GB2155426A - Apparatus for arranging wafer slices in spaced apart rows or in a line, in which said wafer slices are spaced apart - Google Patents

Apparatus for arranging wafer slices in spaced apart rows or in a line, in which said wafer slices are spaced apart Download PDF

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Publication number
GB2155426A
GB2155426A GB8504085A GB8504085A GB2155426A GB 2155426 A GB2155426 A GB 2155426A GB 8504085 A GB8504085 A GB 8504085A GB 8504085 A GB8504085 A GB 8504085A GB 2155426 A GB2155426 A GB 2155426A
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United Kingdom
Prior art keywords
conveyor
wafer slices
wafer
slices
conveying means
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB8504085A
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GB8504085D0 (en
GB2155426B (en
Inventor
Franz Haas
Johann Haas
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Haas Franz Waffelmaschinen Industrie GmbH
Original Assignee
Haas Franz Waffelmaschinen Industrie GmbH
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Publication of GB8504085D0 publication Critical patent/GB8504085D0/en
Publication of GB2155426A publication Critical patent/GB2155426A/en
Application granted granted Critical
Publication of GB2155426B publication Critical patent/GB2155426B/en
Expired legal-status Critical Current

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65GTRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G47/00Article or material-handling devices associated with conveyors; Methods employing such devices
    • B65G47/22Devices influencing the relative position or the attitude of articles during transit by conveyors
    • B65G47/26Devices influencing the relative position or the attitude of articles during transit by conveyors arranging the articles, e.g. varying spacing between individual articles
    • B65G47/30Devices influencing the relative position or the attitude of articles during transit by conveyors arranging the articles, e.g. varying spacing between individual articles during transit by a series of conveyors
    • B65G47/31Devices influencing the relative position or the attitude of articles during transit by conveyors arranging the articles, e.g. varying spacing between individual articles during transit by a series of conveyors by varying the relative speeds of the conveyors forming the series
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

Apparatus for arranging wafer slices in spaced apart rows, wherein said water slices are fed in a plurality of juxtaposed lines, in which consecutive wafer slices in each line abut and possibly adhere to each other at trailing and leading faces, respectively comprises a feeding conveyor (1) for conveying said wafer slices in said lines with abutting trailing and leading faces into engagement with a stop (2), which is movable out of the path of said wafer slices, preferably in a down direction, which feeding conveyor is operable to transfer said water slices to a succeeding delivering conveyor (3) past said stop when said stop has been removed from said path, said delivering conveyor being operable at least adjacent to said stop at higher velocity than said feeding conveyor. In order to ensure that consecutive water slices will be separated in time by the two conveyor belts moving at different velocities, the feeding conveyor and the delivering conveyor each comprise lower conveying means (4,9) for carrying the water slices and upper conveying means (5,8) for at least temporarily engaging the wafer slices at their top and the upper conveying means of the feeding conveyor are movable in height relative to the lower conveying means of the feeding conveyor into and out of engagement with the wafer slices on said lower conveying means of said feeding conveyor. The upper conveying means may each be a driven roller (6,12) or the upper conveying means of the feeding conveyor may be an endless belt. <IMAGE>

