GB2102431A - Silamine compositions for curing epoxide resins - Google Patents
Silamine compositions for curing epoxide resins Download PDFInfo
- Publication number
- GB2102431A GB2102431A GB08218473A GB8218473A GB2102431A GB 2102431 A GB2102431 A GB 2102431A GB 08218473 A GB08218473 A GB 08218473A GB 8218473 A GB8218473 A GB 8218473A GB 2102431 A GB2102431 A GB 2102431A
- Authority
- GB
- United Kingdom
- Prior art keywords
- compositions
- silamine
- acid
- phenol
- compositions according
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 82
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 54
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 claims abstract description 28
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 19
- 150000001412 amines Chemical class 0.000 claims abstract description 12
- 125000003118 aryl group Chemical group 0.000 claims abstract description 10
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 9
- 125000001931 aliphatic group Chemical group 0.000 claims abstract description 8
- 150000007524 organic acids Chemical class 0.000 claims abstract description 7
- 125000002924 primary amino group Chemical group [H]N([H])* 0.000 claims abstract description 6
- 239000003822 epoxy resin Substances 0.000 claims description 35
- 239000001257 hydrogen Substances 0.000 claims description 28
- 229910052739 hydrogen Inorganic materials 0.000 claims description 28
- -1 ethylene, hexamethylene, trimethylhexamethylene, xylylene Chemical group 0.000 claims description 22
- 239000002253 acid Substances 0.000 claims description 15
- 125000004432 carbon atom Chemical group C* 0.000 claims description 10
- ATUOYWHBWRKTHZ-UHFFFAOYSA-N Propane Chemical compound CCC ATUOYWHBWRKTHZ-UHFFFAOYSA-N 0.000 claims description 8
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 claims description 8
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 claims description 8
- 238000000034 method Methods 0.000 claims description 8
- 150000002989 phenols Chemical class 0.000 claims description 8
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 claims description 6
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 claims description 6
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 6
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 claims description 6
- MLIREBYILWEBDM-UHFFFAOYSA-N cyanoacetic acid Chemical compound OC(=O)CC#N MLIREBYILWEBDM-UHFFFAOYSA-N 0.000 claims description 5
- 150000002148 esters Chemical class 0.000 claims description 5
- 125000004956 cyclohexylene group Chemical group 0.000 claims description 4
- 239000001294 propane Substances 0.000 claims description 4
- NLZUEZXRPGMBCV-UHFFFAOYSA-N Butylhydroxytoluene Chemical compound CC1=CC(C(C)(C)C)=C(O)C(C(C)(C)C)=C1 NLZUEZXRPGMBCV-UHFFFAOYSA-N 0.000 claims description 3
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 3
- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 claims description 3
- 125000001174 sulfone group Chemical group 0.000 claims description 3
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 claims description 2
- 125000005843 halogen group Chemical group 0.000 claims description 2
- ARCGXLSVLAOJQL-UHFFFAOYSA-N trimellitic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 claims 2
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 claims 1
- 239000007788 liquid Substances 0.000 abstract description 8
- YGSDEFSMJLZEOE-UHFFFAOYSA-N salicylic acid Chemical compound OC(=O)C1=CC=CC=C1O YGSDEFSMJLZEOE-UHFFFAOYSA-N 0.000 description 22
- 150000002118 epoxides Chemical group 0.000 description 17
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 15
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 15
- IJOOHPMOJXWVHK-UHFFFAOYSA-N chlorotrimethylsilane Chemical compound C[Si](C)(C)Cl IJOOHPMOJXWVHK-UHFFFAOYSA-N 0.000 description 13
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 12
- FJKROLUGYXJWQN-UHFFFAOYSA-N papa-hydroxy-benzoic acid Natural products OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 11
- 239000000047 product Substances 0.000 description 11
- 229960004889 salicylic acid Drugs 0.000 description 11
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 9
- 238000006243 chemical reaction Methods 0.000 description 9
- 238000003860 storage Methods 0.000 description 7
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 6
- 150000007513 acids Chemical class 0.000 description 6
- 239000003795 chemical substances by application Substances 0.000 description 6
- DCFKHNIGBAHNSS-UHFFFAOYSA-N chloro(triethyl)silane Chemical compound CC[Si](Cl)(CC)CC DCFKHNIGBAHNSS-UHFFFAOYSA-N 0.000 description 6
- 150000001875 compounds Chemical class 0.000 description 6
- 239000011521 glass Substances 0.000 description 6
- 229920005989 resin Polymers 0.000 description 6
- 239000011347 resin Substances 0.000 description 6
- 239000005051 trimethylchlorosilane Substances 0.000 description 6
- YBRVSVVVWCFQMG-UHFFFAOYSA-N 4,4'-diaminodiphenylmethane Chemical compound C1=CC(N)=CC=C1CC1=CC=C(N)C=C1 YBRVSVVVWCFQMG-UHFFFAOYSA-N 0.000 description 5
- 238000010992 reflux Methods 0.000 description 5
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 4
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 4
- 150000002170 ethers Chemical class 0.000 description 4
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 4
- 229910052757 nitrogen Inorganic materials 0.000 description 4
- 238000003756 stirring Methods 0.000 description 4
- ZOVIVPPZCMSLMJ-IHWYPQMZSA-N (z)-4-(2-methoxyethoxy)-4-oxobut-2-enoic acid Chemical compound COCCOC(=O)\C=C/C(O)=O ZOVIVPPZCMSLMJ-IHWYPQMZSA-N 0.000 description 3
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 3
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 3
- BRLQWZUYTZBJKN-UHFFFAOYSA-N Epichlorohydrin Chemical compound ClCC1CO1 BRLQWZUYTZBJKN-UHFFFAOYSA-N 0.000 description 3
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical group O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 3
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- 229910021529 ammonia Inorganic materials 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 150000002334 glycols Chemical class 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- WZCQRUWWHSTZEM-UHFFFAOYSA-N 1,3-phenylenediamine Chemical compound NC1=CC=CC(N)=C1 WZCQRUWWHSTZEM-UHFFFAOYSA-N 0.000 description 2
- RNLHGQLZWXBQNY-UHFFFAOYSA-N 3-(aminomethyl)-3,5,5-trimethylcyclohexan-1-amine Chemical compound CC1(C)CC(N)CC(C)(CN)C1 RNLHGQLZWXBQNY-UHFFFAOYSA-N 0.000 description 2
- VVJKKWFAADXIJK-UHFFFAOYSA-N Allylamine Chemical compound NCC=C VVJKKWFAADXIJK-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- QUSNBJAOOMFDIB-UHFFFAOYSA-N Ethylamine Chemical compound CCN QUSNBJAOOMFDIB-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- BAVYZALUXZFZLV-UHFFFAOYSA-N Methylamine Chemical compound NC BAVYZALUXZFZLV-UHFFFAOYSA-N 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 2
