GB2145284B - Processes for applying a semiconductor material to a substrate - Google Patents

Processes for applying a semiconductor material to a substrate

Info

Publication number
GB2145284B
GB2145284B GB08420903A GB8420903A GB2145284B GB 2145284 B GB2145284 B GB 2145284B GB 08420903 A GB08420903 A GB 08420903A GB 8420903 A GB8420903 A GB 8420903A GB 2145284 B GB2145284 B GB 2145284B
Authority
GB
United Kingdom
Prior art keywords
processes
applying
substrate
semiconductor material
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB08420903A
Other versions
GB2145284A (en
GB8420903D0 (en
Inventor
Peter William Fry
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
IMO Industries Inc
Original Assignee
Transamerica DeLaval Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Transamerica DeLaval Inc filed Critical Transamerica DeLaval Inc
Publication of GB8420903D0 publication Critical patent/GB8420903D0/en
Publication of GB2145284A publication Critical patent/GB2145284A/en
Application granted granted Critical
Publication of GB2145284B publication Critical patent/GB2145284B/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02367—Substrates
    • H01L21/0237—Materials
    • H01L21/02373—Group 14 semiconducting materials
    • H01L21/02381—Silicon, silicon germanium, germanium
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02367—Substrates
    • H01L21/0237—Materials
    • H01L21/02425—Conductive materials, e.g. metallic silicides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02518—Deposited layers
    • H01L21/02521—Materials
    • H01L21/02524—Group 14 semiconducting materials
    • H01L21/02532—Silicon, silicon germanium, germanium
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02612—Formation types
    • H01L21/02617—Deposition types
    • H01L21/0262—Reduction or decomposition of gaseous compounds, e.g. CVD
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104—Forming layers
    • H01L21/02365—Forming inorganic semiconducting materials on a substrate
    • H01L21/02612—Formation types
    • H01L21/02617—Deposition types
    • H01L21/02636—Selective deposition, e.g. simultaneous growth of mono- and non-monocrystalline semiconductor materials
    • H01L21/02639—Preparation of substrate for selective deposition

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Measuring Fluid Pressure (AREA)
  • Pressure Sensors (AREA)
GB08420903A 1983-08-18 1984-08-17 Processes for applying a semiconductor material to a substrate Expired GB2145284B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB838322273A GB8322273D0 (en) 1983-08-18 1983-08-18 Applying semiconductor material to substrate

Publications (3)

Publication Number Publication Date
GB8420903D0 GB8420903D0 (en) 1984-09-19
GB2145284A GB2145284A (en) 1985-03-20
GB2145284B true GB2145284B (en) 1987-05-28

Family

ID=10547502

Family Applications (2)

Application Number Title Priority Date Filing Date
GB838322273A Pending GB8322273D0 (en) 1983-08-18 1983-08-18 Applying semiconductor material to substrate
GB08420903A Expired GB2145284B (en) 1983-08-18 1984-08-17 Processes for applying a semiconductor material to a substrate

Family Applications Before (1)

Application Number Title Priority Date Filing Date
GB838322273A Pending GB8322273D0 (en) 1983-08-18 1983-08-18 Applying semiconductor material to substrate

Country Status (5)

Country Link
DE (1) DE3430379A1 (en)
FR (1) FR2550885A1 (en)
GB (2) GB8322273D0 (en)
IT (1) IT1175603B (en)
NL (1) NL8402533A (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19645083C2 (en) * 1996-11-01 2000-01-27 Austria Card Gmbh Wien Contactless chip card with transponder coil
US8044472B2 (en) 2003-03-25 2011-10-25 Kulite Semiconductor Products, Inc. Nanotube and graphene semiconductor structures with varying electrical properties

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1465112A1 (en) * 1963-10-04 1969-01-23 Anritsu Electric Company Ltd Semiconductor layers deposited in a vacuum for elasto resistance elements
GB1244551A (en) * 1969-02-28 1971-09-02 British Aircraft Corp Ltd Improvements relating to acoustic detector arrays
US3673354A (en) * 1969-05-08 1972-06-27 Matsushita Electric Ind Co Ltd Semiconductor stress transducer
JPS5438491B1 (en) * 1969-09-22 1979-11-21
US3805601A (en) * 1972-07-28 1974-04-23 Bell & Howell Co High sensitivity semiconductor strain gauge

Also Published As

Publication number Publication date
IT8422345A0 (en) 1984-08-17
GB2145284A (en) 1985-03-20
IT1175603B (en) 1987-07-15
FR2550885A1 (en) 1985-02-22
DE3430379A1 (en) 1985-03-07
NL8402533A (en) 1985-03-18
GB8322273D0 (en) 1983-09-21
GB8420903D0 (en) 1984-09-19

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee