GB2198888A - Cooling electronic components - Google Patents
Cooling electronic components Download PDFInfo
- Publication number
- GB2198888A GB2198888A GB08629442A GB8629442A GB2198888A GB 2198888 A GB2198888 A GB 2198888A GB 08629442 A GB08629442 A GB 08629442A GB 8629442 A GB8629442 A GB 8629442A GB 2198888 A GB2198888 A GB 2198888A
- Authority
- GB
- United Kingdom
- Prior art keywords
- tile
- heat sink
- assembly according
- platform
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/4824—Connecting between the body and an opposite side of the item with respect to the body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/12—Passive devices, e.g. 2 terminal devices
- H01L2924/1203—Rectifying Diode
- H01L2924/12033—Gunn diode
Abstract
An electronic assembly comprises a heat sink P, a ceramic tile T located on the heat sink, a thick film circuit on the upper face of the tile, a semiconductor device D supported on a platform 6 above the tile, and leads 7 connecting the device to the circuit. The platform 6 is in thermal contact with the heat sink P through a supporting stud 5. <IMAGE>
Description
ASSEMBLY OF ELECEONIC COMPONENTS
The invention relates to an assembly of electronic components.
There is a need to assemble electronic components incorporating many circuits in such a way that heat generated in use is well dissipated while at the same time the total components do not occupy too much space. This two fold need is especially acute in the case of small assemblies used in automotive vehicles such as ignition system control modules or engine management control modules.
According to one aspect of the invention there is provided a compact assembly of electronic components comprising a heat sink base, a ceramic tile located on the base, the tile having a thick film circuit on its upper face, a semiconductor device supported above the ceramic tile and in thermal contact with the heat sink base, leads extending from the semiconductor device to the thick film circuit.
It is an advantage of toe invention that because the cericonductor device Is above the tile leads may extend from any of three sides of the device to the thick film circuit tracks on the tile, and that such leads may be direct and short.
In one specific embodiment of the invention the semiconductor device is sup? ~ted on the head of a thermally conductive stud which is received a ahole in the base, the hole being located to one side of the ceramic tile so that the semiconductor device is directly above the tile. Such a stud may be connected to the base in a wide variety of ways, e.g.
press fitting, screwing, by adhesive or riveting or the like.
Alternatively, the hole may be omitted and the thermally conductive stud may be ultra sonically welded or otherwise attached to the heat sink base.
In another embodiment of the invention the base includes an upright wall fror one side of which extends a roof to overlie the base. One or more sericond#ctor device may be mounted on the roof.
In order that the invention may be well understood it will now be described, by way of example only, with reference to the accompanying diagrammatic drawings, in which. Figure 1 is a part sectional view of one assembly and Figure 2 is a perspective view of another assembly.
The same reference numerals are used whenever possible in describing the different embodiments of the invention.
The assembly of Figure 1 includes a heat sink platform P on which is mounted a ceramic tile T having thick film circuits thereon. The platform P is made of a thermally conductive material such as copper, which may be gold passivated or plated with silver. Nickel may also be used as the plating material.
The platform P has a vertical wall 1 at one side and the floor is thickened adjacent the wall. A hole 2 is present in the thickened floor portion 3. The lower end 4 of a stud of copper or like thermally conductive material 5 is knurled, and is dimensioned to be received in the hole 2. A flange 6 extends from one side of the top of the stud 5 c that when the stud is received in the hole the flange 6 overlies the tile T. A multicircuit power generating semiconductor device D is mounted on the flange 6 and leads 7 extend from three sides of the device D to the thick film circuits tracks below. Because the components are close together the leads may be short and direct connections can be made.
In the embodiment of Figure 2, the platform has no holes, and the roof is in the form of side extensions 8 from the vertical wall 1. Again, a compact assembly is formed and because of the shape of the platform, wall and roof, heat is readily dissipated from the heat generating components.
The invention is not limited to the embodiments shown. For example, the assembly may be potted in resin, an electrically insulating pad of beryllium may be present between the device and the tile, and the device or tile may sit in a recess in the roof or platform respectively.
Claims (10)
1. An assembly of electronic components comprising a heat sink base, a ceramic tile located on the base, the tile having an electronic circuit on its upper face, a semiconductor device supported on support means present above the ceramic tile and in thermal contact with the heat sink base, leads extending from the semiconductor device to the electronic circuit.
2. An assembly according to Claim 1 characterised in that, the semiconductor device is supported on a platform which at one end is connected to the heat sink base.
3. An assembly according to Claim 2 characterised in that the platform is present at or near the top of a stud which is received in a hole in the heat sink base, and the hole is present at one side of the ceramic tile so that the semiconductor device is directly above the tile.