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical compound C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- FDLQZKYLHJJBHD-UHFFFAOYSA-N [3-(aminomethyl)phenyl]methanamine Chemical compound NCC1=CC=CC(CN)=C1 FDLQZKYLHJJBHD-UHFFFAOYSA-N 0.000 description 2
- 239000001361 adipic acid Substances 0.000 description 2
- 235000011037 adipic acid Nutrition 0.000 description 2
- 150000001298 alcohols Chemical class 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- 125000004429 atom Chemical group 0.000 description 2
- WGQKYBSKWIADBV-UHFFFAOYSA-N benzylamine Chemical compound NCC1=CC=CC=C1 WGQKYBSKWIADBV-UHFFFAOYSA-N 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 229910052801 chlorine Inorganic materials 0.000 description 2
- 125000001309 chloro group Chemical group Cl* 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- LIKFHECYJZWXFJ-UHFFFAOYSA-N dimethyldichlorosilane Chemical compound C[Si](C)(Cl)Cl LIKFHECYJZWXFJ-UHFFFAOYSA-N 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 239000000945 filler Substances 0.000 description 2
- 239000000706 filtrate Substances 0.000 description 2
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 2
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 2
- 150000002430 hydrocarbons Chemical group 0.000 description 2
- 230000007062 hydrolysis Effects 0.000 description 2
- 238000006460 hydrolysis reaction Methods 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 229940018564 m-phenylenediamine Drugs 0.000 description 2
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 2
- 229920003986 novolac Polymers 0.000 description 2
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 2
- WLJVNTCWHIRURA-UHFFFAOYSA-N pimelic acid Chemical compound OC(=O)CCCCCC(O)=O WLJVNTCWHIRURA-UHFFFAOYSA-N 0.000 description 2
- 229920000768 polyamine Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 150000003141 primary amines Chemical class 0.000 description 2
- YPFDHNVEDLHUCE-UHFFFAOYSA-N propane-1,3-diol Chemical compound OCCCO YPFDHNVEDLHUCE-UHFFFAOYSA-N 0.000 description 2
- 239000012779 reinforcing material Substances 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- TYFQFVWCELRYAO-UHFFFAOYSA-N suberic acid Chemical compound OC(=O)CCCCCCC(O)=O TYFQFVWCELRYAO-UHFFFAOYSA-N 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- VYMPLPIFKRHAAC-UHFFFAOYSA-N 1,2-ethanedithiol Chemical compound SCCS VYMPLPIFKRHAAC-UHFFFAOYSA-N 0.000 description 1
- OUPZKGBUJRBPGC-UHFFFAOYSA-N 1,3,5-tris(oxiran-2-ylmethyl)-1,3,5-triazinane-2,4,6-trione Chemical compound O=C1N(CC2OC2)C(=O)N(CC2OC2)C(=O)N1CC1CO1 OUPZKGBUJRBPGC-UHFFFAOYSA-N 0.000 description 1
- DEWLEGDTCGBNGU-UHFFFAOYSA-N 1,3-dichloropropan-2-ol Chemical compound ClCC(O)CCl DEWLEGDTCGBNGU-UHFFFAOYSA-N 0.000 description 1
- 125000001989 1,3-phenylene group Chemical group [H]C1=C([H])C([*:1])=C([H])C([*:2])=C1[H] 0.000 description 1
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 1
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 description 1
- OWHGTRSGCFWNJI-UHFFFAOYSA-N 2,2,4-trimethyl-n,n'-bis(trimethylsilyl)hexane-1,6-diamine Chemical compound C[Si](C)(C)NCCC(C)CC(C)(C)CN[Si](C)(C)C OWHGTRSGCFWNJI-UHFFFAOYSA-N 0.000 description 1
- JCUZDQXWVYNXHD-UHFFFAOYSA-N 2,2,4-trimethylhexane-1,6-diamine Chemical compound NCCC(C)CC(C)(C)CN JCUZDQXWVYNXHD-UHFFFAOYSA-N 0.000 description 1
- NDUPDOJHUQKPAG-UHFFFAOYSA-M 2,2-Dichloropropanoate Chemical compound CC(Cl)(Cl)C([O-])=O NDUPDOJHUQKPAG-UHFFFAOYSA-M 0.000 description 1
- YWBPSYQZVDKEPT-UHFFFAOYSA-N 2,3,3-trimethyl-n,n'-bis(trimethylsilyl)hexane-1,6-diamine Chemical compound C[Si](C)(C)NCC(C)C(C)(C)CCCN[Si](C)(C)C YWBPSYQZVDKEPT-UHFFFAOYSA-N 0.000 description 1
- JFTWQOMLWRPTQL-UHFFFAOYSA-N 2,3,3-trimethylhexane-1,6-diamine Chemical compound NCC(C)C(C)(C)CCCN JFTWQOMLWRPTQL-UHFFFAOYSA-N 0.000 description 1
- AYHLPQOWRMPEKH-UHFFFAOYSA-N 2-(6-methylheptoxymethyl)oxirane Chemical compound CC(C)CCCCCOCC1CO1 AYHLPQOWRMPEKH-UHFFFAOYSA-N 0.000 description 1
- YSUQLAYJZDEMOT-UHFFFAOYSA-N 2-(butoxymethyl)oxirane Chemical compound CCCCOCC1CO1 YSUQLAYJZDEMOT-UHFFFAOYSA-N 0.000 description 1
- SZCFDTYKNQJQKT-UHFFFAOYSA-N 2-(oxiran-2-ylmethoxy)-6-oxabicyclo[3.1.0]hexane Chemical compound C1CC2OC2C1OCC1CO1 SZCFDTYKNQJQKT-UHFFFAOYSA-N 0.000 description 1
- XORJNZNCVGHBDZ-UHFFFAOYSA-N 2-[2-(6-oxabicyclo[3.1.0]hexan-2-yloxy)ethoxy]-6-oxabicyclo[3.1.0]hexane Chemical compound C1CC2OC2C1OCCOC1C2OC2CC1 XORJNZNCVGHBDZ-UHFFFAOYSA-N 0.000 description 1
- OJPDDQSCZGTACX-UHFFFAOYSA-N 2-[n-(2-hydroxyethyl)anilino]ethanol Chemical compound OCCN(CCO)C1=CC=CC=C1 OJPDDQSCZGTACX-UHFFFAOYSA-N 0.000 description 1
- KNKXKITYRFJDNF-UHFFFAOYSA-N 2-methylphenol Chemical compound CC1=CC=CC=C1O.CC1=CC=CC=C1O KNKXKITYRFJDNF-UHFFFAOYSA-N 0.000 description 1
- VEORPZCZECFIRK-UHFFFAOYSA-N 3,3',5,5'-tetrabromobisphenol A Chemical compound C=1C(Br)=C(O)C(Br)=CC=1C(C)(C)C1=CC(Br)=C(O)C(Br)=C1 VEORPZCZECFIRK-UHFFFAOYSA-N 0.000 description 1
- GWRIJLLBNMNVSW-UHFFFAOYSA-N 3,3,5-trimethyl-n-trimethylsilyl-5-[(trimethylsilylamino)methyl]cyclohexan-1-amine Chemical compound CC1(C)CC(N[Si](C)(C)C)CC(C)(CN[Si](C)(C)C)C1 GWRIJLLBNMNVSW-UHFFFAOYSA-N 0.000 description 1
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 1
- WXQZLPFNTPKVJM-UHFFFAOYSA-N 4-[(4-hydroxycyclohexyl)methyl]cyclohexan-1-ol Chemical compound C1CC(O)CCC1CC1CCC(O)CC1 WXQZLPFNTPKVJM-UHFFFAOYSA-N 0.000 description 1
- HDPBBNNDDQOWPJ-UHFFFAOYSA-N 4-[1,2,2-tris(4-hydroxyphenyl)ethyl]phenol Chemical compound C1=CC(O)=CC=C1C(C=1C=CC(O)=CC=1)C(C=1C=CC(O)=CC=1)C1=CC=C(O)C=C1 HDPBBNNDDQOWPJ-UHFFFAOYSA-N 0.000 description 1
- CDBAMNGURPMUTG-UHFFFAOYSA-N 4-[2-(4-hydroxycyclohexyl)propan-2-yl]cyclohexan-1-ol Chemical compound C1CC(O)CCC1C(C)(C)C1CCC(O)CC1 CDBAMNGURPMUTG-UHFFFAOYSA-N 0.000 description 1
- PLIKAWJENQZMHA-UHFFFAOYSA-N 4-aminophenol Chemical class NC1=CC=C(O)C=C1 PLIKAWJENQZMHA-UHFFFAOYSA-N 0.000 description 1
- WXNZTHHGJRFXKQ-UHFFFAOYSA-N 4-chlorophenol Chemical compound OC1=CC=C(Cl)C=C1 WXNZTHHGJRFXKQ-UHFFFAOYSA-N 0.000 description 1
- YWVFNWVZBAWOOY-UHFFFAOYSA-N 4-methylcyclohexane-1,2-dicarboxylic acid Chemical compound CC1CCC(C(O)=O)C(C(O)=O)C1 YWVFNWVZBAWOOY-UHFFFAOYSA-N 0.000 description 1
- QHPQWRBYOIRBIT-UHFFFAOYSA-N 4-tert-butylphenol Chemical compound CC(C)(C)C1=CC=C(O)C=C1 QHPQWRBYOIRBIT-UHFFFAOYSA-N 0.000 description 1
- YIROYDNZEPTFOL-UHFFFAOYSA-N 5,5-Dimethylhydantoin Chemical compound CC1(C)NC(=O)NC1=O YIROYDNZEPTFOL-UHFFFAOYSA-N 0.000 description 1
