GB2095477A - A stripline surface acoustic wave package - Google Patents
A stripline surface acoustic wave package Download PDFInfo
- Publication number
- GB2095477A GB2095477A GB8207511A GB8207511A GB2095477A GB 2095477 A GB2095477 A GB 2095477A GB 8207511 A GB8207511 A GB 8207511A GB 8207511 A GB8207511 A GB 8207511A GB 2095477 A GB2095477 A GB 2095477A
- Authority
- GB
- United Kingdom
- Prior art keywords
- acoustic wave
- surface acoustic
- stripline
- package according
- transmission line
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
- H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
- H03H9/1071—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the SAW device
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H3/00—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators
- H03H3/007—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks
- H03H3/08—Apparatus or processes specially adapted for the manufacture of impedance networks, resonating circuits, resonators for the manufacture of electromechanical resonators or networks for the manufacture of resonators or networks using surface acoustic waves
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
- H03H9/0542—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a lateral arrangement
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/0538—Constructional combinations of supports or holders with electromechanical or other electronic elements
- H03H9/0547—Constructional combinations of supports or holders with electromechanical or other electronic elements consisting of a vertical arrangement
Abstract
A stripline surface acoustic wave package comprising a triplate strip transmission line (1) and a surface acoustic wave device (12), the triplate strip transmission line comprising two ground planes (2, 4), a conducting strip (10) positioned between the ground planes (2, 4), and a dielectric substrate material (6, 8) separating the conducting strip (10) from the ground planes (2, 4), and the surface acoustic wave device (12) being positioned on one of the ground planes (2, 4) and in a cavity (13) which is formed in the dielectric substrate material (6, 8) and which extends to the ground plane on which the surface acoustic wave device is positioned. <IMAGE>
Description
SPECIFICATION
A stripline surface acoustic wave package
This invention relates to a stripline surface acoustic wave package, for example for radio frequency system modules.
Strip transmission lines are well known. One known strip transmission line is a triplate strip transmission line. The triplate strip transmission line comprises two ground planes, a conducting strip positioned between the ground lanes and a dielectric substrate material separating the conducting strip from the ground planes. The strip transmission lines are usually used as separate items of equipment and other items of equipment are required to be attached thereto.
Surface acoustic wave devices are also known.
They are also usually used as separate items of equipment with other separate items of equipment requiring to be attached thereto. With surface acoustic wave devices, there is a recent requirement that the surface acoustic wave devices should be incorporated into system modules. This incorporation of the surface acoustic wave devices into system modules normally involves a hybrid type of construction with the surface acoustic wave device being separately mounted in a hermetically sealed package. Amplifiers and filters are then connected to the surface acoustic wave package on a printed circuit board. The system module can thus be relatively bulky.
In addition to the problems of bulkiness associated with strip transmission lines and surface acoustic wave devices1 there is the further problem that, at frequencies above a few tens of MHz, the layout of electronic circuits is of prime importance. Signal breakthrough of signals from adjacent devices as well as earth currents are principle problems.
It is an aim of the present invention to provide a more monolithic approach to electronic circuit system design by providing a combined package of a triplate strip transmission line and a surface acoustic wave device, whilst at the same time obviating or reducing signal breakthough in the combined package.
Accordingly, this invention provides a stripline surface acoustic wave package comprising a triplate strip transmission line and a surface acoustic wave device, the triplate strip transmission line comprising two ground planes, a conducting strip positioned between the ground planes, and a dielectric substrate material separating the conducting strip from the ground planes, and the surface acoustic wave device being positioned on one of the ground planes and in a cavity which is formed in the dielectric substrate material and which extends to the ground plane on which the surface acoustic wave device is positioned.
The stripline surface acoustic wave package may be used for radio frequency system modules such as surface acoustic wave convolvers or correlators, non-dispersive delay lines, dispersive delay lines and filters. The stripline surface acoustic wave package can be produced to be small and compact with very good resistance to signal breakthrough.
The compact structure enables the stripline surface acoustic wave package to be used in confined space areas where savings of space are of considerable importance. The good rejection to signal breakthrough is considerably facilitated by the positioning of the surface acoustic wave device on one of the ground planes.
Preferably, the cavity is sealed for signal breakthrough by a conducting material positioned on a surface of the dielecric substrate material adjacent the end of the cavity remote from the ground plane on which the surface acoustic wave device is mounted, the conducting material being connected to one of the ground planes by one or more earth conductors. The earth conductors are preferably earth pins. The sealing of the cavity with the conducting material helps to stop signal breakthrough as aforesaid.
Usually, the dielectric substrate material will be formed in two portions which are joined together.
