2407917A (en) * | 2003-10-07 | 2005-05-11 | Hewlett Packard Development Co | Component retention means |
US7061126B2 (en) | 2003-10-07 | 2006-06-13 | Hewlett-Packard Development Company, L.P. | Circuit board assembly |
GB2407917B (en) * | 2003-10-07 | 2007-05-30 | Hewlett Packard Development Co | Circuit board assembly |
EP4440250A1 (en) * | 2023-03-28 | 2024-10-02 | Siemens Aktiengesellschaft | Tolerance compensation in the event of current contact to a printed circuit board |
WO2024199814A1 (en) | 2023-03-28 | 2024-10-03 | Siemens Aktiengesellschaft | Tolerance compensation for current contact with a circuit board |
Also Published As
Publication number | Publication date |
---|---|
GB8707663D0 (en) | 1987-05-07 |
GB2202993B (en) | 1990-10-03 |
GB8710951D0 (en) | 1987-06-10 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
732 | Registration of transactions, instruments or events in the register (sect. 32/1977) | ||
PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 19930508 |