- RZJKZTPKSRPUFJ-UHFFFAOYSA-N 5,5-dimethyl-1,3-bis(oxiran-2-ylmethyl)imidazolidine-2,4-dione Chemical compound O=C1N(CC2OC2)C(=O)C(C)(C)N1CC1CO1 RZJKZTPKSRPUFJ-UHFFFAOYSA-N 0.000 description 1
- 239000005995 Aluminium silicate Substances 0.000 description 1
- KLSJWNVTNUYHDU-UHFFFAOYSA-N Amitrole Chemical compound NC1=NC=NN1 KLSJWNVTNUYHDU-UHFFFAOYSA-N 0.000 description 1
- ADAHGVUHKDNLEB-UHFFFAOYSA-N Bis(2,3-epoxycyclopentyl)ether Chemical compound C1CC2OC2C1OC1CCC2OC21 ADAHGVUHKDNLEB-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- FBPFZTCFMRRESA-FSIIMWSLSA-N D-Glucitol Natural products OC[C@H](O)[C@H](O)[C@@H](O)[C@H](O)CO FBPFZTCFMRRESA-FSIIMWSLSA-N 0.000 description 1
- FBPFZTCFMRRESA-JGWLITMVSA-N D-glucitol Chemical compound OC[C@H](O)[C@@H](O)[C@H](O)[C@H](O)CO FBPFZTCFMRRESA-JGWLITMVSA-N 0.000 description 1
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 1
- MQIUGAXCHLFZKX-UHFFFAOYSA-N Di-n-octyl phthalate Natural products CCCCCCCCOC(=O)C1=CC=CC=C1C(=O)OCCCCCCCC MQIUGAXCHLFZKX-UHFFFAOYSA-N 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- 239000004606 Fillers/Extenders Substances 0.000 description 1
- OYHQOLUKZRVURQ-HZJYTTRNSA-N Linoleic acid Chemical compound CCCCC\C=C/C\C=C/CCCCCCCC(O)=O OYHQOLUKZRVURQ-HZJYTTRNSA-N 0.000 description 1
- AFVFQIVMOAPDHO-UHFFFAOYSA-N Methanesulfonic acid Chemical compound CS(O)(=O)=O AFVFQIVMOAPDHO-UHFFFAOYSA-N 0.000 description 1
- ALQSHHUCVQOPAS-UHFFFAOYSA-N Pentane-1,5-diol Chemical compound OCCCCCO ALQSHHUCVQOPAS-UHFFFAOYSA-N 0.000 description 1
- FQYUMYWMJTYZTK-UHFFFAOYSA-N Phenyl glycidyl ether Chemical compound C1OC1COC1=CC=CC=C1 FQYUMYWMJTYZTK-UHFFFAOYSA-N 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004146 Propane-1,2-diol Substances 0.000 description 1
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 239000005864 Sulphur Substances 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- YXEBFFWTZWGHEY-UHFFFAOYSA-N [1-(hydroxymethyl)cyclohex-3-en-1-yl]methanol Chemical compound OCC1(CO)CCC=CC1 YXEBFFWTZWGHEY-UHFFFAOYSA-N 0.000 description 1
- MSILJOYZYPRFDK-UHFFFAOYSA-N [4-[4-(sulfanylmethyl)phenoxy]phenyl]methanethiol Chemical compound C1=CC(CS)=CC=C1OC1=CC=C(CS)C=C1 MSILJOYZYPRFDK-UHFFFAOYSA-N 0.000 description 1
- UMVBXBACMIOFDO-UHFFFAOYSA-N [N].[Si] Chemical compound [N].[Si] UMVBXBACMIOFDO-UHFFFAOYSA-N 0.000 description 1
- IKHGUXGNUITLKF-XPULMUKRSA-N acetaldehyde Chemical compound [14CH]([14CH3])=O IKHGUXGNUITLKF-XPULMUKRSA-N 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000001476 alcoholic effect Effects 0.000 description 1
- 150000001299 aldehydes Chemical class 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 description 1
- 125000002490 anilino group Chemical group [H]N(*)C1=C([H])C([H])=C([H])C([H])=C1[H] 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 239000010426 asphalt Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- VCCBEIPGXKNHFW-UHFFFAOYSA-N biphenyl-4,4'-diol Chemical group C1=CC(O)=CC=C1C1=CC=C(O)C=C1 VCCBEIPGXKNHFW-UHFFFAOYSA-N 0.000 description 1
- BJQHLKABXJIVAM-UHFFFAOYSA-N bis(2-ethylhexyl) phthalate Chemical compound CCCCC(CC)COC(=O)C1=CC=CC=C1C(=O)OCC(CC)CCCC BJQHLKABXJIVAM-UHFFFAOYSA-N 0.000 description 1
- XFUOBHWPTSIEOV-UHFFFAOYSA-N bis(oxiran-2-ylmethyl) cyclohexane-1,2-dicarboxylate Chemical compound C1CCCC(C(=O)OCC2OC2)C1C(=O)OCC1CO1 XFUOBHWPTSIEOV-UHFFFAOYSA-N 0.000 description 1
- IYYIVELXUANFED-UHFFFAOYSA-N bromo(trimethyl)silane Chemical compound C[Si](C)(C)Br IYYIVELXUANFED-UHFFFAOYSA-N 0.000 description 1
- HQABUPZFAYXKJW-UHFFFAOYSA-N butan-1-amine Chemical compound CCCCN HQABUPZFAYXKJW-UHFFFAOYSA-N 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 235000010216 calcium carbonate Nutrition 0.000 description 1
- 235000013877 carbamide Nutrition 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 125000002843 carboxylic acid group Chemical group 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 235000010980 cellulose Nutrition 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- ACTAPAGNZPZLEF-UHFFFAOYSA-N chloro(tripropyl)silane Chemical compound CCC[Si](Cl)(CCC)CCC ACTAPAGNZPZLEF-UHFFFAOYSA-N 0.000 description 1
- 239000008119 colloidal silica Substances 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- IFDVQVHZEKPUSC-UHFFFAOYSA-N cyclohex-3-ene-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCC=CC1C(O)=O IFDVQVHZEKPUSC-UHFFFAOYSA-N 0.000 description 1
- QSAWQNUELGIYBC-UHFFFAOYSA-N cyclohexane-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCCCC1C(O)=O QSAWQNUELGIYBC-UHFFFAOYSA-N 0.000 description 1
- RLMGYIOTPQVQJR-UHFFFAOYSA-N cyclohexane-1,3-diol Chemical compound OC1CCCC(O)C1 RLMGYIOTPQVQJR-UHFFFAOYSA-N 0.000 description 1
- VKONPUDBRVKQLM-UHFFFAOYSA-N cyclohexane-1,4-diol Chemical compound OC1CCC(O)CC1 VKONPUDBRVKQLM-UHFFFAOYSA-N 0.000 description 1
- 238000007033 dehydrochlorination reaction Methods 0.000 description 1
- 150000004985 diamines Chemical class 0.000 description 1
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical compound C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- CZZYITDELCSZES-UHFFFAOYSA-N diphenylmethane Chemical compound C=1C=CC=CC=1CC1=CC=CC=C1 CZZYITDELCSZES-UHFFFAOYSA-N 0.000 description 1
- 150000004662 dithiols Chemical class 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- 235000013312 flour Nutrition 0.000 description 1
- HYBBIBNJHNGZAN-UHFFFAOYSA-N furfural Chemical compound O=CC1=CC=CO1 HYBBIBNJHNGZAN-UHFFFAOYSA-N 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- VOZRXNHHFUQHIL-UHFFFAOYSA-N glycidyl methacrylate Chemical compound CC(=C)C(=O)OCC1CO1 VOZRXNHHFUQHIL-UHFFFAOYSA-N 0.000 description 1
- 150000008282 halocarbons Chemical class 0.000 description 1
- 229910052736 halogen Inorganic materials 0.000 description 1
- 150000002367 halogens Chemical group 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 125000005842 heteroatom Chemical group 0.000 description 1
- WJSATVJYSKVUGV-UHFFFAOYSA-N hexane-1,3,5-triol Chemical compound CC(O)CC(O)CCO WJSATVJYSKVUGV-UHFFFAOYSA-N 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- 150000001469 hydantoins Chemical class 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- YAMHXTCMCPHKLN-UHFFFAOYSA-N imidazolidin-2-one Chemical compound O=C1NCCN1 YAMHXTCMCPHKLN-UHFFFAOYSA-N 0.000 description 1
- 239000003701 inert diluent Substances 0.000 description 1
- 239000012442 inert solvent Substances 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000004922 lacquer Substances 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- OYHQOLUKZRVURQ-IXWMQOLASA-N linoleic acid Natural products CCCCC\C=C/C\C=C\CCCCCCCC(O)=O OYHQOLUKZRVURQ-IXWMQOLASA-N 0.000 description 1
