GB2106346A - Improvements in or relating to piezoelectric transducers - Google Patents
Improvements in or relating to piezoelectric transducers Download PDFInfo
- Publication number
- GB2106346A GB2106346A GB08124990A GB8124990A GB2106346A GB 2106346 A GB2106346 A GB 2106346A GB 08124990 A GB08124990 A GB 08124990A GB 8124990 A GB8124990 A GB 8124990A GB 2106346 A GB2106346 A GB 2106346A
- Authority
- GB
- United Kingdom
- Prior art keywords
- grooves
- substrate
- piezoelectric transducer
- piezoelectric
- electrodes
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000758 substrate Substances 0.000 claims abstract description 25
- 229910052751 metal Inorganic materials 0.000 claims description 7
- 239000002184 metal Substances 0.000 claims description 7
- 238000000576 coating method Methods 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 6
- 239000013078 crystal Substances 0.000 claims description 5
- 238000000034 method Methods 0.000 claims description 5
- 238000005530 etching Methods 0.000 claims description 3
- 238000010897 surface acoustic wave method Methods 0.000 abstract description 3
- 239000004411 aluminium Substances 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 229910003327 LiNbO3 Inorganic materials 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
- B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
- B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
- B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
- B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
- B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
- B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface
- B06B1/0629—Square array
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02535—Details of surface acoustic wave devices
- H03H9/02637—Details concerning reflective or coupling arrays
- H03H9/02653—Grooves or arrays buried in the substrate
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/125—Driving means, e.g. electrodes, coils
- H03H9/145—Driving means, e.g. electrodes, coils for networks using surface acoustic waves
- H03H9/14544—Transducers of particular shape or position
Landscapes
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Abstract
A transducer comprises a piezoelectric substrate 14 whose upper surface is provided with a plurality of grooves 16, opposite polarity electrodes being formed either on the side surfaces of the grooves 18, 20 (fig. 11) or in the bases 28 of the grooves and on the surfaces 26 of the substrate between the grooves (fig. 13). When an alternating signal is applied to the electrodes alternating stresses are set up in the ridges between the grooves and bulk acoustic waves are launched into the substrate from the grooves. Surface acoustic waves may also be produced depending on the groove geometry. The arrangement is particularly suitable for high frequency signals and applications include high frequency volume wave delay lines, acousto-optic signal processing such as light beam deflection. <IMAGE>
Description
SPECIFICATION
Improvements in or relating to piezoelectric transducers
This invention relates to piezoelectric transducers and more particularly to a piezoelectric transducer having an improved method of launching acoustic waves into the material of the transducer.
In conventional piezoelectric transducers it is usual practice to launch acoustic waves into a crystal using metal layers formed on each side of a piezoelectric material which is then bonded to a crystal. The layers and the bonding can both cause matching problems and it is an object of the present invention therefore to provide a piezoelectric transducer in which these matching problems are reduced or eliminated.
According to the present invention a piezoelectric transducer comprises a piezoelectric substrate having an appropriate crystal cut, at least a portion of its surface being provided with a plurality of grooves, electrodes being formed in and/or adjacent to the grooves in such a manner that when a signal is applied to the electrodes acoustic waves are launched into the substrate from the grooves.
Preferably the grooves are parallel sided with walls perpendicular to the surface of the substrate although slightly sloping walls may be used.
The electrodes may comprise metal coatings formed on the walls of each groove or they may be formed aiternately in the bases of the grooves and on the surfaces of the substrate between the grooves.
The invention also comprises a method of making a piezoelectric transducer comprising the steps of etching a plurality of grooves in at least a portion of the surface of a piezoelectric substrate and forming electrodes in and/or adjacent to the grooves.
Embodiments of the invention will now be described by way of example only with reference to the accompanying drawings in which
Figure 1 is a pictorial view of a portion of a piezoelectric transducer made in accordance with the present invention,
Figures 2 to 9 are cross-sectional views of a piezoelectric transducer illustrating the steps in one method of forming the grooves and electrodes,
Figure 10 is a cross-sectional view of the completed transducer along line 10-10 on
Figure 1,
Figure 11 is a cross-sectiona view along line 11-11 on Figure 1,
Figure 12 is a cross-sectional view along line 12-12 on Figure 1 and
Figure 13 is a cross-sectional view of a transducer with an alternative arrangement of electrodes.
As shown in Figure 1 the piezoelectric transducer comprises a piezoelectric substrate 14, which may conveniently be LiNbO3 or any other piezoelectric material, on a surface of which are formed a number of parallel sided grooves 1 6.
Although only three grooves are shown it will be appreciated that many such grooves can be formed because of the very small size of the grooves (a few microns only in width). Along each side of the grooves is formed an electrode 1 8 and 20 by depositing or evaporating a metal such as aluminium thereon, the electrodes on opposite sides of each groove being connected to separate connection pads 22 and 24.
When an alternating signal is applied to the connection pads 22 and 24 alternating stresses are set up in the ridges between the grooves and bulk acoustic waves are launched into the substrate from the grooves. Surface acoustic waves may also be produced depending on the groove geometry. The arrangement is particularly suitable for high frequency signals and applications include high frequency volume wave delay lines, acousto-optic signal processing such as light beam deflection and any application for which conventional acoustic wave devices are used but particularly allowing extension to higher frequencies.
