GB2089117B - Improvements in and relating to the manufacure of wafer scale integrated circuits - Google Patents

Improvements in and relating to the manufacure of wafer scale integrated circuits

Info

Publication number
GB2089117B
GB2089117B GB8039046A GB8039046A GB2089117B GB 2089117 B GB2089117 B GB 2089117B GB 8039046 A GB8039046 A GB 8039046A GB 8039046 A GB8039046 A GB 8039046A GB 2089117 B GB2089117 B GB 2089117B
Authority
GB
United Kingdom
Prior art keywords
manufacure
relating
integrated circuits
scale integrated
wafer scale
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB8039046A
Other versions
GB2089117A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Unisys Corp
Original Assignee
Burroughs Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Burroughs Corp filed Critical Burroughs Corp
Priority to GB8039046A priority Critical patent/GB2089117B/en
Publication of GB2089117A publication Critical patent/GB2089117A/en
Application granted granted Critical
Publication of GB2089117B publication Critical patent/GB2089117B/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
GB8039046A 1980-12-05 1980-12-05 Improvements in and relating to the manufacure of wafer scale integrated circuits Expired GB2089117B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB8039046A GB2089117B (en) 1980-12-05 1980-12-05 Improvements in and relating to the manufacure of wafer scale integrated circuits

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB8039046A GB2089117B (en) 1980-12-05 1980-12-05 Improvements in and relating to the manufacure of wafer scale integrated circuits

Publications (2)

Publication Number Publication Date
GB2089117A GB2089117A (en) 1982-06-16
GB2089117B true GB2089117B (en) 1984-10-17

Family

ID=10517775

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8039046A Expired GB2089117B (en) 1980-12-05 1980-12-05 Improvements in and relating to the manufacure of wafer scale integrated circuits

Country Status (1)

Country Link
GB (1) GB2089117B (en)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0403898A3 (en) * 1989-06-15 1991-08-07 Fujitsu Limited Wafer-scale semiconductor integrated circuit device and method of forming interconnection lines arranged between chips of wafer-scale semiconductor integrated circuit device
US5349219A (en) * 1989-06-15 1994-09-20 Fujitsu Limited Wafer-scale semiconductor integrated circuit device and method of forming interconnection lines arranged between chips of wafer-scale semiconductor integrated circuit device
US5338397A (en) * 1993-10-01 1994-08-16 Motorola, Inc. Method of forming a semiconductor device

Also Published As

Publication number Publication date
GB2089117A (en) 1982-06-16

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee

Effective date: 19921205