The dielectric substrate material may be a plastics material or a ceramic material.
In one embodiment of the invention, the strip transmission line is a copper strip transmission line and the dielectric substrate material is then a plastics material. In another embodiment of the invention, the strip transmission line is a gold strip transmission line and the dielectric material is then alumina.
The stripline surface acoustic wave package may include an amplifier. The amplifier may be positioned on one of the ground planes.
The stripline surface acoustic wave package may include filter means. The filter means may be a lumped element matching network. The lumped element matching network may be positioned on one of the ground planes. The filter means may also be a stripline filter. The use of the triplate strip transmission line enables either type of filter means easily to be used.
Embodiments of the invention will now be described solely by way of example and with reference to the accompanying drawings which:
Figure 1 shows part of a known triplate strip transmission line;
Figure 2 shows a first embodiment of the invention in which a stripline surface acoustic wave package is formed by the known triplate strip transmission line shown in Figure 1 and a surface acoustic wave device which is mounted in a cavity in the triplate strip transmission line;
Figure 3 shows a part of the stripline surface acoustic wave package illustrated in Figure 2 looking from top to bottom with the top removed;
Figure 4 shows a part of the stripline surface acoustic wave package shown in Figure 2 looking from bottom to top with the bottom removed; and
Figure 5 shows a second embodiment of the invention in which a double triplate strip transmission line construction is provided with a surface acoustic wave device which is mounted in a cavity in the double triplate strip transmission line construction.
Referring now to Figure 1, there is shown part of a known triplate strip transmission line 1 comprising two ground planes 2,4, two dielectric layers 6, 8 and a copper strip conductor 10 which can be attached to either layer 6, 8. The triplate strip transmission line 1 confines the transverse electromagnetic (TEM) field of the propagating signal to the close vicinity of the strip conductor 10, thus affording excellent signal isolation whilst allowing access to the plane of propagation. A frequency range of usage of the triplate strip transmission line 1 extends into the microwave region.
Referring now to Figure 2, a first embodiment of the invention is shown in which the triplate strip transmission line 1 shown in Figure 1 is provided with a surface acoustic wave device 12. As can be seen, the surface acoustic wave device 12 is provided in a cavity 13 and is connected to the strip conductor 10 by leads 14. The surface acoustic wave device 12 is positioned on the ground plane 4 and the positioning of the surface acoustic wave device 12 on the ground plane 4 helps to prevent signal breakthrough that might otherwise occur.
The cavity 13 extends to the ground plane 4 as shown. The cavity 13 is sealed for signal breakthrough buy a conducting material 16 which is positioned on the surface of the dielectric layer 6 adjacent the end of the cavity 13 remote from the ground plane 4 on which the surface acoustic wave device is mounted. The conducting material 16 is connected to the ground plane 2 by means of five earth conductors in the form of earth pins 18. The use of the conducting material 16 further helps in preventing unwanted signal breakthrough. The conducting material 16 may be deposited on the surface of the dielectric layer 6 using photolithography.
Also shown in Figure 2 is a lumped element matching network 20 which acts as a filter and which is positioned in a cavity 22 in the dielectric layer 8.
The lumped element matching network 20 is mounted on the ground plane 4, and it is connected to the conductor 10 by leads 24.
The dielectric layer 6 is provided with an amplifier 26. The amplifier 26 is connected by pins 28 to the strip conductor 10. The amplifier 26 is also enabled to receive a positive volt power supply from a conductor 30 which extends through the dielectric layer 6 to an input point 32.
It will be appreciated that the strip line surface acoustic wave package illustrated in Figure 2 is small and compact in construction. It can thus be used in locations where space is of prime importance.
Furthermore, signal breakthrough is reduced or obviated.
Referring now to Figure 5, similar parts as in
Figures 2,3 and 4 have been given the same reference numbers and their precise construction and operation will not again be given. In Figure 5, it will be noticed that the relative positions of the surface acoustic wave device 12 and the amplifier 26 are different and that the lumped element matching network 20 is not present.
Figure 5 shows a double triplate construction giving increased isolation with integral power supply rails. One power supply rail 34 is provided on a layer 36 of dielectric material. The dielectric material for the layer 36 may be different from the dielectric material employed for the dielectric layers 6, 8.
