GB2200128B - Crosslinkable polyphenylene oxide resin composition - Google Patents

Crosslinkable polyphenylene oxide resin composition

Info

Publication number
GB2200128B
GB2200128B GB8729432A GB8729432A GB2200128B GB 2200128 B GB2200128 B GB 2200128B GB 8729432 A GB8729432 A GB 8729432A GB 8729432 A GB8729432 A GB 8729432A GB 2200128 B GB2200128 B GB 2200128B
Authority
GB
United Kingdom
Prior art keywords
resin composition
polyphenylene oxide
oxide resin
crosslinkable polyphenylene
crosslinkable
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
GB8729432A
Other languages
English (en)
Other versions
GB2200128A (en
GB8729432D0 (en
Inventor
Shuji Maeda
Takaaki Sakamoto
Munehiko Ito
Takahiro Heiuchi
Takayoshi Ozeki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Publication of GB8729432D0 publication Critical patent/GB8729432D0/en
Publication of GB2200128A publication Critical patent/GB2200128A/en
Application granted granted Critical
Publication of GB2200128B publication Critical patent/GB2200128B/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/06—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B27/08—Layered products comprising a layer of synthetic resin as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
    • C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
    • C08F283/06—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polyethers, polyoxymethylenes or polyacetals
    • C08F283/08—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polyethers, polyoxymethylenes or polyacetals on to polyphenylene oxides
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/18—Layered products comprising a layer of synthetic resin characterised by the use of special additives
    • B32B27/20—Layered products comprising a layer of synthetic resin characterised by the use of special additives using fillers, pigments, thixotroping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B27/00—Layered products comprising a layer of synthetic resin
    • B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
    • B32B27/285—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyethers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/24—Acids; Salts thereof
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C08L71/12—Polyphenylene oxides
    • C08L71/123—Polyphenylene oxides not modified by chemical after-treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2305/00—Condition, form or state of the layers or laminate
    • B32B2305/07—Parts immersed or impregnated in a matrix
    • B32B2305/076—Prepregs
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2311/00—Metals, their alloys or their compounds
    • B32B2311/12—Copper
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0242—Shape of an individual particle
    • H05K2201/0245—Flakes, flat particles or lamellar particles

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
GB8729432A 1986-12-23 1987-12-17 Crosslinkable polyphenylene oxide resin composition Expired - Lifetime GB2200128B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP30672186 1986-12-23

Publications (3)

Publication Number Publication Date
GB8729432D0 GB8729432D0 (en) 1988-02-03
GB2200128A GB2200128A (en) 1988-07-27
GB2200128B true GB2200128B (en) 1990-08-29

Family

ID=17960496

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8729432A Expired - Lifetime GB2200128B (en) 1986-12-23 1987-12-17 Crosslinkable polyphenylene oxide resin composition

Country Status (3)

Country Link
DE (1) DE3743964A1 (ja)
FR (1) FR2608616B1 (ja)
GB (1) GB2200128B (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5275878A (en) * 1990-02-06 1994-01-04 Matsushita Electric Works, Ltd. Composite dielectric and printed-circuit use substrate utilizing the same
EP0695116B1 (en) * 1994-07-29 2004-01-28 World Properties, Inc. Fluoropolymer composites containing two or more ceramic fillers to achieve independent control of dielectric constant and dimensional stability
DE19917477A1 (de) * 1998-08-25 2000-03-02 Cellpack Ag Wohlen Isolierstoffe
JP5261896B2 (ja) * 2006-07-27 2013-08-14 ダイキン工業株式会社 コーティング組成物

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3557045A (en) * 1967-11-13 1971-01-19 Fmc Corp Mixed thermosetting resin compositions containing polyphenylene ethers

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4034136A (en) * 1969-06-30 1977-07-05 Fmc Corporation Flame-retardant resin compositions
SU1001189A1 (ru) * 1980-09-01 1983-02-28 Предприятие П/Я А-3177 Электроизол ционна композици
US4318836B1 (en) * 1980-11-24 1995-10-31 Gen Electric Titanium dioxide filled polyphenylene ether compositions
DE3609664C2 (de) * 1985-03-25 1994-11-03 Matsushita Electric Works Ltd Verfahren zur Herstellung eines Films oder einer Folie auf Polyphenylenoxid-Basis und deren Verwendung
JPS6248711A (ja) * 1985-08-27 1987-03-03 Matsushita Electric Works Ltd 広範な誘電率を有する組成物
JPH01245059A (ja) * 1988-03-27 1989-09-29 Matsushita Electric Works Ltd 賦形可能な高誘電性熱硬化性組成物

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3557045A (en) * 1967-11-13 1971-01-19 Fmc Corp Mixed thermosetting resin compositions containing polyphenylene ethers

Also Published As

Publication number Publication date
DE3743964C2 (ja) 1992-09-10
DE3743964A1 (de) 1988-07-07
FR2608616A1 (fr) 1988-06-24
GB2200128A (en) 1988-07-27
FR2608616B1 (fr) 1993-10-15
GB8729432D0 (en) 1988-02-03

Similar Documents

Publication Publication Date Title
GB8606764D0 (en) Preparing polyphenylene oxide composition
AU603518B2 (en) Polyphenylene ether resin composition
EP0222157A3 (en) Resin composition
EP0196035A3 (en) Dielectric composition
GB8606595D0 (en) Resin compositions
EP0232522A3 (en) Polypropylene resin composition
EP0168139A3 (en) Crosslinkable polymer composition
EP0260123A3 (en) Polyphenylene ether resin composition
EP0265075A3 (en) Polypropylene resin composition
GB8504528D0 (en) Resin composition
EP0203402A3 (en) Polyolefin-based resin composition polyolefin-based resin composition
EP0264291A3 (en) Polyester resin composition
GB8727257D0 (en) Moulding composition
GB8612969D0 (en) Moulding composition
EP0205328A3 (en) One-pack curing type composition
GB8719323D0 (en) Moulding composition
ZA866197B (en) Polyolefin molding composition
GB8622604D0 (en) Polypropylene resin composition
EP0199510A3 (en) Polyphenylene ether resin composition
DE3569256D1 (en) Resin composition
GB2200128B (en) Crosslinkable polyphenylene oxide resin composition
GB8501898D0 (en) Vacuum switch
GB8530112D0 (en) Switch latches
GB2210623B (en) Resin composition
AU553785B2 (en) Modified polyphenylene oxide resin composition

Legal Events

Date Code Title Description
746 Register noted 'licences of right' (sect. 46/1977)

Effective date: 20020620

PE20 Patent expired after termination of 20 years

Effective date: 20071216