- 235000020778 linoleic acid Nutrition 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 150000002763 monocarboxylic acids Chemical class 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- ZMVMYBGDGJLCHV-UHFFFAOYSA-N n-methyl-4-[[4-(methylamino)phenyl]methyl]aniline Chemical compound C1=CC(NC)=CC=C1CC1=CC=C(NC)C=C1 ZMVMYBGDGJLCHV-UHFFFAOYSA-N 0.000 description 1
- 125000004123 n-propyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- DUZBERYJODSHTQ-UHFFFAOYSA-N n-triethylsilyl-4-[[4-(triethylsilylamino)phenyl]methyl]aniline Chemical compound C1=CC(N[Si](CC)(CC)CC)=CC=C1CC1=CC=C(N[Si](CC)(CC)CC)C=C1 DUZBERYJODSHTQ-UHFFFAOYSA-N 0.000 description 1
- BDWDZSUKCWFTLP-UHFFFAOYSA-N n-trimethylsilyl-1-[3-[(trimethylsilylamino)methyl]phenyl]methanamine Chemical compound C[Si](C)(C)NCC1=CC=CC(CN[Si](C)(C)C)=C1 BDWDZSUKCWFTLP-UHFFFAOYSA-N 0.000 description 1
- IOIYNJAHBOTFLM-UHFFFAOYSA-N n-trimethylsilyl-4-[[4-(trimethylsilylamino)phenyl]methyl]aniline Chemical compound C1=CC(N[Si](C)(C)C)=CC=C1CC1=CC=C(N[Si](C)(C)C)C=C1 IOIYNJAHBOTFLM-UHFFFAOYSA-N 0.000 description 1
- 229910017464 nitrogen compound Inorganic materials 0.000 description 1
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-methyl phenol Natural products CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 1
- 125000000962 organic group Chemical group 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- RPQRDASANLAFCM-UHFFFAOYSA-N oxiran-2-ylmethyl prop-2-enoate Chemical compound C=CC(=O)OCC1CO1 RPQRDASANLAFCM-UHFFFAOYSA-N 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- 239000004014 plasticizer Substances 0.000 description 1
- 229920002755 poly(epichlorohydrin) Polymers 0.000 description 1
- 239000004848 polyfunctional curative Substances 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 229960004063 propylene glycol Drugs 0.000 description 1
- 235000013772 propylene glycol Nutrition 0.000 description 1
- UMJSCPRVCHMLSP-UHFFFAOYSA-N pyridine Natural products COC1=CC=CN=C1 UMJSCPRVCHMLSP-UHFFFAOYSA-N 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 125000003808 silyl group Chemical group [H][Si]([H])([H])[*] 0.000 description 1
- 239000000600 sorbitol Substances 0.000 description 1
- 239000012258 stirred mixture Substances 0.000 description 1
- 239000011269 tar Substances 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- UFDHBDMSHIXOKF-UHFFFAOYSA-N tetrahydrophthalic acid Natural products OC(=O)C1=C(C(O)=O)CCCC1 UFDHBDMSHIXOKF-UHFFFAOYSA-N 0.000 description 1
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 1
- HFFLGKNGCAIQMO-UHFFFAOYSA-N trichloroacetaldehyde Chemical compound ClC(Cl)(Cl)C=O HFFLGKNGCAIQMO-UHFFFAOYSA-N 0.000 description 1
- ILWRPSCZWQJDMK-UHFFFAOYSA-N triethylazanium;chloride Chemical compound Cl.CCN(CC)CC ILWRPSCZWQJDMK-UHFFFAOYSA-N 0.000 description 1
- CSRZQMIRAZTJOY-UHFFFAOYSA-N trimethylsilyl iodide Chemical compound C[Si](C)(C)I CSRZQMIRAZTJOY-UHFFFAOYSA-N 0.000 description 1
- 239000010456 wollastonite Substances 0.000 description 1
- 229910052882 wollastonite Inorganic materials 0.000 description 1
- 239000002023 wood Substances 0.000 description 1
- 210000002268 wool Anatomy 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
-
- C—CHEMISTRY; METALLURGY
- C07—ORGANIC CHEMISTRY
- C07F—ACYCLIC, CARBOCYCLIC OR HETEROCYCLIC COMPOUNDS CONTAINING ELEMENTS OTHER THAN CARBON, HYDROGEN, HALOGEN, OXYGEN, NITROGEN, SULFUR, SELENIUM OR TELLURIUM
- C07F7/00—Compounds containing elements of Groups 4 or 14 of the Periodic Table
- C07F7/02—Silicon compounds
- C07F7/08—Compounds having one or more C—Si linkages
- C07F7/10—Compounds having one or more C—Si linkages containing nitrogen having a Si-N linkage
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/4007—Curing agents not provided for by the groups C08G59/42 - C08G59/66
- C08G59/4085—Curing agents not provided for by the groups C08G59/42 - C08G59/66 silicon containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
- C08G59/4284—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof together with other curing agents
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Epoxy Resins (AREA)
Abstract
A composition for curing epoxide resins contains a mixture of (a) a silamine of the general formula <IMAGE> where either m represents 1, in which case R<1> represents the residue of an aromatic, aliphatic, araliphatic, or cycloaliphatic diprimary amine after removal of the two primary amino groups and n represents zero or an integer of from 1 to 10, or m represents 2, in which case R<1> represents the residue of an aliphatic triprimary amine after removal of the three primary amino groups and n represents zero, and R<2>, R<3>, R<4>, R<5>, and R<6> each represent alkyl or aryl groups, and (b) a substantially anhydrous organic acid or phenol. Mixtures containing these compositions and epoxide resins are stable for prolonged periods in the absence of water but cure rapidly at room temperature or at elevated temperatures in the presence of water, which may be as water vapour or liquid water.
Description
SPECIFICATION
Compositions for curing epoxide resins
This invention relates to compositions for curing epoxide resins, to curable mixtures of these
compositions and epoxide resins, and to cured products obtained by curing the aforesaid mixtures.
It is known that epoxide resins, i.e., substances containing on average more than one 1,2-epoxide
group per molecule, may be cured by reaction with various classes of substances to form cross-linked,
infusible, insoluble products having valuable technical properties. Typical curing agents include
polyamines.
These are useful curing agents, and may be employed to cure epoxide resins at room temperature
or at elevated temperatures. They suffer from the drawback, however, that curing commences as soon
as they are mixed with the epoxide resin and so it is not possible to make 'one shot' mixtures, i.e.,
mixtures of epoxide resins and such hardeners which remain stable on storage until required for use.
British Patent Specification No. 867,487 describes compounds prepared by the reaction of at
least one epoxide group and a silicon-nitrogen compound (a 'silamine'), itself prepared by reaction of a
halosilane with ammonia or a primary amine. Suitable halosilanes used in the reaction are of the
generic formula R,--Sii-Hal,~ I where R represents a hydrogen atom or an organic group, and p is 1, 2, or 3. Suitable amines include
methylamine, ethylamine, allylamine, ethylenediamine, hexamethylenediamine, aniline, p
phenylenediamine, and benzylamine. It is stated that silamines will cure epoxide resins at room
temperature and that silamines made from primary amines tend to react with epoxy resins somewhat
more rapidly than silamines derived from ammonia.The combination of epoxy resin and silamine has
an exceedingly short 'shelf-life' it is said, and the components are mixed only immediately before use.