Description

SPECIFICATION Apparatus for arranging wafer slices in spaced apart rows or in a line, in which said wafer slices are spaced apart Background of the invention Field of the Invention This invention relates to apparatus for arranging wafer slices in spaced apart rows, wherein said wafer slices are fed in a plurality of juxtaposed lines, in which consecutive wafer slices in each line abut and possible adhere to each other at their trailing and leading faces, respectively, which apparatus comprises a feeding conveyor for conveying said wafer slices in said lines with abutting trailing and leading faces into engagement with a stop, which is movable out of the path of said wafer slices, preferably in a downward direction, which feeding conveyor is operable to transfer said wafer slices to a succeeding delivering conveyor past said stop when said stop has been removed from said path, said delivering conveyor being operable at least adjacent to said stop at a higher velocity than said feeding conveyor.
Description of the prior art Known apparatus of that kind comprises a conveyor belt for pushing the wafer slices against a stop, which is adapted to be lowered, and for transferring the wafer slices to a conveyor belt moving at a higher velocity when said stop has been lowered. Springs are disposed above both conveyor belts in the region extending before and behind the stop and urge the wafer slices from above against the respective conveyor belt. Said springs have the disadvantage that they slide on the top of the wafer slices so that only a low pressure can be applied to the wafer slices if damage to the top of the wafer slices by the sliding contact with the springs and the resulting friction is to be avoided.During a handling of wafer slices which have relatively strong adhering faces, a further disadvantage resides in that the slight spring pressure is not sufficient to ensure that consecutive wafer slices will be separated in time by the two conveyor belts moving at different velocities. As the wafer slices are fed in a plurality of lines, this may result in misalignment and in damage to individual wafer slices by the lowerable stop when it returns to its initial position.
Summary of the invention It is an object of the invention to eliminate these disadvantages.
In apparatus of the kind described first hereinbefore this is accomplished in accordance with the invention in that the feeding conveyor and the delivering conveyor each comprise lower conveying means for carrying the wafer slices and upper conveying means for at least temporarily engaging the wafer slices at their top and the upper conveying means of the feeding conveyor are movable in height relative to the lower conveying means of the feeding conveyor into and out of engagement with the wafer slices on said lower conveying means of said feeding conveyor.That arrangement ensures a reliable separation of consecutive wafer slices because both the wafer slice which is being accelerated by the delivering conveyor and the next succeeding wafer slice are clamped each between upper and lower conveying means as said consecutive wafer slices are separated so that the succeeding wafer slice cannot be pulled along by the preceding one, even if their filler layers adhere at their adjoining faces.The upper conveying means of the feeding conveyor are intermittently moved into and out of engagement with the top of the wafer slices on the lower conveying means of said feeding conveyor and when a given wafer slice has just been taken over by the delivering conveyor the upper conveying means of the feeding conveyor will remain in contact with the next succeeding wafer slice until the stop which is removable from the path of the wafer slices has returned to its initial position, whereafter said upper conveying means of the feeding conveyor are disengaged from the wafer slices on the feeding conveyor.
In accordance with a further feature of the invention, the upper conveying means of the feeding conveyor comprise a driven roller, which extends at right angles to the direction of conveyance and parallel to the plane of conveyance of the wafer slices in the feeding conveyor and is adapted to be lowered into and raised out of engagement with the top of the wafer slices on the feeding conveyor, and is provided, if desired, with an elastic covering. Said driven roller may be guided in tracks which are at right angles to the plane of conveyance of the wafer slices in the feeding conveyor or may be mounted on arms which are pivoted on an axis which is parallel to the plane of conveyance of the wafer slices in the feeding conveyor.
