GB2068640B - Wiring layers for semiconductor devices - Google Patents

Wiring layers for semiconductor devices

Info

Publication number
GB2068640B
GB2068640B GB8102607A GB8102607A GB2068640B GB 2068640 B GB2068640 B GB 2068640B GB 8102607 A GB8102607 A GB 8102607A GB 8102607 A GB8102607 A GB 8102607A GB 2068640 B GB2068640 B GB 2068640B
Authority
GB
United Kingdom
Prior art keywords
semiconductor devices
wiring layers
wiring
layers
semiconductor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB8102607A
Other versions
GB2068640A (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Publication of GB2068640A publication Critical patent/GB2068640A/en
Application granted granted Critical
Publication of GB2068640B publication Critical patent/GB2068640B/en
Expired legal-status Critical Current

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    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/156—Material
    • H01L2924/15786—Material with a principal constituent of the material being a non metallic, non metalloid inorganic material
    • H01L2924/15787—Ceramics, e.g. crystalline carbides, nitrides or oxides

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Semiconductor Integrated Circuits (AREA)
GB8102607A 1980-01-28 1981-01-28 Wiring layers for semiconductor devices Expired GB2068640B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP853780A JPS56105660A (en) 1980-01-28 1980-01-28 Semiconductor device

Publications (2)

Publication Number Publication Date
GB2068640A GB2068640A (en) 1981-08-12
GB2068640B true GB2068640B (en) 1984-08-08

Family

ID=11695894

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8102607A Expired GB2068640B (en) 1980-01-28 1981-01-28 Wiring layers for semiconductor devices

Country Status (2)

Country Link
JP (1) JPS56105660A (en)
GB (1) GB2068640B (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58169942A (en) * 1982-03-29 1983-10-06 Fujitsu Ltd Semiconductor device
JPH0611076B2 (en) * 1985-10-08 1994-02-09 三菱電機株式会社 Method for manufacturing semiconductor device
JPH07109857B2 (en) * 1989-10-19 1995-11-22 三洋電機株式会社 Method for manufacturing semiconductor integrated circuit
TW520072U (en) * 1991-07-08 2003-02-01 Samsung Electronics Co Ltd A semiconductor device having a multi-layer metal contact
JP4973463B2 (en) * 2007-11-16 2012-07-11 トヨタ自動車株式会社 Semiconductor device

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5856977B2 (en) * 1977-03-18 1983-12-17 株式会社東芝 Manufacturing method of semiconductor device

Also Published As

Publication number Publication date
JPS56105660A (en) 1981-08-22
GB2068640A (en) 1981-08-12

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Effective date: 20010127