GB2068640B - Wiring layers for semiconductor devices - Google Patents
Wiring layers for semiconductor devicesInfo
- Publication number
- GB2068640B GB2068640B GB8102607A GB8102607A GB2068640B GB 2068640 B GB2068640 B GB 2068640B GB 8102607 A GB8102607 A GB 8102607A GB 8102607 A GB8102607 A GB 8102607A GB 2068640 B GB2068640 B GB 2068640B
- Authority
- GB
- United Kingdom
- Prior art keywords
- semiconductor devices
- wiring layers
- wiring
- layers
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
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- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
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Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Semiconductor Integrated Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP853780A JPS56105660A (en) | 1980-01-28 | 1980-01-28 | Semiconductor device |
Publications (2)
Publication Number | Publication Date |
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GB2068640A GB2068640A (en) | 1981-08-12 |
GB2068640B true GB2068640B (en) | 1984-08-08 |
Family
ID=11695894
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB8102607A Expired GB2068640B (en) | 1980-01-28 | 1981-01-28 | Wiring layers for semiconductor devices |
Country Status (2)
Country | Link |
---|---|
JP (1) | JPS56105660A (en) |
GB (1) | GB2068640B (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58169942A (en) * | 1982-03-29 | 1983-10-06 | Fujitsu Ltd | Semiconductor device |
JPH0611076B2 (en) * | 1985-10-08 | 1994-02-09 | 三菱電機株式会社 | Method for manufacturing semiconductor device |
JPH07109857B2 (en) * | 1989-10-19 | 1995-11-22 | 三洋電機株式会社 | Method for manufacturing semiconductor integrated circuit |
TW520072U (en) * | 1991-07-08 | 2003-02-01 | Samsung Electronics Co Ltd | A semiconductor device having a multi-layer metal contact |
JP4973463B2 (en) * | 2007-11-16 | 2012-07-11 | トヨタ自動車株式会社 | Semiconductor device |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5856977B2 (en) * | 1977-03-18 | 1983-12-17 | 株式会社東芝 | Manufacturing method of semiconductor device |
-
1980
- 1980-01-28 JP JP853780A patent/JPS56105660A/en active Pending
-
1981
- 1981-01-28 GB GB8102607A patent/GB2068640B/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS56105660A (en) | 1981-08-22 |
GB2068640A (en) | 1981-08-12 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PE20 | Patent expired after termination of 20 years |
Effective date: 20010127 |