In accordance with a further feature of the invention the driven roller and the stop which is movable out of the path of the wafer slices are adapted to be raised and lowered in unison with each other.
In accordance with a further feature of the invention the upper conveying means of the feeding conveyor comprise a revolving conveyor belt, which is pivoted on an axis that is parallel to the plane of conveyance and at right angles to the direction of conveyance of the wafer slices in the feeding conveyor. Such an arrangement provides for a larger area of contact with the top of the wafer slices in the feeding conveyor.
In accordance with a further feature of the invention the upper conveying means of the delivering conveyor comprise a driven roller, which extends at right angles to the direction of conveyance and parallel to the plane of conveyance of the wafer slices in the delivering conveyor and which is provided, if desired, with an elastic covering. That arrangement ensures that each wafer slice will be engaged at its top and bottom at the same time by the delivering conveyor.
In accordance with a further feature of the inven tion the upper and lower conveying means of the delivering conveyor are provided at their receiving end with a roller which extends at right angles to the direction of conveyance and parallel to the plane of conveyance of the wafer slices in the delivering conveyor and which is provided, if desired, with an elastic covering, and said two driven rollers of the delivering conveyor constitute a pair of rollers for accelerating the wafer slices to said higher velocity. The accelerating rollers may rotate at a higher surface velocity than the remaining delivering conveyor so that a precise separation of wafer slices adhering at their adjoining faces will be ensured even if there is only a slight difference between the velocities of conveyance of the feeding and delivering conveyors.
The apparatus in accordance with the invention permits a precise separation of consecutive wafer slices conveyed at high speeds and will ensure an exact alignment of the wafer slices which are juxtaposed in a row. This result will not be charged even when wafer slices filled, e.g., with caramel, adhere strongly to each other at their adjoining faces.
Brief description of the drawing Figure 1 is a diagrammatic side elevation showing a first embodiment of apparatus in accordance with the invention.
Figure 2 is a side elevation showing a second embodiment.
Detailed description of the preferred embodiments Illustrative embodiments of the invention will now be described more in detail with reference to the drawing.
The apparatus in accordance with the invention can be described as a row-forming apparatus and is usually employed for handling filled wafer slices, each of which consists of two or more layers of wafer sheets and interposed filling material layers, consisting, e.g., of fat cream, caramel, marmelade or the like. Such wafer slices are made in wafer block slicers, in which wafer blocks filled with the filler composition are cut into wafer slices, which are discharged from such slicers in a plurality of juxtaposed lines, in which consecutive wafer slices abut at their trailing and leading faces, respectively.
In the embodiment shown in Figure 1, the apparatus in accordance with the invention comprises a feeding conveyor 1, a stop 2 succeeding that feeding conveyor, and a succeeding delivering conveyor 3.
The feeding conveyor 1 comprises lower conveying means 4, which preferably consist of a revolving conveyor belt, and upper conveying means 5, which are disposed above the lower conveying means 4 and comorise a roller 6, which is vertically displaceable relative to the lower conveying means 4 and extends parallel to the plane of conveyance and at right angles to the direction of conveyance of the lower conveying means 4. The roller 6 is preferably provided with an elastic covering 7 and from a position in which the roller 6 urges down the wafer slices lying on the lower conveying means 4 can be raised to a position in which the roller is clear of the top of the wafer slices.That roller 6 is suitably operatively coupled to the lower conveying means 4 in such a manner that the surface velocity of the roller is substantially as high as the velocity of conveyance of the lower conveying means 4.