However, it is further stated that certain of the silamines may be used as curing agents for epoxide
resins wherein the mixture of curing agent and resin has a shelf-life of days or weeks. From what is stated previously it is implied that these less-active silamines are those derived from ammonia.
That specification gives no example of a silamine prepared from a monohalosilane and no
example of a silamine prepared from a diamine although such are included within the general description. Further, that specification indicates that no mixture of an epoxide and a silamine would be stable for longer than a few weeks.
We have now found that combinations of epoxide resins with silamines derived from a
monohalosilane and a di- or polyamine, the said combinations further containing a substantially
anhydrous organic acid or phenol, are stable in the absence of moisture for several months at room
temperatures and at elevated temperatures up to about 800C. Such combinations will then cure
rapidly at room temperature or elevated temperature when exposed to water or water vapour. These
combinations therefore form a storage-stable but rapidly-curing 'one-shot' epoxide resin composition.
One aspect of this invention comprises compositions, suitable as curing agents for epoxide resins,
containing
(a) a silamine of the formula
where
either m represents 1, in which case R1 represents the divalent residue of an aromatic, aliphatic, araliphatic, or cycloaliphatic diprimary amine after removal of the two primary amino groups and n represents zero or an integer of from 1 to 10, or m represents 2, in which case R' represents the trivalent residue of an aliphatic triprimary amine after removal of the three primary amino groups and n represents zero, and
R2, R3, R4, R5, and R6, which may be the same or different, each represent an alkyl or aryl group, and
(b) a substantially anhydrous organic acid or a substantially anhydrous phenol.
Suitable groups R1 have from 2 to 20 carbon atoms and include ethylene, hexamethylene, trimethylhexamethylene such as 2,2,4-trimethylhexamethyiene and 2,3,3-trimethylhexamethylene, xylylene such as m-xylylene, cyclohexylene, substituted cyclohexylene, such as the substituted cyclohexylenemethylene group of formula
and also bis(phenylene)methane such as bis(p-phenylene)methane, bis(phenylene)sulphone such as bis(p-phenylene)sulphone, 2,2-bis(phenylene)propane such as 2,2-bis(p-phenylene)propane, and phenylene such as 1,3-phenylene.
Suitable groups R2, R3, R4, R5, and Re include alkyl groups of 1 to 8 carbon atoms, such as methyl, ethyl, and n-propyl groups, and aryl groups of 6 to 10 carbon atoms, such as phenyl groups, optionally substituted by one or more alkyl groups of 1 to 4 carbon atoms or by one or more halogen atoms. In the particularly preferred compounds of formula II, m represents 1, n represents zero or 1, and R2 to Re each denote a methyl group.
Another aspect of this invention comprises curable compositions containing
(a) a silamine of formula II,
(b) a substantially anhydrous organic acid or a substantially anhydrous phenol, and
(c) an epoxide resin.
Further aspects of this invention provide a process for curing an epoxide resin which comprises forming a mixture of the epoxide resin, a silamine of formula II, and a substantially anhydrous organic acid or a substantially anhydrous phenol, and exposing the mixture to water or water vapour at ambient or elevated temperature, and cured products made by this process.
Silamines of formula II may be prepared by reaction of a primary di- or tri-amine of formula H2NR'(NH2)m IV where
R1 and m are as hereinbefore defined, with a monohalosilane of formula
and optionally, when m is the amine of formula IV represents 1, also with a dihalosilane of formula
where
R1, R2, R3, R4, R5, and Re are as hereinbefore defined and
X represents a halogen, preferably a chlorine, atom.
The silamines of formula II are prepared from an amine (IV), a monohalosilane (V) and a dihalosilane (VI) in the molar ratio n+ 1 :2:n, where n is as hereinbefore defined. This reaction is effected under anhydrous conditions by heating the reactants, usually at 50 to 1 500C, for a period of from 30 minutes to 5 hours, especially for 1-2 hours, in an inert solvent such as an aromatic hydrocarbon, an ether, a halogenated hydrocarbon, or a ketone, and in the presence of an acid acceptor such as a tertiary amine, especially pyridine or triethylamine.
Suitable diprimary amines of formula IV which may be used in the preparation of the silamines of formula II include m-phenylenediamine, bis(p-aminophenyl)methane, bis(p-aminophenyl)sulphone, 5 amino-1 ,3,3-trimethylcyclohexylmethylamine ("isophoronediamine"), and m-xylylenediamine. Suitable triprimary amines of formula IV include polyoxypropylene triamines.
Preferred monohalosilanes of formula V include trimethylchlorosilane, triethylchlorosilane, tripropylchlorosilane, triphenyichlorosilane, trimethylbromosilane, and trimethyliodosilane.
Trimethyichlorosilane is particularly preferred. A preferred dihalosilane of formula V: is dimethyldichlorosilane.
The acids used in the present compositions may be mono-, di-, or poly-basic. As stated previously, they must be substantially anhydrous, by which is meant that they must contain insufficient water to cause hydrolysis of the silamines of formula lí at ambienttemnperature. Suitable such acids include acetic, phthalic, methanesulphonic, salicylic, maleic, 2,2-dichloropropionic, adipic, trimellitic, and cyanoacetic acids and, where they are di- or poly-basic, their partial esters (such as 2methoxyethyl hydrogen maleate).
Phenols which may be used in the present compositions must likewise be substantially anhydrous. They may be mono-, di-, or polyhydric and include phenol itself, alkylated phenols such as 2,6-di-tert. butyl-4-methylphenol (which is preferred), halogenated phenols, resorcinol, bisphenol F, and bisphenol A.
The weight ratio of acid or phenol to epoxide resin in the present compositions is usually within the range 0.5-20:100, and especially 2-1 5:100.
Epoxide resins which may be employed in these compositions as component (c) should be, as should other components to be incorporated, substantially anhydrous (unless it is required to initiate cure). Preferably the epoxide resins are those containing groups of formula
directly attached to atoms of oxygen, nitrogen, or sulphur, where either R7 and R9 each represent a hydrogen atom, in which case R9 denotes a hydrogen atom or a methyl group, or R7 and R9 together represent -CH2OH2-, in which case R8 denotes a hydrogen atom.
As examples of such resins may be mentioned polyglycidyl and poly(p-methylglycidyl) esters obtainable by reaction of a compound containing two or more carboxylic acid groups per molecule with epichlorohydrin, glycerol dichlorohydrin, or ,B-methylepichlorohydrin in the presence of an alkali. Such polyglycidyl esters may be derived from aliphatic polycarboxylic acids, e.g., oxalic acid, succinic acid, glutaric acid, adipic acid, pimelic acid, suberic acid, azelaic acid, sebacic acid, or dimerised or trimerised linoleic acid; from cycloaliphatic polycarboxylic acids such as tetrahydrophthalic acid, 4methyltetrahydrophthalic acid, hexahydrophthalic acid, and 4-methylhexahydrophthalic acid; and from aromatic polycarboxylic acids such as phthalic acid, isophthalic acid, and terephthalic acid.