Depending of the ratio of ridge width to height, and the method of electrode connection and drive, acoustic beam steering is also possible. This should allow similar flexibility of design for high frequency bulk wave acousto-optic processors as is presently possible for surface acoustic wave guided optical wave processors.
A different embodiment is illustrated in crosssection in Figure 13 in which electrodes 26 and 28 of opposite polarity are formed on the surface of the substrate 14 between the grooves 1 6 and on the bases of the grooves. The device operates in substantially the same manner as that shown in
Figure 1.
One method of manufacturing the transducer is to coat a surface of the piezoelectric substrate 14 with a layer of resist material 30 (Figure 2), mask the surface with a suitable groove pattern and subject the substrate to which milling to produce grooves 16 are approximately equal to half the acoustic wavelength in depth (e.g. for LiNbO3 at 600 MHz the groove depth would be about 4 microns. (Figure 3). The resist 30 is now removed (Figure 4), and the surface of the substrate 14 with the grooves 1 6 is coated with a layer of aluminium 32 by deposition or evaporation at suitable angles to ensure that the sides of the grooves are coated (Figure 5).Another layer of resist 34 is applied over the aluminium coating 32 (Figure 6), a mask 36 having the connector pad pattern is placed over the resist 34 and the substrate is exposed and developed to produce the result shown in Figure 7. The mask 36 is removed and a further layer 38 of aluminium applied (Figure 8). Finally, the layer of resist 34 is floated off (Figure 9) and surplus aluminium is removed by a further ion mill. The completed groove and electrode pattern is shown in crosssection in Figures 10, 11 and 12 illustrating the electrodes 18, 20 and the connecting pads 22 and 24 at one end of the grooves, at the centre of the grooves and at the other end of the grooves 1 6 respectively.
The transducer has a number of advantages over existing methods of launching acoustic waves in a piezoelectric material including no layer bonding, with no matching problems, and no top electrode in the conventional sense, with no mass loading.
Claims (Filed 13 Aug 1982)
1. A piezoelectric transducer comprising a piezoelectric substrate having an appropriate crystal cut, at least a portion of its surface being provided with a plurality of grooves, electrodes being formed in and/or adjacent to the grooves in such a manner that when a signal is applied to the electrodes acoustic waves are launched into the substrate from the grooves.
2. A piezoelectric transducer claimed in claim 1 in which the grooves are parallel sided with walls perpendicular to the surface of the substrate.
3. A piezoelectric transducer as claimed in claim 1 in which the grooves have slightly sloping walls.
4. A piezoelectric transducer as claimed in any preceding claim in which the electrodes comprise metal coatings formed on the walls of each groove.
5. A piezoelectric transducer as claimed in any of claims 1 to 3 in which the electrodes comprise metal coatings formed alternately in the bases of the grooves and on the surfaces of the substrate between the grooves.
6. A method of making a piezoelectric transducer comprising the steps of etching a plurality of grooves in at least a portion of the surface of a piezoelectric substrate and forming electrodes in and/or adjacent to the grooves.
7. A piezoelectric transducer constructed and adapted to operate substantially as hereinbefore described with reference to Figures 1 to 12 or 13 of the accompanying drawings.
8. A method of making a piezoelectric transducer substantially as hereinbefore described with reference to Figures 1 to 12 or 1 3 of the accompanying drawings.
**WARNING** end of DESC field may overlap start of CLMS **.
Claims (8)
1. A piezoelectric transducer comprising a piezoelectric substrate having an appropriate crystal cut, at least a portion of its surface being provided with a plurality of grooves, electrodes being formed in and/or adjacent to the grooves in such a manner that when a signal is applied to the electrodes acoustic waves are launched into the substrate from the grooves.
2. A piezoelectric transducer claimed in claim 1 in which the grooves are parallel sided with walls perpendicular to the surface of the substrate.
3. A piezoelectric transducer as claimed in claim 1 in which the grooves have slightly sloping walls.
4. A piezoelectric transducer as claimed in any preceding claim in which the electrodes comprise metal coatings formed on the walls of each groove.
5. A piezoelectric transducer as claimed in any of claims 1 to 3 in which the electrodes comprise metal coatings formed alternately in the bases of the grooves and on the surfaces of the substrate between the grooves.
6. A method of making a piezoelectric transducer comprising the steps of etching a plurality of grooves in at least a portion of the surface of a piezoelectric substrate and forming electrodes in and/or adjacent to the grooves.
7. A piezoelectric transducer constructed and adapted to operate substantially as hereinbefore described with reference to Figures 1 to 12 or 13 of the accompanying drawings.
