GB2057189A - Semi-conductor rectifier bridge - Google Patents

Semi-conductor rectifier bridge

Info

Publication number
GB2057189A
GB2057189A GB8027712A GB8027712A GB2057189A GB 2057189 A GB2057189 A GB 2057189A GB 8027712 A GB8027712 A GB 8027712A GB 8027712 A GB8027712 A GB 8027712A GB 2057189 A GB2057189 A GB 2057189A
Authority
GB
United Kingdom
Prior art keywords
semi
conductor
conductors
rectifier bridge
rectifier
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB8027712A
Other versions
GB2057189B (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semikron GmbH and Co KG
Original Assignee
Semikron GmbH and Co KG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semikron GmbH and Co KG filed Critical Semikron GmbH and Co KG
Publication of GB2057189A publication Critical patent/GB2057189A/en
Application granted granted Critical
Publication of GB2057189B publication Critical patent/GB2057189B/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/08—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including only semiconductor components of a single kind
    • H01L27/0814—Diodes only
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4918—Disposition being disposed on at least two different sides of the body, e.g. dual array
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/12—Passive devices, e.g. 2 terminal devices
    • H01L2924/1203—Rectifying Diode
    • H01L2924/12036—PN diode

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Rectifiers (AREA)
  • Current-Collector Devices For Electrically Propelled Vehicles (AREA)

Abstract

The semi-conductor rectifier bridge comprises rectifier elements (1, 2) mounted at the end of the conductors in band or wire shape and enclosed therewith in an envelope, said bridge presenting two semi-conductor bodies (1, 2) having each a member of integrated elements defined by the assembly. Each semi-conductor body comprises at least one pn jonction and is divided by at least one reinforcement of a main surface in a selected member of rectifier elements. By a corresponding relative arrangement of the semi-conductor bodies and of the conductors, the rectifier elements are connected with the smallest possible interval according to the assembly, by means of one extremity (5a, 6a, 7a, 8a) of a conductor, and the conductors are formed and arranged so that their free ends (5, 6, 7, 8) present a relative gap (m) fonction of the application.
GB8027712A 1978-08-26 1979-08-13 Semi-conductor rectifier bridge Expired GB2057189B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19782837332 DE2837332A1 (en) 1978-08-26 1978-08-26 SEMICONDUCTOR RECTIFIER ARRANGEMENT IN BRIDGE CIRCUIT

Publications (2)

Publication Number Publication Date
GB2057189A true GB2057189A (en) 1981-03-25
GB2057189B GB2057189B (en) 1983-04-20

Family

ID=6047987

Family Applications (1)

Application Number Title Priority Date Filing Date
GB8027712A Expired GB2057189B (en) 1978-08-26 1979-08-13 Semi-conductor rectifier bridge

Country Status (5)

Country Link
EP (1) EP0019624A1 (en)
JP (1) JPS55500776A (en)
DE (1) DE2837332A1 (en)
GB (1) GB2057189B (en)
WO (1) WO1980000512A1 (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2518788A1 (en) * 1981-12-23 1983-06-24 Thomson Csf Voltage dependent resistor for LCD screen control - uses two semiconductor diodes opposed in series between supply terminals and formed of amorphous silicon

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL262934A (en) * 1960-03-30
US3348105A (en) * 1965-09-20 1967-10-17 Motorola Inc Plastic package full wave rectifier
US3463970A (en) * 1966-10-26 1969-08-26 Gen Electric Integrated semiconductor rectifier assembly
DE1964795U (en) * 1967-04-28 1967-07-27 Siemens Ag ELECTRICAL COMPONENT, IN PARTICULAR SEMI-CONDUCTOR RECTIFIER, WITH CONNECTING PARTS MADE OF FLAT MATERIAL FOR PRINTED CIRCUITS.
US3654527A (en) * 1970-07-27 1972-04-04 Gen Electric Unitary full wave inverter

Also Published As

Publication number Publication date
EP0019624A1 (en) 1980-12-10
GB2057189B (en) 1983-04-20
DE2837332A1 (en) 1980-03-06
JPS55500776A (en) 1980-10-16
WO1980000512A1 (en) 1980-03-20

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Legal Events

Date Code Title Description
PCNP Patent ceased through non-payment of renewal fee