GB2176936B - Semiconductor apparatus - Google Patents
Semiconductor apparatusInfo
- Publication number
- GB2176936B GB2176936B GB8610966A GB8610966A GB2176936B GB 2176936 B GB2176936 B GB 2176936B GB 8610966 A GB8610966 A GB 8610966A GB 8610966 A GB8610966 A GB 8610966A GB 2176936 B GB2176936 B GB 2176936B
- Authority
- GB
- United Kingdom
- Prior art keywords
- semiconductor apparatus
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
- H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
- H01L23/24—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel at the normal operating temperature of the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
- H01L23/057—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads being parallel to the base
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
- H01L2224/45124—Aluminium (Al) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01014—Silicon [Si]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1301—Thyristor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Dispersion Chemistry (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60102972A JPS61260657A (en) | 1985-05-15 | 1985-05-15 | Semiconductor device |
Publications (3)
Publication Number | Publication Date |
---|---|
GB8610966D0 GB8610966D0 (en) | 1986-06-11 |
GB2176936A GB2176936A (en) | 1987-01-07 |
GB2176936B true GB2176936B (en) | 1988-10-12 |
Family
ID=14341666
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB8610966A Expired GB2176936B (en) | 1985-05-15 | 1986-05-06 | Semiconductor apparatus |
Country Status (3)
Country | Link |
---|---|
JP (1) | JPS61260657A (en) |
DE (1) | DE3616226A1 (en) |
GB (1) | GB2176936B (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
NO911774D0 (en) * | 1991-05-06 | 1991-05-06 | Sensonor As | DEVICE FOR ENCAPLING A FUNCTIONAL ORGANIZATION AND PROCEDURE FOR PRODUCING THE SAME. |
JP2774906B2 (en) * | 1992-09-17 | 1998-07-09 | 三菱電機株式会社 | Thin semiconductor device and method of manufacturing the same |
CN106252422A (en) * | 2016-08-23 | 2016-12-21 | 太仓市威士达电子有限公司 | A kind of metal shell for packaging of photoelectric device |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB1140677A (en) * | 1965-05-07 | 1969-01-22 | Ass Elect Ind | Improvements relating to semi-conductor devices |
DE1489688A1 (en) * | 1965-06-26 | 1969-12-11 | Bosch Gmbh Robert | Semiconductor component |
US3533965A (en) * | 1966-09-13 | 1970-10-13 | Nippon Electric Co | Low expansion material |
US3569797A (en) * | 1969-03-12 | 1971-03-09 | Bendix Corp | Semiconductor device with preassembled mounting |
DE2922005A1 (en) * | 1979-05-30 | 1980-12-04 | Siemens Ag | SEMICONDUCTOR COMPONENT WITH PASSIVATED SEMICONDUCTOR BODY |
US4339768A (en) * | 1980-01-18 | 1982-07-13 | Amp Incorporated | Transistors and manufacture thereof |
FR2528658A1 (en) * | 1982-06-15 | 1983-12-16 | Silicium Semiconducteur Ssc | PLASTIC COVER HOUSING FOR SEMICONDUCTOR COMPONENTS |
JPS59181627A (en) * | 1983-03-31 | 1984-10-16 | Toshiba Corp | Manufacture of semiconductor device |
-
1985
- 1985-05-15 JP JP60102972A patent/JPS61260657A/en active Pending
-
1986
- 1986-05-06 GB GB8610966A patent/GB2176936B/en not_active Expired
- 1986-05-14 DE DE19863616226 patent/DE3616226A1/en not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
DE3616226A1 (en) | 1986-11-20 |
JPS61260657A (en) | 1986-11-18 |
GB2176936A (en) | 1987-01-07 |
GB8610966D0 (en) | 1986-06-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
SG59995A1 (en) | Semiconductor device | |
EP0433271A3 (en) | Semiconductor device | |
EP0221523A3 (en) | Semiconductor device | |
GB2172744B (en) | Semiconductor devices | |
EP0205217A3 (en) | Semiconductor devices | |
GB2184762B (en) | Well apparatus | |
EP0195607A3 (en) | Semiconductor device | |
GB8500681D0 (en) | Semiconductor device | |
EP0216304A3 (en) | Display-reproducing apparatus | |
GB8623528D0 (en) | Semiconductor device | |
GB8627128D0 (en) | Semiconductor device | |
GB8604500D0 (en) | Semiconductor | |
GB2175031B (en) | Well apparatus | |
GB8506489D0 (en) | Semiconductor device | |
GB2181205B (en) | Tray-cleaning apparatus | |
EP0218828A3 (en) | Web-lifting apparatus | |
GB8611845D0 (en) | Fault-protection apparatus | |
GB8509314D0 (en) | Apparatus | |
GB2176936B (en) | Semiconductor apparatus | |
GB8619843D0 (en) | Semiconductor | |
GB8510200D0 (en) | Semiconductor device | |
GB2174307B (en) | Palmball apparatus | |
GB8606487D0 (en) | Coin-separating apparatus | |
GB2183907B (en) | Semiconductor device | |
GB8823114D0 (en) | Apparatus |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
746 | Register noted 'licences of right' (sect. 46/1977) |
Effective date: 19950522 |
|
PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 19960506 |