Further examples are polyglycidyl and poly(p-methylglycidyl) ethers obtainable by reaction of a compound containing at least two free alcoholic hydroxyl and/or phenolic hydroxyl groups per molecule with the appropriate epichlorohydrin under alkaline conditions or, alternatively, in the presence of an acidic catalyst and subsequent treatment with alkali.These ethers may be made from acyclic alcohols such as ethylene glycol, diethylene glycol, and higher poly(oxyethylene) glycols, propane-1 ,2-diol and poly(oxypropylene) glycols, propane-1,3-diol, butane-1,4-diol, poly(oxytetramethylene) glycols, pentane-1,5-diol, hexane- 1 ,6-diol, hexane-2,4,6-triol, glycerol, 1,1,1 -trimethylolpropane, pentaerythritol, sorbitol, and poly(epichlorohydrin); from cycloaliphatic alcohols such as resorcitol, quinitol, bis(4-hydroxycyclohexyl)methane, 2,2-bis(4-hydroxycyclohexyl)propane, and 1 , 1 - bis(hydroxymethyl)cyclohex-3-ene; and from alcohols having aromatic nuclei, such as N,N-bis(2hydroxyethyl)aniline and p,p'-bis(2-hydroxyethylamino)diphenylmethane. Or they may be made from mononuclear phenols, such as resorcinol and hydroquinone, and from polynuclear phenols, such as bis(4-hydroxyphenyl)methane, 4,4'-dihydroxydiphenyl, bis(4-hydroxyphenyl) sulphone, 1,1,2,2tetrakis(4-hydroxyphenyl)ethane, 2,2-bis(4-hydroxyphenyl)propane, 2,2-bis(3,5-dibromo-4hydroxyphenyl)propane, and novolaks formed from aldehydes such as formaldehyde, acetaldehyde, chloral, and furfuraldehyde, with phenols such as phenol itself, and phenol substituted in the ring by chlorine atoms or by alkyl groups each containing up to nine carbon atoms, such as 4-chlorophenol, 2methylphenol, and 4-tert. butylphenol.
Poly(N-glycidyl) compounds include, for example, those obtained by dehydrochlorination of the reaction products of epichlorohydrin with amines containing at least two amino-hydrogen atoms, such as aniline, n-butylamine, bis(4-aminophenyl)-methane, and bis(4-methylaminophenyl)methane; triglycidyl isocyanurate; and N,N'-diglycidyl derivatives of cyclic alkylene ureas, such as ethyleneurea and 1 ,3-propyleneurea, and of hydantoins such as 5,5-dimethylhydantoin.
Examples of poly(S-glycidyl) compounds are di-S-glycidyl derivatives of dithiols such as ethane1,2-dithiol and bis(4-mercaptomethylphenyl) ether.
Examples of epoxide resins having groups of formula VII where R7 and R9 conjointly denote a -CH2-CH2- group are bis(2,3-epoxycyclopentyl) ether, 2,3-epoxycyclopentyl glycidyl ether, and 1 ,2-bis(2,3-epoxycyclopentyloxy)ethane.
Epoxide resins having the 1 ,2-epoxide groups attached to different kinds of hetero atoms may be employed, e.g., the N,N,O-triglycidyl derivative of 4-aminophenol, the glycidyl ether-glycidyl ester of salicylic acid, N-glycidyl-N'-(2-g lycidyloxypropyl)-5,5-dimethyl hydantoin, and 2-glycidyloxy-1,3- bis(5,5-dimethyl-1 -glycidylhydantoin-3-yI)propane.
If desired, a mixture of epoxide resins may be used.
Preferred epoxide resins are polyglycidyl ethers, polyglycidyl esters, and N,N'diglycidylhydantoins. Specific preferred resins are polyglycidyl ethers of 2,2-bis(4hydroxyphenyl)propane, of bis(4-hydroxyphenyl)methane, or of a novolak formed from formaldehyde and phenol, or phenol substituted in the ring by one chlorine atom or by one alkyl hydrocarbon group containing from one to nine carbon atoms, and having a 1 ,2-epoxide content of more than 0.5 equivalent per kilogram.
An effective, i.e. a curing, amount of the silamine must be used. Normally there will be used from about 0.7 to about 1.4 theoretical amino-hydrogen equivalents of the silamine of formula II per 1,2epoxide equivalent of the epoxide resin. By the term "theoretical amino-hydrogen equivalents", as used in the present specification and claims, is meant the number of amino-hydrogen equivalents present after removal of substantially all the silyl groups by hydrolysis, each molecule of the silamine affording (2+2m+4n) such equivalents.
Curing can be carried out, depending on the desired rate of cure, at room temperature (18 to 25 C, for example) or at higher temperatures, up to about 1 000C. Room temperature cure is, however, preferred.
Water required to initiate the curing reaction may be obtained in a variety of ways. It may, for example, be atmospheric moisture, or the resin-silamine mixture may be placed in contact with liquid water, either directly or through a semi-permeable membrane. Alternatively, the composition may be contacted with a material that contains water, such as wood or a porous material such as concrete or brickwork.
The new compositions may further contain suitable plasticisers such as dibutyl phthalate and dioctyl phthalate, inert diluents such as tars and bitumen and so-called reactive diluents, especially monoepoxides such as n-butyl glycidyl ether, iso-octyl glycidyl ether, phenyl glycidyl ether, cresyl glycidyl ethers, glycidyl esters of tertiary, aliphatic, monocarboxylic acids, glycidyl acrylate, and glycidyl methacrylate. They may also contain additives such as fillers, reinforcing materials, colouring matter, flow control agents, flame inhibitors, and mould lubricants.Suitable extenders, fillers, and reinforcing materials are, for example, glass fibers, carbon fibres, ballotini, mica, quartz flour, calcium carbonate, cellulose, kaolin, wollastonite, colloidal silica having a large specific surface area, powdered poly(vinyl chloride), and powdered polyolefin hydrocarbons such as polyethylene and polypropylene.
The curable compositions of this invention may be used as laminating resins, paints and lacquers, impregnating and casting resins, moulding compositions, putties and sealing compounds, potting and insulating compounds for the electrical industry, and adhesives, and also in the manufacture of such products.
The following Examples illustrate the invention.
Silamines used in these Examples were prepared as follows:
Silamine I
Bis(4-aminophenyl)methane (20 g; 0.1 mole) was mixed with triethylamine (20.2 g; 0.2 mole) in dry toluene (100 ml). Trimethylchlorosilane (21.7 g; 0.2 mole) was added dropwise to the stirred mixture over 1 hour, and stirring was continued at room temperature for a further 5 hours. Next, the mixture was heated under reflux for 1 hour. The mixture was cooled, filtered to remove triethylamine hydrochloride, and the toluene was distilled off in vacuo from a water bath at 800C. The residue, bis(4 (trimethylsilylamino)phenyl)methane, weighed 32.5 g, and is hereinafter referred to as 'Silamine I'. This product has a theoretical amino-hydrogen equivalent weight of 85.5, i.e., its theoretical aminohydrogen content is 11.69 equivalents/kg.
Silamine II
m-Phenylenediamine(10.8 9;0.1 mole) andtriethylamine (20.2 g;0.2 mole) in drytoluene (100 ml) were stirred and treated with trimethylchlorosilane (21.7 g; 0.2 mole) which was added dropwise over 1 hour. Stirring was continued for a further hour, and the mixture was then heated under reflux for 1 hour. After cooling and filtering the product, the solvent was evaporated to leave 24.2 g of mbis(trimethylsilylamino)benzene, which is hereinafter referred to as Silamine II. This product has a theoretical amino-hydrogen equivalent weight of 63, i.e., its theoretical amino-hydrogen content is 1 5.87 equivalents/kg.
Silamine Ill
Bis(4-aminophenyl)methane (40 g; 0.2 mole) and triethylamine (40.4 g; 0.4 mole) in dry toluene (200 ml) were stirred and treated with a mixture of trimethylchlorosilane (21.7 g; 0.2 mole) and dimethyldichlorosilane (12.9 g; 0.1 mole) which was added dropwise over 1 hour. Stirring was continued for a further hour and the mixture was then heated under reflux for 2 hours, filtered, and the solvent was distilled off to leave 54 g of 'Silamine Ill' which is a mixture having an average structure of formula II in which R1 is of formula
R2, R3, R4, R5 and R8 all denote methyl groups, and m and n denote 1. This product has a theoretical amino-hydrogen equivalent weight of 74, i.e., its theoretical amino-hydrogen content is 1 3.5 equivalents/kg.It has the average structure dimethylbis(p-(p'-(trimethylsilylamino)benzyl)phenyl- amino)silane.