The delivering conveyor 3 comprises upper conveying means 8 and lower conveying means 9 for engaging each wafer slice at its top and bottom, respectively. At its receiving end, the lower conveying means 9 comprise a lower driven roller 10, which extends at right angles to the direction of conveyance of the delivering conveyor 3 and which is succeeded by a e.g., of a conveyor belt which is trained around an edge at the rear end of its upper course. The upper conveying means 8 comprise an upper driven roller 12, which is parallel to the lower roller 10 and, if the lower conveyor belt 11 is trained around an edge at the rear end of its upper course, said upper conveying means 8 comprise a loose roller 13, which lower revolving conveyor belt 11, which consists succeeds the roller 12 and is disposed above the conveyor belt 11.Each of the lower and upper rollers 10 and 12 is provided with an elastic covering 14 or 15 and they rotate at the same surface velocity in mutually opposite senses. That surface velocity may be the same as that of the conveyor belt 11.
The lower and upper rollers 10 and 12 constitute a pair of accelerating rollers, by which each wafer slice is engaged at its top and bottom at the same time at its leading end and is pushed onto the conveyor belt 11. Thereafter the loose roller 13 disposed above the conveyor belt 11 engages the wafer slice at its top and urges the latter against the surface of the conveyor belt in order to increase the friction between the bottom of the wafer slice and the surface of the conveyor belt.
The stop 2 disposed between the feeding conveyor 1 and the delivering conveyor 3 is adapted to be lowered. The descent of the driven roller 6 of the feeding conveyor 1 and the descent of the stop 2 are so timed relative to each other that the driven roller 6 will be in contact with the surface of the wafer slices when the top edge of they stop 2 is moving below the plane of conveyance of the wafer slices in the feeding conveyor. The ascent of the driven roller 6 and the ascent of the stop 2 are so timed in relation to each other that the roller 6 will not disengage from the top of the wafer slices until the top edge of the stop 2 has moved above the plane of conveyance of the wafer slices in the feeding conveyor.
The rows are formed by that apparatus as follows: When wafer slices abutting at their adjacent end faces lie on the feeding conveyor 1 and the stop 2 is in an upper position, in which the top edge of the stop 2 is disposed above the plane of conveyance for the wafer slices in the feeding conveyor and in the path of conveyance of said wafer slices, and when the driven roller 6 of the upper conveying means 5 has been raised from the top of the wafer slices, the continuously revolving conveyor belt of the lower conveying means 4 will push the wafer slices against the stop 2. Thereafter the roller 6 and the stop 2 are lowered so that the roller 6 engages the top of the wafer slices before the top edge of the stop 2 has moved below the plane of conveyance for the wafer slices.The conveyance of the wafer slices at a velocity which corresponds to the surface velocity of the roller 6 and of the conveyor belt 4 is now resumed. As a result, that wafer slice which is the leading wafer slice in its line and at its leading end face had previously engaged the stop 2 is engaged by the pair of accelerating rollers 10, 12 of the delivering conveyor 3 and disengages the driven roller 6. The pair of accelerating rollers 10, 12 rotating at a higher surface velocity than the feeding conveyor 1 now pull the leading wafer slice in each line from the next succeeding wafer slice, which is now in engagement with the driven roller 6. Because the next succeeding wafer slice is gripped between the conveyor belt 4 and the roller 6, the leading wafer slice cannot pull said succeeding wafer slice along even if said wafer slices adhere to each other at their adjoining faces.Owing to the difference in velocity between the feeding conveyor 1 and the pair of accelerating rollers 10, 12, the leading wafer slice and the next succeeding wafer slice in each line will be separated by a space for receiving the stop 2 as it returns to its initial position. As soon as the trailing end of the leading wafer slice has moved beyond the lowered stop 2, that stop is raised until its top edge has moved above the plane of conveyance in the feeding conveyor. Thereafter the the driven roller 6 is raised from the top of the now leading wafer slice in the feeding conveyor 1 and said now leading wafer slice is pushed against the stop 2, which has returned to its initial position.The pair of accelerating rollers 10, 12 push the leading wafer slice in each line onto the conveyor belt 11, which revolves at the same surface velocity as the two rollers 10, 12. The juxtaposed leading wafer slices of all lines now form a row extending transversely to the direction of conveyance in the delivering conveyor. The formation of the next row is initiated in that the stop 2 and the driven roller 6 are lowered. The spacing of consecutive rows on the conveyor belt 11 will be determined by the interval of time between consecutive descents of the stop 2 and on the difference in velocity between the conveyor belt 4 and the pair of accelerating rollers 10, 12.