8. A method of making a piezoelectric transducer substantially as hereinbefore described with reference to Figures 1 to 12 or 1 3 of the accompanying drawings.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB08124990A GB2106346B (en) | 1981-08-15 | 1981-08-15 | Improvements in or relating to piezoelectric transducers |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB08124990A GB2106346B (en) | 1981-08-15 | 1981-08-15 | Improvements in or relating to piezoelectric transducers |
Publications (2)
Publication Number | Publication Date |
---|---|
GB2106346A true GB2106346A (en) | 1983-04-07 |
GB2106346B GB2106346B (en) | 1985-07-31 |
Family
ID=10523973
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB08124990A Expired GB2106346B (en) | 1981-08-15 | 1981-08-15 | Improvements in or relating to piezoelectric transducers |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB2106346B (en) |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5815054A (en) * | 1997-05-27 | 1998-09-29 | Motorola Inc. | Surface micromachined acoustic wave piezoelectric crystal with electrodes on raised ridges and in spaces therebetween |
US6414414B1 (en) * | 1998-05-29 | 2002-07-02 | Thomson-Csf | Unidirectional transducer etched with surface acoustic waves |
US6465930B1 (en) * | 1998-05-29 | 2002-10-15 | Thomson-Csf | Transducer with surface acoustic waves with low gap |
EP1456946A1 (en) * | 2001-12-17 | 2004-09-15 | Intel Corporation | Film bulk acoustic resonator structure and method of producing it |
US6822535B2 (en) * | 2001-12-17 | 2004-11-23 | Intel Corporation | Film bulk acoustic resonator structure and method of making |
CN111316566A (en) * | 2017-11-15 | 2020-06-19 | 华为技术有限公司 | Surface acoustic wave device |
-
1981
- 1981-08-15 GB GB08124990A patent/GB2106346B/en not_active Expired
Cited By (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5815054A (en) * | 1997-05-27 | 1998-09-29 | Motorola Inc. | Surface micromachined acoustic wave piezoelectric crystal with electrodes on raised ridges and in spaces therebetween |
WO1998054836A1 (en) * | 1997-05-27 | 1998-12-03 | Cts Corporation | Surface micromachined acoustic wave piezoelectric crystal |
US6414414B1 (en) * | 1998-05-29 | 2002-07-02 | Thomson-Csf | Unidirectional transducer etched with surface acoustic waves |
US6465930B1 (en) * | 1998-05-29 | 2002-10-15 | Thomson-Csf | Transducer with surface acoustic waves with low gap |
EP1456946A1 (en) * | 2001-12-17 | 2004-09-15 | Intel Corporation | Film bulk acoustic resonator structure and method of producing it |
US6822535B2 (en) * | 2001-12-17 | 2004-11-23 | Intel Corporation | Film bulk acoustic resonator structure and method of making |
US7154358B2 (en) | 2001-12-17 | 2006-12-26 | Intel Corporation | Film bulk acoustic resonator structure and method of making |
CN1620752B (en) * | 2001-12-17 | 2011-06-22 | 英特尔公司 | Film bulk acoustic resonator structure and method of making |
CN111316566A (en) * | 2017-11-15 | 2020-06-19 | 华为技术有限公司 | Surface acoustic wave device |
US11316495B2 (en) | 2017-11-15 | 2022-04-26 | Huawei Technologies Co., Ltd. | Surface acoustic wave device |
Also Published As
Publication number | Publication date |
---|---|
GB2106346B (en) | 1985-07-31 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4692654A (en) | Ultrasonic transducer of monolithic array type | |
US4616152A (en) | Piezoelectric ultrasonic probe using an epoxy resin and iron carbonyl acoustic matching layer | |
EP0210723B1 (en) | Ultrasonic probe | |
US4686408A (en) | Curvilinear array of ultrasonic transducers | |
US4130813A (en) | Surface wave device having enhanced reflectivity gratings | |
US4485321A (en) | Broad bandwidth composite transducers | |
US5706820A (en) | Ultrasonic transducer with reduced elevation sidelobes and method for the manufacture thereof | |
KR102569596B1 (en) | high frequency ultrasonic transducers | |
US4296348A (en) | Interdigitated electrode ultrasonic transducer | |
GB2106346A (en) | Improvements in or relating to piezoelectric transducers | |
EP0100275B1 (en) | Trihedron-shaped deformable reflectors | |
US20190366384A1 (en) | Ultrasound transducer with curved transducer stack | |
US8269400B2 (en) | Ultrasonic transducer, ultrasonic diagnosis apparatus using the same, and ultrasonic flaw inspection apparatus using the same | |
US4409570A (en) | Separated substrate acoustic wave device | |
US4908543A (en) | Acoustic transducer | |
US5122898A (en) | Acousto-optical deflector | |
US20030015944A1 (en) | Co-fired piezo driver and method of making for a ring laser gyroscope | |
JPH05299969A (en) | Surface acoustic wave filter device | |
US4614919A (en) | Magnetostatic wave frequency analyzer apparatus | |
US4151492A (en) | Surface acoustic wave grating | |
JPS5931246B2 (en) | Hyomen Hasoshi | |
JPS583215B2 (en) | Onkiyo Kougakoshi no Seizouhou | |
JPS60235600A (en) | Ultrasonic wave probe and its manufacture | |
JPS6352486B2 (en) | ||
JPS6210411B2 (en) |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PCNP | Patent ceased through non-payment of renewal fee |