On top of the dielectric layer may be positioned another dielectric layer 38 and this dielectric layer 38 may be provided with a further power supply rail (not shown) which will be of a configuration such that it will not short with the supply rail 34 when the two supply rails are brought together in the assembled sandwich package illustrated in Figure 5. Positioned on top of the dielectric layer 38 is in effect a triplate strip transmission line structure similar to that illustrated in Figure 1. Thus, it will be seen that there are two ground planes 40, 42, two dielectric layers 44, 46 and a strip conductor 48. The strip conductor 47 may be an output line and it is isolated by the dielectric layers 44, 46 from the ground planes 40, 42 respectively. the strip conductor 48 may be provided with a strip line filter 50 as shown.
It will be appreciated from Figure 5 that a very compact structure can be achieved. Unwanted signal breakthrough can be reduced or obviated.
It is also to be appreciated that the embodiments of the invention described above with reference to the accompanying drawings have been given by way of example only and that modifications may be effected. Thus, for example, the cavity 22 illustrated in Figure 2 can be sealed against signal breakthrough by conducting material 16a shown in dotted lines. Also, further sandwich constructions can be added on top of the package illustrated in Figure 5 as required. The triplate strip transmission lines used in
Figures 2 to 5 can be exteriorly connected using standard radio frequency connectors such for example as SMA connectors. Alternatively, the packages illustrated in Figures 2 to 5 can be made as "drop-in" packages by the use of tab connectors.
Claims (14)
1. A stripline surface acoustic wave package comprising a triplate strip transmission line and a surface acoustic wave device, the triplate strip transmission line comprising two ground planes, a conducting strip positioned between the ground planes, and a dielectric substrate material separating the conducting strip from the ground planes, and the surface acoustic wave device being positioned on one of the ground planes and in a cavity which is formed in the dielectric substrate material and which extends to the ground plane on which the surface acoustic wave device is positioned.
2. A stripline surface acoustic wave package according to claim 1 in which the cavity is sealed for signal breakthrough by a conducting material positioned on a surface of the dielectric substrate material adjacent the end of the cavity remote from the ground plane on which the surface acoustic wave device is mounted, the conducting material being connected to one of the ground planes by one or more earth conductors.
3. A stripline surface acoustic wave package according to claim 2 in which the earth conductors are earth pins.
4. Astriplinesurface acousticwave package according to any one of the preceding claims in which the dielectric substrate material is formed in two portions which are joined together.
5. A stripline surface acoustic wave package according to any one of the preceding claims in which the dielectric substrate material is a plastics material or a ceramic material.
6. A stripline surface acoustic wave package according to claim 5 in which the strip transmission line is a copper strip transmission line, and the dielectric substrate material is a plastics material.
7. A stripline surface acoustic wave package according to claim 5 in which the strip transmission line is a gold strip transmission line and the dielectric material is alumina.
8. A stripline surface acoustic wave package according to any one of the preceding claims and including an amplifier.
9. A stripline surface acoustic wave package according to claim 8 in which the amplifier is position on one of the ground planes.
10. A stripline surface acoustic wave package according to any one of the preceding claims and including filter means.
11. A stripline surface acoustic wave package according to claim 10 in which the filter means is lumped element matching network.
12. A stripline surface acoustic wave package according to claim 11 in which the lumped element matching network is positioned on one of the ground planes.
13. A stripline surface acoustic wave package according to claim 10 in which the filter means is a stripline filter.
14. A stripline surface acoustic wave package substantially as herein described with reference to
Figure 2 or Figure 3 of the accompanying drawings.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB8207511A GB2095477B (en) | 1981-03-23 | 1982-03-15 | A stripline surface acoustic wave package |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB8109045 | 1981-03-23 | ||
| GB8207511A GB2095477B (en) | 1981-03-23 | 1982-03-15 | A stripline surface acoustic wave package |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| GB2095477A true GB2095477A (en) | 1982-09-29 |
| GB2095477B GB2095477B (en) | 1984-09-12 |
Family
ID=26278861
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| GB8207511A Expired GB2095477B (en) | 1981-03-23 | 1982-03-15 | A stripline surface acoustic wave package |
Country Status (1)
| Country | Link |
|---|---|
| GB (1) | GB2095477B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20170179920A1 (en) * | 2015-12-22 | 2017-06-22 | Murata Manufacturing Co., Ltd. | Electronic component |
-
1982
- 1982-03-15 GB GB8207511A patent/GB2095477B/en not_active Expired
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20170179920A1 (en) * | 2015-12-22 | 2017-06-22 | Murata Manufacturing Co., Ltd. | Electronic component |
| US10243535B2 (en) * | 2015-12-22 | 2019-03-26 | Murata Manufacturing Co., Ltd. | Electronic component |
Also Published As
| Publication number | Publication date |
|---|---|
| GB2095477B (en) | 1984-09-12 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PCNP | Patent ceased through non-payment of renewal fee |