In the embodiment shown in Figure 1 the entire delivering conveyor 3 may be operated at a uniform velocity of conveyance, which extends the velocity of conveyance of the feeding conveyor 1, or the pair of accelerating rollers 10, 12 of the delivering conveyor 3 may be operated at a surface velocity which exceeds the velocity of conveyance of the feeding conveyor 1 whereas the conveyor belt 11 of the delivering conveyor is operated at a velocity which equals or exceeds the velocity of the feeding conveyor 1.The interval of time between consecutive descents of the stop 2 and any difference in velocity between the feeding conveyor 1 and the conveyor belt 11 may be selected so that the de sired spacing of successive rows will be obtained whereas the surface velocity of the two accelerat ing rollers 10, 12 can be selected so as to promote the separation of wafer slices which adhere to each -other at their adjoining end faces in consideration of the time required to lower and raise the stop.
In the illustrative embodiment shown in Figure 2, each of the lower and upper conveying means of the feeding conveyor 1 comprise a conveyor belt 16 or 17. The lower conveyor belt 16 revolves in a stationary frame 24. The upper conveyor belt 17 revolves in a frame 19, which is pivoted on an axis 18, which is parallel to the plane of conveyance of the lower conveyor belt 16 and parallel to the di rection of conveyance thereof. The delivering conveyor 3 comprises a lower conveyor belt 20 and an upper roller 22, which is disposed above the rear reversing roller 21 of the lower conveyor belt 20 and is provided with an elastic covering. The two conveyor belts 16 and 17 of the feeding conveyor 1 revolve at the same, relatively low velocity.The driven upper roller 22 and the lower belt conveyor 20 of the delivering conveyor 3 revolve at the same surface velocity, which is higher than that of the conveyor belts 16 and 17. In order to form a row of wafer slices, the stop 23 disposed between the feeding conveyor 1 and the delivering conveyor 3 is lowered and the upper conveyor belt 17 of the feeding conveyor 1 is swung down into engage ment with the top of the wafer slices, which lie on the lower conveyor belt 16 and abut at their ad joining trailing and leading faces. The wafer slices gripped between the two conveyor belts 16 and 17 are conveyed by said belts until the leading end of the leading wafer slice in each line has been moved beyond the lowered stop 23 and has been gripped by the delivering conveyor 3 between the driven upper roller 22 and the lower conveyor belt 20.Thereafter, the leading wafer slice is pulled from the next succeeding one and when the trail ing end of the leading wafer slice has moved past the stop the latter is raised into the space formed between the leading wafer slice and the next suc ceeding wafer slice. As soon as the top edge of the stop 23 has moved above the plane of conveyance for the wafer slices the upper conveyor belt 17 of the feeding conveyor 1 is raised from the top of the wafer slices and the latter are pushed against the stop 23 by the lower conveyor belt 16.
It will be understood that the feeding conveyor of the illustrative embodiment shown in Figure 1 can be combined with the delivering conveyor of the illustrative embodiment shown in Figure 2 and that the delivering conveyor shown in Figure 1 can be combined with the feeding conveyor shown in Figure 2.
The stop and the upper conveying means of the feeding conveyor are preferably pneumatically actuated although it will be understood that parts can also be actuated by other means, such as cam mechanisms or the like. Finally, all conveyor belts may be replaced by parallel round belts if this is permitted by the dimensions of the wafer slices.
It will be understood that the concept of the in vention for forming a line of spaced apart wafer slices from wafer slices arranged in a tine in which consecutive wafer stices abut at-th & r trailin'g and leading faces, respectively, and that at least part of the adventages afforded by the invention as de scribed hereinbefore will he afforded also by such apparatus.