Silamine IV
Isophoronediamine (17.0 g; 0.1 mole) and triethylamine (20.2 g; 0.2 mole) were stirred in dry toluene (100 ml) and treated over 1 hour with trimethylchlorosilane (21.7 g; 0.2 mole). After stirring the mixture for a further 10 hours it was heated under reflux for 1 hour, cooled, and filtered. The filtrate was evaporated to give 29.8 g of 'Silamine IV' which is of formula II in which R1 is of formula III, R2, R3, and R4 all denote methyl groups, m is 1, n is zero, i.e., 1,1 ,3-trimethyl-3-(trimethylsilylaminomethyl)-5 (trimethylsilylamino)cyclohexane. This product has a theoretical amino-hydrogen equivalent weight of 78.5, i.e., its theoretical amino-hydrogen content is 11.4 equivalents/kg.
Silamine V
m-Xylylenediamine (12.6 g; 0.1 mole) and triethylamine (20.2 g; 0.2 mole) were stirred in dry toluene (100 ml) and treated over 1 hour with trimethylchlorosilane (21.7 g; 0.2 mole). After the mixture had been stirred for a further 10 hours it was heated under reflux for 1 hour, cooled, and filtered. The filtrate was evaporated to give 25.2 g of 'Silamine V'. This product, 1,3bis(trimethylsilylaminomethyl)benzene, has a theoretical amino-hydrogen equivalent weight of 70, i.e., its theoretical amino-hydrogen content is 14.29 equivalents/kg.
Silamine VI
This was made as described for Silamine I except that instead of bis(4-aminophenyl)methane there was used a corresponding amount of a commercially available mixture of 2,2,4-trimethylhexane1,6-diamine and 2,3,3-trimethylhexane-1 ,6-diamine. The product, a mixture 1,6 bis(trimethylsilylamino)-2,2,4-trimethylhexane and 1 ,6-bis(trimethylsilylamino)-2,3,3-trimethylhexane, has a theoretical amino-hydrogen equivalent weight of 76, i.e., its theoretical amino-hydrogen content is 13.1 6 equivalents/kg.
Silamine VII
This was made as for Silamine I but using 30.1 g of triethylchlorosilane. Silamine VII, i.e., bis(4 (triethylsilylamino)phenyl)methane, has a theoretical amino-hydrogen equivalent weight of 106.5, i.e., its theoretical amino-hydrogen content is 9.38 equivalents/kg.
Silamine VIII
This was made as for Silamine IV but using 30.1 g of triethylchlorosilane. Silamine VIII, i.e., 1,1 ,3-trimethyl-3-(triethylsilylaminomethyl)-5-(trimethylsilylamino)cyclohexane, has a theoretical amino-hydrogen equivalent weight of 99.5, i.e., its theoretical amino-hydrogen content is 10 equivalents/kg.
'Epoxide resin I' denotes a polyglycidyl ether of 2,2-bis(4-hydroxyphenyl)propane having a 1,2epoxide content of 5.1 6 equivalents/kg and a viscosity at 21 OC of 24.5 Pa s.
'Epoxide resin II' denotes butane-l, 4-diol diglycidyl ether having a 1 ,2-epoxide content of 9.0 equivalents/kg.
'Epoxide resin III' denotes N,N'-diglycidyl-5,5-dimethylhydantoin, having a 1 ,2-epoxide content of 8.3 equivalents/kg.
'Epoxide resin IV' denots diglycidyl hexahydrophthalate, having a 1 ,2-epoxide content of 6.5 equivalents/kg.
Example 1
Silamine 1(24.0 g; 0.28 theoretical amino-hydrogen equivalent) and salicylic acid (0.8 g) were mixed and placed in a glass container which was sealed with a polyethylene stopper. The mixture was perfectly stable on storage.
Into each of two glass containers was placed a mixture of Epoxide resin 1(10 g; 0.052 epoxide equivalent), Epoxide resin 11(10 g; 0.09 epoxide equivalent), Silamine 1(12 g), and salicylic acid (0.4 g), and the containers were sealed as described above. The containers were stored for 3 months, at the end of which neither mixture showed any indication that any curing had taken place, remaining clear, mobile liquids throughout the storage period.
The stopper was then removed from one container so that the upper surface of the liquid came into contact with atmospheric moisture. The liquid solidified throughout its entire depth (40 mm) within 36 hours. The contents of the other, sealed container, however, remained a clear, mobile liquid.
Example 2
Silamine it (6.6 g; 0.104 theoretical amino-hydrogen equivalent) and 2-methoxyethyl hydrogen maleate (Q.4 g) were mixed and placed in a glass container and sealed as described in Example 1. The
mixture remained a clear, mobile liquid.
In each of two such containers was placed a mixture of Silamine it (3.3 g), 2-methoxyethyl hydrogen maleate (0.2 g), and Epoxide Resin 1(10 g; 0.052 epoxide equivalent). The containers were sealed and stored as described in Example 1. Both mixtures remained mobile liquids for over 3 months at room temperature, but when the stopper was removed from one container the contents solidified to a brittle solid throughout the entire depth (40 mm) within 24 hours while the contents in the sealed container remained unchanged.
Example 3
Example 2 was repeated, except that dibutyl phthalate (3 g) was also incorporated into the epoxide resin-containing mixtures. These were stable in a sealed container for over 3 months,but, once the stopper had been removed, the composition in the opened container cured to a hard solid within 48 hours.
Example 4
Epoxide resin 1(10 g; 0.052 epoxide equivalent), Silamine lit (4 g; 0.027 theoretical aminohydrogen equivalent), dibutyl phthalate (3 g), and salicylic acid (0.2 g) were mixed and placed in sealed glass containers as described in Example 1. The mixtures were stable in the containers for over 1 month but cured within 24 hours once the stopper had been removed.
Example 5
Epoxide resin 1(10 9; 0.052 epoxide equivalent), Epoxide resin 11 (10 g; 0.09 epoxide equivalent),
Silamine IV (11.4 g; 0.146 theoretical amino-hydrogen equivalent), and salicylic acid (0.02 g) were mixed and placed in sealed glass containers as described in Example 1. The mixtures were stable in the containers but cured within 24 hours once the stopper had been removed.
Example 6
Silamine it (9 g; 0.142 theoretical amino-hydrogen equivalent), Epoxide resin 1(10 g; 0.052 epoxide equivalent), Epoxide resin 11 (10 g; 0.09 epoxide equivalent), and salicylic acid (0.3 g) were
mixed and stored in a sealed container as described in Example 1. This mixture showed no signs of
curing having taken place after 3 months' storage, but it cured completely within 48 hours once the stopper had been removed.
For purposes of comparison, this experiment was repeated, but omitting the salicylic acid. The mixture was perfectly stable on storage but did not cure rapidly once the stopper was removed, curing only slowly and taking about 2 weeks to cure completely. These experiments showed the accelerating effect that an acid has on the cure of the epoxide resin.
Example 7
A composition as used in Example 6, containing salicylic acid, was placed in a glass tube to a depth of 30 mm and covered with an equal volume of water, which remained as a separate, upper
layer. The lower (resin) layer solidified within 24 hours at room temperature.
Example 8
A composition as used in Example 6, containing salicylic acid, was applied as a coating 20 ,um thick to an aluminium sheet. This coating cured to a hard, glassy film within 24 hours at room temperature; it was unaffected when rubbed 20 times with a cooton wool swab soaked in acetone.
Example 9
Epoxide resin 1(10 g; 0.052 epoxide equivalent), Silamine it (3.3 g; 0.052 theoretical aminohydrogen equivalent), and 2,6-di-tert. butyl-4-methyl phenol (3 g) were mixed and stored in a sealed container as described in Example 1. No evidence of curing having taken place in the mixture could be observed after 2 months at ambient temperature. When the stopper was removed this mixture cured to a hard solid within 4 days at ambient temperature.
Example 10
Epoxide resin 1(10 g; 0.052 epoxide equivalent), Silamine 1(4.5 g; 0.052 theoretical aminohydrogen equivalent), dibutyl phthalate (3 g), and an acid as specified below (0.2 g) were mixed and stored in sealed containers as described in Example 1. No evidence of curing having taken place could be observed after 1 month at ambient temperature. The time taken for the mixtures to cure once the stoppers had been removed, containing different acids, was as follows: acetic acid, 23 days; 2,2dichloropropionic acid, 1 day; methanesulphonic acid, 5 days; adipic acid, 3 days; cyanoacetic acid, 1 day; maleic acid, 2 days.