4. An assembly according to Claim 1 or 2 characterised in that the platform is present at or near the top of a stud which is ultrasonically welded to the heat sink base.
5. An assembly according to Claim 1 or 2 characterised in that the heat sink base and the platform are joined together at one side by a vertical wall.
6. An assembly according to any preceding Claim characterised in that direct and short leads extend from any of three sides of the semiconductor device to the electronic circuit tracks on the tile.
7. An assembly according to any preceding Claim characterised in that the device or tile sit in a recess in the platform of the heat sink base.
8. An assembly according to any preceding Claim characterised in that an electrically insulating pad of beryllium or like is present between the device and the tile.
9. An assembly according to any preceding Claim characterised in that it is potted in resin or like.
10. For use in making an assembly according to any preceding Claim, a heat sink base on which is mounted a ceramic tile, the tile having an electronic circuit on its upper face characterised in that a platform is present above the base to receive a semiconductor device whereby the device may be connected to the circuit by direct and short electrical leads.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB08629442A GB2198888A (en) | 1986-12-09 | 1986-12-09 | Cooling electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB08629442A GB2198888A (en) | 1986-12-09 | 1986-12-09 | Cooling electronic components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| GB8629442D0 GB8629442D0 (en) | 1987-01-21 |
| GB2198888A true GB2198888A (en) | 1988-06-22 |
Family
ID=10608722
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB08629442A Pending GB2198888A (en) | 1986-12-09 | 1986-12-09 | Cooling electronic components |
Country Status (1)
| Country | Link |
|---|---|
| GB (1) | GB2198888A (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0053967A1 (en) * | 1980-12-05 | 1982-06-16 | COMPAGNIE INTERNATIONALE POUR L'INFORMATIQUE CII - HONEYWELL BULL (dite CII-HB) | Removable cooling device for an integrated-circuit mounting |
| US4459639A (en) * | 1982-07-12 | 1984-07-10 | Rockwell International Corporation | Circuit board heatsink clamping assembly and technique |
| GB2165704A (en) * | 1984-10-11 | 1986-04-16 | Teraydne Inc | Heat dissipation for electronic components |
-
1986
- 1986-12-09 GB GB08629442A patent/GB2198888A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0053967A1 (en) * | 1980-12-05 | 1982-06-16 | COMPAGNIE INTERNATIONALE POUR L'INFORMATIQUE CII - HONEYWELL BULL (dite CII-HB) | Removable cooling device for an integrated-circuit mounting |
| US4459639A (en) * | 1982-07-12 | 1984-07-10 | Rockwell International Corporation | Circuit board heatsink clamping assembly and technique |
| GB2165704A (en) * | 1984-10-11 | 1986-04-16 | Teraydne Inc | Heat dissipation for electronic components |
Also Published As
| Publication number | Publication date |
|---|---|
| GB8629442D0 (en) | 1987-01-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6060772A (en) | Power semiconductor module with a plurality of semiconductor chips | |
| KR100544033B1 (en) | Microelectronic component with a sandwich design | |
| KR100307465B1 (en) | Power module | |
| US5461542A (en) | Multi-board electrical control device | |
| US6185100B1 (en) | Control device consisting of at least two housing sections | |
| US5338971A (en) | Electronic device structure with studs locating lead frame on backing plate | |
| US5646828A (en) | Thin packaging of multi-chip modules with enhanced thermal/power management | |
| US4916575A (en) | Multiple circuit board module | |
| US5159537A (en) | Mounting structure for electronic apparatus | |
| EP0468475B1 (en) | Power semiconductor device suitable for automation of production | |
| KR940002993A (en) | Pad Array Semiconductor Device with Thermal Conductor and Manufacturing Method Thereof | |
| KR100488433B1 (en) | Device for fixing a heat distribution cover on a printed circuit board | |
| DE69940495D1 (en) | The power semiconductor module | |
| EP1345265B1 (en) | Electronics assembly with improved heatsink configuration | |
| KR960012455A (en) | Multi-Chip Ceramic Modules Mount Electronic Components Connected to the Board and Cap Through the Connection Pins | |
| US5469329A (en) | Printed circuit board with bi-metallic heat spreader | |
| US20020164895A1 (en) | Integrated power delivery with flex circuit interconnection for high density high power circuits for integrated circuits and systems | |
| US4488167A (en) | Current converter assembly in a flat housing | |
| US6011692A (en) | Chip supporting element | |
| GB2198888A (en) | Cooling electronic components | |
| US6905361B2 (en) | Electrical device | |
| US6057594A (en) | High power dissipating tape ball grid array package | |
| EP1524893B1 (en) | Electronic control unit, in particular for motor vehicles, with improved heat dissipation system | |
| JPS6231888Y2 (en) | ||
| JPH0727779B2 (en) | Power module mounting board |