Claims (10)

  1. Apparatus for arranging wafer slices in spaced apart rows; wherein said wafer slices are fed in a plurality of juxtaposed lines, in which con secutive wafer slices in each line abut and possibly adhere to each other at their trailing and leading faces, respectively, which apparatus comprises a feeding-conveyor for conveying said wafer slices in said lines with abutting trailing and leading faces into~ engagement with a stop, which is movable out of the påth of said wafer slices, preferably in a downward direction, which feeding conveyor is op erable to transfer said wafer slices to a succeeding delivering conveyor past said stop when said stop has been removed from said path, said delivering conveyor being operable at least adjacent to said stop at a higher velocity than said feeding con veyor, characterized in that the feeding conveyor an#d the delivering conveyor each comprise lower conveying means for carrying the wafer slices and upper conveying means for at least temporarily en gaging the wafer slices at their top and the upper conveying means of the feeding conveyor are movable in height relative to the lower conveying means of the feeding conveyor into and out of en gagement with the wafer slices on said lower con veying me#ans of said feeding conveyor.
    #
  2. 2. Apparatus according to claim 1, characterized in-that-the upper conveying means of the feeding conveyor comprise a driven roller, which extends at rig#ht angles to the direction of conveyance and parallel to the plane of conveyance of the wafer slices in the feeding conveyor and is adapted to be lowered into and raised out of engagement with the top of the wafer slices on the feeding con veyor, and is provided, if desired, with an elastic covering.
  3. 3. Apparatus according to claim 2, characterized in that the driven roller and the stop which is mov able out of the path of the wafer slices are adapted to be raised and lowered in unison with each other.
  4. 4. Apparatus according to claim 1, characterized in that the upper conveying means of the feeding conveyor comprise a revolving conveyor belt, which is pivoted on an axis that is parallel to the plane of conveyance and at right angles to the di rection of conveyance of the wafer slices in the feeding conveyor.
  5. 5. Apparatus according'to claim 1, characterized in that the upper conveying means of the delivery ing# conveyor comprise a. driven roller, which ex tends at right angles to the direction of conveyance and parallel to the plane of conveyance of the wafer slices in the delivering conveyor and which is provided, if desired, with an elastic covering.
  6. 6. Apparatus according to claim 1, characterized in that the upper and lower conveying means of the delivering conveyor are provided at their re- ceiving end with a roller which-axtends- at right an;; gle#s to the d'ir'6cti6n"tf-"c'onv-ey'ance and parallel to the plane of' con\i'eV'a#n'ce' of the~wafer slices in the delivering conveyor and which is provided, if de- sired, with an elastic covering, and said two driven rollers of the delivering conveyor constitute a pair of rollers for accelerating the wafer slices to said higher velocity.
  7. 7. Apparatus according to claim 1 or any of~ claims 2 to 4 and claim 5 or claim 6, characterized in that the distance between the forward end of the region in which the upper conveying means, or the driven roller thereof, of the feeding conveyor are engageable with the wafer slices and the.trailing end of the region in which the upper conveying means, or driven roller thereof, of the delivering conveyor are engageable with the wafer slices is at least as large as the extent of each wafer slice in the direction of conveyance.
  8. 8. Apparatus according to claim 1 or any of claims 2 to 4 and claim 5 or claim 6, characterized in that the distance between the forward end of the region in which upper conveying means, or the driven roller, thereof, of the feeding conveyor and the stop is at least as large as or larger than the distance between the stop and the rear end of the region in which the upper conveying means, or the driven roller thereof, of the delivering conveyer are engageable with the wafer slices.
  9. 9. Apparatus for arranging wafer slices in a line, in which they are spaced apart, wherein said wafer slices are fed in a line, in which consecutive wafer slices abut and possibly adhere to each other at their trailing and leading faces, respectively, which apparatus comprises a feeding conveyor for conveying said wafer slices in said lines line with abutting trailing and leading faces into engagement with a stop, which is movable out of the path of said wafer slices, preferably in a downward direction, which feeding conveyor is operable to transfer said wafer slices to a succeeding deliv ering conveyor past said stop when said stop has been removed from said path, said delivering con veyor being operable at least adjacent to said stop at a higher velocity than said feeding conveyor, characterized in that the feeding conveyor and the delivering conveyor each comprise lower convey ing means for carrying the wafer slices and upper conveying means for at least temporarily engaging the wafer slices at their top and the upper convey ing means of-the feeding conveyor are movable in height relative to the lower conveying means of the'feeding conveyor into and out of engagement with the wafer slices on said fower coveying- means of said feeding conveyor.
  10. 10. Apparatus for arranging wafer slices in spaced apart rows in a line, on which they åre.
    spaced apart,substantially as described hereinbe- fore with' reference to aind as shown -dn:the draw ing. ' " -.- -,-
GB08504085A 1984-02-20 1985-02-18 Apparatus for arranging wafer slices in spaced apart rows or in a line, in which said wafer slices are spaced apart Expired GB2155426B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
AT55884A AT383942B (en) 1984-02-20 1984-02-20 DEVICE FOR FORMING FOLLOWED FOLLOWING ROWS OF FILLED WAFFLE CUTS TRANSPORTED FROM ABOVE