Example 11
A mixture of Epoxide resin lit (10 g; 0.083 epoxide equivalent), Silamine 1(6 g; 0.07 theoretical amino-hydrogen equivalent), and 0.2 g of acetic acid was stable on storage at room temperature, whilst kept out of contact with atmospheric moisture, for at least 1 month. In the presence of water vapour a fresh sample of the mixture gelled in less than 24 hours.
Example 12
A mixture of Epoxide resin IV (10 g; 0.065 epoxide equivalent), Silamine 1(5 g; 0.058 theoretical amino-hydrogen equivalent), and 0.2 g of acetic acid was stable on storage at room temperature for at least 1 month while ingress of atmospheric moisture was prevented. In the presence of water vapour a fresh sample of the mixture had cured in 4 days.
Example 13
A mixture of Epoxide resin 1(10 g; 0.052 epoxide equivalent), Epoxide resin 11(10 g; 0.09 epoxide equivalent), Silamine V ( 1 1 9; 0.1 57 theoretical amino-hydrogen equivalent), and 0.4 g of salicylic acid was stable for 1 7 days but a fresh sample, with access to atmospheric moisture, cured within 2 days.
Example 14
The process of Example 12 was repeated except that there was used 11 g (0.145 theoretical amino-hydrogen equivalent) of Silamine VI. Whereas the mixture protected from atmospheric moisture showed signs of gelling only after 6 days, another sample cured within 2 days in the presence of water vapour.
Example 15
A mixture of Epoxide resin 1(20 g; 0.104 epoxide equivalent), Silamine VII (1 1.2 g; 0.105 theoretical amino-hydrogen equivalent), dibutyl phthalate (6 g), and salicylic acid (0.4 g) was stable in the absence of atmospheric moisture for at least one month but gelled within 5 days when exposed to atmospheric moisture.
Example 16
The procedure of Example 14 was repeated, using Silamine VIII (1 1 g; 0.11 theoretical aminohydrogen equivalent) in place of Silamine VII and 20 g of dibutyl phthalate. While the mixture, sealed from atmospheric moisture, was stable for at least a month, a sample exposed to such moisture gelled within 5 days.
Claims (19)
1. Compositions comprising
(a) a silamine of the formula
where
either m represents 1, in which case R1 represents the divalent residue of an aromatic, aliphatic, araliphatic, or cycloaliphatic diprimary amine after removal of the two primary amino groups and n represents zero or an integer of from 1 to 10, or m represents 2, in which case R1 represents the trivalent residue of an aliphatic triprimary amine after removal of the three primary amino groups and n represents zero, and
R2, R3, R4, Rye, and Re, which may be the same or different, each represent an alkyl or aryl group, and
(b) a substantially anhydrous organic acid or a substantially anhydrous phenol.
2. Compositions according to claim 1, wherein R' represents a group having from 2 to 20 carbon atoms.
3. Compositions according to claim 2, wherein R' represents an ethylene, hexamethylene, trimethylhexamethylene, xylylene, cyclohexylene, substituted cyclohexylene of formula
bis(phenylene)methane, bis(phenylene) sulphone, 2,2-bis(phenylene)propane, or phenylene group.
4. Compositions according to any previous claim, in which R2, R3, R4, R5, and Re each represent an alkyl group of 1 to 8 carbon atoms or an aryl group of 6 to 10 carbon atoms.
5. Compositions according to claim 4, in which R2, R3, R4, R5, and R6 each represent methyl, ethyl, propyl, phenyl or phenyl substituted by one or more alkyl groups of 1 to 4 carbon atoms or by one or more halogen atoms.
6. Compositions according to any previous claim, in which m represents 1 and n represents zero or 1.
7. Compositions according to any previous claim, in which component (b) is an organic acid and is acetic, phthalic, methanesulphonic, salicylic, maleic, 2,2-dichloropropionic, adipic, trimellitic, or cyanoacetic acid or, where the acid is di- or polybasic, a partial ester of such an acid.
8. Compositions according to any of claims 1 to 6, in which component (b) is a phenol and is phenol itself, an alkylated phenol, a halogenated phenol, resorcinol, bisphenol F, or bisphenol A.
9. Compositions according to claim 8, in which the phenol is 2,6-di-tert. butyl-4-methylphenol.
10. Compositions according to claim 1, substantially as described in any of the Examples.
11. Curable compositions comprising a composition as claimed in any previous claim and
(c) an epoxide resin.
1 2. Compositions as claimed in claim 11, in which the weight ratio of the acid or phenol to the epoxide resin is within the range 0.5-20:100.
13. Compositions as claimed in claim 12, in which the weight ratio of the acid or phenol to the epoxide resin is within the range 2-15:100.
14. Compositions as claimed in any of claims 11 to 13, in which there is used from 0.7 to 1.4 theoretical amino-hydrogen equivalents, as herein defined, of the silamine per 1 ,2-epoxide equivalent of the epoxide resin.
1 5. Compositions according to claim 11, substantially as described in any of the Examples.
1 6. A process for curing an epoxide resin which comprising exposing a mixture as claimed in any of claims 11 to 1 5 to water or water vapour at ambient or elevated temperature.
17. A process according to claim 16, which is effected at a temperature up to 1 000 C.
1 8. A process according to claim 1 6, substantially as described in any of the Examples.
19. Compositions cured by the process of any of claims 1 6 to 18.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB08218473A GB2102431B (en) | 1981-06-30 | 1982-06-25 | Silamine compositions for curing epoxide resins |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB8120142 | 1981-06-30 | ||
GB08218473A GB2102431B (en) | 1981-06-30 | 1982-06-25 | Silamine compositions for curing epoxide resins |
Publications (2)
Publication Number | Publication Date |
---|---|
GB2102431A true GB2102431A (en) | 1983-02-02 |
GB2102431B GB2102431B (en) | 1984-08-15 |
Family
ID=26279968
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB08218473A Expired GB2102431B (en) | 1981-06-30 | 1982-06-25 | Silamine compositions for curing epoxide resins |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB2102431B (en) |
-
1982
- 1982-06-25 GB GB08218473A patent/GB2102431B/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
GB2102431B (en) | 1984-08-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4250074A (en) | Interpenetrating polymer network comprising epoxy polymer and polysiloxane | |
US4734332A (en) | Method for effecting adhesion using laminates from epoxy resins | |
US4866133A (en) | Solid solutions of polymeric phenols and polyamines as epoxy curing agents | |
EP0057327A1 (en) | Cyclic perfluoroaliphatic disulfonimides | |
KR100584173B1 (en) | Accelerators for hardenable systems | |
US3784647A (en) | Curing epoxide resin with boron trichloride-amine complex | |
JPH0635503B2 (en) | Diethyltoluenediamine curing agent system | |
US4393180A (en) | Curing agents for epoxide resins and compositions containing them | |
JPH04211427A (en) | Curing agent for epoxy resin | |
CA1209297A (en) | Heat-curable epoxide resin compositions | |
EP0020604B1 (en) | Method for preparing a coating comprising an interpenetrating polymer network | |
JP3932404B2 (en) | A curable mixture comprising a glycidyl compound, an amine curing agent and a heterocyclic curing accelerator | |
US6258919B1 (en) | Curable epoxy resin compositions containing water-processable polyamine hardeners | |
US5171769A (en) | Filled thixotropic resin compositions comprising epoxy resin, curing agent, sugar-aldehyde and filler | |
US4394492A (en) | Curing epoxide resins in an aquatic environment | |
GB2102431A (en) | Silamine compositions for curing epoxide resins | |
EP0385949B1 (en) | Compositions | |
US4431756A (en) | Method of increasing the viscosity of epoxide resin compositions | |
JPH0236220A (en) | Cold-curing one-pack epoxy resin composition | |
US4414377A (en) | Epoxide resin compositions containing esters as diluents and cure accelerators | |
JPS6318609B2 (en) | ||
JPH08217858A (en) | Hardener for epoxy resin | |
JPS58147464A (en) | Coating material | |
JPS6129973B2 (en) | ||
KR20160121959A (en) | Epoxy hardener composition with excellent chemical resistance and method of preparing the same |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PCNP | Patent ceased through non-payment of renewal fee |