Publications (3)

Publication Number Publication Date
GB8504085D0 GB8504085D0 (en) 1985-03-20
GB2155426A true GB2155426A (en) 1985-09-25
GB2155426B GB2155426B (en) 1987-04-29

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Application Number Title Priority Date Filing Date
GB08504085A Expired GB2155426B (en) 1984-02-20 1985-02-18 Apparatus for arranging wafer slices in spaced apart rows or in a line, in which said wafer slices are spaced apart

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AT (1) AT383942B (en)
DE (1) DE3505597C2 (en)
GB (1) GB2155426B (en)

Cited By (5)

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Publication number Priority date Publication date Assignee Title
US5287954A (en) * 1991-06-21 1994-02-22 G.D Societa' Per Azioni Device for equally-spaced in-line transportation of randomly arranged incoming products
EP0837015A1 (en) * 1996-10-18 1998-04-22 Dimac S.P.A. Device for feeding selected groups of products
EP1161870A1 (en) * 2000-06-06 2001-12-12 Danmatic, automated Bakery Systems A/S Separation of baked breads
EP1847488A1 (en) * 2006-04-21 2007-10-24 Costi S.r.l. An ordering machine
WO2010009865A1 (en) * 2008-07-24 2010-01-28 Stangl Semiconductor Equipment Ag Device and method for processing and handling process products

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Publication number Priority date Publication date Assignee Title
DE19539844C2 (en) * 1995-10-26 2000-10-12 Krups Gmbh Method and device for transporting workpiece carriers on conveyor tracks between work stations
DE19617279A1 (en) * 1996-04-30 1997-11-06 Linnemann Alfons Dipl Ing Fh Vending machine for crates of beverages
DE19840448A1 (en) * 1998-09-04 2000-03-16 Crown Simplimatic Maschinentec Separation arrangement with separating rollers and movable stop element for drinks industry has delivery mechanism, transport arrangement with driven roller and/or output roller path
CN108263845A (en) * 2018-01-18 2018-07-10 玉田县炬兴印刷包装机械制造有限公司 A kind of conveying mechanism and tipper

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US1860491A (en) * 1929-02-19 1932-05-31 Arthur E Burtchaell Facing and stacking machine
GB500296A (en) * 1937-08-07 1939-02-07 T And T Vicars Ltd Improvements in conveying arrangements
DE1532917A1 (en) * 1967-06-16 1970-02-19 Kooperativa Foerbundet Ekenomi Device for separating bread that is sticking together
SE308269B (en) * 1968-07-01 1969-02-03 Ytong Ab
JPS5115318B2 (en) * 1971-09-09 1976-05-15
US3827545A (en) * 1972-12-04 1974-08-06 Scott Paper Co Method and apparatus for changing the spacing between discrete, flexible web product
DE2340221A1 (en) * 1973-08-08 1975-02-20 Debag Deutsche Backofenbau Pivotable release roll - for use in the transfer of "tacky" dough pieces from one conveyor belt to another
SE417939B (en) * 1978-05-05 1981-04-27 Arenco Match Machinery Ab SET FOR ASTAD COMMISSION OF REORIORATION OF FORMALS IN A CONSEQUENCE OF ANY FOLLOWING FORMALS AND DEVICE FOR IMPLEMENTATION OF THE SET
FR2430382A1 (en) * 1978-07-04 1980-02-01 Ouest Ets Generaux Meca DEVICES FOR FOLDING CREPES OR THE LIKE
NL172429C (en) * 1978-09-21 1983-09-01 Tevopharm Schiedam Bv Apparatus for supplying objects between the members of a towed conveyor.

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5287954A (en) * 1991-06-21 1994-02-22 G.D Societa' Per Azioni Device for equally-spaced in-line transportation of randomly arranged incoming products
EP0837015A1 (en) * 1996-10-18 1998-04-22 Dimac S.P.A. Device for feeding selected groups of products
EP1161870A1 (en) * 2000-06-06 2001-12-12 Danmatic, automated Bakery Systems A/S Separation of baked breads
EP1847488A1 (en) * 2006-04-21 2007-10-24 Costi S.r.l. An ordering machine
WO2010009865A1 (en) * 2008-07-24 2010-01-28 Stangl Semiconductor Equipment Ag Device and method for processing and handling process products

Also Published As

Publication number Publication date
DE3505597C2 (en) 1996-03-14
GB8504085D0 (en) 1985-03-20
GB2155426B (en) 1987-04-29
AT383942B (en) 1987-09-10
ATA55884A (en) 1987-02-15
DE3505597A1 (en) 1985-08-22

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